CN1901237A - Super radiation light emitting tube heat insulation package body and its package method - Google Patents
Super radiation light emitting tube heat insulation package body and its package method Download PDFInfo
- Publication number
- CN1901237A CN1901237A CNA2005100850897A CN200510085089A CN1901237A CN 1901237 A CN1901237 A CN 1901237A CN A2005100850897 A CNA2005100850897 A CN A2005100850897A CN 200510085089 A CN200510085089 A CN 200510085089A CN 1901237 A CN1901237 A CN 1901237A
- Authority
- CN
- China
- Prior art keywords
- heat
- refrigerator
- barrier material
- shell
- packaging body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
This invention discloses a heat isolating body of a super radiation light emitting tube and its packaging method, in which, said package body includes a tube cover and a tube shell matched to said cover, an insulation heat isolating material is set on the lower surface of the cover and around the shell and a refrigeration device is set in said package unit, the package method includes: 1, cleaning the cover and shell and setting an insulation heat isolation material at the lower surface of the cover and around the shell, 2, setting a refrigerator in said package, 3, packaging said cover on the shell, 4, coupling the fibers and soldering them to test their photoelectric and heat performance.
Description
Technical field
The present invention relates to have semi-conductor photoelectronic active device and the method for packing thereof that heat radiation requires, particularly relate to the heat insulation packaging body of semiconductor super-radiation light emitting pipe and the method for packing thereof in fields such as being applied to optic fiber gyroscope, optical time domain reflectometer, Fibre Optical Sensor.
Background technology
Super radiation light emitting tube (Super Luminescence Diode, be abbreviated as SLD) be a kind of incoherent light light source with interior gain, it is a kind of semiconductor photoelectric device that early seventies grows up, in recent years, because it is in the important application of aspects such as optic fiber gyroscope, optical time domain reflectometer and interferometric optical fiber sensor, make development and the exploitation of SLD more and more be subjected to people's attention, SLD is the perfect light source of optic fiber gyroscope and optical time domain reflectometer, also is one of main light source of short-distance and medium-distance optical communication.Its optical characteristics is between semiconductor laser (LD) and light-emitting diode (LED).The SLD characteristics are that spectral width, power are big, coherence length is short etc., and its operation principle is the reflection that utilizes amplified spont-aneous emission and suppress end face in semiconductor active region, eliminates sharp the penetrating that the F-P effect produces, thereby produces continuous wide spectrum output.
SLD can significantly reduce by Mode Partition Noise in the rayleigh backscattering in the fiber turns and caused noise of non-linear Kerr effect and the Optical Fiber Transmission etc.Compare with general light-emitting diode, SLD power output height, coupling efficiency height, and beam divergence angle is little, and improved the power that is coupled into tail optical fiber and the signal to noise ratio of system.Just because of these characteristics of SLD (the power output height, coherence length is short, beam divergence angle is little and the spectral modulation degree of depth low etc.), just can remedy the deficiency of semiconductor laser and conventional light-emitting diode.Therefore it is widely used at aspects such as optic fiber gyroscope, optical time domain reflectometer and interferometric optical fiber sensors.
Yet the heat dissipation intrinsic owing to the superradiance pipe is big, and the internal heat conduction is bigger, and refrigerating efficiency is low, makes semiconductor cooler under the ambient temperature condition with higher, is difficult to realize enough refrigeration.And the applied environment of optic fiber gyroscope requires interior (40 ℃ to the 85 ℃) steady operation of the temperature range of superradiance Guan Zaida, and this makes conventional encapsulating structure can't satisfy its performance requirement.
In order to allow the superradiance pipe enlarge normal range of operation, improve the refrigeration temperature control efficient of encapsulation shell, low to overcome the refrigerating efficiency that causes because of the heat conduction in the encapsulation shell in the prior art, semiconductor element temperature height, the weakness of heat radiation difficulty, and cooperate with existing encapsulating structure parts well, with the implementation structure compactness, stable, volume is little, the purpose that cost is low, be necessary to design a kind of new super radiation light emitting tube heat insulation packaging body and method for packing thereof in fact, thereby solve the package cooling problem of long-term puzzlement industry, the characteristic and the applied environment scope of superradiance pipe risen to new level.
