CN101730440A - Heat radiating system - Google Patents
Heat radiating system Download PDFInfo
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- CN101730440A CN101730440A CN200810170317A CN200810170317A CN101730440A CN 101730440 A CN101730440 A CN 101730440A CN 200810170317 A CN200810170317 A CN 200810170317A CN 200810170317 A CN200810170317 A CN 200810170317A CN 101730440 A CN101730440 A CN 101730440A
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- heat
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Abstract
The invention discloses a heat radiating system which comprises an electromagnetic drive reciprocating pump, a flow channel and heat-exchange fluid, wherein the electromagnetic drive reciprocating pump comprises a shell, a magnetic hollow piston which is configured in the shell and an electromagnetic device; the shell is provided with an inlet, an outlet and a first check valve which is configured in the inlet; the magnetic hollow piston is provided with a through hole which extends along the axial direction and a second check valve which is configured in the through hole; and the electromagnetic device is configured in the shell and drives the magnetic hollow piston to do reciprocating motion along the axial direction. When the magnetic hollow piston moves to the outlet from the inlet, the first check valve and the second check valve are respectively opened and closed. When the magnetic hollow piston moves to the inlet from the outlet, the first check valve and the second check valve are respectively closed and opened. The flow channel is connected with the inlet and the outlet and configured outside the shell, and part of the flow channel is hot coupled with a heat source. The heat-exchange fluid flows on the flow channel and in the shell.
Description
Technical field
The present invention relates to a kind of cooling system (heat-dissipating system), and particularly relate to a kind of cooling system with pump (pump) with promotion heat-exchange fluid (heat-exchanging fluid).
Background technology
Along with the advancing by leaps and bounds of computer technology, make the running speed of computer constantly improve in recent years, and the heating power (heat generationrate) of the electronic component of host computer inside (electronic element) is also constantly soaring.Overheated for the electronic component that prevents host computer inside, and cause electronic component that temporary or nonvolatil inefficacy takes place, so provide enough heat dissipation to the electronic component of computer inside will become extremely important.
With CPU (central processing unit, CPU) be example, CPU is under working at high speed, when in a single day the temperature of CPU own exceeds its normal operating temperature range, operation mistake very likely can take place in CPU, or temporarily lost efficacy, so will cause host computer to work as machine.In addition, when itself temperature of CPU during, even very likely damage the electric crystal of CPU inside, thereby cause the permanent inefficacy of CPU considerably beyond its normal operating temperature range.
Therefore, the main electronic component on the computer motherboard, for example CPU needs cooling system (heat-dissipating system) to be dispelled the heat usually.Existing cooling system comprises a motor driving pump (motor-driven pump), a runner (pipeline) and a heat-exchange fluid.Motor driving pump has a housing, a piston, a motor and a transmission mechanism.The operation principles of motor driving pump for the rotation by motor with drive transmission mechanism (comprising an eccentric wheel and a linkage), make the transmission mechanism driven plunger reciprocating in housing.Heat-exchange fluid (for example being water) flows on the runner by the effect of motor driving pump.In addition, part runner heat couples an electronic component.The torrid zone that is produced when therefore, heat-exchange fluid can operate electronic component from.
Yet the volume of motor is bigger, and the noise during motor running is bigger, and transmission mechanism uses the heat-exchange fluid seepage that with the passing of time can cause in the housing.Therefore, existing cooling system has improved necessity in fact.
Summary of the invention
The object of the present invention is to provide a kind of cooling system, its take up space less, noise is less and heat-exchange fluid easy to leak not.
