CN1635449A - Liquid-circulating refrigeration system for computer heat radiation - Google Patents
Liquid-circulating refrigeration system for computer heat radiation Download PDFInfo
- Publication number
- CN1635449A CN1635449A CN 200510023283 CN200510023283A CN1635449A CN 1635449 A CN1635449 A CN 1635449A CN 200510023283 CN200510023283 CN 200510023283 CN 200510023283 A CN200510023283 A CN 200510023283A CN 1635449 A CN1635449 A CN 1635449A
- Authority
- CN
- China
- Prior art keywords
- condenser
- liquid
- evaporator
- gas
- valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
This invention relates to a computer heat dissipation liquid recycling cooling system, which comprises the micro pump, evaporator, gas and liquid separator, condenser, fan and one three-way valve, wherein, the micro pump is connected to the evaporator liquid-in hole; the exit of the evaporator is connected to the gas and liquid separator entrance hole; the separator has two exits and the liquid exit is connected to the three-way valve entrance A and the gas condenser dose flows into the condenser from the upper exit; the exit of the condenser is connected to the three-way entrance B and the exit C of three-way valve is connected to the micro pump through pipes; the fan is fixed above the condenser through clamper.
Description
Technical field
What the present invention relates to is a kind of refrigeration system, specifically is a kind of liquid-circulating refrigeration system for computer heat radiation.Be used for refrigeration technology field.
Background technology
Increase along with the energy of the raising of the integrated degree of computer and the increase of system capacity, especially CPU.The heat management of the computer system that makes is faced with increasing challenge.According to the prediction of " international semiconductor guide " magazine, the maximum heat dissipation capacity of single chip board will reach 170w in the time of 2008; Reliability and the life cycle of while in order to improve electronic equipment, the maximum contact temperature of permission will be controlled at below 85 degree.Because the restriction of the hot rerum natura of working fluid itself, this is difficult to reach concerning the passive type cooling technology.So adopting active cooling means may be effective solution, wherein a kind of is exactly to adopt refrigeration system.Because the restriction in space in the computer system of reality, refrigeration system should have much the same size with chip or printed circuit board (PCB).
Find through literature search prior art, Bernd Gromoll is at " Revue G é n é rale deThermique " Volume 37, Issue 9, October 1998, " the Microcooling systems for high density packaging " that delivers on the Pages 781-787 (is applied to the micro cooling system of high density assembling, the technology general survey, the 37th volume, proposition 9, in October, 1998, the 781-787 page or leaf) propose in: by miniature thermal siphon, miniature evaporator and miniature fin condenser are formed cooling system.Evaporator links to each other with thermal source, and heat is delivered to condenser by the evaporation and the condensation of cold-producing medium (water or FC72), and condenser is dispersed into heat in the environment by the forced convertion with surrounding air and goes.The position of condenser must be above evaporator in addition, and its heat flux can reach 30Wcm
-2Along with the raising of electronic system integrated level and the increase of heat dissipation capacity, its heat dissipation capacity eventually can not meet the demands.In the application of reality, be difficult to guarantee that condenser one fixes on the top of evaporator (as when using notebook computer) simultaneously.
Summary of the invention
The present invention is directed to the deficiencies in the prior art and defective, a kind of liquid-circulating refrigeration system for computer heat radiation is provided, make it adopt a kind of new refrigeration cycle, can satisfy the heat radiation requirement of computer system.
The present invention is achieved by the following technical solutions, the present invention includes: micropump, evaporator, gas-liquid separator, condenser, fan and a T-valve.Their annexations are: micropump links to each other by the inlet of pipeline and evaporator, and the outlet of evaporator and the import of gas-liquid separator link together; Gas-liquid separator has two outlets, liquid after the separation is connected to T-valve import A by the outlet of lower end, gaseous state condensing agent after the separation flows into the condenser from the outlet of upper end, condenser is forced cooling by fan, the outlet of condenser is connected to T-valve import B, and the outlet C of T-valve is connected to micropump by pipeline.Fan is fixed on directly over the condenser by clip.Each parts closes along the position of gravity direction: evaporator, and gas-liquid separator and condenser are positioned at the top of system, and micropump and T-valve are positioned at system bottom, and evaporator 4 and T-valve 6 are positioned at the centre position.