Summary of the invention
The object of the present invention is to provide a kind of super radiation light emitting tube heat insulation packaging body and method for packing thereof that reduces the hot reflux of super radiation light emitting tube inside with the raising refrigerating efficiency.
According to an aspect of the present invention, a kind of super radiation light emitting tube heat insulation packaging body is provided, and it comprises Guan Gai, can cover the shell that covers mutually with pipe, wherein, around described pipe lid lower surface and described shell, be provided with the insulation heat-barrier material, in described shell, also be provided with refrigerator.
In described refrigerator, be provided with a plurality of refrigeration units, establish in the gap between this refrigeration unit and be filled with heat-barrier material, the temperature end of refrigerator and the heat conduction of low-temperature end are hindered.
In addition, it is heat sink heat sink and transition to be installed on described refrigerator.
According to another aspect of the present invention, also provide a kind of method for packing of above-mentioned super radiation light emitting tube heat insulation packaging body, may further comprise the steps:
(1) scavenge pipe lid and shell are provided with the insulation heat-barrier material around lower surface of managing lid and shell;
(2) in described packaging body, refrigerator is set;
(3) described pipe cap seal is contained on the described shell;
(4) carry out optical fiber coupling and welding, and carry out photoelectricity and thermal characteristics test.
In addition, can also be included in the heat sink and heat sink step of transition of installation on the refrigerator afterwards in step (2).
Reduce the heat conduction of superradiance pipe shell inside effectively according to heat-insulating type super radiation light emitting tube packaging body of the present invention and method for packing thereof, widened the operating temperature range of device; In addition, this product technology is simple, and can with existing encapsulating structure compatibility, this product cost is low simultaneously, be fit to produce in enormous quantities.
Description of drawings
Below, will be described in more detail specific embodiments of the invention in conjunction with the accompanying drawings, wherein:
Fig. 1 is the schematic perspective view of super radiation light emitting tube heat insulation packaging body of the present invention;
Fig. 2 is the schematic diagram of the side sectional view of super radiation light emitting tube heat insulation packaging body of the present invention;
Fig. 3 is the schematic diagram of the side sectional view of the Peltier refrigerator that is injected with heat-barrier material in the first embodiment of the present invention;
Fig. 4 is the schematic diagram of the side sectional view of the Peltier refrigerator that prefabricated heat-barrier material is installed in the second embodiment of the present invention;
Fig. 5 for the transition heat sink temperature of the thermal characteristics that can reflect encapsulation with the curve chart of variation of ambient temperature.
Embodiment
See also Fig. 1 and Fig. 2, heat-insulating type super radiation light emitting tube packaging body according to the present invention is roughly rectangular box-shaped structure, it comprise pipe cover 101, can with pipe cover 101 shells that cover mutually 102, can be by the optic fibre guide hole 103 of optical fiber, be installed in size ratio that pipe covers 101 lower surface and manage and cover 101 slightly little last heat-barrier materials 201, be installed in the side heat-barrier material 202 on the wall of inboard of shell 102.In addition, can further be provided with Peltier refrigerator 104 in heat-insulating type super radiation light emitting tube package interior of the present invention, be installed in above the Peltier refrigerator 104 heat sink 105, be installed in transition heat sink 106 and super radiation light emitting tube tube core 107 on heat sink 105.Certainly, also can adopt the refrigerator of other types to realize purpose of the present invention.
Install heat-barrier material 201 101 times at the pipe of super radiation light emitting tube packaging body lid, pipe cover between 101 heat and the tube core 107 produce isolation; And the installed inside side heat-barrier material 202 around the shell 102 of super radiation light emitting tube then can make to produce between the heat of housing around the shell 102 and the tube core 107 and isolate.
