CN101751181B - Touch control panel manufacturing method - Google Patents
Touch control panel manufacturing method Download PDFInfo
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- CN101751181B CN101751181B CN2009102627825A CN200910262782A CN101751181B CN 101751181 B CN101751181 B CN 101751181B CN 2009102627825 A CN2009102627825 A CN 2009102627825A CN 200910262782 A CN200910262782 A CN 200910262782A CN 101751181 B CN101751181 B CN 101751181B
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Abstract
The invention relates to a touch control panel manufacturing method, which comprises the steps that: a substrate is provided, a first transparent conductive layer is formed on the substrate and a first screen printing manufacturing process is performed; a first sacrificing pattern layer is formed on the first transparent conductive layer and the first sacrificing pattern layer is used for patterning the first transparent conductive layer to form a sensing pad pattern layer; a second screen printing manufacturing process is performed and a patterned insulation layer is formed on the substrate; a second transparent conductive layer is formed on the substrate and a third screen printing manufacturing process is performed to form a second sacrificing pattern layer on the second transparent conductive layer and the second sacrificing pattern layer is used for patterning the second transparent conductive layer to form a bridge connector pattern layer.
Description
Technical field
The invention relates to a kind of method of making contact panel, refer to a kind of method of utilizing the wire mark manufacturing process to form sensor pad patterned layer, patterned insulation layer and the bridging line patterned layer of contact panel especially.
Background technology
In the market of various consumption electronic products now, portable electronic products such as mobile phone (mobile phone), satellite navigation system (GPS) and digital audio-video player use contact panel (touch panel) to link up interface as people's machine data widely.Because it is compact that the design of consumption electronic products is at present stressed, in product design, hope can save traditional input medias such as the button that takes up space and mouse, so the employing touch control manner is imported, so contact panel has become one of spare part of key.
Distinguish with the touch-control principle; Existing contact panel mainly can be divided into resistance/contact contact panel (resistance/contact touch panel) and two types of capacitance type touch-control panels (capacitive touch panel), and wherein capacitance type touch-control panel is a main product in the market.Therefore retes such as the sensor pad of existing capacitance type touch-control panel, insulation course and bridging line form with yellow light lithography mode, make that cost of manufacture is expensive and have influenced the popularization degree of capacitance type touch-control panel.
Summary of the invention
One of the object of the invention is to provide a kind of method of making contact panel, to save the cost of manufacture of contact panel.
A preferred embodiment of the present invention provides a kind of method of making contact panel, comprises the following steps.One ground (base) is provided, and it comprises a sensing area.In the sensing area of ground, form one first transparency conducting layer; And carry out one first wire mark manufacturing process; On first transparency conducting layer, form one first sacrificial pattern layer, and utilize the first sacrificial pattern patterned, first transparency conducting layer to form a sensor pad patterned layer.Carry out one first tempering manufacturing process, described sensor pad patterned layer is carried out tempering.Carry out one second wire mark manufacturing process, in the sensing area of ground, form a patterned insulation layer, described patterned insulation layer comprises a plurality of island insulation systems.In the sensing area of ground, form one second transparency conducting layer; And carry out one the 3rd wire mark manufacturing process; On second transparency conducting layer, form one second sacrificial pattern layer, and utilize the second sacrificial pattern patterned, second transparency conducting layer, to form a bridging line patterned layer; Described bridging line patterned layer comprises a plurality of bridging lines, and respectively corresponding each the described island insulation system of each described bridging line.
Because making the method for contact panel, the present invention utilize the wire mark manufacturing process to form sacrificial pattern layer in order to definition sensor pad patterned layer and bridging line patterned layer; Therefore compared to the existing method of using yellow light lithography manufacturing process, the present invention makes the method for contact panel can significantly save cost.
Description of drawings
Fig. 1 to Fig. 9 has illustrated the synoptic diagram of method of the making contact panel of first preferred embodiment of the present invention.
Figure 10 to Figure 13 has illustrated another of step of patterning first transparency conducting layer and patterning second transparency conducting layer of first preferred embodiment of the present invention and has implemented appearance attitude.
Figure 14 to Figure 20 has illustrated the synoptic diagram of method of the making contact panel of second preferred embodiment of the present invention.
Figure 21 and Figure 22 have illustrated the present invention and have made the synoptic diagram of two preferred embodiments in addition of the method for contact panel.
Drawing reference numeral:
10 ground 10S sensing areas
14 first sacrificial pattern layers, 16 sensor pad patterned layer
161 first sensor pads, 162 second sensor pads
163 connecting lines, 18 patterned insulation layers
181 island insulation systems, 20 second transparency conducting layers
22 second sacrificial pattern layers, 24 bridging line patterned layer
241 bridging lines 26 connect lead
27 protective seams, 28 first sacrificial pattern layers
30 second sacrificial pattern layers, 50 ground
52 second transparency conducting layers, 54 second sacrificial pattern layers
561 bridging lines of 56 bridging line patterned layer
58 patterned insulation layers, 581 island insulation systems
60 first transparency conducting layers, 62 first sacrificial pattern layers
64 sensor pad patterned layer, 641 first sensor pads
642 second sensor pads, 643 connecting lines
66 connect lead 67 protective seams
80 display panels
Embodiment
Be familiar with for making that the general technology person of technical field can further understand the present invention under the present invention, the hereinafter spy enumerates preferred embodiment of the present invention, and cooperate appended graphic, specify constitution content of the present invention and the effect desiring to reach.In addition, hereinafter, " first ", " second ", " the 3rd " with " the 4th " etc. term be in order to distinguishing different elements or manufacturing process, do not represent restriction to its order.
Please refer to Fig. 1 to Fig. 9.Fig. 1 to Fig. 9 has illustrated the synoptic diagram of method of the making contact panel of first preferred embodiment of the present invention; Wherein be clear demonstration characteristic of the present invention; Fig. 3 and Fig. 8 on look synoptic diagram, Fig. 1, Fig. 2, Fig. 4 to Fig. 7 and Fig. 9 are the diagrammatic cross-sections that the hatching line A-A ' direction along Fig. 3 illustrates.As shown in Figure 1, a ground 10 at first is provided, and ground 10 comprises a sensing area 10S at least in order to sensing element to be set, and a surrounding zone 10P is in order to be provided with the connection lead.Then, in the sensing area 10S of ground 10, form one first transparency conducting layer 12.First transparency conducting layer 12 can be various transparent conductive material and constitutes, and for example physical vapour deposition (PVD) or chemical vapor deposition form to utilize various thin film technique.For example, in the present embodiment, first transparency conducting layer 12 is to select amorphous tin indium oxide (amorphous ITO) for use, and utilizes sputtering way to form, but not as limit.
As shown in Figure 2, carry out one first wire mark manufacturing process subsequently, on first transparency conducting layer 12, form one first sacrificial pattern layer 14, and utilize the first sacrificial pattern layer, 14 patterning, first transparency conducting layer 12, to form a sensor pad patterned layer 16.In the present embodiment; The first sacrificial pattern layer 14 comprises a pattern etched barrier layer (etching resistance); Therefore the step of patterning first transparency conducting layer 12 comprises and utilizes the pattern etched barrier layer to carry out one first etching manufacturing process as etch shield, is not patterned first transparency conducting layer 12 that etch barrier covers and forms sensor pad patterned layer 16 to remove.The first etching manufacturing process can be for example uses the Wet-type etching manufacturing process of oxalic acid as etching solution, but not as limit, and the material of visual first transparency conducting layer 12 is selected different and select other etching solution for use, or use the dry-etching manufacturing process.In addition, impaired in follow-up etching manufacturing process for fear of sensor pad patterned layer 16, after forming sensor pad patterned layer 16, optionally carry out a upgrading manufacturing process, one first tempering manufacturing process for example is to change the kenel of sensor pad patterned layer 16.For example, the material of the sensor pad patterned layer 16 of present embodiment is the amorphous tin indium oxide originally, can be polycrystalline tin indium oxide (poly ITO) with the material upgrading of sensor pad patterned layer 16 and see through the first tempering manufacturing process.
