CN101754643B - Electronic device and thermal module thereof - Google Patents
Electronic device and thermal module thereof Download PDFInfo
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- CN101754643B CN101754643B CN2008101869381A CN200810186938A CN101754643B CN 101754643 B CN101754643 B CN 101754643B CN 2008101869381 A CN2008101869381 A CN 2008101869381A CN 200810186938 A CN200810186938 A CN 200810186938A CN 101754643 B CN101754643 B CN 101754643B
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Abstract
The invention relates to an electronic device which comprises a circuit board and a thermal module. The circuit board is provided with a heat source, the thermal module is arranged in the heat source and is provided with a heat conduction unit, a first heat dissipation unit and a second heat dissipation unit. The heat conduction unit is provided with a heat conduction board and a heat conduction pipe; a first surface of the heat conduction board is contacted with the heat source, a first end of the heat conduction pipe is connected to the heat conduction board; the first heat dissipation unit is connected with a second end of the heat conduction pipe, the second heat dissipation unit is movably arranged on a second surface of the heat conduction board. Through different cooling modes, the thermal module of the invention can achieve double heat dissipation efficiency and satisfy heat dissipation requirements of a high speed processor.
Description
Technical field
The invention relates to a kind of electronic installation and radiating module thereof.
Background technology
Along with the progress of science and technology, the calculation process speed of various electronic installations is also more and more faster, but relatively, the heat energy that various chip produced in the electronic installation is also increasingly high.Therefore, the heat dissipation technology of corresponding various chips is also more and more paid attention to by the dealer.Below, comprising circuit board with electronic installation is example, and is that example is explained with the radiating mode of the north bridge chips of circuit board.
Please with reference to shown in Figure 1, it is the board side view of known electronic.Electronic installation 1 has circuit board 11, north bridge chips 12, heat conduction plate 13 and radiating fin 14.North bridge chips 12 is arranged on the circuit board 11, and heat conduction plate 13 is connected with north bridge chips 12, and radiating fin 14 then contacts with heat conduction plate 13 and be sealed with circuit board 11.
Therefore, utilize heat conduction plate 13 can the heat that north bridge chips 12 is produced be directed to radiating fin 14, and radiating fin 14 is the ventilation type heat-sink unit, the heat loss is gone out by the mode of gas thermal convection.
Yet the radiating fin 14 of known circuit board 1 is connected with circuit board 11 with sealed mode.Therefore,, then must earlier radiating fin 14 be removed, then could the water-cooled heat-sink unit be arranged on the heat conduction plate 13 when user's desire is strengthened heat dissipation and reequiped the water-cooled heat-sink unit when (figure does not show).So; Only can select to dispel the heat with ventilation type heat-sink unit (radiating fin 14) or water-cooled heat-sink unit; Not only heat dissipation does not apply the radiating requirements of high speed processor, and radiating fin 14 is inconvenient with the substitute mode of water-cooled heat-sink unit, also can cause user's puzzlement.Moreover the radiating fin 14 after the replacing also forms waste if there is not other purposes.
Summary of the invention
Because above-mentioned problem, the object of the invention is that a kind of electronic installation and radiating module thereof that can have first heat-sink unit and second heat-sink unit simultaneously is provided, and reaches dual heat dissipation by different refrigerating modes.
For reaching above-mentioned purpose,, be arranged at a pyrotoxin of a circuit board according to the radiating module of a kind of electronic installation of the present invention.Radiating module comprises a heat-conducting unit, one first heat-sink unit and one second heat-sink unit.Heat-conducting unit has a heat conduction plate and a heat pipe, and a first surface of heat conduction plate contacts with pyrotoxin, and one first end of heat pipe is connected in the heat conduction plate.First heat-sink unit is connected with one second end of heat pipe, and second heat-sink unit is disposed at the second surface contact of heat conduction plate versatilely.
For reaching above-mentioned purpose, comprise a circuit board and a radiating module according to a kind of electronic installation of the present invention.Circuit board has a pyrotoxin, and radiating module is arranged at pyrotoxin.Radiating module has a heat-conducting unit, one first heat-sink unit and one second heat-sink unit, and heat-conducting unit has a heat conduction plate and a heat pipe, and a first surface of heat conduction plate contacts with pyrotoxin, and one first end of heat pipe is connected in the heat conduction plate.First heat-sink unit is connected with one second end of heat pipe, and second heat-sink unit is disposed at a second surface of heat conduction plate versatilely.
