CN101728468B - Method for realizing non-refrigeration package coupling of semiconductor super-radiation light emitting diode - Google Patents
Method for realizing non-refrigeration package coupling of semiconductor super-radiation light emitting diode Download PDFInfo
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- CN101728468B CN101728468B CN2008102241083A CN200810224108A CN101728468B CN 101728468 B CN101728468 B CN 101728468B CN 2008102241083 A CN2008102241083 A CN 2008102241083A CN 200810224108 A CN200810224108 A CN 200810224108A CN 101728468 B CN101728468 B CN 101728468B
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Abstract
The invention discloses a method for realizing the non-refrigeration package coupling of a semiconductor super-radiation light emitting diode (LED). The method comprises the steps of: welding a radiation base on the bottom of a rectangular tube shell, and welding a heat sink on the radiation base near the back wall of the tube shell; vertically welding a tube core substrate of the semiconductor super-radiation LED on the heat sink; coupling a light emitting tail fiber from the front wall of the rectangular tube shell, and leading out two pins consisting of a positive tube pin and a negative tube pin of tube core drive current from the sidewall or the back wall of the rectangular tube shell; and placing the rectangular shell in a full nitrogen atmosphere, and carrying out the non-refrigeration package of the semiconductor super-radiation LED on the rectangular shell. In the invention, the method for realizing the non-refrigeration package coupling of the semiconductor super-radiation LED has the characteristics of simple realization, small structure size, greatly reduced volume and cost and miniaturization, and realizes the miniaturization and the low cost of the super-radiation LED module.
Description
Technical field
The present invention relates to the encapsulation coupling technique field of semiconductor super-radiation light emitting diode tube core, relating in particular to a kind of semiconductor super-radiation light emitting diode of realizing does not have the method for refrigeration encapsulation coupling.
Background technology
Semiconductor super-radiation light emitting diode is as the photoelectric device of a kind of performance between semiconductor laser and semiconductor light-emitting-diode, because high-output power of being had itself, wide spectrum, low ripple coefficient, than characteristics such as small divergence angles, make it obtain in many fields such as national defence, communication, medical science using widely.Such as be applied in optic fiber gyroscope, Fibre Optical Sensor, optical fiber telecommunications system, optical tomography aspect or the like.
The inertial guidance technology has become a key factor that influences modern war victory or defeat, and fiber-optics gyroscope is then leading the developing direction and the trend of following inertial guidance technology.Because plurality of advantages such as that optic fiber gyroscope had was all solid state, high bandwidth, great dynamic range, anti-vibration, anti-electromagnetic interference are so all have very important application in military affairs such as space flight, navigation, various weapons.
The core devices of optical fibre gyro system is exactly the semiconductor super-radiation light emitting diode module, and the miniaturization of super-radiance light emitting diode module, cost degradation also just become the key of the problem that solves fiber-optics gyroscope miniaturization, cost degradation.
Along with the development of military science technology, device miniaturization, low cost have become a kind of trend and needs.So the present invention proposes a kind of method for designing of nothing refrigeration encapsulation coupled structure of semiconductor super-radiation light emitting diode under this technical background, to realize miniaturization, the cost degradation of semiconductor super-radiation light emitting diode module.
Summary of the invention
(1) technical problem that will solve
In view of this, main purpose of the present invention is to provide a kind of semiconductor super-radiation light emitting diode of realizing not have the method for refrigeration encapsulation coupling, to realize the miniaturization and the cost degradation of semiconductor super-radiation light emitting diode encapsulation.
(2) technical scheme
For achieving the above object, the technical solution used in the present invention is as follows:
A kind of semiconductor super-radiation light emitting diode of realizing does not have the method for refrigeration encapsulation coupling, and this method comprises:
Weld a cooling base in the bottom of cuboid shell;
One is heat sink in close shell rear wall place welding on the cooling base;
With the tube core substrate of semiconductor super-radiation light emitting diode be vertically welded in this heat sink on;
Be coupled out light emitting tail fiber from this cuboid shell antetheca, two pins of both positive and negative polarity of drawing the tube core drive current from the sidewall or the rear wall of cuboid shell;
This cuboid shell is placed the full nitrogen atmosphere of welder, this cuboid shell is carried out the nothing refrigeration encapsulation of semiconductor super-radiation light emitting diode tube core.
In the such scheme, described cooling base is heat radiation copper coin or the plank identical with the bottom area of this cuboid shell.
In the such scheme, the thickness of described cooling base is 1mm.
In the such scheme, described heat sinkly be made by aluminium nitride material.
In the such scheme, describedly be coupled out light emitting tail fiber from this cuboid shell antetheca, the step of two pins of both positive and negative polarity of drawing the tube core drive current from the sidewall or the rear wall of cuboid shell, be to adopt squared design, realize the optical fiber coupling by laser welding technology, realize drawing of tube core drive current both positive and negative polarity lead by spun gold pressure welding technology.
In the such scheme, the length range of described cuboid shell is 5.0mm to 12.0mm, and width range is 3.0mm to 8.0mm, and height is 4.5mm.
In the such scheme, the raft alloy material is made but the employing of described cuboid shell is dispelled the heat preferably.
(3) beneficial effect
From technique scheme as can be seen, the present invention has following beneficial effect:
1, this realization semiconductor super-radiation light emitting diode provided by the invention does not have the method for refrigeration encapsulation coupling, be used for the nothing refrigeration encapsulation coupling of super-radiance light emitting diode, adopt squared design, tube core substrate is vertically welded on the heat dispersion heat sink, improves its heat-sinking capability.
2, this realization semiconductor super-radiation light emitting diode provided by the invention does not have the method for refrigeration encapsulation coupling, adopts the laser welding mode to improve the coupling efficiency and the stability of tube core.
3, this realization semiconductor super-radiation light emitting diode provided by the invention does not have the method for refrigeration encapsulation coupling, super-radiance light emitting diode has wide operating temperature range, thereby can be implemented in the purpose of tube core maintenance operate as normal under no refrigerator and the thermistor situation.
4, this realization semiconductor super-radiation light emitting diode provided by the invention does not have the method for refrigeration encapsulation coupling, realize that simply physical dimension is little, its volume and cost are reduced significantly, the characteristics that possess miniaturization have realized the miniaturization and the cost degradation of super luminescence diode module.
Description of drawings
Fig. 1 is the method flow diagram that realization semiconductor super-radiation light emitting diode provided by the invention does not have refrigeration encapsulation coupling;
Fig. 2 is the schematic diagram of the concrete encapsulating structure that provides according to the embodiment of the invention;
Fig. 3 is the agent structure schematic diagram that does not have the refrigeration encapsulating structure according to the semiconductor super-radiation light emitting diode that the embodiment of the invention is made;
Fig. 4 is the outline drawing that does not have the refrigeration encapsulating structure according to the semiconductor super-radiation light emitting diode that the embodiment of the invention is made.
Embodiment
For making the purpose, technical solutions and advantages of the present invention clearer, below in conjunction with specific embodiment, and with reference to accompanying drawing, the present invention is described in more detail.
Realization semiconductor super-radiation light emitting diode provided by the invention does not have the method for refrigeration encapsulation coupling, being used for the nothing refrigeration encapsulation coupling of semiconductor super-radiation light emitting diode, is a kind of in order to realize that semiconductor super-radiation light emitting diode does not have the method for designing of refrigeration encapsulation coupling.
As shown in Figure 1, Fig. 1 is the method flow diagram that realization semiconductor super-radiation light emitting diode provided by the invention does not have refrigeration encapsulation coupling, and this method may further comprise the steps:
Step 101: weld a cooling base in the bottom of cuboid shell; Described cooling base is heat radiation copper coin or the plank identical with the bottom area of this cuboid shell, and its thickness is 1mm.
Step 102: one is heat sink in close shell rear wall place welding on the cooling base; Described heat sinkly be made by aluminium nitride material.
Step 103: with the tube core substrate of semiconductor super-radiation light emitting diode be vertically welded in this heat sink on; The present invention adopts vertical welding manner, with the tube core substrate plane of semiconductor super-radiation light emitting diode be vertically welded in this heat sink on.
Step 104: be coupled out light emitting tail fiber from this cuboid shell antetheca, two pins of both positive and negative polarity of drawing the tube core drive current from the sidewall or the rear wall of cuboid shell; Describedly be coupled out light emitting tail fiber from this cuboid shell antetheca, the step of two pins of both positive and negative polarity of drawing the tube core drive current from the sidewall or the rear wall of cuboid shell, be to adopt squared design, realize the optical fiber coupling by laser welding technology, realize drawing of tube core drive current both positive and negative polarity lead by spun gold pressure welding technology.