Above-mentioned heat-barrier material the 201, the 202nd, adopt bonding, machinery is seized on both sides by the arms or the method for fitting naturally, be installed in the lower surface and shell 102 inside of super radiation light emitting tube pipe lid 101, isolate with the heat that forms between high temperature shell 102 (can be made of metal) and the low temperature tube core 107, thereby improve the efficient of refrigerator 104 effectively, to reach the purpose of the wavelength of stablizing tube core 107.Described heat-barrier material can be pottery, glass, plastics or the inactive material of other various chemical property, and shell 102 can be 14 pin dual-in-line shells, 14 pin butterfly type shells or 8 pin butterfly type shells etc.
See also Fig. 3, according to the semiconductor Peltier refrigerator 104 of the first embodiment of the present invention comprise Peltier refrigerator cold junction 109, the Peltier refrigerator hot junction 108 relative with described cold junction 109, between Peltier refrigerator cold junction 109 and hot junction 108 a plurality of column refrigeration units 110 and at the Peltier refrigerator 104 inner heat-barrier materials 203 of filling that inject.
See also Fig. 4, semiconductor Peltier refrigerator 104 according to a second embodiment of the present invention ' comprise Peltier refrigerator cold junction 109 ', with the Peltier refrigerator hot junction 108 of described cold junction 109 ' relative ', Peltier refrigerator cold junction 109 ' and hot junction 108 ' between a plurality of column refrigeration units 110 ' and be placed in refrigeration unit 110 ' between prefabricated heat-barrier material 203 '.
The Peltier refrigerator 104,104 of super radiation light emitting tube package interior ' a plurality of refrigeration units 110 between the gap in the heat-barrier material 203 made in advance of filling with insulation material 203 or install ', make the hot junction 108,108 of refrigerator 104 ' and cold junction 109,109 ' between heat conduction hindered, wherein said injection filling mode can be that the method that it is solidified is injected in densification of fluid heat-barrier material or loosely.
The concrete rigging position of heat-barrier material 201,202,203,203 ' in the super radiation light emitting tube packaging body can be determined according to required heat radiation requirement and space size; The laying of choosing not influence in the shell of tube core 107, optical fiber and other accessory of its size is principle.
Can be according to the heat radiation requirement, be installed in heat-barrier material 201,202,203,203 ' selectively on the wall of inboard that pipe covers 101 lower surface, shell 102 respectively and Peltier refrigerator 104,104 ' refrigeration unit 110 between.
Heat-barrier material 201,202,203,203 ' be applicable to from seeing infrared different wavelength range in the application of super radiation light emitting tube heat insulation package interior, and not relying on the parameters such as material, structure, coupled mode or operation wavelength of tube core 107, its purpose is to improve the thermal characteristics of encapsulation.
Heat insulation encapsulation of the present invention is carried out and existing technology highly compatible on existing active device air-tight packaging basis.In order to further specify technical characterictic of the present invention, for specifying its processing step, illustrate as follows below:
1. scavenge pipe lid 101 and shell 102 are laid heat-barrier material 201 below pipe covers 101, lay side heat-barrier material 202 on shell 102 inwalls;
2. be provided with in Peltier refrigerator 104,104 ' inside heat-barrier material 203,203 ';
3. on shell 102 bases, install Peltier refrigerator 104,104 ';
Pa Er card refrigerator 104,104 ' on install heat sink 105;
5. super radiation light emitting tube tube core 107 and transition heat sink 106 are installed on heat sink 105;
6. carry out optical fiber coupling and welding;
7. will be encapsulated on the shell 102 with the pipe lid 101 of heat-barrier material 201;
8. carry out the test of photoelectric characteristic and thermal characteristics.