In preferred embodiment of the present invention, first heat-sink unit serves as a relative heat conduction plate rotation with second end, makes the interference on first heat-sink unit and the unlikely generation of second heat-sink unit space.
In preferred embodiment of the present invention, second heat-sink unit can be bonding with heat conduction plate connected mode, engages, screws togather, sealed, chimeric, welding or its combination, and second heat-sink unit is directly contacted with pyrotoxin.
In preferred embodiment of the present invention, the heat that pyrotoxin is produced via heat pipe conducts to first heat-sink unit indirectly and dispels the heat.
Hold the above, first heat-sink unit of electronic installation of the present invention and radiating module thereof is connected with the heat conduction plate by heat pipe, and second heat-sink unit then contacts with the second surface of heat conduction plate with respect to pyrotoxin.Therefore, the heat that pyrotoxin produced can be gone out by the first heat-sink unit loss via heat conduction plate and heat pipe, goes out via the heat conduction plate and the second heat-sink unit loss simultaneously.By different cooling modes, radiating module of the present invention can reach dual heat dissipation, satisfies the radiating requirements of high speed processor.
Can be about the advantages and spirit of the present invention by following detailed Description Of The Invention and appended graphic being further understood.
Description of drawings
Fig. 1 is the board side view of known electronic.
Fig. 2 is the electronic installation of preferred embodiment of the present invention and the exploded view of radiating module thereof.
Fig. 3 is the electronic installation of Fig. 2 and the constitutional diagram of radiating module thereof.
Fig. 4 is the electronic installation of Fig. 3 and the end view of radiating module thereof.
Embodiment
Below will electronic installation and radiating module thereof according to preferred embodiment of the present invention be described with reference to correlative type, wherein similar elements is represented with same-sign.
Please with reference to shown in Figure 2, it is the exploded view of the radiating module 4 of the electronic installation 2 of preferred embodiment of the present invention.Electronic installation 2 for example can be notebook computer, desktop computer or game device etc., does not limit in this.Electronic installation 2 comprises a circuit board 3 and a radiating module 4.
Heat-conducting unit 41 has a heat conduction plate 411 and a heat pipe 412, and a first surface F1 of heat conduction plate 411 contacts with pyrotoxin 31, and one first end S1 of heat pipe 412 is connected in heat conduction plate 411.Wherein, the material of heat conduction plate 411 and heat pipe 412 for example can be the material that aluminium and/or copper etc. have high thermal conductivity matter and constitutes.
First heat-sink unit 42 is connected with one second end S2 of heat pipe 412.First heat-sink unit 42 for example can be the combination of heating panel, radiating fin or heating panel and radiating fin.In present embodiment, first heat-sink unit 42 is to be example to squeeze the type radiating fin, and right present embodiment is not done any restriction in this combination to first heat-sink unit.
Second heat-sink unit 43 is disposed at a second surface F2 of heat conduction plate 411 versatilely with respect to pyrotoxin 31.Second heat-sink unit 43 for example can be liquid cooling unit, and liquid cooling unit can be water-cooled unit or oil cooling unit.Wherein, second heat-sink unit 43 for example can be bonding with heat conduction plate 411 connected modes, engage, screw togather, sealed, chimeric, welding or its combination.In present embodiment, second heat-sink unit 43 explains with sealed that with heat conduction plate 411 connected modes it is non-in order to restriction the present invention.
The heat that pyrotoxin 31 is produced can conduct to 42 loss of first heat-sink unit via heat conduction plate 411 and heat pipe 412 and go out; Simultaneously conduct to second heat-sink unit 43 via heat conduction plate 411, the cooling fluid via second heat-sink unit 43 of flowing through removes the heat that conducts to second heat-sink unit 43 again.By this, the radiating module 4 of electronic installation 2 can reach dual heat dissipation.Wherein, cooling fluid for example is to flow into second heat-sink unit 43 by fluid intake portion 431, flows out second heat-sink unit 43 by fluid issuing portion 432 again.
Please with reference to Fig. 3 and shown in Figure 4, wherein Fig. 3 is the electronic installation 2 of present embodiment and the constitutional diagram of radiating module 4 thereof, and Fig. 4 is the end view of Fig. 3.In present embodiment, first heat-sink unit 42 of the radiating module 4 of electronic installation 2 is heat conduction plate 411 rotations relatively movably, and so it is non-limiting.Wherein, first heat-sink unit 42 fits in the second surface F2 of heat conduction plate 411 movably, in other words, do not install second heat-sink unit 43 before, first heat-sink unit 42 can rotate to the second surface F2 that fits in heat conduction plate 411.By this, first heat-sink unit 42 can change spatial configuration position originally by rotation mode, being adjusted to the appropriate location, is provided in the narrow and small electronic equipment in space being fit to.On the other hand, on heat conduction plate 411, can install second heat-sink unit 43,, and dual heat dissipation arranged so pyrotoxin 31 can dispel the heat via the refrigerating mode (air cooling and liquid cooling) of different kenels simultaneously.