Step 105: this cuboid shell is placed the full nitrogen atmosphere of welder, this cuboid shell is carried out the nothing refrigeration encapsulation of semiconductor super-radiation light emitting diode tube core.
The length range of described cuboid shell is 5.0mm to 12.0mm, and width range is 3.0mm to 8.0mm, and height is 4.5mm, and the raft alloy material is made but this cuboid shell employing is dispelled the heat preferably.
The present invention adopts the squared design scheme, all-metal encapsulation coupling, square tube shell bottom is placed with the heat sink of bigger heat-radiating substrate of an area and aluminium nitride, with tube core substrate be vertically welded in aluminium nitride heat sink on, increase area of dissipation to improve the radiating efficiency of tube core.By laser welding technology tube core is coupled, is coupled out light emitting tail fiber from square antetheca perforate in maintenance and the same plane of tube core, the slit of tail optical fiber and antetheca tapping closes with scolding tin.By spun gold pressure welding technology, the both positive and negative polarity lead spun gold of tube core is welded on respectively on two pins of cuboid shell sidewall or rear wall.But the material of shell adopts the good raft alloy material of thermal diffusivity.
Physical dimension of the present invention is little, and is simple in structure, and shell size of main body scope is long 5-12mm, wide 3-8mm, high 4.5mm.Can determine the size of main body of design pipe shell structure according to the needs of die package coupling.Tube shell bottom is placed with 1mm thick heat radiation copper coin or plank, and the aluminium nitride on heat-radiating substrate is heat sink to be of a size of long 3-5mm, wide 2-3mm.
The present invention improves the radiating efficiency and the coupling efficiency of tube core by various technological means, make super-radiance light emitting diode under the situation of no refrigerator, have wide operating temperature range, reach the nothing refrigeration encapsulation coupling effect of super-radiance light emitting diode, finally can realize the miniaturization and the cost degradation of super-radiance light emitting diode module, to satisfy market-oriented demand in many fields such as military affairs, medical science, communications.
Fig. 2 is the schematic diagram of the concrete encapsulating structure that provides according to the embodiment of the invention, and implementation step is divided into:
Step 1: but a cuboid raft alloy shell, long 10mm, wide 7.5mm, high 4.5mm.At tube shell bottom welding one identical size heat radiation copper coin with bottom area, copper plate thickness is 1mm.And then welding an aluminium nitride heat dispersion heat sink near shell rear wall place on the heat radiation copper coin, the heat sink length of aluminium nitride is 3mm, wide 1mm.
Step 2: with the semiconductor super-radiation light emitting diode tube core substrate be vertically welded in aluminium nitride heat sink on, to reach good radiating efficiency.
Step 3: the coupling by laser welding technology realization semiconductor super-radiation light emitting diode tube core, with the coupling efficiency of acquisition tube core maximum, and improve its stability.The tail optical fiber that is coupled out is drawn from shell antetheca perforate 7, and the portal vertical height of 7 relative tube shell bottom and the vertical height of the relative tube shell bottom of tube core of tail optical fiber is 2.5m all in the structure, makes tube core and optical fiber remain in the same plane.7 the opening diameter of portalling is 1.1mm.At 7 places of portalling, the slit of light emitting tail fiber and shell is sealed with scolding tin.
Step 4: adopt spun gold pressure welding technology that the both positive and negative polarity spun gold of semiconductor super-radiation light emitting diode tube core drive current is welded on respectively on pin two and the pin 3. the length of pin two and pin 3 is 11.5mm, and the distance between two pins is 2.54mm.
Step 5: place the full nitrogen atmosphere of welder to finish the nothing refrigeration encapsulation of semiconductor super-radiation light emitting diode tube core whole shell structure, interior all original papers of shell are in the stable nitrogen atmosphere, to keep the stable operational environment of tube core.
Fig. 3 and Fig. 4 show agent structure schematic diagram and the outline drawing that the semiconductor super-radiation light emitting diode that is made according to the embodiment of the invention does not have the refrigeration encapsulating structure respectively.
Above-described specific embodiment; purpose of the present invention, technical scheme and beneficial effect are further described; institute is understood that; the above only is specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any modification of being made, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. realize that semiconductor super-radiation light emitting diode does not have the method for refrigeration encapsulation coupling, is characterized in that this method comprises for one kind:
Weld a cooling base in the bottom of cuboid shell;
One is heat sink in close shell rear wall place welding on the cooling base;
With the tube core substrate of semiconductor super-radiation light emitting diode be vertically welded in this heat sink on;
Be coupled out light emitting tail fiber from this cuboid shell antetheca, two pins of both positive and negative polarity of drawing the tube core drive current from the sidewall or the rear wall of cuboid shell;
This cuboid shell is placed the full nitrogen atmosphere of welder, this cuboid shell is carried out the nothing refrigeration encapsulation of semiconductor super-radiation light emitting diode tube core.
2. realization semiconductor super-radiation light emitting diode according to claim 1 does not have the method for refrigeration encapsulation coupling, it is characterized in that described cooling base is heat radiation copper coin or the plank identical with the bottom area of this cuboid shell.
3. realization semiconductor super-radiation light emitting diode according to claim 1 and 2 does not have the method for refrigeration encapsulation coupling, it is characterized in that the thickness of described cooling base is 1mm.
4. realization semiconductor super-radiation light emitting diode according to claim 1 does not have the method for refrigeration encapsulation coupling, it is characterized in that, described heat sinkly be made by aluminium nitride material.
5. realization semiconductor super-radiation light emitting diode according to claim 1 does not have the method for refrigeration encapsulation coupling, it is characterized in that, describedly be coupled out light emitting tail fiber from this cuboid shell antetheca, the step of two pins of both positive and negative polarity of drawing the tube core drive current from the sidewall or the rear wall of cuboid shell, be to adopt squared design, realize the optical fiber coupling by laser welding technology, realize drawing of tube core drive current both positive and negative polarity lead by spun gold pressure welding technology.
6. realization semiconductor super-radiation light emitting diode according to claim 1 does not have the method for refrigeration encapsulation coupling, it is characterized in that the length range of described cuboid shell is 5.0mm to 12.0mm, and width range is 3.0mm to 8.0mm, and height is 4.5mm.
7. realization semiconductor super-radiation light emitting diode according to claim 1 does not have the method for refrigeration encapsulation coupling, it is characterized in that, the raft alloy material is made but the employing of described cuboid shell is dispelled the heat preferably.
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| CN101728468B true CN101728468B (en) | 2011-12-21 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102780157A (en) * | 2012-07-06 | 2012-11-14 | 江苏飞格光电有限公司 | Chip patching system of semiconductor laser and patching method |
| US9112091B2 (en) | 2012-10-05 | 2015-08-18 | Futurewei Technologies, Inc. | Apparatus and method for an optical package structure using aluminum nitride |
| CN104466662A (en) * | 2014-12-04 | 2015-03-25 | 国家电网公司 | Super-radiation light-emitting diode based on thermistors |
| CN104466663A (en) * | 2014-12-04 | 2015-03-25 | 国家电网公司 | High-polarization super-radiation light-emitting diode |
| CN105987323A (en) * | 2015-02-12 | 2016-10-05 | 中国科学院理化技术研究所 | Light source module and display device |
| CN109104796B (en) * | 2018-10-09 | 2023-09-22 | 西安中科华芯测控有限公司 | Chip assembly positioning fixture and method for super-radiation light-emitting diode |
| CN113224634A (en) * | 2020-01-19 | 2021-08-06 | 山东华光光电子股份有限公司 | Light-packaged semiconductor laser and application thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1901237A (en) * | 2005-07-20 | 2007-01-24 | 北京世维通光通信技术有限公司 | Super radiation light emitting tube heat insulation package body and its package method |
| CN2901585Y (en) * | 2006-03-29 | 2007-05-16 | 中国电子科技集团公司第四十四研究所 | Super radiation LED module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1901237A (en) * | 2005-07-20 | 2007-01-24 | 北京世维通光通信技术有限公司 | Super radiation light emitting tube heat insulation package body and its package method |
| CN2901585Y (en) * | 2006-03-29 | 2007-05-16 | 中国电子科技集团公司第四十四研究所 | Super radiation LED module |
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