Starting under semiconductor cooler and the constant current working condition thermal characteristics that can test non-heat insulation encapsulation and heat insulation encapsulation.Fig. 5 shows the change curve of heat sink 106 temperature of transition and ambient temperature.Abscissa is ambient temperature Tamb, and ordinate is the temperature T sink of transition heat sink 106 (thermistors).For ideal situation, 106 temperature that transition is heat sink is not with variation of ambient temperature, as curve 301 (as the reference curve).For non-heat insulation encapsulation, when ambient temperature raise, the temperature that transition is heat sink also obviously rose (as curve 303), even this is to be refluxed by excessive internal heat to cause can to cause refrigerator inefficacy (as curve 304); For heat insulation encapsulation, when ambient temperature raise, 106 temperature that transition is heat sink also raise to some extent, but the degree that its temperature raises is significantly alleviated (as curve 302), thereby prevent the refrigerator failure phenomenon, the temperature that has therefore also just partly suppressed super radiation light emitting tube tube core 107 rises.
In sum, core of the present invention is to conduct with its internal heat of heat-barrier material 201,202,203,203 ' reduction in the inside of super radiation light emitting tube packaging body, makes heat more to shell 102 outside transfers.
In addition, installing under the situation of refrigerator, can also make refrigerator 104,104 ' refrigeration better, efficient significantly improves, the temperature of tube core 107 can effectively be controlled.
The present invention is not only applicable to the encapsulation of superradiance pipe, is applicable to simultaneously the encapsulation of various optical active devices such as the semiconductor laser that needs refrigeration work, luminous tube, image intensifer yet.The present invention is with its good heat insulation and radiating effect, and the temperature range that these semiconductor photoelectronic devices are tolerated is wideer, service behaviour is more stable.
Claims (10)
1. a super radiation light emitting tube heat insulation packaging body comprises the pipe lid and covers the shell that covers mutually with pipe, it is characterized in that, is provided with the insulation heat-barrier material around described pipe lid lower surface and described shell, also is provided with refrigerator in described packaging body.
2. heat insulation packaging body according to claim 1 is characterized in that described refrigerator is provided with a plurality of refrigeration units, establishes in the gap between this refrigeration unit and is filled with heat-barrier material, and the temperature end of refrigerator and the heat conduction of low-temperature end are hindered.
3. heat insulation packaging body according to claim 2 is characterized in that, is equipped with heat sink heat sink with transition on described refrigerator.
4. heat insulation packaging body according to claim 3 is characterized in that, described refrigerator is the Peltier refrigerator.
5. according to any one described heat insulation packaging body in the claim 1 to 4, it is characterized in that, described heat-barrier material be by bonding, machinery is seized on both sides by the arms or the method for fitting naturally is installed in described shell inside.
6. heat insulation packaging body according to claim 5 is characterized in that, described insulation heat-barrier material can be pottery, glass, plastics or the inactive material of other various chemical property.
7. the method for packing of the heat insulation packaging body of superradiation light-emitting according to claim 1 is characterized in that, may further comprise the steps:
(1) scavenge pipe lid and shell are provided with the insulation heat-barrier material around lower surface of managing lid and shell;
(2) in described packaging body, refrigerator is set;
(3) described pipe cap seal is contained on the described shell;
(4) carry out optical fiber coupling and welding, and carry out photoelectricity and thermal characteristics test.
8. method for packing according to claim 7 is characterized in that, in step (2) afterwards, also is included in the heat sink and heat sink step of transition is installed on the refrigerator.
9. according to claim 7 or 8 described method for packing, it is characterized in that, in described refrigerator, be provided with a plurality of refrigeration units, establish in the gap between this refrigeration unit and be filled with heat-barrier material, the temperature end of refrigerator and the heat conduction of low-temperature end are hindered.