The power that the present invention is provided by micropump overcomes friction and the action of gravity equal loss in the circulation system.Because the whole circulation system size is less, change through the fluid pressure behind the micropump little, little to the influence of its thermal behavior, so total system can be supposed to carry out waiting to depress.Liquid coolant after micropump is pumped, in the inflow evaporator, behind the heat of absorption thermal source, the part liquid coolant flashes to gaseous state; The cooling medium of gaseous state flows in the gas-liquid separator under the promotion of vapor pressure, cooling medium after the partial condensation flows into T-valve under the effect of gravity, the cooling medium of gaseous state flows in the condenser under the promotion of vapor pressure, condenser adopts the fin-tube type structure, force cooling by the fan blow air, the cooling medium behind condenser flows into T-valve; The cooling medium that flows into T-valve is sucked by micropump again, has so just finished the whole circulation process.
The invention solves the deficiencies in the prior art, can satisfy the heat radiation requirement of computer system.Since adopt indirect liquid cooling mode, by regulating the flow of micropump, can be so that the heat dissipation capacity of total system reaches very big value.In addition by selecting for use suitable low-boiling liquid coolant just the temperature of evaporator section can be controlled at than low spot, the temperature that is about to thermal source such as electronic product etc. is controlled at than low spot, and higher temperature will influence the performance of electronic product, will help improving its performance on the lower temperature spot so be controlled at by the temperature with electronic product.
Description of drawings
Fig. 1 structural representation of the present invention
Embodiment
As shown in Figure 1, the present invention includes: micropump 1, evaporator 2, gas-liquid separator 3, condenser 4, fan 5 and T-valve 6.Micropump 1 links to each other by the inlet of pipeline with evaporator 2, and the import of the outlet of evaporator 2 and gas-liquid separator 3 links together; Gas-liquid separator 3 has two outlets, liquid after the separation is connected to T-valve 6 import A by the outlet of lower end, gaseous state condensing agent after the separation flows into the condenser 2 from the outlet of upper end, the outlet of condenser 2 is connected to T-valve 6 import B, the outlet C of T-valve 6 is connected to micropump 1 by pipeline, and fan is fixed on directly over the condenser by clip.Each parts closes along the position of gravity direction: gas-liquid separator 3 and condenser 4 are positioned at the top of system, and micropump 1 is positioned at evaporator 2 bottom, and evaporator 4 and T-valve 6 are positioned at the centre position.
Claims (4)
1, a kind of liquid-circulating refrigeration system for computer heat radiation, comprise: evaporator (2), condenser (4), fan (5), it is characterized in that, also comprise: micropump (1), gas-liquid separator (3), T-valve (6), wherein micropump (1) links to each other by the inlet of pipeline with evaporator (2), the import of the outlet of evaporator (2) and gas-liquid separator (3) links together, gas-liquid separator (3) has two outlets, liquid after the separation is connected to T-valve (6) import A by the outlet of lower end, gaseous state condensing agent after the separation flows into the condenser (2) from the outlet of upper end, the outlet of condenser (2) is connected to T-valve (6) import B, the outlet C of T-valve (6) is connected to micropump (1) by pipeline, and fan (5) is fixed on directly over the condenser (4) by spring clip.
2, liquid-circulating refrigeration system for computer heat radiation according to claim 1 is characterized in that, described gas-liquid separator (3) and condenser (4) are positioned at the top of system.
3, liquid-circulating refrigeration system for computer heat radiation according to claim 1 is characterized in that, described micropump (1) is positioned at evaporator (2) bottom.
4, liquid-circulating refrigeration system for computer heat radiation according to claim 1 is characterized in that, described evaporator (4) and T-valve (6) are positioned at the centre position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510023283 CN1278202C (en) | 2005-01-13 | 2005-01-13 | Liquid-circulating refrigeration system for computer heat radiation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510023283 CN1278202C (en) | 2005-01-13 | 2005-01-13 | Liquid-circulating refrigeration system for computer heat radiation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1635449A true CN1635449A (en) | 2005-07-06 |
| CN1278202C CN1278202C (en) | 2006-10-04 |
Family
ID=34853147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510023283 Expired - Fee Related CN1278202C (en) | 2005-01-13 | 2005-01-13 | Liquid-circulating refrigeration system for computer heat radiation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1278202C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100394353C (en) * | 2006-11-16 | 2008-06-11 | 马进 | Electrical power supplier based on natural convective heat elimination |
| CN101751096B (en) * | 2009-12-25 | 2011-11-16 | 中国科学院电工研究所 | Evaporation-cooled device attached to surface of super computer |
| CN103576812A (en) * | 2013-11-06 | 2014-02-12 | 曙光信息产业(北京)有限公司 | Refrigerant distribution device and heat dissipation equipment for server cluster |
| CN109686709A (en) * | 2018-12-13 | 2019-04-26 | 上海新储集成电路有限公司 | A kind of fast cooling device and method |
| CN110213933A (en) * | 2018-11-30 | 2019-09-06 | 中航光电科技股份有限公司 | A kind of cooling plate type cooling system and liquid cooling source |
| CN110213934A (en) * | 2018-11-30 | 2019-09-06 | 中航光电科技股份有限公司 | A kind of immersion cooling system and immersion liquid cooling source |
-
2005
- 2005-01-13 CN CN 200510023283 patent/CN1278202C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100394353C (en) * | 2006-11-16 | 2008-06-11 | 马进 | Electrical power supplier based on natural convective heat elimination |
| CN101751096B (en) * | 2009-12-25 | 2011-11-16 | 中国科学院电工研究所 | Evaporation-cooled device attached to surface of super computer |
| CN103576812A (en) * | 2013-11-06 | 2014-02-12 | 曙光信息产业(北京)有限公司 | Refrigerant distribution device and heat dissipation equipment for server cluster |
| CN110213933A (en) * | 2018-11-30 | 2019-09-06 | 中航光电科技股份有限公司 | A kind of cooling plate type cooling system and liquid cooling source |
| CN110213934A (en) * | 2018-11-30 | 2019-09-06 | 中航光电科技股份有限公司 | A kind of immersion cooling system and immersion liquid cooling source |
| CN109686709A (en) * | 2018-12-13 | 2019-04-26 | 上海新储集成电路有限公司 | A kind of fast cooling device and method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1278202C (en) | 2006-10-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8077463B2 (en) | Heat dissipating system | |
| US8813834B2 (en) | Quick temperature-equlizing heat-dissipating device | |
| CN1278202C (en) | Liquid-circulating refrigeration system for computer heat radiation | |
| Ohadi et al. | A comparison analysis of air, liquid, and two-phase cooling of data centers | |
| JP4551261B2 (en) | Cooling jacket | |
| US20090272144A1 (en) | Computer cooling apparatus | |
| CN102577654A (en) | Heat conveying structure for electronic device | |
| TW505776B (en) | High-efficiency computer thermal management apparatus and method | |
| US8985195B2 (en) | Condensing device and thermal module using same | |
| CN101207112A (en) | Light emitting diode radiating module and applied display apparatus | |
| CN104851857A (en) | Chip cooling system | |
| US10874034B1 (en) | Pump driven liquid cooling module with tower fins | |
| US6741469B1 (en) | Refrigeration cooling assisted MEMS-based micro-channel cooling system | |
| TW201319505A (en) | Heat dissipation device and heat dissipation system | |
| US20070076376A1 (en) | Method, apparatus and computer system for providing for the transfer of thermal energy | |
| CN107062963B (en) | A kind of alternating expression micro-channel condenser for hair cell regeneration | |
| US10928869B2 (en) | Heat dissipation module | |
| Cataldo et al. | Implementation of passive two-phase cooling to an entire server rack | |
| CN214901821U (en) | Combined type cooling system | |
| US20140054009A1 (en) | Cooling plate and water cooling device having the same | |
| US7047759B1 (en) | Liquid cooling system | |
| CN213462750U (en) | Pulsating heat pipe type blade server heat management system | |
| CN112105231B (en) | Pulsating heat pipe type blade server thermal management system | |
| CN212569678U (en) | Heat radiation structure and electronic equipment | |
| US8850816B2 (en) | Power regeneration for an information handling system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061004 Termination date: 20100222 |