CN101740438B - Silicon wafer transferring arm and use method thereof - Google Patents
Silicon wafer transferring arm and use method thereof Download PDFInfo
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- CN101740438B CN101740438B CN2008100439329A CN200810043932A CN101740438B CN 101740438 B CN101740438 B CN 101740438B CN 2008100439329 A CN2008100439329 A CN 2008100439329A CN 200810043932 A CN200810043932 A CN 200810043932A CN 101740438 B CN101740438 B CN 101740438B
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- arm support
- arm
- silicon chip
- silicon wafer
- wafer transferring
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Abstract
The invention discloses a silicon wafer transferring arm which comprises a plurality of arm brackets, a connector and a driving motor, wherein one end of each arm bracket is connected with the connector; the connector is connected with the driving motor; the number of the arm brackets is four, and the four arm brackets form cross shapes with each other; the arm brackets in the horizontal direction are used for receiving and sending the silicon wafers in the horizontal direction; the arm brackets in the vertical direction are used for transferring the silicon wafers in the vertical direction; the arm bracket at the right side is used for receiving the silicon wafers; the arm bracket at the lower side is used for transferring in the vertical direction; the arm bracket at the left side is used for sending the silicon wafers; and under the rotational driving of a rotational control shaft, the arm brackets in the horizontal direction and the vertical direction can realize function exchange. The invention can carry out silicon wafer transferring operation in a plurality of directions in one arm and simultaneously transfer the silicon wafers in the horizontal direction and the vertical direction. The invention also discloses a use method of the silicon wafer transferring arm.
Description
Technical field
The present invention relates to a kind of semiconductor manufacturing facility, be specifically related to a kind of silicon wafer transferring arm, the invention still further relates to the using method of this silicon wafer transferring arm.
Background technology
At present, employed silicon wafer transferring arm in the manufacture process of integrated circuit, can not realize transmitting silicon chip simultaneously to a plurality of directions (for example level and vertical direction), if desired silicon chip is transmitted to a plurality of directions, then adopt a plurality of independent arms to be used step by step, can not on same arm, finish.
Summary of the invention
Technical problem to be solved by this invention provides a kind of silicon wafer transferring arm, and it can transmit silicon chip to a plurality of directions simultaneously.
For solving the problems of the technologies described above, the technical solution of silicon wafer transferring arm of the present invention is:
Comprise a plurality of arm supports, connector, CD-ROM drive motor; One end of each arm support is connected with connector, and connector is connected with CD-ROM drive motor.Described arm support is four, and described four arm supports form cross each other.Described arm support also can be two, and described two arm supports are orthogonal.
Described arm support comprises and forms scissors-like two clamp holders each other that the tail end of clamp holder connects planetary gear; Two planetary gears are bitten mutually and are closed.Described arm support comprises two pairs or many to clamp holder.
The present invention also provides the using method of this silicon wafer transferring arm, adopts following steps to transmit silicon chip:
The first step makes first-hand arm support, the 3rd arm support be in level, and second-hand's arm support, the 4th arm support are in plumbness; The arm support that is in the right side is used for the reception of silicon chip, and the arm support that is in the below is used for the transmission of vertical direction, and the arm support that is in the left side is used for sending of silicon chip;
In second step, make the arm support that is in the right side receive silicon chip;
The 3rd step turn 90 degrees the connector dextrorotation, made first-hand arm support, the 3rd arm support be in plumbness, and second-hand's arm support, the 4th arm support are in level, realized the arm support exchange function of horizontal direction and vertical direction;
In the 4th step, make the arm support that is in the below carry out the silicon chip operation; Perhaps below directly silicon chip is sent, realize that vertical direction transmits silicon chip; Make the arm support that is in the right side receive silicon chip simultaneously, realize that horizontal direction receives silicon chip.
The 5th the step, make connector once more dextrorotation turn 90 degrees, make first-hand arm support, the 3rd arm support be in level; Silicon chip on the arm support on the left of will being in is sent, and receives new silicon chip by the arm support that is in the right side simultaneously, and the arm support that is in the below is carried out the silicon chip operation.
The technique effect that the present invention can reach is:
The present invention is provided with the arm support of horizontal direction and the arm support of vertical direction, and the arm support of horizontal direction is used for picking of horizontal direction silicon chip, and the arm support of vertical direction is used for the transmission of vertical direction silicon chip.Under the rotation of rotating Control Shaft drove, the arm support of horizontal direction and vertical direction can be realized exchange function.