The present invention proposes a kind of cooling system, is suitable for dispelling the heat for a thermal source (heat source).Cooling system comprises an Electromagnetic Drive reciprocating pump (electromagnetic driven piston pump), a runner and a heat-exchange fluid.The Electromagnetic Drive reciprocating pump comprises a housing (casing), a magnetic hollow piston (magnetic hollow piston) and a calutron (electromagnetic device).Housing has an inlet (inlet), an outlet (outlet) and one first check-valves (non-return valve), and first check valve configuration is in inlet.Magnetic hollow piston is disposed in the housing and is suitable for moving back and forth along one axial (axis) between inlet and outlet.Magnetic hollow piston has one along this axially extended perforation (through hole) and one second check-valves, and second check valve configuration is in perforation.Calutron is disposed at housing and is suitable for driving magnetic hollow piston and moves back and forth.When magnetic hollow piston moved to outlet by inlet, first check-valves was opened and second closure of check ring.When magnetic hollow piston moved to inlet by outlet, first closure of check ring and second check-valves were opened.Runner joint access and outlet and be disposed at outside the housing, and part runner heat couples (thermally coupled to) thermal source.Flow of heat exchange fluid on runner with housing in.
In one embodiment of this invention, above-mentioned cooling system more comprises a temperature-uniforming plate (uniformtemperature plate).Runner passes temperature-uniforming plate, and temperature-uniforming plate heat couples thermal source.In addition, thermal source comprises a circuit board and an electronic component.Electronic component arrangements in and be electrically connected on circuit board, and temperature-uniforming plate is disposed at circuit board and nearby electron element.In addition, cooling system more comprises a radiator (heat sink), and it has a heat and couples the base (base) of temperature-uniforming plate and the fin (fin) that a plurality of heat couple base.These fins are extended with the direction away from temperature-uniforming plate by base.Moreover cooling system more comprises a thermoelectric element (thermoelectric element), is disposed between radiator and the temperature-uniforming plate and has a hot junction (hotside) and a cold junction (cold side).Hot junction heat couples base, and cold junction heat couples temperature-uniforming plate.
In one embodiment of this invention, above-mentioned cooling system more comprises a high voltage control unit (highpressure control unit), a heat-sink unit (heat-dissipating unit) and a low voltage control unit (low pressure control unit).Runner connects outlet, high voltage control unit, heat-sink unit, low voltage control unit and inlet in regular turn, and the part runner heat between inlet and low voltage control unit couples thermal source.
In one embodiment of this invention, above-mentioned heat-exchange fluid is water, alcohol or refrigerant.
Because the Electromagnetic Drive reciprocating pump of the cooling system of embodiments of the invention is to drive magnetic hollow piston by calutron.Therefore, compare with prior art, the volume of calutron is less to make that the occupied space of cooling system is less and the calutron driving noise that magnetic hollow piston produced is less.In addition, because the Electromagnetic Drive reciprocating pump of the cooling system of embodiments of the invention does not adopt the type of drive of traditional transmission mechanism, so the Electromagnetic Drive reciprocating pump can be avoided the heat-exchange fluid seepage of enclosure interior.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended accompanying drawing, be described in detail below.
Description of drawings
Figure 1A illustrates the schematic diagram of a kind of cooling system of first embodiment of the invention;
The runner that Figure 1B illustrates Figure 1A passes the schematic diagram of temperature-uniforming plate;
Fig. 1 C illustrates the schematic diagram of the another kind of cooling system of first embodiment of the invention;
Fig. 2 illustrates the schematic diagram of a kind of cooling system of second embodiment of the invention;
Fig. 3 A illustrates the schematic diagram of a kind of cooling system of third embodiment of the invention;
Fig. 3 B illustrates the schematic diagram of the thermoelectric element of Fig. 3 A;
Fig. 4 illustrates the schematic diagram of a kind of cooling system of fourth embodiment of the invention;
Fig. 5 illustrates the schematic diagram of a kind of cooling system of fifth embodiment of the invention.
