CN207664024U - The conveying device of the automatic cleaning and degumming all-in-one machine of silicon chip - Google Patents
The conveying device of the automatic cleaning and degumming all-in-one machine of silicon chip Download PDFInfo
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- CN207664024U CN207664024U CN201721409578.8U CN201721409578U CN207664024U CN 207664024 U CN207664024 U CN 207664024U CN 201721409578 U CN201721409578 U CN 201721409578U CN 207664024 U CN207664024 U CN 207664024U
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- China
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- conveying device
- silicon chip
- degumming
- silicon
- slideway
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Abstract
The utility model discloses one kind capable of realizing silicon chip turn-over, to realize that the conveying device with the automatic cleaning and degumming all-in-one machine of silicon chip of degumming is cleaned on silicon chip two sides automatically.The conveying device of the automatic cleaning and degumming all-in-one machine of the silicon chip, the automatic cleaning and degumming all-in-one machine of silicon chip includes conveying device and cleaning and degumming device；The cleaning and degumming device is arranged in the top of conveying device；The conveying device includes two horizontal transferring devices and turn-over conveying device；The turn-over conveying device is located between two horizontal transferring devices；Two slideways are located at the both sides of horizontal transferring device.Using the conveying device of the automatic cleaning and degumming all-in-one machine of the silicon chip, working efficiency can be improved, reduces production cost.
Description
Technical field
The utility model relates to the cleaning of silicon chip, the conveying device of especially a kind of automatic cleaning and degumming all-in-one machine of silicon chip.
Background technology
It is well-known：The cleanliness factor of silicon chip surface is the key factor for influencing silicon chip qualification rate and battery conversion efficiency.
To obtain the high silicon chip of cleanliness factor, often silicon chip is needing by degumming cleaning and finely to clean two parts after wire cutting,
Although and it is high not as cutting technique requires as the degumming cleaning of first of cleaning process, be also the weight for obtaining clean piece
Process, cleaning process is wanted to be related to a variety of subjects such as physics, chemistry, ultrasound.
Realize that the degumming cleaning of silicon chip often uses two processes i.e. first by cleaning device to silicon chip in the prior art
Surface by washing, wash off part metals powder, silica flour, silicon carbide of silicon chip surface etc.；Then pass through degumming device reality again
Now to the degumming of silicon chip.
Realize that the degumming cleaning of silicon chip generally requires to carry out artificial turn-over, could realize to silicon chip two sides in existing technology
Cleaning.
Utility model content
The technical problem to be solved by the utility model is to provide one kind capable of realizing silicon chip turn-over, to realize silicon chip two
Face is cleaned automatically and the conveying device of the automatic cleaning and degumming all-in-one machine of silicon chip of degumming.
Technical solution adopted by the utility model to solve its technical problems is：The automatic cleaning and degumming all-in-one machine of silicon chip it is defeated
Device is sent, the automatic cleaning and degumming all-in-one machine of silicon chip includes conveying device and cleaning and degumming device；The cleaning and degumming device
It is arranged in the top of conveying device；The conveying device includes two horizontal transferring devices and turn-over conveying device；
The turn-over conveying device includes two parallel slideways；It is provided with support base on the slideway；Two cunnings
Silicon wafer conveying device is provided between road；The centre position of two slideways is both provided with silicon slice rotating chuck；The silicon chip
Spin chuck is located between two slideways；Have between two silicon slice rotating chucks between silicon wafer conveying device is installed
Away from；The shaft of two silicon slice rotating chucks is conllinear；
The silicon slice rotating chuck includes turntable, and circumferentially equally distributed intermediate plate group is provided on the turntable；It is described
Intermediate plate group has even number set；The intermediate plate group includes two panels intermediate plate, is had and the matched clip slot of silicon chip between the two panels intermediate plate；
The second of any one in two silicon slice rotating chucks of driving or two rotations is provided on the slideway
Driving motor；
Control silicon wafer conveying device braking when silicon chip is moved to clip slot is installed on the slideway, and controls the second driving electricity
The limit switch that machine starts；
The turn-over conveying device is located between two horizontal transferring devices；Two slideways are located at horizontal feed
The both sides of device.
Further, the horizontal transferring device includes at least two root skin bands；The belt both ends are both provided with transmission shaft；
At least two belt pulleys are provided on the transmission shaft, the belt pulley is corresponded with belt；The belt is passed with belt pulley
Dynamic connection；The both ends of the drive shaft is provided with support base；Driving is provided in two transmission shafts on any one support base to pass
First driving motor of moving axis rotation.
Further, the silicon wafer conveying device includes balata belt, and the balata belt both ends are both provided with second
Seat is supportted, the balata belt and the second support base are sequentially connected, and driving balata belt rotation is provided on the second support base
Driving device；The balata belt is parallel with slideway, and concordant.
Further, the position that silicon slice rotating chuck is equipped on the slideway is provided with baffle, and the baffle is located at silicon
The outside of piece spin chuck.
Further, the silicon chip guide groove extended along slideway length direction is provided on the slideway.
The utility model has the beneficial effects that：The conveying of the automatic cleaning and degumming all-in-one machine of silicon chip described in the utility model fills
It sets since there are two horizontal transferring device and turn-over conveying devices for setting；And the turn-over conveying device is located at two levels
Between conveying device；Two slideways are located at the both sides of horizontal transferring device, therefore can be by two water by slideway
Flat conveying device and turn-over conveying device connect into a conveying device, and are made by first by turn-over conveying device
Silicon chip turn-over after a horizontal transferring device conveying, is conveyed on second horizontal transferring device after turn-over.It therefore can
The automatic turnover for realizing silicon chip, since on two horizontal transferring devices, silicon chip is just exchanged with lower surface above, therefore respectively
Cleaning and degumming device is set on two horizontal transferring devices, can realize the automatic cleaning and degumming on the two sides of silicon chip；To
Working efficiency is improved, production cost is reduced.
Description of the drawings
Fig. 1 is the structural schematic diagram of the conveying device of the automatic cleaning and degumming all-in-one machine of silicon chip in the utility model embodiment；
Fig. 2 is the internal structure signal of the conveying device of the automatic cleaning and degumming all-in-one machine of silicon chip in the utility model embodiment
Figure；
Fig. 3 is the structural schematic diagram of horizontal transferring device in the utility model embodiment；
Fig. 4 is the stereogram of turn-over conveying device in the utility model embodiment；
Fig. 5 is the stereogram that spin chuck clamps silicon chip in the utility model embodiment；
Fig. 6 is the front view that spin chuck clamps silicon chip in the utility model embodiment；
It is indicated in figure：1- cleaning and degumming devices, 2- turn-over conveying devices, 21- silicon slice rotating chucks, 22- silicon chips conveying dress
It sets, the second driving motors of 23-, 24- limit switches, 25- baffles, 3- support bases, 4- transmission shafts, 5- belt pulleys, 6- belts, 7-
Slideway.
Specific implementation mode
The utility model is further illustrated with reference to the accompanying drawings and examples.
As shown in Figures 1 to 6, the conveying device of the automatic cleaning and degumming all-in-one machine of silicon chip described in the utility model, it is described
The automatic cleaning and degumming all-in-one machine of silicon chip includes conveying device and cleaning and degumming device 1；The setting of cleaning and degumming device 1 is conveying
The top of device；It is characterized in that：The conveying device includes two horizontal transferring devices and turn-over conveying device 2；
The turn-over conveying device 2 includes two parallel slideways 7；Support base 3 is provided on the slideway 7；Two institutes
It states and is provided with silicon wafer conveying device 22 between slideway；The centre position of two slideways 7 is both provided with silicon slice rotating chuck 21；
The silicon slice rotating chuck 21 is located between two slideways 7；There is installation silicon between two silicon slice rotating chucks 21
The spacing of piece conveying device 22；The shaft of two silicon slice rotating chucks 21 is conllinear；
The silicon slice rotating chuck 21 includes turntable 211, and circumferentially equally distributed intermediate plate is provided on the turntable 211
Group；The intermediate plate group has even number set；The intermediate plate group includes two panels intermediate plate 212, is had between the two panels intermediate plate 212 and silicon
The matched clip slot of piece 213；
The of the rotation of any one or two in two silicon slice rotating chucks 21 of driving is provided on the slideway 7
Two driving motors 23；
Control silicon wafer conveying device 22 when silicon chip is moved to clip slot 213 is installed to brake on the slideway 7, and controls second
The limit switch 24 that driving motor 23 starts；
The turn-over conveying device 2 is located between two horizontal transferring devices；Two slideways 7 are located at horizontal defeated
Send the both sides of device.
In the process of work：
Silicon chip is conveyed by first horizontal transferring device first, when being transported to turn-over conveying device 2, in turn-over
Turn-over is realized in conveying device 2, is then conveyed in second horizontal transferring device.
Silicon chip is during carrying out turn-over on turn-over conveying device 2：
Silicon chip is placed on two slideways 7 first, and between two slideways 7, and makes two silicon slice rotatings
The clip slot 213 of chuck 21 is aligned.Then silicon wafer horizontal is transported to by silicon slice rotating chuck 21 by silicon wafer conveying device 22, this
When due to be equipped on slideway 7 when silicon chip is moved to clip slot 213 control silicon wafer conveying device 22 brake, and control driving motor
23 limit switches 24 started.Silicon wafer conveying device 22 is braked, and driving motor 23, which starts, drives silicon slice rotating chuck 21 to rotate,
When silicon slice rotating chuck 2 turn to the clip slot 23 in next group of intermediate plate group it is parallel with slideway 7 when, braking, start silicon chip conveying dress
22 are set to continue to convey silicon chip；It steps be repeated alternatively until that silicon slice rotating chuck 21 is located in all intermediate plate groups of 7 top of slideway
Accompany silicon chip.Start silicon wafer conveying device 22 to continue to convey silicon chip, then when the piece silicon chip is transported to silicon slice rotating chuck 21
When in clip slot, to the silicon chip and slideway 7 and silicon wafer conveying device 22 on the opposite 180 ° of positions in side, by silicon wafer conveying device
22 are transported away from silicon slice rotating chuck 21, vacate clip slot 213.It is circumferentially equally distributed due to being provided on the turntable 211
Intermediate plate group；The intermediate plate group has even number set；So as to ensure that intermediate plate group has one group and its phase in 180 ° of offsides of turntable 211
Corresponding intermediate plate group.
Then it repeats the above steps, silicon chip does not stop to be sent to silicon slice rotating folder under the conveying effect of silicon wafer conveying device 22
In the clip slot 213 of disk 21, then by silicon slice rotating chuck 21 rotate turn-over after in the other side of silicon slice rotating chuck 21 by silicon
Piece conveying device 22 transports；To realize the continuous automatic turnover of silicon chip.
In conclusion the conveying device of the automatic cleaning and degumming all-in-one machine of silicon chip described in the utility model is due to being provided with two
A horizontal transferring device and turn-over conveying device；And the turn-over conveying device is located between two horizontal transferring devices；
Two slideways are located at the both sides of horizontal transferring device, thus by slideway can by two horizontal transferring devices and
Turn-over conveying device connects into a conveying device, and is made by first horizontal transferring device by turn-over conveying device
Silicon chip turn-over after conveying is conveyed on second horizontal transferring device after turn-over.Therefore the automatic of silicon chip can be realized
Turn-over, since on two horizontal transferring devices, silicon chip is just exchanged with lower surface above, therefore respectively in two horizontal feeds
Cleaning and degumming device is set on device, can realize the automatic cleaning and degumming on the two sides of silicon chip；To improve working efficiency, drop
Low production cost.
Slide unit may be used in the horizontal transferring device, in order to simplify structure, reduces manufacturing cost, it is preferred that the water
Flat conveying device includes at least two root skin bands 6；6 both ends of the belt are both provided with transmission shaft 4；It is provided on the transmission shaft 4
At least two belt pulleys 5, the belt pulley 5 are corresponded with belt 6；The belt 6 is sequentially connected with belt pulley 5；The biography
Moving axis 4 is provided at both ends with support base 3；Driving transmission shaft 4 is provided in two transmission shafts 4 on any one support base 3 to rotate
The first driving motor.
Slide unit may be used in the silicon wafer conveying device 22, in order to simplify structure, reduces manufacturing cost；Preferably, described
Silicon wafer conveying device 22 includes balata belt 222, and 222 both ends of the balata belt are both provided with the second support base 221, the rubber
Rubber belt 222 and the second support base 221 are sequentially connected, and are provided with what driving balata belt 222 rotated on the second support base 221
Driving device；The balata belt 222 is parallel with slideway 7, and concordant.
In order to avoid silicon chip deviates when as silicon slice rotating chuck 21 rotates；Further, pacify on the slideway 7
Position equipped with silicon slice rotating chuck 21 is provided with baffle 25, and the baffle 25 is located at the outside of silicon slice rotating chuck 21.
In order to avoid silicon chip deviates in transmission process, further, it is provided on the slideway 7 and is grown along slideway 7
Spend the silicon chip guide groove that direction extends.
Claims (5)
1. the conveying device of the automatic cleaning and degumming all-in-one machine of silicon chip, the automatic cleaning and degumming all-in-one machine of silicon chip includes conveying device
With cleaning and degumming device (1)；The cleaning and degumming device (1) is arranged in the top of conveying device；It is characterized in that：The conveying
Device includes two horizontal transferring devices and turn-over conveying device (2)；
The turn-over conveying device (2) includes two parallel slideways (7)；It is provided with support base (3) on the slideway (7)；Two
Silicon wafer conveying device (22) is provided between slideway described in item；The centre position of two slideways (7) is both provided with silicon chip rotation
Turn chuck (21)；The silicon slice rotating chuck (21) is located between two slideways (7)；Two silicon slice rotating chucks
(21) there is the spacing of installation silicon wafer conveying device (22) between；The shaft of two silicon slice rotating chucks (21) is conllinear；
The silicon slice rotating chuck (21) includes turntable (211), and circumferentially equally distributed folder is provided on the turntable (211)
Piece group；The intermediate plate group has even number set；The intermediate plate group includes two panels intermediate plate (212), is had between the two panels intermediate plate (212)
Have and the matched clip slot of silicon chip (213)；
The of the rotation of any one or two in two silicon slice rotating chucks (21) of driving is provided on the slideway (7)
Two driving motors (23)；
Control silicon wafer conveying device (22) when silicon chip is moved to clip slot (213) is installed to brake on the slideway (7), and controls the
The limit switch (24) that two driving motors (23) start；
The turn-over conveying device (2) is located between two horizontal transferring devices；Two slideways (7) are located at horizontal defeated
Send the both sides of device.
2. the conveying device of the automatic cleaning and degumming all-in-one machine of silicon chip as described in claim 1, it is characterised in that：The level is defeated
It includes at least two root skin bands (6) to send device；Belt (6) both ends are both provided with transmission shaft (4)；It is set on the transmission shaft (4)
At least two belt pulleys (5) are equipped with, the belt pulley (5) corresponds with belt (6)；The belt (6) passes with belt pulley (5)
Dynamic connection；The transmission shaft (4) is provided at both ends with support base (3)；In two transmission shafts (4) on any one support base (3)
It is provided with the first driving motor that driving transmission shaft (4) rotates.
3. the conveying device of the automatic cleaning and degumming all-in-one machine of silicon chip as claimed in claim 2, it is characterised in that：The silicon chip is defeated
It includes balata belt (222) to send device (22), and balata belt (222) both ends are both provided with the second support base (221), described
Balata belt (222) is sequentially connected with the second support base (221), and is provided with driving balata belt on the second support base (221)
(222) driving device rotated；The balata belt (222) is parallel with slideway (7), and concordant.
4. the conveying device of the automatic cleaning and degumming all-in-one machine of silicon chip as claimed in claim 2, it is characterised in that：The slideway
(7) position that silicon slice rotating chuck (21) is equipped on is provided with baffle (25), and the baffle (25) is located at silicon slice rotating chuck
(21) outside.
5. the conveying device of the automatic cleaning and degumming all-in-one machine of silicon chip as claimed in claim 2, it is characterised in that：The slideway
(7) the silicon chip guide groove extended along slideway (7) length direction is provided on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721409578.8U CN207664024U (en) | 2017-10-27 | 2017-10-27 | The conveying device of the automatic cleaning and degumming all-in-one machine of silicon chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721409578.8U CN207664024U (en) | 2017-10-27 | 2017-10-27 | The conveying device of the automatic cleaning and degumming all-in-one machine of silicon chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207664024U true CN207664024U (en) | 2018-07-27 |
Family
ID=62937440
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721409578.8U Active CN207664024U (en) | 2017-10-27 | 2017-10-27 | The conveying device of the automatic cleaning and degumming all-in-one machine of silicon chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207664024U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110190015A (en) * | 2019-06-27 | 2019-08-30 | 西安奕斯伟硅片技术有限公司 | A kind of wafer cleaning device and method for cleaning wafer |
| CN111463152A (en) * | 2020-04-17 | 2020-07-28 | 重庆芯洁科技有限公司 | High-pressure washing equipment for semiconductor substrate and using method thereof |
-
2017
- 2017-10-27 CN CN201721409578.8U patent/CN207664024U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110190015A (en) * | 2019-06-27 | 2019-08-30 | 西安奕斯伟硅片技术有限公司 | A kind of wafer cleaning device and method for cleaning wafer |
| CN111463152A (en) * | 2020-04-17 | 2020-07-28 | 重庆芯洁科技有限公司 | High-pressure washing equipment for semiconductor substrate and using method thereof |
| CN111463152B (en) * | 2020-04-17 | 2023-03-14 | 重庆芯洁科技有限公司 | High-pressure washing equipment for semiconductor substrate and using method thereof |
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