The present invention can carry out the silicon chip transfer operation of a plurality of directions in same arm, as transmitting silicon chip to horizontal direction and vertical direction simultaneously.
Description of drawings
The present invention is further detailed explanation below in conjunction with the drawings and specific embodiments:
Fig. 1 is the structural representation of silicon wafer transferring arm of the present invention;
Fig. 2 is that each arm support has many structural representations to clamp holder;
Fig. 3 is the structural representation of arm support;
Fig. 4 is the vertical view of Fig. 3;
Fig. 5 is the schematic diagram that the present invention accompanies two pieces of silicon chips;
Fig. 6 is the schematic diagram that Fig. 5 dextrorotation turn 90 degrees.
Among the figure, 1,2,3,4 arm supports, 5 connectors, 10 silicon chips, 11 clamp holders, 12 planetary gears, 13 trough of belt clamps.
Embodiment
As shown in Figure 1, silicon wafer transferring arm of the present invention comprises arm support 1,2,3,4, and arm support is fixedlyed connected with connector 5 respectively, and arm support 1,2,3,4 forms cross each other.Connector 5 is connected with the rotation Control Shaft, rotates Control Shaft and is connected with CD-ROM drive motor.CD-ROM drive motor is by driving the rotation of rotating Control Shaft, the rotation of control connection device 5.
As shown in Figure 3, Figure 4, each arm support comprises that 11, two clamp holders of two clamp holders 11 form the scissors shape, but makes arm support become the clip of folding, and the top of clamp holder 11 (being free end) is arc, and the radian at this radian and silicon chip 10 edges adapts.When closing up, clip can silicon chip 10 be clamped along the circular edge of silicon chip 10.
The arch section of clamp holder 11 is set with a plurality of trough of belt clamps 13, is used for fixing silicon chip.Also can be provided with a plurality of grooves, be used to block silicon chip 10 at the arch section of clamp holder 11.Arm support can be used for fixing the silicon chip of plurality of specifications such as 6 inches, 8 inches, 12 inches, 18 inches.
The tail end of two clamp holders 11 respectively connects a planetary gear 12.Planetary gear 12 is fixedly connected on the connector 5.
Two planetary gears 12 are bitten mutually and are closed, and by the rotation direction of control planetary gear 12, realize the folding of arm support, make arm support can realize clamping fixedly silicon chip and the function that discharges silicon chip.
As shown in Figure 2, each arm support comprises two pairs or many to clamp holder arranged side by side 11, one piece of silicon chip of every pair of clamp holder 11 carryings, and then each arm support can carry many pieces of silicon chips.Each arm support many to clamp holder 11 shared a pair of planetary gears 12 can realize that many pieces of silicon chips operate simultaneously.
The present invention can realize in same arm that a plurality of directions carry out the silicon chip transfer operation simultaneously, as transmitting silicon chip simultaneously with vertical direction in the horizontal direction.The arm support of horizontal direction is realized picking of silicon chip, and the arm support of vertical direction can carry out other operation.
Method of operation of the present invention is as follows:
1, as shown in Figure 5, make arm support 1,3 be in level, arm support 2,4 is in plumbness; The arm support 3 that is in the right side this moment is used for the reception of silicon chip; The arm support 2 that is in the below is used for the transmission of vertical direction, as silicon chip 10 being sent into relevant cavity operation; The arm support 1 that is in the left side is used for sending of silicon chip 10.
2, after silicon chip 10 is sent into arm, receive silicon chip 10 by the arm support 3 that is in the right side; The present invention is turn 90 degrees at the drive backspin that rotates Control Shaft, and this moment, arm support 1,3 was in vertical direction, as shown in Figure 6.
3, make the silicon chip 10 that receives on the arm support 3 that is in the below carry out the silicon chip exchange with relevant device; After exchange finished, the silicon chip 10 on the arm support 3 was the silicon chip of regaining from relevant device.
Arm is revolved under the drive of rotating Control Shaft again turn 90 degrees, this moment, arm support 1,3 was in horizontal direction once more.Silicon chip on the arm support 3 on the left of will being in is sent, and receives new silicon chip by the arm support 4 that is in the right side simultaneously, is in the arm support 2 and the exchange of relevant device execution silicon chip of below this moment.Control Shaft is rotated in rotation successively, carries out the transmission of silicon chip.
The present invention directly sends silicon chip in the time of can be below arm support 3 is in, and realizes that vertical direction transmits silicon chip; Perhaps when arm support 3 is in the left side, silicon chip is sent, realized that horizontal direction transmits silicon chip; In the time of also can after arm support 3 revolves three-sixth turn, being in the right side once more silicon chip is sent, be implemented in same position and receive and send silicon chip.