The main element symbol description
20: thermal source
22,22 ': circuit board
24: electronic component
200,200 ', 300,400,500,600: cooling system
210: the Electromagnetic Drive reciprocating pump
212: housing
212a: inlet
212b: outlet
212c: first check-valves
214: magnetic hollow piston
214a: perforation
214b: second check-valves
214c: body
214d: magnet
216: calutron
216a: solenoid
220,220 ': runner
230: heat-exchange fluid
240,240 ': temperature-uniforming plate
250,250 ': radiator
252,252 ': base
254,254 ': fin
260: thermoelectric element
262: the hot junction
264: cold junction
The 266:N N-type semiconductor N
The 268:P N-type semiconductor N
270: the high voltage control unit
280: heat-sink unit
290: the low voltage control unit
A: axially
C: direct current
Embodiment
[first embodiment]
Please refer to Figure 1A, it illustrates the schematic diagram of a kind of cooling system of first embodiment of the invention.The cooling system 200 of present embodiment is suitable for dispelling the heat for a thermal source 20, and thermal source 20 for example comprises a circuit board 22 and an electronic component 24, and electronic component 24 (for example being integrated circuit (IC) chip or light-emitting diode chip for backlight unit) is disposed at and is electrically connected on circuit board 22.Cooling system 200 comprises an Electromagnetic Drive reciprocating pump 210, a runner 220 and a heat-exchange fluid 230.
Electromagnetic Drive reciprocating pump 210 comprises a housing 212, a magnetic hollow piston 214 and a calutron 216.Housing 212 has an inlet 212a, an outlet 212b and one first a check-valves 212c, and the first check-valves 212c is disposed at inlet 212a.Magnetic hollow piston 214 is disposed in the housing 212 and is suitable for moving back and forth along an axial A between inlet 212a and outlet 212b.Magnetic hollow piston 214 has a perforation 214a and one second a check-valves 214b along this axial A extension, and the second check-valves 214b is disposed at perforation 214a.In the present embodiment, magnetic hollow piston 214 comprises a body 214c and two magnet 214d.Perforation runs through body 214c, and these magnet 214d is disposed at the opposite end of body 214c respectively and respectively around the opposite end of perforation 214a.
In detail, the opposite end of the perforation 214a of present embodiment difference aligned inlet 212a and outlet 212b.In other words, the outlet 212b of the inlet 212a of housing 212, perforation 214a and housing 212 arranges along axial A, and the second check-valves 214b is disposed at that end of the contiguous outlet 212b of perforation 214a.In addition, calutron 216 is disposed at housing 212 and is suitable for driving magnetic hollow piston 214 and moves back and forth.In the present embodiment, calutron 216 comprises two solenoids (coil) 216a, and it is respectively adjacent to inlet 212a and outlet 212b in housing, and is disposed at outside the housing 212.In addition, runner 220 joint access 212a and outlet 212b and being disposed at outside the housing 212, and part runner 220 heat couple thermal source 20.Heat-exchange fluid 230 (for example being water, alcohol or refrigerant) flow on the runner 220 with housing 212 in.
The runner that Figure 1B illustrates Figure 1A passes the schematic diagram of temperature-uniforming plate.Please refer to Figure 1A and Figure 1B, in the present embodiment, cooling system 200 more comprises a temperature-uniforming plate 240.Runner 220 passes temperature-uniforming plate 240, and temperature-uniforming plate 240 heat couple thermal source 20.Offer a piece of advice it, temperature-uniforming plate 240 is disposed on the circuit board 22 and nearby electron element 24.
Below will explain at the operation of cooling system 200.Refer again to Figure 1A, but comprise that calutron 216 load currents of two solenoid 216a act on the magnetic field of magnetic hollow piston 214 with generation.When magnetic hollow piston 214 is subjected to a action of a magnetic field and moves to outlet during 212b by inlet 212a, the first check-valves 212c of housing 212 opens and the second check-valves 214b of magnetic hollow piston 214 closes, and makes heat-exchange fluids 230 in the housing 212 be promoted by magnetic hollow piston 214 and leaves the inside of housing 212 via outlet 212b.When magnetic hollow piston 214 is subjected to another the action of a magnetic field and moves to inlet during 212a by outlet 212b, the first check-valves 212c closes and the second check-valves 214b opens, and makes housing 212 interior heat-exchange fluids 230 be flowed to the space at contiguous outlet 212b place by the space at neighboring entry 212a place.Therefore, heat-exchange fluid 230 flows on the runner 220, and the torrid zone that thermal source 20 is passed to temperature-uniforming plate 240 from.
Because the Electromagnetic Drive reciprocating pump 210 of the cooling system 200 of present embodiment is to drive magnetic hollow piston 214 by calutron 216.Therefore, compare with prior art, the volume of calutron 216 is less to make that the occupied space of cooling system 200 is less, and calutron 216 to drive the noise that magnetic hollow piston 214 are produced less.In addition, because the Electromagnetic Drive reciprocating pump 210 of the cooling system 200 of present embodiment does not adopt the type of drive of traditional transmission mechanism, so Electromagnetic Drive reciprocating pump 210 can be avoided heat-exchange fluid 230 seepages of housing 212 inside.
Fig. 1 C illustrates the schematic diagram of the another kind of cooling system of first embodiment of the invention.Please refer to Figure 1A and Fig. 1 C, cooling system 200 ' is that with the main difference part of cooling system 200 temperature-uniforming plate 240 ' is to be disposed in the circuit board 22 '.In other words, temperature-uniforming plate 240 ' embeds in the circuit board 22 ', or is built in circuit board 22 ' in the temperature-uniforming plate 240 '.In this mandatory declaration is that it is the example explanation that following embodiment only is disposed on the circuit board 22 with temperature-uniforming plate 240.
[second embodiment]
Please refer to Fig. 2, it illustrates the schematic diagram of a kind of cooling system of second embodiment of the invention.Compare with the cooling system 200 of first embodiment, cooling system 300 more comprises a radiator 250.Radiator 250 has a heat and couples the base 252 of temperature-uniforming plate 240 and the fin 254 that a plurality of heat couple base 252.These fins 254 are extended with the direction away from temperature-uniforming plate 240 by base 252.Therefore, the radiating efficiency of cooling system 300 (heat dissipation efficiency) is promoted.
[the 3rd embodiment]
Please refer to Fig. 3 A, it illustrates the schematic diagram of a kind of cooling system of third embodiment of the invention.Compare with the cooling system 200 of first embodiment, cooling system 400 more comprises a thermoelectric element 260, and it is disposed on the temperature-uniforming plate 240.Thermoelectric element 260 has a hot junction 262 and a cold junction 264, and cold junction 264 heat couple temperature-uniforming plate 240.
Please refer to Fig. 3 B, it illustrates the schematic diagram of the thermoelectric element of Fig. 3 A.Thermoelectric element 260 comprises a plurality of N type semiconductors 266 and a plurality of P type semiconductors 268.These N type semiconductors 266 are staggered with these P type semiconductors 268 and are electrically connected in regular turn.When direct current C passes through thermoelectric element 260 according to the direction shown in Fig. 3 B, hot junction 262 heatings of thermoelectric element 260, and its cold junction 264 heat absorptions.The advantage of thermoelectric element 260 is that volume is little, noiselessness, no environmental protection public hazards (not using cold coal), the life-span is long and nondirectional restriction (can stand upside down or edge-on use).
[the 4th embodiment]
Please refer to Fig. 4, it illustrates the schematic diagram of a kind of cooling system of fourth embodiment of the invention.Compare with the cooling system 400 of the 3rd embodiment, cooling system 500 more comprises a radiator 250 '.Radiator 250 ' has a heat and couples the base 252 ' of temperature-uniforming plate 240 and the fin 254 ' that a plurality of heat couple base 252 '.These fins 254 ' are extended with the direction away from temperature-uniforming plate 240 by base 252 '.In addition, thermoelectric element 260 is disposed between radiator 250 ' and the temperature-uniforming plate 240.
[the 5th embodiment]
Please refer to Fig. 5, it illustrates the schematic diagram of a kind of cooling system of fifth embodiment of the invention.Compare with the cooling system 200 of first embodiment, cooling system 600 more comprises a high voltage control unit 270, a heat-sink unit 280 and a low voltage control unit 290.Runner 220 ' connects outlet 212b, high voltage control unit 270, heat-sink unit 280, low voltage control unit 290 and inlet 212a in regular turn.Part runner 220 ' heat between inlet 212a and low voltage control unit 290 couples thermal source 20.
Below will explain at the operation of cooling system 600.When heat-exchange fluid 230 left the reciprocating type delivery side of pump 212b of Electromagnetic Drive and flows to high voltage control unit 270, heat-exchange fluid 230 had one first force value and one first temperature value.When heat-exchange fluid 230 leaves high voltage control unit 270 and flows to heat-sink unit 280, heat-exchange fluid 230 can present liquid state and have one second force value and one second temperature value, wherein second force value greater than first force value and second temperature value greater than first temperature value.In other words, the temperature through the heat-exchange fluid 230 behind the high voltage control unit 270 rises and the pressure increase.When presenting liquid heat-exchange fluid 230 process heat-sink units 280 when (for example comprising a plurality of fins), heat-exchange fluid 230 transfers heat to heat-sink unit 280 and then is passed to external environment.
When heat-exchange fluid 230 left heat-sink unit 280 and flows to low voltage control unit 290, heat-exchange fluid 230 can present liquid state and have one the 3rd force value and one the 3rd temperature value.When heat-exchange fluid 230 left low voltage control unit 290 and flows to temperature-uniforming plate 240, heat-exchange fluid 230 had one the 4th force value and one the 4th temperature value, wherein the 4th force value less than the 3rd force value and the 4th temperature value less than the 3rd temperature value.In other words, the temperature through the gaseous state heat-exchange fluid 230 behind the low voltage control unit 290 descends and the pressure reduction.When heat-exchange fluid 230 during through temperature-uniforming plates 240, heat-exchange fluid 230 will absorb heat and the torrid zone that temperature-uniforming plate 240 is transmitted from.
In sum, the cooling system of embodiments of the invention has following one of them advantage at least:
One, because the Electromagnetic Drive reciprocating pump of the cooling system of embodiments of the invention is to drive magnetic hollow piston by calutron.Therefore, compare with prior art, the volume of calutron is less to make that the occupied space of cooling system is less.
Two, because the Electromagnetic Drive reciprocating pump of the cooling system of embodiments of the invention is to drive magnetic hollow piston by calutron.Therefore, it is less that calutron drives the noise that magnetic hollow piston produced.
Three, because the Electromagnetic Drive reciprocating pump of the cooling system of embodiments of the invention does not adopt the type of drive of traditional transmission mechanism, so the Electromagnetic Drive reciprocating pump can be avoided the heat-exchange fluid seepage of enclosure interior.
Though above embodiment has disclosed the present invention; yet it is not in order to limit the present invention; be familiar with this operator in the technical field under any; without departing from the spirit and scope of the present invention; can do a little change and retouching, thus protection scope of the present invention should with enclose claim was defined is as the criterion.
Claims (7)
1. a cooling system is suitable for dispelling the heat for a thermal source, comprising:
The Electromagnetic Drive reciprocating pump comprises:
Housing has an inlet, an outlet and one first check-valves, and wherein this first check valve configuration enters the mouth in this;
Magnetic hollow piston, be disposed in this housing and be suitable between this inlet and this outlet, axially moving back and forth along one, wherein this magnetic hollow piston has one along this axially extended perforation and one second check-valves, and this second check valve configuration is in this perforation; And
Calutron, be disposed at this housing and be suitable for driving this magnetic hollow piston and move back and forth, wherein when this magnetic hollow piston moves to this outlet by this inlet, this first check-valves is opened and this second closure of check ring, and when this magnetic hollow piston moved to this inlet by this outlet, this first closure of check ring and this second check-valves were opened;
Runner connects this inlet and this outlet and is disposed at outside this housing, and wherein this runner heat of part couples this thermal source; And
Heat-exchange fluid, flow on this runner with this housing in.
2. cooling system as claimed in claim 1 also comprises a temperature-uniforming plate, and wherein this runner passes this temperature-uniforming plate, and this temperature-uniforming plate heat couples this thermal source.
3. cooling system as claimed in claim 2, wherein this thermal source comprises a circuit board and an electronic component, wherein this electronic component arrangements in and be electrically connected on this circuit board, and this temperature-uniforming plate is disposed at this circuit board and contiguous this electronic component.
4. cooling system as claimed in claim 3 also comprises a radiator, and it has a heat and couples the base of this temperature-uniforming plate and the fin that a plurality of heat couples this base, and wherein those fins are extended with the direction away from this temperature-uniforming plate by base.
5. cooling system as claimed in claim 4 also comprises a thermoelectric element, is disposed between this radiator and this temperature-uniforming plate and has a hot junction and a cold junction, and wherein this hot junction heat couples this base, and this cold junction heat couples this temperature-uniforming plate.
6. cooling system as claimed in claim 1 also comprises:
The high voltage control unit;
Heat-sink unit; And
The low voltage control unit, wherein this runner connects this outlet, this high voltage control unit, this heat-sink unit, this low voltage control unit and this inlet in regular turn, and this runner heat of part between this inlet and this low voltage control unit couples this thermal source.
7. cooling system as claimed in claim 1, wherein this heat-exchange fluid is water, alcohol or refrigerant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101703174A CN101730440B (en) | 2008-10-16 | 2008-10-16 | Heat radiating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101703174A CN101730440B (en) | 2008-10-16 | 2008-10-16 | Heat radiating system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101730440A true CN101730440A (en) | 2010-06-09 |
| CN101730440B CN101730440B (en) | 2012-07-25 |
Family
ID=42450360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101703174A Active CN101730440B (en) | 2008-10-16 | 2008-10-16 | Heat radiating system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101730440B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106257966A (en) * | 2015-06-18 | 2016-12-28 | 三星电机株式会社 | Circuit board and manufacture method thereof |
| CN109041525A (en) * | 2018-08-14 | 2018-12-18 | 郝诗敏 | A kind of circuit board pedestal |
| CN109240524A (en) * | 2018-11-20 | 2019-01-18 | 张飞 | One kind can temperature-reducing mouse |
| CN110134213A (en) * | 2019-05-23 | 2019-08-16 | 牛建 | A kind of cpu heat |
| CN110391069A (en) * | 2019-07-31 | 2019-10-29 | 温州普锐智能科技有限公司 | A kind of solar energy transformer cooling system |
| CN112682290A (en) * | 2020-12-28 | 2021-04-20 | 广东虹勤通讯技术有限公司 | Air circulation device and terminal |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1649136A (en) * | 2004-01-20 | 2005-08-03 | 那勒库乐斯股份有限公司 | Heat radiator and its heat dispenser |
| JP2007120788A (en) * | 2005-10-25 | 2007-05-17 | Seiko Epson Corp | Cooling system and electronic equipment |
-
2008
- 2008-10-16 CN CN2008101703174A patent/CN101730440B/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106257966A (en) * | 2015-06-18 | 2016-12-28 | 三星电机株式会社 | Circuit board and manufacture method thereof |
| CN106257966B (en) * | 2015-06-18 | 2020-06-16 | 三星电机株式会社 | Circuit board and method for manufacturing the same |
| CN109041525A (en) * | 2018-08-14 | 2018-12-18 | 郝诗敏 | A kind of circuit board pedestal |
| CN109240524A (en) * | 2018-11-20 | 2019-01-18 | 张飞 | One kind can temperature-reducing mouse |
| CN109240524B (en) * | 2018-11-20 | 2021-04-13 | 广州迈派电子有限公司 | Mouse capable of reducing temperature |
| CN110134213A (en) * | 2019-05-23 | 2019-08-16 | 牛建 | A kind of cpu heat |
| CN110134213B (en) * | 2019-05-23 | 2021-06-25 | 杭州万骏创业服务有限公司 | CPU radiator |
| CN110391069A (en) * | 2019-07-31 | 2019-10-29 | 温州普锐智能科技有限公司 | A kind of solar energy transformer cooling system |
| CN112682290A (en) * | 2020-12-28 | 2021-04-20 | 广东虹勤通讯技术有限公司 | Air circulation device and terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101730440B (en) | 2012-07-25 |
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