Like Fig. 3 and shown in Figure 4, then remove the first sacrificial pattern layer 14, to expose sensor pad patterned layer 16.Sensor pad patterned layer 16 comprises a plurality of sensor pads; For example a plurality of first sensor pads 161 and a plurality of second sensor pads 162; And a plurality of connecting lines 163, wherein first sensor pad 161 is arranged along a first direction (the for example vertical direction of Fig. 3), and two adjacent first sensor pads 161 that are positioned at delegation are connected to each other through connecting line 163; And second sensor pad 162 is arranged along a second direction (the for example horizontal direction of Fig. 3), and is positioned at the second sensor pad 162 connection each other of same row.In addition, in the present embodiment, two adjacent sensor pads, for example adjacent first sensor pad 161 and second sensor pad 162 have a clearance G, and clearance G is substantially between 30 microns and 500 microns, but not as limit.
As shown in Figure 5; Carry out one second wire mark manufacturing process subsequently; In the sensing area 10S of ground 10, to form a patterned insulation layer 18; Wherein patterned insulation layer 18 comprises a plurality of island insulation systems (insulating island) 181, corresponds respectively to the position between two adjacent second sensor pads 162 of same row substantially, and coats corresponding connecting line 163.
As shown in Figure 6, then in the sensing area 10S of ground 10, form one second transparency conducting layer 20.Second transparency conducting layer 20 can be various transparent conductive material and constitutes, and for example physical vapour deposition (PVD) or chemical vapor deposition form to utilize various thin film technique.For example, in the present embodiment, first transparency conducting layer 12 is to select the amorphous tin indium oxide for use, and utilizes sputtering way to form, but not as limit.
As shown in Figure 7, carry out one the 3rd wire mark manufacturing process subsequently, on second transparency conducting layer 20, form one second sacrificial pattern layer 22, and utilize the second sacrificial pattern layer, 22 patterning, second transparency conducting layer 20, to form a bridging line patterned layer 24.In the present embodiment; The second sacrificial pattern layer 22 comprises a pattern etched barrier layer; Therefore the step of patterning second transparency conducting layer 20 comprises and utilizes the pattern etched barrier layer to carry out one second etching manufacturing process as etch shield, is not patterned second transparency conducting layer 20 that etch barrier covers and forms bridging line patterned layer 24 to remove.What be worth explanation is; Because the sensor pad patterned layer 16 of present embodiment is after having experienced the first tempering manufacturing process; Its material has changed the polycrystalline tin indium oxide into; Therefore the second etching manufacturing process only can be carried out etching to second transparency conducting layer 20 that is made up of the amorphous tin indium oxide, and can not carry out etching to first transparency conducting layer 16 that is made up of the polycrystalline tin indium oxide, so can effectively avoid first transparency conducting layer 16 in the process of the second etching manufacturing process, to sustain damage.
Like Fig. 8 and shown in Figure 9; Then remove the second sacrificial pattern layer 22; To expose bridging line patterned layer 24; Wherein bridging line patterned layer 24 comprises a plurality of bridging lines 241, and corresponding respectively each island insulation system 181 also protrudes in island insulation system 181 and contact with two adjacent second sensor pads 162, and two adjacent second sensor pads 162 can be via bridging line 241 electric connections by this.In the present embodiment, the live width of each bridging line 241 is substantially between 50 microns and 500 microns, but not as limit.In addition, the distance B of the side of each island insulation system 181 and the corresponding side of corresponding bridging line 241 is substantially between 50 microns and 500 microns, but not as limit.In addition, after forming bridging line patterned layer 24, optionally carry out one second tempering manufacturing process, to change the kenel of bridging line patterned layer 24, for example the material with bridging line patterned layer 24 is the polycrystalline tin indium oxide by amorphous tin indium oxide upgrading.Subsequently; Carry out one the 4th wire mark manufacturing process; Be connected lead 26 in the 10P of the surrounding zone of ground 10, to form a plurality of with sensor pad patterned layer 16 electrically connects, the input signal that by this sensor pad patterned layer 16 is sensed is passed to sensing circuit (scheming not show).In the present embodiment, connect lead 26 and can be for example silver-colored lead, and the live width that connects lead 26 is substantially between 10 microns and 300 microns, and thickness is substantially between 1 micron and 10 microns, but not as limit.Connect lead 26 and also can be individual layer or the composite bed lead that other conductive material constitutes, and its width also can be done appropriateness adjustment with thickness.Afterwards, on ground 10, form a protective seam 27 (Fig. 7 does not show).
Make in the method for contact panel in the present invention, patterning first transparency conducting layer 12 is not limited to use the pattern etched barrier layer with the step of patterning second transparency conducting layer 20, and can have other to implement the appearance attitude.Please refer to Figure 10 to Figure 13, and please in the lump referring to figs. 1 to Fig. 9.Figure 10 to Figure 13 has illustrated another of step of patterning first transparency conducting layer and patterning second transparency conducting layer of first preferred embodiment of the present invention and has implemented appearance attitude.The manufacturing process of patterning first transparency conducting layer can be carried out according to the following step.Shown in figure 10, after forming first transparency conducting layer 12, carry out the first wire mark manufacturing process, on first transparency conducting layer 12, form one first sacrificial pattern layer 28.The first sacrificial pattern layer 14 that is different from Fig. 2, the first sacrificial pattern layer 28 of this enforcement appearance attitude is to select a pattern etched pulp layer (etching paste) for use.Shown in figure 11, then utilize the etching of pattern etched pulp layer to be positioned at first transparency conducting layer 12 of pattern etched pulp layer below, to define first sensor pad 161, second sensor pad 162 and connecting line 163.Remove the first sacrificial pattern layer 28 subsequently again.In addition, the manufacturing process of patterning second transparency conducting layer can be carried out according to the following step.Shown in figure 12, after forming second transparency conducting layer 20, carry out the 3rd wire mark manufacturing process, on second transparency conducting layer 20, form one second sacrificial pattern layer 30.The second sacrificial pattern layer 22 that is different from Fig. 7, the second sacrificial pattern layer 30 of this enforcement appearance attitude is to select the pattern etched pulp layer for use.Shown in figure 13, then utilize the etching of pattern etched pulp layer to be positioned at second transparency conducting layer 20 of pattern etched pulp layer below, to define bridging line patterned layer 24.Remove the second sacrificial pattern layer 30 subsequently again.
Please refer to Figure 14 to Figure 20.Figure 14 to Figure 20 has illustrated the synoptic diagram of method of the making contact panel of second preferred embodiment of the present invention.For the purpose of simplifying the description; Do not remake and repeat to give unnecessary details for second embodiment part that is basically the same as those in the first embodiment, and show characteristic of the present invention for clear, Figure 15 and Figure 19 look synoptic diagram on being; Figure 14, Figure 16 to Figure 18, and Figure 20 is the diagrammatic cross-section that the hatching line B-B ' direction along Figure 15 illustrates.Shown in figure 14, a ground 50 at first is provided, and ground 50 comprises a sensing area 50S at least in order to sensing element to be set, and a surrounding zone 50P is in order to be provided with the connection lead.Then, in the sensing area 50S of ground 50, form one second transparency conducting layer 52.Subsequently, carry out one the 3rd wire mark manufacturing process, on second transparency conducting layer 52, form one second sacrificial pattern layer 54, and utilize the second sacrificial pattern layer, 54 patterning, second transparency conducting layer 52, to form a bridging line patterned layer 56.In the present embodiment; The second sacrificial pattern layer 54 is to select the pattern etched barrier layer for use; And utilize the pattern etched barrier layer to carry out one second etching manufacturing process as etch shield, form bridging line patterned layer 56 to remove second transparency conducting layer 52 that is not patterned the etch barrier covering.Yet the second sacrificial pattern layer 54 is not limited to select for use the pattern etched barrier layer, also can select the pattern etched pulp layer for use.
Like Figure 15 and shown in Figure 16, then remove the second sacrificial pattern layer 54, to expose bridging line patterned layer 56, wherein bridging line patterned layer 56 comprises a plurality of bridging lines 561.In addition, after forming bridging line patterned layer 56, optionally carry out one second tempering manufacturing process.Subsequently; Carry out one second wire mark manufacturing process; In the sensing area 50S of ground 50, to form a patterned insulation layer 58, wherein patterned insulation layer 58 comprises a plurality of island insulation systems 581, respectively corresponding substantially each bridging line 561; And the length of island insulation system 581 is less than the length of bridging line 561, so the two ends of bridging line 561 can be exposed to outside the island insulation system 581.
Shown in figure 17, then in the sensing area 50S of ground 50, form one first transparency conducting layer 60.Shown in figure 18, carry out one first wire mark manufacturing process subsequently, on first transparency conducting layer 60, form one first sacrificial pattern layer 62, and utilize the first sacrificial pattern layer, 62 patterning, first transparency conducting layer 60.In the present embodiment; The first sacrificial pattern layer 62 is to select the pattern etched barrier layer for use; And utilize the pattern etched barrier layer to carry out one first etching manufacturing process as etch shield, form sensor pad patterned layer 64 to remove first transparency conducting layer 60 that is not patterned the etch barrier covering.The first sacrificial pattern layer 62 is not limited to select for use the pattern etched barrier layer, also can select the pattern etched pulp layer for use.
Like Figure 19 and shown in Figure 20, then remove the first sacrificial pattern layer 62, to expose a sensor pad patterned layer 64.Sensor pad patterned layer 64 comprises a plurality of sensor pads; For example a plurality of first sensor pads 641 and a plurality of second sensor pads 642; And a plurality of connecting lines 643; Wherein first sensor pad 641 is to arrange along a first direction (the for example vertical direction of Figure 19); And two adjacent first sensor pads 641 that are positioned at delegation are connected to each other through connecting line 643, and second sensor pad 642 is to arrange along a second direction (the for example horizontal direction of Figure 19), and two adjacent second sensor pads 642 that are positioned at same row are connected to each other through corresponding bridging line 561.Bridging line 561 is coated by 64 of sensor pad patterned layer fully, can avoid bridging line 561 when etching sensor pad patterned layer 64, to be etched to by this.In addition, after forming sensor pad patterned layer 64, optionally carry out one first tempering manufacturing process.Subsequently, carry out one the 4th wire mark manufacturing process, with in the 50P of the surrounding zone of ground 50, form a plurality of with 64 electric connections of sensor pad patterned layer be connected lead 66.Afterwards, on ground 50, form a protective seam 67 (Figure 17 does not show).
The employed ground of method that the present invention makes contact panel can be various soft substrate plate, or hard substrate for example glass substrate, plastic base or quartz base plate etc.In addition, the present invention's method of making contact panel also can be integrated to produce touch-control display panel with display panel.Please refer to Figure 21 and Figure 22.Figure 21 and Figure 22 have illustrated the present invention and have made the synoptic diagram of two preferred embodiments in addition of the method for contact panel.Shown in figure 21, the ground 50 of contact panel can be an assisting base plate, and after contact panel completes, is pasted on the display panel 80 (a for example display panels).In another embodiment, shown in the 22nd figure, contact panel can be shared same grounds (substrate) with display panel 80, that is the ground 50 of contact panel is the substrate of display panel 80, for example a colorized optical filtering glass substrate.After contact panel completes, again glass substrate and other element are assembled into a touch-control display panel.
In sum; The present invention makes the method for contact panel and utilizes the wire mark manufacturing process to form the sacrificial pattern layer in order to definition sensor pad patterned layer and bridging line patterned layer; Therefore compared to the existing method of using yellow light lithography manufacturing process, the present invention makes the method for contact panel can significantly save cost.
The above is merely preferred embodiment of the present invention, and all equalizations of being done according to claim scope of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (18)
1. a method of making contact panel is characterized in that, described method comprises:
One ground is provided, and described ground comprises a sensing area;
In the described sensing area of described ground, form one first transparency conducting layer;
Carry out one first wire mark manufacturing process, on described first transparency conducting layer, form one first sacrificial pattern layer, and utilize described first transparency conducting layer of the described first sacrificial pattern patterned, to form a sensor pad patterned layer;
Carry out one first tempering manufacturing process, described sensor pad patterned layer is carried out tempering;
Carry out one second wire mark manufacturing process, in the described sensing area of described ground, form a patterned insulation layer, described patterned insulation layer comprises a plurality of island insulation systems;
In the described sensing area of described ground, form one second transparency conducting layer; And
Carry out one the 3rd wire mark manufacturing process; On described second transparency conducting layer, form one second sacrificial pattern layer; And utilize described second transparency conducting layer of the described second sacrificial pattern patterned; To form a bridging line patterned layer, described bridging line patterned layer comprises a plurality of bridging lines, and respectively corresponding each the described island insulation system of each described bridging line.
2. the method for making contact panel as claimed in claim 1; It is characterized in that; The wherein said first sacrificial pattern layer comprises a pattern etched barrier layer; And the step of described first transparency conducting layer of patterning comprises carries out one first etching manufacturing process, removes described first transparency conducting layer that is not covered by described pattern etched barrier layer.
3. the method for making contact panel as claimed in claim 1; It is characterized in that; The wherein said first sacrificial pattern layer comprises a pattern etched pulp layer, and the step of described first transparency conducting layer of patterning comprises described first transparency conducting layer that utilizes described pattern etched pulp layer to remove to be positioned at described pattern etched pulp layer below.
4. the method for making contact panel as claimed in claim 1; It is characterized in that; The wherein said second sacrificial pattern layer comprises a pattern etched barrier layer; And the step of described second transparency conducting layer of patterning comprises carries out one second etching manufacturing process, removes described second transparency conducting layer that is not covered by described pattern etched barrier layer.
5. the method for making contact panel as claimed in claim 1; It is characterized in that; The wherein said second sacrificial pattern layer comprises a pattern etched pulp layer, and the step of described second transparency conducting layer of patterning comprises described second transparency conducting layer that utilizes described pattern etched pulp layer to remove to be positioned at described pattern etched pulp layer below.
6. the method for making contact panel as claimed in claim 1 is characterized in that, wherein said sensor pad patterned layer comprises a plurality of first sensor pads, a plurality of second sensor pad and a plurality of connecting line.
7. the method for making contact panel as claimed in claim 1 is characterized in that, the material of wherein said sensor pad patterned layer comprises the polycrystalline tin indium oxide.
8. the method for making contact panel as claimed in claim 1 is characterized in that, described method is included in addition and forms after the described bridging line patterned layer, carries out one second tempering manufacturing process.
9. the method for making contact panel as claimed in claim 1 is characterized in that, wherein said sensor pad patterned layer comprises a plurality of sensor pads, and two adjacent sensor pads have a gap, and described gap is substantially between 30 microns and 500 microns.
10. the method for making contact panel as claimed in claim 1 is characterized in that, wherein a live width of each described bridging line is substantially between 50 microns and 500 microns.
11. the method for making contact panel as claimed in claim 1; It is characterized in that; Wherein each described island insulation system has a side; And each described bridging line has a side, and a distance of the corresponding described side of the described side of each described island insulation system and corresponding described bridging line is substantially between 50 microns and 500 microns.
12. the method for making contact panel as claimed in claim 1; It is characterized in that; Wherein said ground comprises a surrounding zone in addition; And described method comprises in addition carries out one the 4th wire mark manufacturing process, in the described surrounding zone of described ground, to form a plurality of and the lead that is connected of described sensor pad patterned layer electric connection.
13. the method for making contact panel as claimed in claim 12; It is characterized in that; Wherein a live width of each described connection lead is substantially between 10 microns and 300 microns, and a thickness of each described connection lead is substantially between 1 micron and 10 microns.
14. the method for making contact panel as claimed in claim 1 is characterized in that, wherein said ground comprises an assisting base plate.
15. the method for making contact panel as claimed in claim 14 is characterized in that, described method comprises in addition described assisting base plate is pasted on the display panel.
16. the method for making contact panel as claimed in claim 1 is characterized in that, wherein said ground comprises a display panel.
17. the method for making contact panel as claimed in claim 1 is characterized in that, wherein said ground comprises a glass substrate.
18. the method for making contact panel as claimed in claim 17 is characterized in that, described method comprises in addition described glass substrate is assembled into a touch-control display panel.
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| CN102682875A (en) * | 2011-03-16 | 2012-09-19 | 智盛全球股份有限公司 | Transparent conductive structure for touch panel and manufacturing method thereof |
| CN102902446A (en) * | 2012-10-26 | 2013-01-30 | 信利光电(汕尾)有限公司 | Capacitive type touch screen and manufacturing method thereof |
| CN103500036B (en) | 2013-08-30 | 2015-04-29 | 京东方科技集团股份有限公司 | Manufacturing method for touch screen |
| US9430109B2 (en) | 2013-08-30 | 2016-08-30 | Boe Technology Group Co., Ltd. | Touch screen panel and method for manufacturing the same, and display device |
| CN103455203A (en) * | 2013-08-30 | 2013-12-18 | 京东方科技集团股份有限公司 | Touch screen, manufacturing method of touch screen and display device |
| US9433102B2 (en) | 2013-08-30 | 2016-08-30 | Boe Technology Group Co., Ltd. | Touch screen panel and method for manufacturing the same, and display device |
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