Claims (8)
1. a silicon wafer transferring arm is characterized in that: comprise a plurality of arm supports, connector, CD-ROM drive motor; One end of each arm support is connected with connector, and connector is connected with CD-ROM drive motor; Described arm support is four, and described four arm supports form cross each other; The plane that described four arm supports constitute is perpendicular to horizontal plane.
2. silicon wafer transferring arm according to claim 1 is characterized in that: described arm support comprises and forms scissors-like two clamp holders each other that the tail end of clamp holder connects planetary gear; Described two planetary gears are bitten mutually and are closed.
3. silicon wafer transferring arm according to claim 2 is characterized in that: the free end of described clamp holder is an arc.
4. silicon wafer transferring arm according to claim 2 is characterized in that: be set with a plurality of trough of belt clamps on the described clamp holder.
5. silicon wafer transferring arm according to claim 3 is characterized in that: the arch section of described clamp holder is provided with a plurality of grooves.
6. silicon wafer transferring arm according to claim 2 is characterized in that: described arm support comprises two pairs or many to clamp holder.
7. the using method of the described silicon wafer transferring arm of claim 1 is characterized in that: adopt following steps to transmit silicon chip:
The first step makes first-hand arm support, the 3rd arm support be in level, and second-hand's arm support, the 4th arm support are in plumbness; The arm support that is in the right side is used for the reception of silicon chip, and the arm support that is in the below is used for the transmission of vertical direction, and the arm support that is in the left side is used for sending of silicon chip;
In second step, make the arm support that is in the right side receive silicon chip;
The 3rd step turn 90 degrees the connector dextrorotation, made first-hand arm support, the 3rd arm support be in plumbness, and second-hand's arm support, the 4th arm support are in level, realized the arm support exchange function of horizontal direction and vertical direction;
In the 4th step, make the arm support that is in the below carry out the silicon chip operation; Perhaps below directly silicon chip is sent, realize that vertical direction transmits silicon chip; Make the arm support that is in the right side receive silicon chip simultaneously, realize that horizontal direction receives silicon chip.
8. the using method of silicon wafer transferring arm according to claim 7 is characterized in that: after described the 4th step finishes, make connector once more dextrorotation turn 90 degrees, make first-hand arm support, the 3rd arm support be in level; Silicon chip on the arm support on the left of will being in is sent, and receives new silicon chip by the arm support that is in the right side simultaneously, and the arm support that is in the below is carried out the silicon chip operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100439329A CN101740438B (en) | 2008-11-13 | 2008-11-13 | Silicon wafer transferring arm and use method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100439329A CN101740438B (en) | 2008-11-13 | 2008-11-13 | Silicon wafer transferring arm and use method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101740438A CN101740438A (en) | 2010-06-16 |
| CN101740438B true CN101740438B (en) | 2011-11-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2008100439329A Active CN101740438B (en) | 2008-11-13 | 2008-11-13 | Silicon wafer transferring arm and use method thereof |
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| CN (1) | CN101740438B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102556652A (en) * | 2010-12-31 | 2012-07-11 | 平成科贸股份有限公司 | Object transmission system |
| CN106449510B (en) * | 2016-09-26 | 2020-05-22 | 华海清科股份有限公司 | Wafer transmission device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101017790A (en) * | 2006-02-06 | 2007-08-15 | 三星电子株式会社 | Robot for transferring wafer and semiconductor manufacturing equipment used the same |
| TW200734264A (en) * | 2006-03-15 | 2007-09-16 | Mjc Probe Inc | Multi-directional gripping apparatus |
| CN101293348A (en) * | 2007-04-27 | 2008-10-29 | 日本电产三协株式会社 | Robot for industry and collection processing device |
-
2008
- 2008-11-13 CN CN2008100439329A patent/CN101740438B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101017790A (en) * | 2006-02-06 | 2007-08-15 | 三星电子株式会社 | Robot for transferring wafer and semiconductor manufacturing equipment used the same |
| TW200734264A (en) * | 2006-03-15 | 2007-09-16 | Mjc Probe Inc | Multi-directional gripping apparatus |
| CN101293348A (en) * | 2007-04-27 | 2008-10-29 | 日本电产三协株式会社 | Robot for industry and collection processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101740438A (en) | 2010-06-16 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140109 |
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Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
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Effective date of registration: 20140109 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Patentee before: Shanghai Huahong NEC Electronics Co., Ltd. |