At first; The user removes the securing member that first heat-sink unit 42 is fixed in heat conduction plate 411, and (figure shows; Screw for example); One first end S1 with heat pipe 412 is that first relative heat conduction plate 411 of A1 rotates again, in other words, and the pivot (hinge) when heat pipe 412 can be used as 42 rotations of first heat-sink unit.The person of noting, the stop place of rotation back first heat-sink unit 42 is a principle with the interference on itself and second heat-sink unit 43 or the unlikely generation of other element space.Then, by fasteners is installed in second heat-sink unit 43 position of former first heat-sink unit 42.
In addition, the second end S2 that first heat-sink unit 42 can also heat pipe 412 is that second A2 rotates, and in other words, first heat-sink unit 42 also can rotate with respect to heat pipe 412 except that heat conduction plate 411 rotates relatively.
Again; For pyrotoxin 31 and heat conduction plate 411 and heat conduction plate 411 are closely contacted with heat conduction interface between second heat-sink unit 43; But filling Heat Conduction Material (for example thermal grease or thermal paste etc.) or heating panel, fin etc. are set therebetween is to guarantee the smooth and easy of heat dissipation path.
In sum; First heat-sink unit of electronic installation of the present invention and radiating module thereof (for example being heating panel, fin or radiating fin etc.) is connected with the heat conduction plate by heat pipe, and second heat-sink unit (for example being water-cooled unit or oil cooling unit) then contacts with the second surface of heat conduction plate with respect to pyrotoxin.Therefore, the heat that pyrotoxin produced can be gone out by the first heat-sink unit loss via heat conduction plate and heat pipe, goes out via the heat conduction plate and the second heat-sink unit loss simultaneously.By different cooling modes, radiating module of the present invention can reach dual heat dissipation, to satisfy the radiating requirements of high speed processor.
By the detailed description of above preferred embodiment, hope can be known description characteristic of the present invention and spirit more, and is not to come category of the present invention is limited with the above-mentioned preferred embodiment that is disclosed.On the contrary, its objective is that hope can contain in the category of claim of being arranged in of various changes and tool equality institute of the present invention desire application.Therefore, the category of the claim that the present invention applied for should be done the broadest explanation according to above-mentioned explanation, contains the arrangement of all possible change and tool equality to cause it.
Claims (18)
1. radiating module is arranged at the pyrotoxin of circuit board, it is characterized in that, comprises:
Heat-conducting unit has heat conduction plate and heat pipe, and the first surface of above-mentioned heat conduction plate contacts with above-mentioned pyrotoxin, and first end of above-mentioned heat pipe is connected in above-mentioned heat conduction plate;
First heat-sink unit is connected with second end of above-mentioned heat pipe; And
Second heat-sink unit is disposed at the second surface of above-mentioned heat conduction plate versatilely,
The above-mentioned relatively heat conduction plate of wherein above-mentioned first heat-sink unit rotates to the above-mentioned second surface that fits in above-mentioned heat conduction plate.
2. radiating module according to claim 1 is characterized in that, wherein above-mentioned first heat-sink unit serves as the above-mentioned relatively heat conduction plate rotation of axle with above-mentioned first end.
3. radiating module according to claim 2 is characterized in that, wherein above-mentioned first heat-sink unit serves as that axle rotates with above-mentioned first end, and is disposed at the above-mentioned second surface of above-mentioned heat conduction plate versatilely.
4. radiating module according to claim 1 is characterized in that, wherein above-mentioned first heat-sink unit serves as that axle rotates with above-mentioned second end.
5. radiating module according to claim 1 is characterized in that, wherein above-mentioned first heat-sink unit is the combination of heating panel, radiating fin or heating panel and radiating fin.
6. radiating module according to claim 1 is characterized in that, wherein above-mentioned second heat-sink unit is a liquid cooling unit.
7. radiating module according to claim 6 is characterized in that, wherein above-mentioned liquid cooling unit is water-cooled unit or oil cooling unit.
8. radiating module according to claim 1 is characterized in that, wherein above-mentioned second heat-sink unit and above-mentioned heat conduction plate connected mode for binds, engage, screw togather, sealed, chimeric, weld or its combination.
9. radiating module according to claim 1; It is characterized in that; Wherein above-mentioned second heat-sink unit has fluid intake portion and fluid issuing portion, and cooling fluid flows into above-mentioned second heat-sink unit by above-mentioned fluid intake portion, flows out above-mentioned second heat-sink unit by above-mentioned fluid issuing portion again.
10. an electronic installation is characterized in that, comprises:
Circuit board has pyrotoxin;
Radiating module is arranged at above-mentioned pyrotoxin, and above-mentioned radiating module comprises:
Heat-conducting unit has heat conduction plate and heat pipe, and the first surface of above-mentioned heat conduction plate contacts with above-mentioned pyrotoxin, and first end of above-mentioned heat pipe is connected in above-mentioned heat conduction plate;
First heat-sink unit is connected with second end of above-mentioned heat pipe; And
Second heat-sink unit is disposed at the second surface of above-mentioned heat conduction plate versatilely,
The above-mentioned relatively heat conduction plate of wherein above-mentioned first heat-sink unit rotates to the above-mentioned second surface that fits in above-mentioned heat conduction plate.
11. electronic installation according to claim 10 is characterized in that, wherein above-mentioned first heat-sink unit serves as the above-mentioned relatively heat conduction plate rotation of axle with above-mentioned first end.
12. electronic installation according to claim 11 is characterized in that, wherein above-mentioned first heat-sink unit serves as that axle rotates with above-mentioned first end, and is disposed at the above-mentioned second surface of above-mentioned heat conduction plate versatilely.
13. electronic installation according to claim 10 is characterized in that, wherein above-mentioned first heat-sink unit serves as that axle rotates with above-mentioned second end.
14. electronic installation according to claim 10 is characterized in that, wherein above-mentioned first heat-sink unit is the combination of heating panel, radiating fin or heating panel and radiating fin.
15. electronic installation according to claim 10 is characterized in that, wherein above-mentioned second heat-sink unit is a liquid cooling unit.
16. electronic installation according to claim 15 is characterized in that, wherein above-mentioned liquid cooling unit is water-cooled unit or oil cooling unit.
17. electronic installation according to claim 10 is characterized in that, wherein above-mentioned second heat-sink unit and above-mentioned heat conduction plate connected mode for binds, engage, screw togather, sealed, chimeric, weld or its combination.
18. electronic installation according to claim 10; It is characterized in that; Wherein above-mentioned second heat-sink unit has fluid intake portion and fluid issuing portion, and cooling fluid flows into above-mentioned second heat-sink unit by above-mentioned fluid intake portion, flows out above-mentioned second heat-sink unit by above-mentioned fluid issuing portion again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101869381A CN101754643B (en) | 2008-12-10 | 2008-12-10 | Electronic device and thermal module thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101869381A CN101754643B (en) | 2008-12-10 | 2008-12-10 | Electronic device and thermal module thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101754643A CN101754643A (en) | 2010-06-23 |
| CN101754643B true CN101754643B (en) | 2012-08-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101869381A Active CN101754643B (en) | 2008-12-10 | 2008-12-10 | Electronic device and thermal module thereof |
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| Country | Link |
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| CN (1) | CN101754643B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111261476A (en) * | 2018-11-30 | 2020-06-09 | 曾东荣 | Heat sink for microwave magnetron |
| CN110736084B (en) * | 2019-10-24 | 2020-12-18 | 嘉兴觅特电子商务有限公司 | A lighting device for wisdom piping lane is convenient for clean radiating |
| CN114126328B (en) * | 2020-08-31 | 2023-06-09 | 华为技术有限公司 | Radiating assembly and automobile |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1877828A (en) * | 2005-06-08 | 2006-12-13 | 富准精密工业(深圳)有限公司 | Radiator |
| CN101242732A (en) * | 2007-02-08 | 2008-08-13 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator combination |
-
2008
- 2008-12-10 CN CN2008101869381A patent/CN101754643B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1877828A (en) * | 2005-06-08 | 2006-12-13 | 富准精密工业(深圳)有限公司 | Radiator |
| CN101242732A (en) * | 2007-02-08 | 2008-08-13 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator combination |
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| Publication number | Publication date |
|---|---|
| CN101754643A (en) | 2010-06-23 |
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