CN101728080B - Electronic component unit - Google Patents
Electronic component unit Download PDFInfo
- Publication number
- CN101728080B CN101728080B CN2009102060538A CN200910206053A CN101728080B CN 101728080 B CN101728080 B CN 101728080B CN 2009102060538 A CN2009102060538 A CN 2009102060538A CN 200910206053 A CN200910206053 A CN 200910206053A CN 101728080 B CN101728080 B CN 101728080B
- Authority
- CN
- China
- Prior art keywords
- container
- accessory
- electronic component
- hook portion
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000009434 installation Methods 0.000 claims abstract description 28
- 238000005266 casting Methods 0.000 claims description 33
- 229920005989 resin Polymers 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 abstract description 65
- 238000012856 packing Methods 0.000 abstract description 9
- 238000004806 packaging method and process Methods 0.000 description 43
- 238000005538 encapsulation Methods 0.000 description 26
- 238000009413 insulation Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- 238000005755 formation reaction Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000015556 catabolic process Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020938 Sn-Ni Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910008937 Sn—Ni Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
- H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
The present invention relates to an electronic component unit, such as a capacitor unit. A packing container of the capacitor unit is provided with a packing cover and a packing cup. The front end of a lead frame is introduced out from a part between the packing cover and the packing cup at the side surface. The packing cup is provided with a flange part which projects from the side surface. The packing cover comprises the following components: a projection strip part, an installation grounding surface which is formed as the upper surface of the projection strip part and is grounded at the installation surface, and hook part which forms a hook shape and is combined with the flange part. The upper end surface of the hook part becomes a same surface of the installation grounding surface.
Description
Technical field
The present invention is that relevant electronic unit is housed inside in the container and the electronic component unit that casting resin forms in this container.
Background technology
All the time, as the technology in this field, the electronic component unit of being put down in writing in the open 2-79020 communique of well-known japanese utility model application.This electronic component unit is that the electronic unit of capacitor etc. is housed inside in the container and the mesohigh capacitor of the resin that casting resin forms in this container casting casting mold.
Summary of the invention
Through reflow soldering this electronic component unit is being installed under the situation on the installation base plate, expectation can prevent rightly that the solder flux of the soldering paste of a side terminal electrode from flowing to and invading the opposite side terminal electrode and condition of poor is installed.In addition, in this electronic component unit,, consider container is divided into 2 more than the accessory and through making up the situation that these accessories come assembling container in order easily electronic unit to be contained in the container.In the case, be necessary to combine effectively and fixing divided container Fitment between.
The objective of the invention is to, in electronic component unit, combine effectively and the fixing accessory that constitutes container between, and suppress the intrusion of solder flux when mounted to heteropole side pad.
Electronic component unit of the present invention is characterized in that: this electronic component unit possesses: have ceramic plain body and the electronic unit that is fixed in the metal terminal on the plain body of this pottery and hold the container of electronic unit; This electronic component unit be under the state in the outside that is exposed to container of the front end at metal terminal in container casting resin form, and this electronic component unit is installed on the installed surface and uses; Container have the 1st accessory that when installing, is grounded on installed surface and with the 2nd combined accessory of the 1st accessory; The front end of metal terminal in the side of container from being led to the outside of container between the 1st accessory and the 2nd accessory; The 2nd accessory has along the metal terminal in the outside that is led to container and outstanding from the side protuberance; The 1st accessory has convex strip portions, ground plane, hook portion is installed; This convex strip portions is equipped on the edge part of the side of the end face that intersects with the side; This installation ground plane is used as the upper surface of convex strip portions and forms; And this installation ground plane is grounded on installed surface, and this hook portion extends towards the 2nd accessory side along the side, and sets this hook portion in pairs with the mode of clamping protuberance; One end of the 2nd accessory side of this hook portion is bent and forms hook shape and be incorporated into protuberance, and the end face of the other end of hook portion becomes same plane with the installation ground plane.
According to this electronic component unit, in the 1st accessory and the 2nd accessory that combination container had,, a pair of hook portion of the side of container the 1st accessory combines when clamping the protuberance of the 2nd accessory with this protuberance.Therefore, the 1st accessory and the 2nd accessory can be fixing by effectively.In addition, on the end face of the 1st accessory, have as the upper surface of convex strip portions and be formed on the installation ground plane of the edge part of side, have, the end face of hook portion is formed and installs ground plane becomes same plane.Therefore, when this electronic component unit was installed, the end face of above-mentioned installation ground plane and hook portion all was grounded on installed surface, thereby has strengthened contact area.Have, the shape of ground plane in plan view that is formed by the end face that ground plane and hook portion are installed be again, will be along the protuberance of the 2nd accessory and the shape of the front end encirclement of derivative terminal electrode.Therefore, when this electronic component unit was installed, the scolding tin that can suppress the front end of above-mentioned terminal electrode flowed towards another ground plane of electronic component unit, and its result also just can suppress when mounted solder flux to the intrusion of heteropole side pad.
In addition, the position that combined of hook portion and protuberance can be the midriff of the side of container.In the case, hook portion extends to the installation ground plane from the midriff of container side always, so the whole center of gravity of electronic component unit is partial to install ground plane side, so improved the stability of the electronic component unit when installing.
According to electronic component unit of the present invention, can combine effectively and the fixing accessory that constitutes container between, and can suppress when mounted solder flux to the intrusion of heteropole side pad.
Description of drawings
Fig. 1 is the stereogram of the capacitor unit of expression execution mode as electronic component unit involved in the present invention.
Fig. 2 is the exploded perspective view of the capacitor unit of Fig. 1.
Fig. 3 is the sectional view of the capacitor unit of Fig. 1.
Fig. 4 is the hook portion of expression cap and the side view of the appearance that the packaging container flange part combines.
Fig. 5 (a) is the plane graph of the capacitor unit of Fig. 1, (b) is the side view of appearance that expression is installed on this capacitor unit the installed surface of installation base plate.
Fig. 6 is the sectional view of another capacitor unit of expression.
Embodiment
What Fig. 1～Fig. 3 represented is the surface installation type capacitor unit 1 as the execution mode of electronic component unit involved in the present invention.Capacitor unit 1 is a kind of resin cast mesohigh capacitor unit of casting type, the packaging container 30 that possesses capacitor department (electronic unit) 10 and hold capacitor department 10.In this capacitor unit 1, the lead frame of capacitor department 10 (metal terminal) 15a, 15b expose to the outside of this packaging container 30 from side 34a, the 34b of packaging container 30 respectively.Then, be housed inside in the packaging container 30 with this state capacitor department 10 that lead frame 15a, 15b are exposed after, to carrying out resin cast in this packaging container 30.This capacitor unit 1 is to be installed on the installation base plate towards the mode of installation base plate with the upper surface side of representing among Fig. 1.In addition, when implementing this installation, be formed joint face 14a, the 14b of horizontal plane, on the installed surface of installation base plate, be connected in electrode pads and be grounded at the leading section of lead frame 15a, 15b.
2 lead frames (metal terminal) 15a, 15b that capacitor department 10 possesses the capacitor body 13 of circular plate shape and is electrically connected on capacitor body 13.Capacitor body 13 has the ceramic component 17 that the ceramic formation body by circular plate shape constitutes.And, on relative two sides' up and down of this ceramic component 17 circular end surface, be formed with surface electrode 19a, 19b that the form with expansion on its whole is made up of Cu or Ag respectively.As previously discussed, constituted capacitor by facing surfaces electrode 19a, 19b and the ceramic component 17 that is held in the dielectric between this surface electrode 19a, the 19b.Capacitor body 13 is so that its circular end surface up and down is basically parallel to the posture of the bottom surface 63 of encapsulation cup 60; And above end surface electrode 19a is positioned at the form of lower position than the contact-making surface 60a of encapsulation cup 60, is housed inside the position of the substantial middle of encapsulation cup 60.
Thereby lead frame 15a, 15b impose plating Sn, plating Sn-Ag alloy or plate the Sn-Ni alloy to be formed tabular metal terminal on the base material that is made up of Cu.End through welding lead frame 15a is fixed in the surface electrode 19a in the upper surface existence of capacitor body 13.In addition, the other end of lead frame 15a is bent to the shape of regulation in the outside of packaging container 30 after passing the gap between encapsulation cup 60 and the cap 40 and flatly being led to outside the packaging container 30.Equally, through welding the end of lead frame 15b is fixed in the surface electrode 19b of existence below capacitor body 13.In addition, the other end of lead frame 15b is bent to the shape of regulation in the outside of packaging container 30 after passing the gap between encapsulation cup 60 and the cap 40 and flatly being led to outside the packaging container 30.
And, on the position that lead frame 15a, 15b are passed, be equipped with flange part (protuberance) 62a, 62b that 64a, 64b from the side project to the horizontal direction outside respectively respectively in 2 places on the top of encapsulation cup 60.It presents the U font when observing flange part (protuberance) 62a, 62b from the side, and becomes the fitting projection 42a that is equipped on encapsulation cup 40, the shape that 42b is embedded into. Lead frame 15a, 15b pass the gap between flange part 62a, 62b and fitting projection 42a, the 42b, thereby are directed and are flatly led to the diapire of flange part 62a, 62b.In following explanation, respectively lead frame 15a, 15b are referred to as terminal lead division 33a, 33b with the derivative part of aforesaid mode.In addition, thereby reveal, terminal lead division 33a, 33b are equipped on the side opposite each other of packaging container 30 in order outside packaging container 30, to avoid surperficial away from 2 lead frame 15a, 15b as far as possible.
Then, do following explanation with regard to relevant lead frame 15b detouring in packaging container 30.As shown in Figure 3, lead frame 15b extends with the form of the bottom surface 63 of below capacitor body 13, approaching to encapsulate cup 60, thereby and in front further along the bottom surface 63 and inwall side 65 extend the upper end that arrives flange part 62b.Have, lead frame 15b carries out the crooked outside that is also led to packaging container 30 towards the outside of packaging container 30 again.As previously discussed, lead frame 15b along bottom surface 63 and inwall side 65 detour leaving as far as possible on the position of capacitor body 13.
According to such formation, with lead frame 15b mutually the distance of surface electrode 19a and this lead frame 15b of heteropole become and separate, its result has reduced the possibility of the insulation breakdown that causes owing to the discharge between lead frame 15b and surface electrode 19a.Also have, lead frame 15a just detours with relatively shorter distance to terminal lead division 33a from the upper surface of capacitor body 13.Therefore, for lead frame 15a, there is no need to pass heteropole surface electrode 19b etc. near, the worry of the insulation breakdown of relevant lead frame 15a also just compares less.
In addition, on cap 40, be formed with outstanding projection 47 downwards.This projection 47 is extended towards encapsulation cup 60 1 side from the part of the inboard of fitting projection 42b, until than the contact-making surface 60a of encapsulation cup 60 more bottom surface 63 sides be inserted into along inwall side 65.Near the upper end of encapsulation cup 60, lead frame 15b is withstood on the inwall side 65 by this projection 47, and is clamped between the lateral surface of inwall side 65 and projection 47.Projection 47 is rectangular tabular, and approaches more until the position of specific surface electrode 19a to extend with inwall side 65 till the position of bottom surface 63 with paralleling, and the width of projection 47 is bigger than the width of lead frame 15b.
According to the formation of such projection 47, as shown in Figure 3, when surface electrode 19a observed, projection 47 was present between the proximal most position 16 and this surface electrode 19a of lead frame 15b.That is, when surface electrode 19a observed, the proximal most position 16 of lead frame 15b was hidden by projection 47, and becoming can not be in sight.
As previously discussed, capacitor department 10 is being disposed under the state in the packaging container 30, with carrying out resin cast in 80 pairs of packaging containers 30 of casting resin.As previously discussed, through cap 40 is made into the quadrangular barrel shape, packaging container 30 becomes the cup-shape that upper surface has opening 31 as a whole, so can easily aqueous casting resin be injected through opening 31 and be filled in the packaging container 30.As the aqueous casting resin that is injected, use belongs to the heat-resistance epoxy resin of coatings etc.At this, owing to the surface tension of the aqueous casting resin that injects from opening 31, liquid level becomes the shape that bends to concavity, afterwards, forms the casting face 81 that bends to concavity through this casting resin of hot curing.So this casting face 81 directly becomes the surface of accomplishing the capacitor unit 1 after making.So, through making casting face 81 bendings of casting resin 80, make elongated between lead frame 15a and the lead frame 15b, thereby also just can reduce the possibility that reveal on the surface at capacitor unit 1 lip-deep creepage distance.
In addition, before injecting casting resin, the surface coated base coating of the part that will be positioned at packaging container 30 in the middle of capacitor department 10 is so be formed with dope layer 11 on every side at capacitor department 10 and lead frame 15a, 15b.Also have, in Fig. 2, omit the diagram of casting resin 80 and dope layer 11.
Then, be used for the fastening above-mentioned encapsulation cup 60 and the structure of cap 40 with reference to Fig. 2 and Fig. 4 explanation.On the two ends of the lateral surface 44b of the cap 40 of the part of the side 34b that constitutes packaging container 30, be equipped with 2 (a pair of) hook portions 71,71 that extend below.This hook portion 71,71 both can be used as the part of cap 40 and had been shaped integratedly, also can be used as other individuality and was installed on the lateral surface 44b of cap 40.This hook portion 71,71st positions with the form of the 62b of clamped flanges portion, and the bottom of the hook portion 71,71 of extending in the lower end that surpasses flange part 62b, presents hook shape through carry out bending towards the inboard respectively.In addition, the upper surface 71a of hook portion 71,71,71a forms to become conplane form with above-mentioned installation ground plane 73a.
Then, as shown in Figure 4, in assembled package lid 40 and encapsulation cup 60, flange part 62b clamps in hook portion 71,71 and the midriff of 34b combines with flange part 62b in the side of packaging container 30.Also have, on the 34a of the side of packaging container 30, with same mode fully, 2 (a pair of) hook portions 71,71 at two ends that are equipped on the lateral surface 44a of cap 40 combine with flange part 62a.
Then, do following explanation with regard to the relevant action effect that produces by above-mentioned capacitor unit 1.
In the process of assembled package container 30, as previously discussed, can fix encapsulation cup 60 and cap 40 effectively by the structure that combines hook portion 71,71 and flange part 62a, 62b respectively.Its result can reduce the leakage possibility of the casting resin that is injected in the packaging container 30.
Also have; Though also can consider will be by hook portion so and the combined structure that forms is equipped on the inboard of packaging container 30; But in this case; The inner shapes of packaging container 30 will become complicated, thus the bad possibility of the filling of casting resin 80 can increase, thereby make the possibility of the defective insulation in the packaging container 30 also can increase.With respect to this, in capacitor unit 1, because the combined structure that is formed by hook portion 71,71 and flange part 62a, 62b is equipped on the outside of packaging container 30, so can not increase the possibility of the defective insulation in the packaging container 30.
In addition; Though also consider the combined structure that will form by hook portion so be equipped on lead frame 15a, 15b draw the perpendicular side of direction 36 (with reference to Fig. 1); But in this case, the size of drawing the perpendicular direction of direction with lead frame 15a, 15b is increased.Its result is with the miniaturization that hinders capacitor unit and the improve of packing density.With respect to this, in capacitor unit 1, the combined structure that is formed by hook portion 71,71 and flange part 62a, 62b is equipped on side 34a, 34b, and outstanding on the direction identical with lead frame 15a, the derivative direction of 15b.That is, utilize that original just necessary space set combined structure in order to draw lead frame 15a, 15b, so the above-mentioned combined structure of capacitor unit 1 can not hinder the raising of miniaturization and packing density.
In addition, on cap 40, have, the edge part of lateral surface 44a, 44b side as the upper surface of convex strip portions 73 and the installation ground plane 73a that forms have again, make the upper surface 71a of hook portion 71,71,71a and this installation ground plane 73a become same plane.Therefore, shown in Fig. 5 (a) and (b), on the installed surface 90 that capacitor unit 1 is installed on installation base plate in, the upper surface 71a of above-mentioned installation ground plane 73a and hook portion 71,71,71a all is grounded on installed surface 90, thereby contact area becomes big.Have, ground plane 73a and upper surface 71a are installed, 71a forms the ground plane 75 of " コ " shape of the joint face 14a that surrounds terminal electrode respectively, 14b together.Therefore, in the installation procedure of this capacitor unit 1, suppress to be used to connect owing to the existence of ground plane 75 joint face 14a, 14b fusion scolding tin on installed surface 90, flow to joint face 14b, the 14a of heteropole respectively.Its result just can suppress when mounted solder flux to the intrusion of heteropole side pad.
In addition, hook portion 71,71 is the side 34a of packaging container 30, the midriff of 34b with the position that flange part 62a, 62b combine, and hook portion 71,71 extends to installation ground plane 73a from the midriff of container side 34a, 34b always.Therefore, capacitor unit 1 whole center of gravity is partial to install ground plane 73a one side, thereby has improved the stability of capacitor unit 1 when mounted.