10. method for packing according to claim 6, it is characterized in that it is to inject the method realization that the fluid heat-barrier material solidifies it then or directly heat-barrier material is made in installation in advance by filling earlier that heat-barrier material is set in the air gap between the refrigeration unit of described refrigerator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100850897A CN1901237A (en) | 2005-07-20 | 2005-07-20 | Super radiation light emitting tube heat insulation package body and its package method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100850897A CN1901237A (en) | 2005-07-20 | 2005-07-20 | Super radiation light emitting tube heat insulation package body and its package method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1901237A true CN1901237A (en) | 2007-01-24 |
Family
ID=37657040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005100850897A Pending CN1901237A (en) | 2005-07-20 | 2005-07-20 | Super radiation light emitting tube heat insulation package body and its package method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1901237A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101728468B (en) * | 2008-10-15 | 2011-12-21 | 中国科学院半导体研究所 | Method for realizing non-refrigeration package coupling of semiconductor super-radiation light emitting diode |
| CN104319620A (en) * | 2014-10-11 | 2015-01-28 | 北京世维通科技发展有限公司 | Device for optical transmitter module and optical transmitter module |
| WO2016011820A1 (en) * | 2014-07-25 | 2016-01-28 | 深圳市光之谷新材料科技有限公司 | Led lighting |
| WO2019109512A1 (en) * | 2017-12-08 | 2019-06-13 | 深圳光峰科技股份有限公司 | Laser device and projection apparatus |
-
2005
- 2005-07-20 CN CNA2005100850897A patent/CN1901237A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101728468B (en) * | 2008-10-15 | 2011-12-21 | 中国科学院半导体研究所 | Method for realizing non-refrigeration package coupling of semiconductor super-radiation light emitting diode |
| WO2016011820A1 (en) * | 2014-07-25 | 2016-01-28 | 深圳市光之谷新材料科技有限公司 | Led lighting |
| CN104319620A (en) * | 2014-10-11 | 2015-01-28 | 北京世维通科技发展有限公司 | Device for optical transmitter module and optical transmitter module |
| CN104319620B (en) * | 2014-10-11 | 2018-04-06 | 北京世维通科技股份有限公司 | Device and light emission component for light emission component |
| WO2019109512A1 (en) * | 2017-12-08 | 2019-06-13 | 深圳光峰科技股份有限公司 | Laser device and projection apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107565003B (en) | Quantum dot LED encapsulation structure | |
| CN1901237A (en) | Super radiation light emitting tube heat insulation package body and its package method | |
| CN101313415B (en) | Light-emitting device and its manufacture method | |
| CA2747234C (en) | Led lighting system | |
| JP5209981B2 (en) | SEMICONDUCTOR COMPONENT HAVING OPTICALLY ACTIVE LAYER, DEVICE HAVING MULTIPLE OPTICALLY ACTIVE LAYERS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT | |
| US10050185B2 (en) | Hermetically sealed illumination device with luminescent material and manufacturing method therefor | |
| CN101132044A (en) | Methods of forming semiconductor light emitting device packages by liquid injection molding and molded semiconductor light emitting device strips | |
| CN103180977A (en) | Encapsulated radiation-emitting component comprising cooled wavelength converter and method for producing it | |
| CN102119451A (en) | Light-emitting device | |
| US20080087907A1 (en) | Light emitting diode package | |
| CN105655464A (en) | Light emitting device package | |
| KR20140039740A (en) | Light emitting device package | |
| TWI463703B (en) | Light source device | |
| CN101222012A (en) | LED package | |
| WO2013102861A1 (en) | Remote phosphor led lighting device | |
| CN103168197A (en) | Optical element edge treatment for lighting device | |
| CN102099622B (en) | Retaining frame having at least one optical element | |
| CN102185246A (en) | Single-frequency optical fiber laser resonant cavity | |
| CN104241474A (en) | Light emitting device and lighting system | |
| WO2005109529A1 (en) | Light-emitting-diode chip package and a collimator | |
| KR101349907B1 (en) | Method for manufacturing of heatpipe and radiating module manufactured the same | |
| KR20120132979A (en) | Light emitting device | |
| GB2452121A (en) | Packaging structure of a light emitting diode | |
| KR20110049117A (en) | Light fixture | |
| CN103633235A (en) | LED module and manufacturing process thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |