CN102566811B - Touch panel fabrication method - Google Patents
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- CN102566811B CN102566811B CN201110294137.9A CN201110294137A CN102566811B CN 102566811 B CN102566811 B CN 102566811B CN 201110294137 A CN201110294137 A CN 201110294137A CN 102566811 B CN102566811 B CN 102566811B
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Abstract
The invention relates to a touch screen fabrication method. The method comprises the steps of providing a substrate; forming a first transparent conductive layer on the substrate; carrying out a first screen printing process to form a first sacrificed pattern layer on the first transparent conductive layer; patterning the first transparent conductive layer by use of the first sacrificed pattern layer to form a sensing pad pattern layer; carrying out a second screen printing process to form a patterned insulation layer on the substrate; forming a second transparent conductive layer on the substrate; carrying out a third screen printing process to form a second sacrificed pattern layer on the second transparent conductive layer; patterning the second transparent conductive layer by use of the second sacrificed patter layer to form a bridge connection pattern layer.
Description
The application is that application number is " 200910262782.5 ", the applying date to be the divisional application that " on Dec 28th, 2009 ", invention and created name are the patented claim of " making the method for contact panel ".
Technical field
The invention relates to a kind of method of making contact panel, espespecially a kind of method of utilizing wire mark manufacturing process to form sensor pad patterned layer, patterned insulation layer and the bridging line patterned layer of contact panel.
Background technology
In the market of various consumption electronic products now, the portable electronic products such as mobile phone (mobile phone), satellite navigation system (GPS) and digital audio-video player use contact panel (touch panel) to link up interface as people's machine data widely.Stress compactly due to the at present design of consumption electronic products, wish can save traditional input media such as the button and the mouse etc. that take up space in product design, therefore employing touch control manner is inputted, therefore contact panel has become one of crucial spare part.
Distinguish with touch-control principle, existing contact panel mainly can be divided into resistance/contact contact panel (resistance/contact touch panel) and two types of capacitance type touch-control panels (capacitive touch panel), and wherein capacitance type touch-control panel is main product in the market.The retes such as sensor pad, insulation course and the bridging line of existing capacitance type touch-control panel are formed in yellow light lithography mode, therefore make cost of manufacture expensive and affected the popularization degree of capacitance type touch-control panel.
Summary of the invention
One of object of the present invention is to provide a kind of method of making contact panel, to save the cost of manufacture of contact panel.
A preferred embodiment of the present invention provides a kind of method of making contact panel, comprises the following steps.
One ground is provided, and described ground comprises a sensing area;
In the described sensing area of described ground, form one first transparency conducting layer;
Carry out the first wire mark manufacturing process, on the first described transparency conducting layer, form the first sacrificial pattern layer, and utilize the first transparency conducting layer described in the first described sacrificial pattern layer pattern, to form bridging line patterned layer, described bridging line patterned layer comprises a plurality of bridging lines;
Carry out one first tempering manufacturing process, described bridging line patterned layer is carried out to tempering;
Carry out one second wire mark manufacturing process, in the described sensing area of described ground, form a patterned insulation layer, described patterned insulation layer comprises a plurality of island insulation systems, and each described bridging line corresponding each described island insulation system respectively;
In the described sensing area of described ground, form one second transparency conducting layer; And
Carry out the 3rd wire mark manufacturing process, on the second described transparency conducting layer, form the second sacrificial pattern layer, and utilize the second transparency conducting layer described in the second described sacrificial pattern layer pattern, to form sensor pad patterned layer.
Making the method for contact panel due to the present invention utilizes wire mark manufacturing process to form in order to define the sacrificial pattern layer of sensor pad patterned layer and bridging line patterned layer, therefore compared to the method for the yellow light lithography manufacturing process of existing use, the present invention makes the method for contact panel can significantly save cost.
Brief description of the drawings
Fig. 1 to Fig. 9 has illustrated the schematic diagram of the method for the making contact panel of the first preferred embodiment of the present invention.
Figure 10 to Figure 13 has illustrated another enforcement sample state of patterning first transparency conducting layer of the first preferred embodiment of the present invention and the step of patterning the second transparency conducting layer.
Figure 14 to Figure 20 has illustrated the schematic diagram of the method for the making contact panel of the second preferred embodiment of the present invention.
Figure 21 and Figure 22 have illustrated the present invention makes the schematic diagram of another two preferred embodiments of the method for contact panel.
Drawing reference numeral:
10 ground 10S sensing areas
14 first sacrificial pattern layer 16 sensor pad patterned layer
161 first sensor pad 162 second sensor pads
163 connecting line 18 patterned insulation layers
181 island insulation system 20 second transparency conducting layers
22 second sacrificial pattern layer 24 bridging line patterned layer
241 bridging lines 26 connect wire
27 protective seam 28 first sacrificial pattern layers
30 second sacrificial pattern layer 50 ground
52 second transparency conducting layer 54 second sacrificial pattern layers
56 bridging line patterned layer 561 bridging lines
58 patterned insulation layer 581 island insulation systems
60 first transparency conducting layer 62 first sacrificial pattern layers
64 sensor pad patterned layer 641 first sensor pads
642 second sensor pad 643 connecting lines
66 connect wire 67 protective seams
80 display panels
Embodiment
For making the general technology person who is familiar with the technical field of the invention can further understand the present invention, below spy enumerates preferred embodiment of the present invention, and coordinate appended graphic, describe in detail constitution content of the present invention and effect of wanting to reach.In addition, hereinafter, " first ", " second ", " the 3rd " from " the 4th " etc. term be to distinguish different elements or manufacturing process, do not represent to its order restriction.
Please refer to Fig. 1 to Fig. 9.Fig. 1 to Fig. 9 has illustrated the schematic diagram of the method for the making contact panel of the first preferred embodiment of the present invention, it is wherein clear demonstration feature of the present invention, Fig. 3 and Fig. 8 on look schematic diagram, Fig. 1, Fig. 2, Fig. 4 to Fig. 7 and Fig. 9 are the diagrammatic cross-sections illustrating along the hatching line A-A ' direction of Fig. 3.As shown in Figure 1, first provide a ground 10, and ground 10 at least comprises that a sensing area 10S is in order to sensing element to be set, and a surrounding zone 10P is in order to arrange connection wire.Then, in the sensing area 10S of ground 10, form one first transparency conducting layer 12.The first transparency conducting layer 12 can be various transparent conductive material and forms, and utilizes for example physical vapour deposition (PVD) of various thin film technique or chemical vapor deposition to be formed.For example, in the present embodiment, the first transparency conducting layer 12 is to select amorphous tin indium oxide (amorphous ITO), and utilizes sputtering way to form, but not as limit.
As shown in Figure 2, carry out subsequently one first wire mark manufacturing process, on the first transparency conducting layer 12, form one first sacrificial pattern layer 14, and utilize first sacrificial pattern layer 14 patterning the first transparency conducting layer 12, to form a sensor pad patterned layer 16.In the present embodiment, the first sacrificial pattern layer 14 comprises a pattern etched barrier layer (etching resistance), therefore the step of patterning the first transparency conducting layer 12 comprises and utilizes pattern etched barrier layer to carry out one first etching manufacturing process as etch shield, is not patterned the first transparency conducting layer 12 that etch barrier covers and forms sensor pad patterned layer 16 to remove.The first etching manufacturing process can be and for example uses the Wet-type etching manufacturing process of oxalic acid as etching solution, but not as limit, and the material of visual the first transparency conducting layer 12 is selected different and select other etching solution, or use dry-etching manufacturing process.In addition, impaired in follow-up etching manufacturing process for fear of sensor pad patterned layer 16, after forming sensor pad patterned layer 16, optionally carry out a upgrading manufacturing process, for example one first tempering manufacturing process, to change the kenel of sensor pad patterned layer 16.For example, the material of the sensor pad patterned layer 16 of the present embodiment is amorphous tin indium oxide originally, can be polycrystalline tin indium oxide (poly ITO) by the material upgrading of sensor pad patterned layer 16 and see through the first tempering manufacturing process.
As shown in Figure 3 and Figure 4, then remove the first sacrificial pattern layer 14, to expose sensor pad patterned layer 16.Sensor pad patterned layer 16 comprises a plurality of sensor pads, for example a plurality of the first sensor pads 161 and a plurality of the second sensor pads 162, and a plurality of connecting lines 163, wherein the first sensor pad 161 for example, is arranged along a first direction (vertical direction of Fig. 3), and two adjacent the first sensor pads 161 that are positioned at same a line are connected to each other by connecting line 163, and the second sensor pad 162 for example, is arranged along a second direction (horizontal direction of Fig. 3), and the second sensor pad 162 that is positioned at same row does not connect each other.In addition, in the present embodiment, two adjacent sensor pads, for example the first adjacent sensor pad 161 and the second sensor pad 162 have a clearance G, and clearance G is substantially between 30 microns and 500 microns, but not as limit.
As shown in Figure 5, carry out subsequently one second wire mark manufacturing process, to form a patterned insulation layer 18 in the sensing area 10S of ground 10, wherein patterned insulation layer 18 comprises a plurality of island insulation systems (insulating island) 181, correspond respectively to substantially the position between two adjacent the second sensor pads 162 of same row, and coated corresponding connecting line 163.
As shown in Figure 6, then in the sensing area 10S of ground 10, form one second transparency conducting layer 20.The second transparency conducting layer 20 can be various transparent conductive material and forms, and utilizes for example physical vapour deposition (PVD) of various thin film technique or chemical vapor deposition to be formed.For example, in the present embodiment, the first transparency conducting layer 12 is to select amorphous tin indium oxide, and utilizes sputtering way to form, but not as limit.
As shown in Figure 7, carry out subsequently one the 3rd wire mark manufacturing process, on the second transparency conducting layer 20, form one second sacrificial pattern layer 22, and utilize second sacrificial pattern layer 22 patterning the second transparency conducting layer 20, to form a bridging line patterned layer 24.In the present embodiment, the second sacrificial pattern layer 22 comprises a pattern etched barrier layer, therefore the step of patterning the second transparency conducting layer 20 comprises and utilizes pattern etched barrier layer to carry out one second etching manufacturing process as etch shield, is not patterned the second transparency conducting layer 20 that etch barrier covers and forms bridging line patterned layer 24 to remove.What deserves to be explained is, because the sensor pad patterned layer 16 of the present embodiment is experiencing after the first tempering manufacturing process, its material has changed polycrystalline tin indium oxide into, therefore the second etching manufacturing process only can be carried out etching for the second transparency conducting layer 20 being made up of amorphous tin indium oxide, and can not carry out etching to the first transparency conducting layer 16 being formed by polycrystalline tin indium oxide, therefore can effectively avoid the first transparency conducting layer 16 to sustain damage in the process of the second etching manufacturing process.
As shown in Fig. 8 and Fig. 9, then remove the second sacrificial pattern layer 22, to expose bridging line patterned layer 24, wherein bridging line patterned layer 24 comprises a plurality of bridging lines 241, corresponding each island insulation system 181 protrude from island insulation system 181 and contact with two adjacent the second sensor pads 162 respectively, two adjacent the second sensor pads 162 can be electrically connected via bridging line 241 by this.In the present embodiment, the live width of each bridging line 241 is substantially between 50 microns and 500 microns, but not as limit.In addition, the distance B of the side of each island insulation system 181 and the corresponding side of corresponding bridging line 241 is substantially between 50 microns and 500 microns, but not as limit.In addition, after forming bridging line patterned layer 24, optionally carrying out one second tempering manufacturing process, to change the kenel of bridging line patterned layer 24, for example, is polycrystalline tin indium oxide by the material of bridging line patterned layer 24 by amorphous tin indium oxide upgrading.Subsequently, carry out one the 4th wire mark manufacturing process, be connected wire 26 with what form in the 10P of the surrounding zone of ground 10 that a plurality of are electrically connected with sensor pad patterned layer 16, the input signal by this sensor pad patterned layer 16 being sensed is passed to sensing circuit (not shown).In the present embodiment, connect wire 26 and can be for example silver-colored wire, and the live width that connects wire 26 is substantially between 10 microns and 300 microns, and thickness is substantially between 1 micron and 10 microns, but not as limit.Connect wire 26 and also can be individual layer or the composite bed wire that other conductive material forms, and its width also can be done appropriateness adjustment with thickness.Afterwards, on ground 10, form a protective seam 27 (Fig. 7 does not show).
Make in the method for contact panel in the present invention, patterning the first transparency conducting layer 12 is not limited to use pattern etched barrier layer with the step of patterning the second transparency conducting layer 20, and can have other to implement sample state.Please refer to Figure 10 to Figure 13, and please also refer to Fig. 1 to Fig. 9.Figure 10 to Figure 13 has illustrated another enforcement sample state of patterning first transparency conducting layer of the first preferred embodiment of the present invention and the step of patterning the second transparency conducting layer.The manufacturing process of patterning the first transparency conducting layer can be carried out according to the following step.As shown in figure 10, after forming the first transparency conducting layer 12, carry out the first wire mark manufacturing process, on the first transparency conducting layer 12, form one first sacrificial pattern layer 28.Be different from the first sacrificial pattern layer 14 of Fig. 2, the first sacrificial pattern layer 28 of this enforcement sample state is to select a pattern etched pulp layer (etching paste).As shown in figure 11, then utilize the etching of pattern etched pulp layer to be positioned at the first transparency conducting layer 12 of pattern etched pulp layer below, to define the first sensor pad 161, the second sensor pad 162 and connecting line 163.Remove again subsequently the first sacrificial pattern layer 28.In addition, the manufacturing process of patterning the second transparency conducting layer can be carried out according to the following step.As shown in figure 12, after forming the second transparency conducting layer 20, carry out the 3rd wire mark manufacturing process, on the second transparency conducting layer 20, form one second sacrificial pattern layer 30.Be different from the second sacrificial pattern layer 22 of Fig. 7, the second sacrificial pattern layer 30 of this enforcement sample state is to select pattern etched pulp layer.As shown in figure 13, then utilize the etching of pattern etched pulp layer to be positioned at the second transparency conducting layer 20 of pattern etched pulp layer below, to define bridging line patterned layer 24.Remove again subsequently the second sacrificial pattern layer 30.
Please refer to Figure 14 to Figure 20.Figure 14 to Figure 20 has illustrated the schematic diagram of the method for the making contact panel of the second preferred embodiment of the present invention.For the purpose of simplifying the description, no longer repeat for the second embodiment part that is basically the same as those in the first embodiment, and show feature of the present invention for clear, Figure 15 and Figure 19 on look schematic diagram, Figure 14, Figure 16 to Figure 18, and Figure 20 is the diagrammatic cross-section illustrating along the hatching line B-B ' direction of Figure 15.As shown in figure 14, first provide a ground 50, and ground 50 at least comprises that a sensing area 50S is in order to sensing element to be set, and a surrounding zone 50P is in order to arrange connection wire.Then, in the sensing area 50S of ground 50, form one second transparency conducting layer 52.Subsequently, carry out one the 3rd wire mark manufacturing process, on the second transparency conducting layer 52, form one second sacrificial pattern layer 54, and utilize second sacrificial pattern layer 54 patterning the second transparency conducting layer 52, to form a bridging line patterned layer 56.In the present embodiment, the second sacrificial pattern layer 54 is to select pattern etched barrier layer, and utilize pattern etched barrier layer to carry out one second etching manufacturing process as etch shield, be not patterned the second transparency conducting layer 52 that etch barrier covers and form bridging line patterned layer 56 to remove.But the second sacrificial pattern layer 54 is not limited to select pattern etched barrier layer, also can select pattern etched pulp layer.
As shown in Figure 15 and Figure 16, then remove the second sacrificial pattern layer 54, to expose bridging line patterned layer 56, wherein bridging line patterned layer 56 comprises a plurality of bridging lines 561.In addition, after forming bridging line patterned layer 56, optionally carry out one second tempering manufacturing process.Subsequently, carry out one second wire mark manufacturing process, to form a patterned insulation layer 58 in the sensing area 50S of ground 50, wherein patterned insulation layer 58 comprises a plurality of island insulation systems 581, distinguish substantially corresponding each bridging line 561, and the length of island insulation system 581 is less than the length of bridging line 561, therefore the two ends of bridging line 561 can be exposed to outside island insulation system 581.
As shown in figure 17, then in the sensing area 50S of ground 50, form one first transparency conducting layer 60.As shown in figure 18, carry out subsequently one first wire mark manufacturing process, on the first transparency conducting layer 60, form one first sacrificial pattern layer 62, and utilize first sacrificial pattern layer 62 patterning the first transparency conducting layer 60.In the present embodiment, the first sacrificial pattern layer 62 is to select pattern etched barrier layer, and utilize pattern etched barrier layer to carry out one first etching manufacturing process as etch shield, be not patterned the first transparency conducting layer 60 that etch barrier covers and form sensor pad patterned layer 64 to remove.The first sacrificial pattern layer 62 is not limited to select pattern etched barrier layer, also can select pattern etched pulp layer.
As shown in Figure 19 and Figure 20, then remove the first sacrificial pattern layer 62, to expose a sensor pad patterned layer 64.Sensor pad patterned layer 64 comprises a plurality of sensor pads, for example a plurality of the first sensor pads 641 and a plurality of the second sensor pads 642, and a plurality of connecting lines 643, wherein the first sensor pad 641 is for example, to arrange along a first direction (vertical direction of Figure 19), and two adjacent the first sensor pads 641 that are positioned at same a line are connected to each other by connecting line 643, and the second sensor pad 642 is for example, to arrange along a second direction (horizontal direction of Figure 19), and two adjacent the second sensor pads 642 that are positioned at same row are connected to each other by corresponding bridging line 561.64 of the sensed pad patterned layer of bridging line 561 are completely coated, can avoid by this bridging line 561 to be etched in the time of etching sensor pad patterned layer 64.In addition,, after forming sensor pad patterned layer 64, optionally carry out one first tempering manufacturing process.Subsequently, carry out one the 4th wire mark manufacturing process, be connected wire 66 with what form in the 50P of the surrounding zone of ground 50 that a plurality of are electrically connected with sensor pad patterned layer 64.Afterwards, on ground 50, form a protective seam 67 (Figure 17 does not show).
The present invention makes the ground that the method for contact panel uses and can be various soft substrate plate, or hard substrate such as glass substrate, plastic base or quartz base plate etc.In addition, the method that the present invention makes contact panel also can integrate to produce touch-control display panel with display panel.Please refer to Figure 21 and Figure 22.Figure 21 and Figure 22 have illustrated the present invention makes the schematic diagram of another two preferred embodiments of the method for contact panel.As shown in figure 21, the ground 50 of contact panel can be an assisting base plate, and for example after contact panel completes, is pasted to, on a display panel 80 (display panels).In another embodiment, as shown in the 22nd figure, contact panel can be shared same ground (substrate) with display panel 80, that is the ground 50 of contact panel is the substrate of display panel 80, a for example colorized optical filtering glass substrate.After contact panel completes, then glass substrate and other element are assembled into a touch-control display panel.
In sum, the present invention makes the method for contact panel and utilizes wire mark manufacturing process to form in order to define the sacrificial pattern layer of sensor pad patterned layer and bridging line patterned layer, therefore compared to the method for the yellow light lithography manufacturing process of existing use, the present invention makes the method for contact panel can significantly save cost.
The foregoing is only preferred embodiment of the present invention, all equalizations of doing according to the claims in the present invention scope change and modify, and all should belong to covering scope of the present invention.
Claims (18)
1. a method of making contact panel, is characterized in that, described method comprises:
One ground is provided, and described ground comprises a sensing area;
In the described sensing area of described ground, form one first transparency conducting layer;
Carry out the first wire mark manufacturing process, on the first described transparency conducting layer, form the first sacrificial pattern layer, and utilize the first transparency conducting layer described in the first described sacrificial pattern layer pattern, to form bridging line patterned layer, described bridging line patterned layer comprises a plurality of bridging lines;
Carry out one first tempering manufacturing process, described bridging line patterned layer is carried out to tempering;
Carry out one second wire mark manufacturing process, in the described sensing area of described ground, form a patterned insulation layer, described patterned insulation layer comprises a plurality of island insulation systems, and each described bridging line corresponding each described island insulation system respectively;
In the described sensing area of described ground, form one second transparency conducting layer; And
Carry out the 3rd wire mark manufacturing process, on the second described transparency conducting layer, form the second sacrificial pattern layer, and utilize the second transparency conducting layer described in the second described sacrificial pattern layer pattern, to form sensor pad patterned layer.
2. the method for making contact panel as claimed in claim 1, it is characterized in that, the first wherein said sacrificial pattern layer comprises a pattern etched barrier layer, and the step of the first transparency conducting layer described in patterning comprises carries out one first etching manufacturing process, remove the first described transparency conducting layer not covered by described pattern etched barrier layer.
3. the method for making contact panel as claimed in claim 1, it is characterized in that, the first wherein said sacrificial pattern layer comprises a pattern etched pulp layer, and the step of the first transparency conducting layer described in patterning comprises the first described transparency conducting layer that utilizes described pattern etched pulp layer to remove to be positioned at described pattern etched pulp layer below.
4. the method for making contact panel as claimed in claim 1, it is characterized in that, the second wherein said sacrificial pattern layer comprises a pattern etched barrier layer, and the step of the second transparency conducting layer described in patterning comprises carries out one second etching manufacturing process, remove the second described transparency conducting layer not covered by described pattern etched barrier layer.