In addition, in capacitor unit 1, constituted packaging container 30 by the accessory that is divided into 2 parts that is referred to as cap 40 and encapsulation cup 60.Capacitor department 10 is being contained under the state in the packaging container 30; By the projection that is equipped on cap 40 47 lead frame 15b is withstood on the inwall side 65 of encapsulation cup 60, thereby just can enough projections 47 clamp lead frame 15b and in addition fixing effectively with inwall side 65.At this; Metal tabular lead frame 15a, 15b have fully big rigidity with respect to the weight of capacitor body 13 etc., and the external force (for example when casting resin being injected in the packaging container 30, acting on the power of capacitor department 10) that in manufacturing process, acts on capacitor department 10 is regarded as the distortion that lead frame 15a, 15b are bent etc.Therefore, through anchor leg frame 15b, capacitor department 10 integral body also become fixing with respect to this packaging container 30 in packaging container 30.
Therefore; Capacitor department 10 is being contained in the operation in the packaging container 30; After effectively capacitor department 10 (particularly capacitor body 13) being positioned the desired position in the packaging container 30 and fixing, just can inject aqueous casting resin and with its curing.Therefore, in the capacitor unit of accomplishing after making 1, capacitor department 10 also is disposed at desired position effectively, thereby also just can be suppressed at the element occurrence positions skew in the packaging container 30.
What in addition, in this capacitor unit, become problem is the ruined situation of insulation between each one.Particularly under the situation of this capacitor unit 1, the lead frame 15b that below capacitor body 13, extends is necessary below capacitor body 13, till terminal lead division 33b, to detour with long path.Therefore, still can not avoid the problem of close proximity of the surface electrode 19a of lead frame 15b and heteropole fully.In addition, because the situation that insulating reliability reduces also can appear in the defective part that casting resin 80 is produced when solidifying etc.Therefore, the insulation breakdown that causes owing to the discharge between lead frame 15b and the surface electrode 19a also can let the people worry.
With respect to this, in capacitor unit 1, as previously discussed, the position that above-mentioned projection 47 extends to specific surface electrode 19a is approached the position (with reference to Fig. 3) of bottom surface 63 more.Therefore, when surface electrode 19a observes, between the nearest position 16 of lead frame 15b and this surface electrode 19a, have projection 47.As previously discussed; Being considered to the projection 47 higher than casting resin 80 insulating reliabilities is present between position 16 and this surface electrode 19a; So improved the insulating reliability between projection 47 and the lead frame 15b, thereby also just can reduce the ruined possibility of insulation.
In addition; Resin cast mesohigh capacitor unit as other casting types; As shown in Figure 6, it is also conceivable that the capacitor unit 201 of following type, wherein; Draw lead frame 215a, the 215b of capacitor department 210 from the opening 231 of the packaging container 203 of cup-shaped, and inject aqueous casting resin from this opening 231.But in this case, around the lead frame 215a that draws from the casting face 281 of casting resin, 215b, formed protrusion 216a, the 216b of resin owing to surface tension.As previously discussed; If on casting face 281, have irregularly shaped as protrusion 216a, 216b; So for example in the thermal shock test of capacitor unit 201, thermal stress can concentrate on protrusion 216a, 216b, thus might be on casting resin 280 generation of cracks.
With respect to this, according to capacitor unit 1 (Fig. 3), be divided into 2 parts up and down through packaging container 30 with cup-shape, lead frame 15a, 15b are passed between encapsulation cup 60 and the cap 40 and from the sidewall of packaging container 30 draw.So, there is no need to draw lead frame 15a, 15b from casting face 81, and on casting face 81, can not produce irregularly shaped, so reduced the possibility of generation of cracks on casting resin 80.
The present invention is not limited to above-mentioned execution mode.For example; In execution mode; Though be employed in the formation that becomes rectangular shape in the plan view as cap 40 and encapsulation cup 60; It is circular shape that but cap and encapsulation cup also can be made on plan view, also can be other polygonal shape, perhaps also can be other shapes.
Claims (2)
1. electronic component unit is characterized in that:
This electronic component unit possesses: has ceramic plain body and the electronic unit that is fixed in the metal terminal on the plain body of this pottery and holds the container of said electronic unit,
This electronic component unit be under the state in the outside that is exposed to said container of the front end at said metal terminal in said container casting resin form, and this electronic component unit is installed on the installed surface and uses,
Said container has the 1st accessory that when installing, is grounded on said installed surface, and said container has and the 2nd combined accessory of said the 1st accessory,
The front end of said metal terminal in the side of said container from being led to the outside of said container between said the 1st accessory and said the 2nd accessory,
Said the 2nd accessory has the protuberance outstanding along the said metal terminal in the outside that is led to said container and from said side,
Said the 1st accessory has: convex strip portions, and this convex strip portions is equipped on the edge part of the said side of the end face that intersects with said side; Ground plane is installed, and this installation ground plane is used as the upper surface of said convex strip portions and forms, and this installation ground plane is grounded on said installed surface; Hook portion; This hook portion extends towards said the 2nd accessory side along said side; And set this hook portion in couples with the mode of clamping said protuberance, an end of said the 2nd accessory side of this hook portion is bent and forms hook shape and be incorporated into said protuberance
The end face of the other end of said hook portion and said installation ground plane are on same plane.
