CN113224634A - Light-packaged semiconductor laser and application thereof - Google Patents
Light-packaged semiconductor laser and application thereof Download PDFInfo
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- CN113224634A CN113224634A CN202010061902.1A CN202010061902A CN113224634A CN 113224634 A CN113224634 A CN 113224634A CN 202010061902 A CN202010061902 A CN 202010061902A CN 113224634 A CN113224634 A CN 113224634A
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- laser
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- main part
- main body
- laser instrument
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 238000001816 cooling Methods 0.000 claims abstract description 32
- 238000005538 encapsulation Methods 0.000 claims description 10
- 239000000835 fiber Substances 0.000 claims 2
- 230000003287 optical effect Effects 0.000 abstract description 7
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 238000009434 installation Methods 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000013307 optical fiber Substances 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention relates to a light-packaged semiconductor laser and application thereof, belonging to the technical field of laser packaging, comprising a laser main body, wherein the laser main body is a packaged laser which has perfect light path design and is packaged by a shell, a chip is arranged in the laser main body, an optical mirror adjusting mirror, an optical steering mirror and the like are also arranged in the laser main body, a clamping position is arranged outside the laser main body and is used for bearing a cooling device outside the laser main body, a base is arranged at the bottom of the laser main body, the external shape of the laser main body is cuboid, the base is arranged on a plane with the smallest area of the cuboid, the design of the base reduces the occupation ratio of the laser in the horizontal direction, so that the laser occupies the fixed area as small as possible, the combinable power of the laser in unit area is increased, and more lasers can be accommodated and installed in the installation range of the laser in unit area, thereby increasing the total power that can ultimately be achieved as a whole.
Description
Technical Field
The invention relates to a laser with a novel packaging structure and application thereof, belonging to the technical field of laser packaging.
Background
With the needs of production and living, the design of the laser is required to meet various requirements. The power-weight ratio is an important index for measuring the laser. A higher power-to-weight ratio means that higher powers can be achieved per unit mass of laser. For example, in patent document CN 207148444U, the power of the laser is increased by a method of installing a dual-row laser on the same side by polarization beam combination, and in patent document CN 105652452A, the power of the laser is increased by a method of spatial beam combination, so that the power-to-weight ratio of the laser is increased. Both of the above two ways improve the power-to-weight ratio of the laser by increasing the close packing of the laser. Close packing of the lasers can also be bottleneck and insufficient heat dissipation from the lasers to a certain extent can affect the lifetime of the lasers and the performance of the lasers.
In addition, most of the existing lasers adopt a heat dissipation mode that the lasers horizontally lie on a water cooling plate, the horizontal lying mode can enable the water cooling effect to be sufficient, but the horizontal space occupation area of the lasers is large, and the lasers are not beneficial to simultaneous installation of a plurality of lasers. This limits the combination of laser units into higher power lasers to a large extent. In a horizontal laser, generally, in order to ensure that a chip is not deformed during welding, a base plate is relatively thick, and the thickness of a shell wall of the existing laser is also reduced, so that the power-weight ratio of the laser has a large space for improving. For better heat dissipation of the horizontally-arranged laser, a good damping mode is not provided between the water cooling plate and the laser generally, and the reliability of the laser can be reduced to a certain extent due to the fact that no damping scheme is provided in the environment with large vibration.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a laser with a novel packaging structure, and aims to solve the problems of small power-weight ratio, heat dissipation of the laser, shock absorption of the laser and the like of the laser in the prior art.
The invention also provides application of the laser.
The technical scheme of the invention is as follows:
the utility model provides a light-duty encapsulated semiconductor laser, includes the laser instrument main part, the laser instrument of laser instrument main part completion for the encapsulation, there has been perfect light path design and the laser instrument of casing encapsulation has been accomplished, be equipped with the chip in the laser instrument main part, chip quantity more than or equal to 1, still include the optical lens adjusting mirror in the laser instrument main part, optics turn to the mirror etc. the laser instrument main part outside sets up the screens, the screens is used for bearing the outside cooling device of laser instrument main part, laser instrument main part bottom is equipped with the base, laser instrument main part external shape is the cuboid, the base is located on the minimum plane of cuboid area.
The clamping aims to better attach the laser and the cooling device, so that better heat dissipation is achieved, the laser main body device comprises a chip and various corresponding required adjusting mirrors, steering mirrors and the like, the chip and various mirrors are mounted on the laser main body before the laser main body is covered, and the laser main body refers to the laser which is provided with the chip and the mirrors and is covered. The chip is in the main laser shell, and the cooling device is outside the main shell.
Preferably, a seat cushion is arranged below the base. The seatpad is installed between the fixed plate that base and laser instrument will be fixed, and the purpose is the shock attenuation and more stable fixed laser instrument and play the absorbing effect, protects the part of each part of laser instrument, increases the reliability of laser instrument.
Preferably, the laser main body comprises a shell wall, a bottom plate and a cover plate, the shell wall, the bottom plate and the cover plate are in a cuboid shape after being packaged, the base is arranged on the bottom plate, and the thickness of the shell wall and the thickness of the cover plate are smaller than or equal to that of the bottom plate. The device of the application allows the bottom plate, the shell wall and the cover plate to be continuously thinned and lightened within the technical allowable range, and aims to reduce the overall weight of the laser and increase the power-weight ratio of the laser.
Further preferably, the laser main body includes an electrical connection pin and an optical fiber output portion of the laser, and the electrical connection pin and the optical fiber output portion are disposed on the laser main body except the bottom plate. The two parts can be designed at reasonable positions according to the practical application requirements of the laser without special requirements.
Further preferably, a clamping position is arranged on the outer side of the vertical shell wall of the laser main body. The cooling device connected with the part can be a water cooling plate, a water cooling pipe can be air-cooled, or other cooling devices meeting the design, use and the like of the laser, and the cooling device and the chip are arranged inside and outside the same side.
Preferably, the base is provided with a screw hole, so that the device can be stably fixed, and the laser main body is fixed on an external device through the base.
The area of the base can be larger than the area in contact with the laser main body or smaller than the area in contact with the laser main body, and is mainly determined by the position of the fixing screw hole. The shape of the base design is not particularly required, so that the laser can be reliably fixed.
The utility model provides a light-duty encapsulated semiconductor laser, includes the laser instrument main part, the laser instrument of laser instrument main part for the encapsulation is accomplished has perfect light path design and has accomplished the laser instrument of casing encapsulation, is equipped with the chip in the laser instrument main part, chip quantity more than or equal to 1, still include the optical lens adjusting mirror in the laser instrument main part, optics turn to the mirror etc. the laser instrument main part is outside to be connected with cooling device, laser instrument main part bottom is equipped with the base, laser instrument main part external shape is the cuboid, the base is located on the minimum plane of cuboid area.
The application of a light-weight packaged semiconductor laser comprises the following steps: the chip is installed in the laser main body, the light path design is carried out, the laser main body is packaged, the base is fixed on a platform to be installed, the laser main body is vertical, the number of the set laser main bodies is installed in a unit area according to requirements, and the cooling device is installed outside the laser main body.
Preferably, the chip and the external cooling device are respectively mounted on the inner side surface and the outer side surface of the same side surface.
The invention has the beneficial effects that:
1. the technical scheme of the invention aims at the packaged whole laser rather than the local heat dissipation in the laser, and on the premise of optimizing the performance of the laser, the design of the base reduces the occupation ratio of the laser in the horizontal direction, so that the laser occupies the fixed area as small as possible, the combinable power of the laser in unit area is increased, more lasers can be contained and installed in the installation range of the laser in unit area, and the total power which can be finally achieved is integrally increased.
2. The chip mounting position and the laser fixing position are not combined together, the bottom plate, the shell wall and the cover plate are allowed to become thinner and lighter within the technical allowable range, the overall weight of the laser is reduced, and the overall weight of the laser is smaller and the power-to-weight ratio of the laser is increased due to the fact that the shell wall of the laser is thinner under the same power.
3. The base and the seat cushion can absorb shock to a great extent, and the stability and the reliability of the laser and the service life of the laser are improved.
Drawings
Fig. 1 is a schematic front view of a light-weight packaged semiconductor laser device according to embodiment 1 of the present invention;
fig. 2 is a schematic side view of a light-weight packaged semiconductor laser device according to embodiment 1 of the present invention;
fig. 3 is a schematic front view of a light-weight packaged semiconductor laser device according to embodiment 4 of the present invention;
fig. 4 is a schematic side view of a light-weight packaged semiconductor laser device according to embodiment 4 of the present invention;
in the figure, 1, a base, 2, a laser main body, 3, a clamping position, 4 and a screw hole; 2-1 parts of shell wall, 2-2 parts of bottom plate, 2-3 parts of cover plate, 2-4 parts of laser chip mounting position, 2-5 parts of cooling device mounting position.
Detailed Description
The present invention will be further described by way of examples, but not limited thereto, with reference to the accompanying drawings.
Example 1:
the utility model provides a light-duty encapsulated semiconductor laser, as shown in fig. 1-2, including laser main part 2, the laser main part is the laser instrument that the encapsulation was accomplished, there has been perfect light path design and the laser instrument of casing encapsulation has been accomplished, be equipped with the chip in the laser main part, chip quantity more than or equal to 1, require to set for according to the product of difference, still include the optical lens adjusting mirror in the laser main part, optics turns to mirror etc. laser main part outside sets up screens 3, the screens is used for bearing the outside cooling device of laser main part, laser main part bottom is equipped with base 1, laser main part external shape is the cuboid, the base is located on the minimum plane of cuboid area.
The laser main body comprises a shell wall 2-1, a bottom plate 2-2 and a cover plate 2-3, the shell wall, the bottom plate and the cover plate are cuboid after being packaged, the base is arranged on the bottom plate, and the thickness of the shell wall and the thickness of the cover plate are smaller than or equal to that of the bottom plate. The device of the application allows the bottom plate, the shell wall and the cover plate to be continuously thinned and lightened within the technical allowable range, and aims to reduce the overall weight of the laser and increase the power-weight ratio of the laser. The screens are arranged on the outer sides of the vertical shell walls of the laser main body. The cooling device connected with the part can be a water cooling plate, a water cooling pipe can be air-cooled, and other cooling devices meeting the design, use and the like of the laser can be arranged.
The clamping aims to better attach the laser and the cooling device, so that better heat dissipation is achieved, the laser main body device comprises a chip and various corresponding required adjusting mirrors, steering mirrors and the like, the chip and various mirrors are mounted on the laser main body before the laser main body is covered, and the laser main body refers to the laser which is provided with the chip and the mirrors and is covered. The chip is in the main laser shell, and the cooling device is outside the main shell.
The laser main body comprises a power connection pin and an optical fiber output part of the laser, and the power connection pin and the optical fiber output part are arranged on the laser main body except the bottom plate. The two parts can be designed at reasonable positions according to the practical application requirements of the laser without special requirements. The laser package is completed and its mounting position is determined accordingly.
Example 2:
a semiconductor laser in a light package, having the structure as described in embodiment 1, except that a seat pad is provided below the base. The seatpad is installed between the fixed plate that base and laser instrument will be fixed, and the purpose is the shock attenuation and more stable fixed laser instrument and play the absorbing effect, protects the part of each part of laser instrument, increases the reliability of laser instrument, further prevents simultaneously that the laser instrument warp.
Example 3:
a semiconductor laser of light weight package, whose structure is as described in embodiment 1, except that a screw hole 4 is provided on a base 1, which can stably fix the device, and a laser main body is fixed on an external device through the base.
The area of the base can be larger than the area in contact with the laser main body or smaller than the area in contact with the laser main body, and is mainly determined by the position of the fixing screw hole. The shape of the base design is not particularly required, so that the laser can be reliably fixed.
Example 4:
a light-weight packaged semiconductor laser is shown in figures 3-4 and comprises a laser main body 2, wherein the laser main body is a packaged laser which is designed with a perfect light path and is packaged by a shell, chips are arranged in the laser main body, the number of the chips is more than or equal to 1, an optical mirror adjusting mirror, an optical steering mirror and the like are also arranged in the laser main body, the outer part of the laser main body is connected with a cooling device, a base 1 is arranged at the bottom of the laser main body, the outer shape of the laser main body is cuboid, the base is arranged on a plane with the smallest area of the cuboid, the device is not provided with a clamping position, the outer cooling device is directly connected with the laser main body, as shown in figure 4, the mounting positions 2-4 of the laser chips are arranged on the inner side, the mounting positions 2-5 of the outer cooling device are arranged on the outer side, and are arranged, better heat dissipation.
Example 5:
use of a lightweight packaged semiconductor laser, the laser structure being as described in embodiment 1, comprising the steps of: the chip is installed inside the laser body, the light path design is carried out, the laser body is packaged, the base is fixed on a platform to be installed, the laser body is vertical, the number of the set laser bodies is installed in a unit area according to requirements, the cooling device is installed outside the laser body, and the chip and the cooling device are installed on the inner side face and the outer side face of the same side face respectively, as shown in fig. 2.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. The utility model provides a semiconductor laser of light-duty encapsulation, its characterized in that, includes the laser instrument main part, the laser instrument of laser instrument main part for the encapsulation completion is equipped with the chip in the laser instrument main part, and chip quantity more than or equal to 1, the outside screens that sets up of laser instrument main part, the screens is used for bearing the outside cooling device of laser instrument main part, and laser instrument main part bottom is equipped with the base, and laser instrument main part external shape is the cuboid, and the base is located on the minimum plane of cuboid area.
2. A semiconductor laser of light weight package as claimed in claim 1 wherein a seat is provided below the base.
3. A light weight packaged semiconductor laser as claimed in claim 1 wherein the laser body includes a wall, a base plate, and a cover plate, the wall, the base plate, and the cover plate are packaged to be rectangular, the base is disposed on the base plate, and the wall and the cover plate have a thickness less than or equal to that of the base plate.
4. A light weight packaged semiconductor laser as claimed in claim 3 wherein the laser body includes electrical leads and fiber output portions of the laser, the electrical leads and fiber output portions being provided on portions of the laser body other than the base.
5. A light weight packaged semiconductor laser as claimed in claim 3 wherein the outside of the vertical laser body housing wall or the outside of the vertical cover plate is provided with detents.
6. A semiconductor laser of light weight package as claimed in claim 1 wherein the base is provided with screw holes.
7. The utility model provides a semiconductor laser of light-duty encapsulation, its characterized in that, includes the laser instrument main part, the laser instrument of laser instrument main part for the encapsulation completion is equipped with the chip in the laser instrument main part, and chip quantity more than or equal to 1, the outside cooling device that is connected with of laser instrument main part, and laser instrument main part bottom is equipped with the base, and the outside shape of laser instrument main part is the cuboid, and the base is located on the minimum plane of cuboid area.
8. Use of a light-weight packaged semiconductor laser as described in embodiments 1-7, comprising the steps of: the chip is installed in the laser main body, the light path design is carried out, the laser main body is packaged, the base is fixed on a platform to be installed, the laser main body is vertical, the number of the set laser main bodies is installed in a unit area according to requirements, and the cooling device is installed outside the laser main body.
9. Use of a light-weight packaged semiconductor laser as claimed in claim 8 wherein the chip and the external cooling means are mounted on the same inner and outer side of the side respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010061902.1A CN113224634A (en) | 2020-01-19 | 2020-01-19 | Light-packaged semiconductor laser and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010061902.1A CN113224634A (en) | 2020-01-19 | 2020-01-19 | Light-packaged semiconductor laser and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113224634A true CN113224634A (en) | 2021-08-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010061902.1A Pending CN113224634A (en) | 2020-01-19 | 2020-01-19 | Light-packaged semiconductor laser and application thereof |
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| Country | Link |
|---|---|
| CN (1) | CN113224634A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1104053A2 (en) * | 1999-11-29 | 2001-05-30 | Nec Corporation | Semiconductor laser module |
| CN101728468A (en) * | 2008-10-15 | 2010-06-09 | 中国科学院半导体研究所 | Method for realizing non-refrigeration package coupling of semiconductor super-radiation light emitting diode |
| CN102255238A (en) * | 2010-09-17 | 2011-11-23 | 武汉高晟知光科技有限公司 | Packaging structure of semiconductor laser device and application device thereof |
| CN205319507U (en) * | 2015-12-15 | 2016-06-15 | 西安炬光科技股份有限公司 | Big passageway semiconductor laser liquid refrigeration piece and laser instrument thereof |
| CN205811270U (en) * | 2016-07-21 | 2016-12-14 | 北京工业大学 | A kind of self-control ECLD package casing |
| CN106898943A (en) * | 2015-12-18 | 2017-06-27 | 上海奥镭光电科技有限公司 | A kind of grand channel semiconductor laser |
| US20180278013A1 (en) * | 2016-04-26 | 2018-09-27 | Nlight, Inc. | Low swap laser pump diode module and laser amplifier incorporating the same |
| CN110137139A (en) * | 2019-06-06 | 2019-08-16 | 西安炬光科技股份有限公司 | Semiconductor packages shell and Optical Maser System |
-
2020
- 2020-01-19 CN CN202010061902.1A patent/CN113224634A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1104053A2 (en) * | 1999-11-29 | 2001-05-30 | Nec Corporation | Semiconductor laser module |
| CN101728468A (en) * | 2008-10-15 | 2010-06-09 | 中国科学院半导体研究所 | Method for realizing non-refrigeration package coupling of semiconductor super-radiation light emitting diode |
| CN102255238A (en) * | 2010-09-17 | 2011-11-23 | 武汉高晟知光科技有限公司 | Packaging structure of semiconductor laser device and application device thereof |
| CN205319507U (en) * | 2015-12-15 | 2016-06-15 | 西安炬光科技股份有限公司 | Big passageway semiconductor laser liquid refrigeration piece and laser instrument thereof |
| CN106898943A (en) * | 2015-12-18 | 2017-06-27 | 上海奥镭光电科技有限公司 | A kind of grand channel semiconductor laser |
| US20180278013A1 (en) * | 2016-04-26 | 2018-09-27 | Nlight, Inc. | Low swap laser pump diode module and laser amplifier incorporating the same |
| CN205811270U (en) * | 2016-07-21 | 2016-12-14 | 北京工业大学 | A kind of self-control ECLD package casing |
| CN110137139A (en) * | 2019-06-06 | 2019-08-16 | 西安炬光科技股份有限公司 | Semiconductor packages shell and Optical Maser System |
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Application publication date: 20210806 |
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