5. the method for making contact panel as claimed in claim 1, it is characterized in that, the second wherein said sacrificial pattern layer comprises a pattern etched pulp layer, and the step of the second transparency conducting layer described in patterning comprises the second described transparency conducting layer that utilizes described pattern etched pulp layer to remove to be positioned at described pattern etched pulp layer below.
6. the method for making contact panel as claimed in claim 1, is characterized in that, wherein sensor pad patterned layer comprises a plurality of the first sensor pads, a plurality of the second sensor pad and a plurality of connecting line.
7. the method for making contact panel as claimed in claim 1, is characterized in that, wherein the material of sensor pad patterned layer comprises polycrystalline tin indium oxide.
8. the method for making contact panel as claimed in claim 1, is characterized in that, described method is carried out one second tempering manufacturing process after being separately included in and forming described bridging line patterned layer.
9. the method for making contact panel as claimed in claim 1, is characterized in that, wherein said sensor pad patterned layer comprises a plurality of sensor pads, and two adjacent sensor pads have a gap, and described gap is between 30 microns and 500 microns.
10. the method for making contact panel as claimed in claim 1, is characterized in that, wherein a live width of each described bridging line is between 50 microns and 500 microns.
The method of 11. making contact panels as claimed in claim 1, it is characterized in that, wherein each described island insulation system has a side, and each described bridging line has a side, and the corresponding described side of the described side of each described island insulation system and corresponding described bridging line one apart between 50 microns and 500 microns.
The method of 12. making contact panels as claimed in claim 1, it is characterized in that, wherein said ground separately comprises a surrounding zone, and described method separately comprises carries out one the 4th wire mark manufacturing process, to form the wire that is connected that a plurality of are electrically connected with described sensor pad patterned layer in the described surrounding zone of described ground.
The method of 13. making contact panels as claimed in claim 12, is characterized in that, wherein a live width of each described connection wire is between 10 microns and 300 microns, and a thickness of connection wire described in each is between 1 micron and 10 microns.
The method of 14. making contact panels as claimed in claim 1, is characterized in that, wherein said ground comprises an assisting base plate.
The method of 15. making contact panels as claimed in claim 14, is characterized in that, described method separately comprises described assisting base plate is pasted on a display panel.
The method of 16. making contact panels as claimed in claim 1, is characterized in that, wherein said ground comprises a display panel.
The method of 17. making contact panels as claimed in claim 1, is characterized in that, wherein said ground comprises a glass substrate.
The method of 18. making contact panels as claimed in claim 17, is characterized in that, described method separately comprises described glass substrate is assembled into a touch-control display panel.
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| CN201110294137.9A CN102566811B (en) | 2009-12-28 | 2009-12-28 | Touch panel fabrication method |
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| CN2009102627825A Division CN101751181B (en) | 2009-12-28 | 2009-12-28 | Touch control panel manufacturing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108415602A (en) * | 2018-03-12 | 2018-08-17 | 武汉华星光电半导体显示技术有限公司 | A kind of preparation method of touch-control structure, OLED touch control display apparatus |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111273799B (en) * | 2018-12-04 | 2023-07-21 | 瀚宇彩晶股份有限公司 | Touch display device and manufacturing method thereof |
| CN112241212A (en) * | 2019-07-16 | 2021-01-19 | 中强光电股份有限公司 | Conductive sheet for touch panel and method for manufacturing same |
| CN114489367B (en) * | 2020-11-13 | 2024-09-17 | 瀚宇彩晶股份有限公司 | Electronic device and manufacturing method thereof |
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| CN101470564A (en) * | 2007-12-28 | 2009-07-01 | 财团法人工业技术研究院 | Touching control panel and its manufacturing method |
| CN101533319A (en) * | 2008-03-12 | 2009-09-16 | 台达电子工业股份有限公司 | Touch panel and manufacture method thereof |
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| JP4577109B2 (en) * | 2005-06-20 | 2010-11-10 | パナソニック株式会社 | Touch panel and manufacturing method thereof |
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| CN101470564A (en) * | 2007-12-28 | 2009-07-01 | 财团法人工业技术研究院 | Touching control panel and its manufacturing method |
| CN101533319A (en) * | 2008-03-12 | 2009-09-16 | 台达电子工业股份有限公司 | Touch panel and manufacture method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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