2. the electronic component unit of putting down in writing like claim 1 is characterized in that:
The position that said hook portion and said protuberance are combined is the midriff of the said side of said container.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008-270057 | 2008-10-20 | ||
| JP2008270057A JP4687769B2 (en) | 2008-10-20 | 2008-10-20 | Electronic component unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101728080A CN101728080A (en) | 2010-06-09 |
| CN101728080B true CN101728080B (en) | 2012-03-28 |
Family
ID=42218972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102060538A Active CN101728080B (en) | 2008-10-20 | 2009-10-20 | Electronic component unit |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4687769B2 (en) |
| KR (1) | KR101051622B1 (en) |
| CN (1) | CN101728080B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2571047A2 (en) * | 2011-06-03 | 2013-03-20 | Huawei Technologies Co., Ltd. | Insulating ring for packaging, insulating ring assembly and package |
| CN104240944B (en) * | 2014-09-01 | 2017-01-25 | 慈溪市日益电容器厂 | Capacitor insulated terminal cover |
| JP6264340B2 (en) * | 2015-08-11 | 2018-01-24 | Tdk株式会社 | Piezoelectric sounding body |
| CN108831745A (en) * | 2018-05-23 | 2018-11-16 | 苏州宏泉高压电容器有限公司 | A kind of novel high-pressure ceramic capacitor insulation suit shell |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3352783B2 (en) * | 1993-09-29 | 2002-12-03 | 米沢電線株式会社 | Coil storage case |
| JP2601410Y2 (en) * | 1993-09-30 | 1999-11-22 | 株式会社トーキン | Noise filter |
| JP2007227661A (en) * | 2006-02-23 | 2007-09-06 | Tdk Corp | Coil part |
-
2008
- 2008-10-20 JP JP2008270057A patent/JP4687769B2/en active Active
-
2009
- 2009-09-04 KR KR1020090083307A patent/KR101051622B1/en active IP Right Grant
- 2009-10-20 CN CN2009102060538A patent/CN101728080B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010098252A (en) | 2010-04-30 |
| JP4687769B2 (en) | 2011-05-25 |
| KR101051622B1 (en) | 2011-07-26 |
| CN101728080A (en) | 2010-06-09 |
| KR20100044086A (en) | 2010-04-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101728080B (en) | Electronic component unit | |
| US7974077B2 (en) | Solid electrolytic capacitor | |
| TWI413143B (en) | Solid electrolytic capacitor | |
| CN1767186B (en) | Lead frame and semiconductor package therefor | |
| JPS63157649A (en) | Induction generator and manufacture of the same | |
| CN106257652B (en) | Packaging module and packaging method | |
| TWI419188B (en) | Solid electrolytic capacitor | |
| US9343334B2 (en) | Electronic component and method for manufacturing electronic component | |
| US10388581B2 (en) | Semiconductor device having press-fit terminals disposed in recesses in a case frame | |
| CN102196703A (en) | Electronic apparatus | |
| JP4940665B2 (en) | Case mold type capacitor | |
| JP4396734B2 (en) | Surface mount electronic components | |
| KR101232241B1 (en) | Ceramic electronic component | |
| KR101043196B1 (en) | Electronic part unit and electronic part unit manufacturing method | |
| CN108831673A (en) | Electromagnetic coil | |
| CN102956575A (en) | Package structure and manufacture method thereof | |
| JP4737664B2 (en) | Surface mount type solid electrolytic capacitor and manufacturing method thereof | |
| JP4339956B2 (en) | Electronic components | |
| JP4693469B2 (en) | Surface mount type solid electrolytic capacitor | |
| CN214279970U (en) | Packaging structure of shielding component | |
| CN214753742U (en) | Lead frame and power module of preventing rosin joint | |
| CN218730925U (en) | Chip packaging structure | |
| CN219832666U (en) | Chip packaging assembly, camera module and electronic equipment | |
| CN210667990U (en) | Resin packaging-based anti-warping wire inductor | |
| CN209843690U (en) | Integrated forming and packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |