CN101701937A - Ultrasonic nondestructive test method and test device - Google Patents
Ultrasonic nondestructive test method and test device Download PDFInfo
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- CN101701937A CN101701937A CN200910073151A CN200910073151A CN101701937A CN 101701937 A CN101701937 A CN 101701937A CN 200910073151 A CN200910073151 A CN 200910073151A CN 200910073151 A CN200910073151 A CN 200910073151A CN 101701937 A CN101701937 A CN 101701937A
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Abstract
The invention provides an ultrasonic nondestructive test method with high accuracy and a test device. An ultrasonic probe component comprises a transmitting probe and two receiving probes. The ultrasonic wave transmitted by the transmitting probe is reflected by a wedge block and then enters the interior of a machinery structure piece, thereby generating diffracted wave at the edge of defects. The ultrasonic diffracted wave received by the two receiving probes is tested and measured to obtain transmission time tS1 and tS2. Two ovals with different focal lengths and end point parameters are formed by three ultrasonic wave probe position parameters and transmission distance parameters TL1 and TL2 corresponding to transmission time tS1 and tS2. The coordinate values of the edges of the upper end and lower end of the defect can be obtained by oval equation set settlement, thereby figuring out geometric parameters such as defect length L, slant angle alpha and defect depth d. Data fusion between displacement parameters (delta x, delta y) given by a CMOS image senor which is installed in the probe component and defect measure values is carried out to draw a high accurate three-dimensional image of the defect.
Description
Technical field
What the present invention relates to is the method for quantitative measuring of mechanical structured member inherent vice in a kind of Ultrasonic Nondestructive, the fracturing mechanics technical field.Be particularly related to the method for the measurement of defect geometry feature in a kind of Ultrasonic NDT.
Background technology
The TOFD method is the abbreviation of Time of Flight Diffraction (diffraction time difference method), is the method general name of carrying out defectoscopy in diffracted wave travel-time of utilizing the defective edge to be produced.Therefore, in a broad sense, every defective end diffracted wave time of reception difference of utilizing comes the method for quantitative evaluation to be referred to as the TOFD method.But practical application in recent years and relevant criterion, to use two longitudinal wave probes opposed in opposite directions, one one receipts, so-called " echo " (being lateral wave, scattering wave, diffracted wave and the bottom surface ripple) information of utilization are carried out defect location, method quantitative, qualitative evaluation specially refers to be the TOFD method.This method is that Britain AEA (International Atomic Energy Agency) proposes at first, has stipulated to carry out with the TOFD method specific procedure and the requirement of defective quantitative evaluation subsequently in BS7706 in 1993, and once is used for detecting in labour of generating set.Use the method and the acceptance condition of TOFD method detected pressures container and power boiler weld seam several years ago, in ASME code cases 2235, made specified in more detail again.During with this method, two longitudinal wave oblique probes are fixing at a certain distance, obtain display image with D scanning or in conjunction with the B scan mode, and it is fixed high in view of the above defective to be carried out depth measurement.The imperfection of the Ultrasonic Nondestructive method self-technique that the TOFD method is realized causes mechanical structured member Inner Defect Testing precision is difficult to guarantee, can not well satisfy actual requirement of engineering.
Fig. 1 has described the detection principle according to TOFD method ultrasonic non destructive detection equipment, i.e. one one two probe detection methods of receiving.The ultrasound wave that ultrasound transmitting transducer 1 sends passes through the refraction of wedge 3 and incides structural member inside; Wherein a part of hyperacoustic energy is propagated along structural member upper surface 7, and part energy incides structural member 9 inside.
The signal that is received by receiving transducer 2 can obtain the travel-time, is respectively t to the travel-time of acceptance point 8 by launching site 4 again to defective 6 upper and lower edges
1And t
2Transmitting transducer 1 and receiving transducer about defective 6 centrosymmetric conditions under, can draw the depth d that the defective edge is positioned at structural member inner distance upper surface 7:
In the formula: c is the velocity of sound of ultrasound wave at structural member 9 internal communications
t
SFor by launching site 4 to defective 6 go up or lower limb again to travel-time of acceptance point 8
S is half of distance between launching site 4 and the acceptance point 8
Work as t
S=t
1The time, d is the depth value d of defective 6 upper end-face edges
1t
S=t
2The time, d is the depth value d of defective 6 lower edge
2
For avoiding caused measuring error of probe delay time, can also adopt the time difference t of lateral wave and diffracted wave
DCalculate the depth value d of defective 6:
Work as t
DDuring for defective 6 upper end-face edge time difference signals, adopting (2) d that formula calculated is defective upper end-face edge depth value d
1Work as t
DDuring for defective 6 lower edge time difference signals, adopting (2) d that formula calculated is defective lower edge depth value d
2
All exist the defective off-center based on the existing supersonic damage-free detection method of TOFD principle and produce the common problem of measuring error.For travel-time t in the formula (1)
S, the upper and lower end edge of defective 6 respectively and launching site 4 and 8 air line distance sums of acceptance point be a fixed constant, this mark sheet reveals oval character.As shown in Figure 2, the upper end-face edge for defective 6 and 10 all drops on the same elliptic curve respectively; Defective 6 and 10 lower edge can drop on another elliptic curve equally.Suppose that structural member inside has only a defective 10, adopt the TOFD method computing formula (1) or (2) all can be with defective 10 equivalences to defective 6 residing positions.This has just caused the measuring error of position on defect length, the degree of depth and the y direction of principal axis.Based on two probe detection methods of TOFD principle, measure the parametric t that is obtained once launching ultrasound wave
DOr t
SSituation under, can not carry out the high-acruracy survey of Ultrasonic Nondestructive technology substantially to the structural member inherent vice.As long as defective departs from this oval central point at the y direction of principal axis, it is just inevitable that TOFD detects error, and it is big more to depart from then error far away more.For this reason, TOFD needs to improve in conjunction with the B scan mode accuracy of detection of TOFD.
Summary of the invention
The object of the present invention is to provide a kind of need not just can realize the inherent vice high Precision Detection, also can provide defect geometry feature high-acruracy survey result's Ultrasonic NDT TOFD-LWE method with B scanning; The present invention also aims to provide a kind of pick-up unit according to the constructed high-precision ultrasound Non-Destructive Testing of TOFD-LWE method.
The object of the present invention is achieved like this:
The y-z plane of detected mechanical structured member (definition of coordinate is referring to Fig. 5) is the detection section perpendicular to the mechanical structured member surface.The detection probe assembly is moving on the x direction of principal axis on the x-y plane.Described detection probe assembly contains three probes at least, wherein has at least one to be transmitting probe; Comprise a transmitting probe 1 and two receiving transducers 2,13 in the three probe patterns, as shown in Figure 4.The ultrasound wave part that transmitting probe 1 is sent makes it incide mechanical structured member inside through the refraction of transmitting probe wedge 3, and another part ultrasound wave is propagated at the y direction of principal axis along the mechanical structured member upper surface.When the ultrasound wave of incident runs into defective 6,11,12 produce diffracted waves at defective upper and lower end edge, and diffracted wave is by 2,13 receptions of two receiving transducers.Detect by the diffracted wave signal that two receiving transducers 2,13 are received, can obtain ultrasound wave at the travel-time of structural member inside t
S1And T
S2Pairing diffusion path length TL
1And TL
2, t
S1Corresponding point 4 are to putting 11 to point 14 path TL
1Ultrasonic propagation time, t
S2Corresponding point 4 are to putting 12 to point 8 path TL
2Ultrasonic propagation time.So by point 4,14 and TL
1And put 4,8 and TL
2Just can form focal length, end points a, two ellipses that the b parameter is different, the coordinate (y that utilizes elliptic equation group that formula (3), (4) form and formula (5)-(8) just can calculate defective upper end-face edge point 11 then
1, z
1) value.
The utilization said method can solve the coordinate (y of defective lower edge point 12 equally
2, z
2) value, again according to the coordinate figure (y of defective upper and lower end marginal point 11,12
1, z
1), (y
2, z
2) just calculate length L, inclined angle alpha, the depth of defect d geometric parameter of defective.
Three probe patterns among the present invention also can be designed to the integrated mode of two transmitting probes, a receiving transducer.
Pick-up unit of the present invention comprises ultrasonic inspection probe module, ultrasonic simulation signal conditioner module, ultrasonic emitting machine module and four modules of embedded system module; As shown in Figure 6, the ultrasonic inspection probe module is made of a transmitting probe 1, two 2,13 and cmos image sensors 19 of receiving transducer, two receiving transducers are connected with the ultrasonic simulation signal conditioner respectively, and transmitting probe is connected with the output of ultrasonic power amplifier; Two passages of ultrasonic simulation signal conditioner module are except that respectively with separately receiving transducer is connected, be connected with the embedded system module through the ultrasonic signal connector through between pcb board that amplifies, Filtering Processing two passages are afterwards exported, the ultrasonic signal after amplifying delivered to analog to digital converter 24,25 respectively carry out analog to digital conversion; The output of ultrasonic emitting machine module is connected with the ultrasound emission probe, the input of transmitter is connected with 26 outputs of FPGA programming device, FPGA produces the prestage 21 that the required Transistor-Transistor Logic level pulse signal of defects detection transfers to the ultrasonic emitting machine under the control of flush bonding processor 27.LCD display in the embedded system module adopts the form of connector between pcb board to be connected with the flush bonding processor mainboard with keyboard, and the CF card apparatus is directly installed on the flush bonding processor mainboard, and mouse and usb communication interface all adopt USB A type or Type B connector.
The invention provides a kind of need not with B scanning just can implementation structure spare inherent vice high Precision Detection, also can provide defect geometry feature high-acruracy survey result's Ultrasonic NDT new method, i.e. TOFD-LWE method.
TOFD-LWE (Time of Flight Diffraction and Locating with Ellipse) method is to utilize the high-acruracy survey of the structural member inherent vice that TOFD method and combining of bielliptic(al) location technology realized.Fig. 4 has described TOFD-LWE supersonic damage-free detection method implementation structure spare inherent vice high-acruracy survey principle.According to the bielliptic(al) location technology, the TOFD-LWE Ultrasonic NDT can adopt a ultrasound emission probe and two ultrasonic receiving transducers or two ultrasound emission to pop one's head in and a ultrasonic receiving transducer, perhaps abbreviates three probe patterns as.Ultrasound examination by three probe patterns can obtain two ellipses on the y-z plane; Just can obtain the coordinate figure of defective marginal point on the y-z plane to resolving of two oval joinings.Receive detecting pattern than two the one detection efficiency height of receiving detecting pattern for one two, because the former only needs a ultrasonic emitting can finish one-time detection; And the latter needs twice ultrasonic emitting just can finish one-time detection.Aspect defect geometry pattern measurement precision, two kinds of detecting patterns and indifference.
The accuracy of detection of TOFD-LWE detection method and defective depart from the range-independence of central point between two probes at the y direction of principal axis, and characteristics are that a ultrasonic emitting can be finished defective y-z plane and detects; The accurate description of the measuring accuracy height of the geometric properties of defective, defect location precision height, suitable defective three-dimensional geometry feature.This detection method belongs to the new method of Ultrasonic NDT quantitative measurment truly.This defective two, the accurate measurement that the three-dimensional geometry characteristic parameter is comparatively complete are that employed ultrasonic non destructive detection equipment or ray non-destructive detecting device are unapproachable in the present engineering, not only be fit to the structural member Non-Destructive Testing, be fit to the Non-Destructive Testing at the scene in fracturing mechanics field simultaneously.
In the detection probe module of pick-up unit of the present invention, installed cmos image sensor 19 additional.In the actual detection process, imageing sensor 19 can the displacement data parameter of detection probe assembly on the x-y plane; By popping one's head in, just can obtain defective three-dimensional geometry feature and draw the three-dimensional picture of defective in the fusion of x-y in-plane displancement data and y-z section fault detection data; Can remove complicated x-y plane high-accuracy mechanical like this from and walk frame, be particularly suitable for the on-the-spot convenience that detects.
Description of drawings
Fig. 1 is that structural member inherent vice TOFD detects principle schematic.
Fig. 2 is based on the common measuring error key diagram of TOFD principle detection method.
Fig. 3 is the description about structural member inherent vice geometric properties.
Fig. 4 is a TOFD-LWE method high-precision ultrasound Non-Destructive Testing schematic diagram.
Fig. 5 is the definition of TOFD-LWE method detection coordinates.
Fig. 6 is that TOFD-LWE method ultrasonic non destructive detection equipment is realized theory diagram.
Label declaration
The 1st, the ultrasonic emitting probe, 2, the 13rd, the ultrasound wave receiving transducer, the 3rd, emission and receiving transducer wedge, the 4th, ultrasonic emitting is in the equivalent geometric center point in structural member surface, the 5th, detected structural member basal surface, 6,10 is the structural member inherent vice, the 7th, detected structural member upper surface, 8, the 14th, receive ultrasound wave in structural member upper surface equivalence geometric center point, 9 is detected structural member inside, the 11st, the upper end-face edge point of defective, the 12nd, defective lower edge point, the 15th, the defective upper end-face edge is put the joining of 11 formed bielliptic(al)s in detected structural member outside, the 16th, the length L of defective in the y-z detection plane, the 17th, the angle α between defective and the structural member upper surface 7, the 18th, detected structural member, the 19th, cmos image sensor, the 20th, ultrasonic power amplifier, the 21st, ultrasonic emitting machine prestage, 22, the 23rd, ultrasound wave analog signal conditioner device passage, 24, the 25th, analog to digital converter, the 26th, programmable device FPGA, the 27th, the flush bonding processor that constitutes by DSP and ARM, the 28th, the LCD LCD, the 29th, CF card apparatus, the 30th, keyboard, mouse I/O equipment, the 31st, USB interface.
Annotate: the definition of defect geometry feature is: angle α, length L, upper end-face edge point position 11 and lower edge point position 12 described defect geometry features.
Embodiment
For example the present invention is done description in more detail below in conjunction with accompanying drawing:
In Fig. 5, provided the definition of TOFD-LWE method detection coordinates.Wherein the y-z plane is the detection section perpendicular to the mechanical structured member surface, and the three-dimensional that just can realize inherent vice x-y plane detection probe assembly moving on the x direction of principal axis detects.
In Fig. 4: the ultrasound wave that transmitting probe 1 is sent is mapped to structural member 9 inside through being refracted into of transmitting probe wedge 3, and wherein some ultrasound wave is to propagate at the y direction of principal axis along the structural member upper surface; When the ultrasound wave that incides structural member inside (being commonly referred to compressional wave) runs into defective 6, will be thereon, lower limb 11,12 produces diffracted waves (only having marked the transmission path of defective coboundary 11 diffracted wave that produces to receiving transducer 13,2 among the figure). Receiving transducer 13 and 2 all can receive the diffracted wave that the defective edge is produced.According to three probe detecting patterns of TOFD-LWE detection principle, the transmitting-receiving probe of two various combinations can be to an edge formation focal length of tested structural member inherent vice, two ellipses that oval endpoint parameter is different; And at ultrasound emission probe launching site 4 places, the focal position of two ellipses is identical.Because launching site 4, acceptance point 13 and 8 all are positioned on the y axle,, there are two between these two ellipses about axisymmetric two joinings 11 of y and 15 for the upper end-face edge 11 of defective 6.The upper end-face edge point 11 of first intersection point counter structure spare inherent vice 6, another intersection point are positioned at the outside joining 15 of tested structural member.Two joinings 11 and 15 are axisymmetric about y.Obviously joining 15 is irrational, and has only intersection point 11 to be only correct separating.The mode that the lower edge coordinate points 12 of defective 6 adopts two ellipses to cross equally too among Fig. 4 solves.
Have according to elliptic equation:
Wherein:
t
S1For launching site 4 to the defective coboundary point 13 ultrasonic transmission times of 11 to first acceptance points;
C is the velocity of sound of detected mechanical structured member inside;
s
1Be half of launching site 4 to first acceptance points 13 distances, and be known;
t
S2For launching site 4 to defective coboundary point 11 to secondary destination 8 ultrasonic transmission times;
s
2Be launching site 4 half, and be known to secondary destination 8 distances;
When detecting, ultrasonic emitting probe 1 launch and detects ultrasonic signal and make ultrasound wave receiving transducer 13,2 can receive diffracted wave by the edge generation of defective 6; By being detected just, 2, the 13 diffracted wave signals that received of popping one's head in to obtain t
S1And t
S2Measured value just can calculate the some coordinate (y at 11 places according to formula (5)-(10) then
1, z
1) value.
The utilization said method can solve the coordinate (y of defective 6 lower edge points 12 equally
2, z
3) value.So on the y-z plane of tested structural member, according to the coordinate figure (y at defective upper and lower end edge 11,12
1, z
1), (y
2, z
2) just can calculate the length L, inclined angle alpha, depth of defect d geometric parameter (referring to Fig. 3 and Fig. 3 explanation) of defective.
With reference to Fig. 3,4,5, adopt the TOFD-LWE principle that mechanical structured member is detected and obtain how much properties and characteristicses of mechanical structured member inherent vice on the y-z plane.On this basis, adopting the TOFD-LWE detection to carry out the D scan mode along the x direction of principal axis detects; So just can obtain to be spaced apart each sectional view on the defective y-z plane of Δ x, just can make up the three-dimensional picture of mechanical structured member inherent vice by computer graphics at the x direction of principal axis.
The principle schematic that detects the Ultrasonic NDT device that principle realizes according to TOFD-LWE as shown in Figure 6, the described equipment implementation of this figure adopts one the two three probe detecting patterns of receiving.
1. the ultrasonic emitting of defects detection
Under the control of flush bonding processor 27, send the detection pulse signal by programming device 26; This pulse signal drives ultrasonic power amplifier 20 after ultrasonic emitting machine prestage 21.The power-type pulsed drive ultrasound transmitting transducer 1 of ultrasonic power amplifier 20 outputs.
2. ultrasonic signal receives and amplifies
Owing to adopt one two receipts pattern, so the ultrasound wave analog signal processing adopts two passages to handle the signal of ultrasound wave receiving transducer 2,13 outputs respectively, and the circuit form of two passages is in full accord.
The function of ultrasound wave analog signal conditioner device is: the faint ultrasonic signal of receiving transducer 2/13 output is amplified, and then amplify through the temporal gain control amplifier, and post-amplifier further amplifies.Carry out analog to digital conversion anti-aliasing filter before through the signal after amplifying by wave filter.The signal of wave filter output drives analog to digital converter 24/25 by buffering driver.
3. ultrasonic signal is handled
Ultrasound wave analog signal conversion after two analog to digital converters 24/25 in embedded system will amplify becomes digital signal.The digital signal of analog to digital converter output is carried out real-time buffer-stored at a high speed by FPGA programming device 26, is read by the dedicated digital signal processor DSP in the back flush bonding processor 27 then and carries out corresponding signal process.
Real-time processing by the DSP digital signal processor in the embedded system, finish the digital filtering that to select different center frequency, different bandwidth, adaptive time gain control, defective is discerned automatically, signal Processing such as the three-dimensional aided drawing of defective, the processing of defect inspection blind area.Under the ARM control in flush bonding processor of treated ultrasonic signal and defective two, 3 D graphic data, be transferred to LCD LCD 28 and show; Also can adopt the form of file to be stored in the CF card 29 that is operated under the TRUE IDE pattern.
By usb communication interface 31, the DSP signal processing software can upgrade or upgrade.
4. man-machine interaction
Man-machine interaction comprises LCD LCD 28 and keyboard, mouse IO equipment 30 with equipment.These equipment all are to be controlled by the flush bonding processor 27 that ARM and DSP constitute.Can finish management such as Equipment Inspection pattern, detected structural member technological parameter, defects detection are manually auxiliary, display mode, measurement raw data file by man-machine interaction.
5. computer interface
Ultrasonic monitoring equipment not only can off line independently carry out engineering detecting, can also communicate with main frame by the synchronous serial interface 31 of USB 2.0 standards.By USB interface, the CF card 29 in the embedded system can the USB flash disk form appear in the main frame as a drive.Main frame can duplicate the measurement raw data from CF card 29, measure technical papers to the checkout equipment bookbinding, upgrades or the checkout equipment signal processing software etc. of upgrading.
6. x-y plane continuous precise scanning manually
With reference to accompanying drawing 5,6, if when on the x-y plane, structural member being carried out whole Ultrasonic Detection, utilize the ultrasonic probe place to install cmos image sensor 19 additional and provide (Δ x, Δ y) displacement, be transferred to ARM﹠amp by the USB synchronous serial communication; DSP flush bonding processor 27.By embedded system Ultrasonic Detection data and (Δ x, Δ y) displacement data are merged then.(x, y z) have described geometric position in the three dimensions of defective to the three-dimensional testing result data that provide by data fusion, and in two or three-dimensional picture of LCD 28 display defects, provide the continuous high precision scanning result in x-y plane.Thereby exempted x-y plane high-accuracy mechanical travel mechanism, equipment complexity and cost have been reduced, dirigibility, convenience and the agility (especially much being not suitable for installing the engineering site of x-y plane mechanical running mechanism) that have made things convenient for engineering site to detect simultaneously.
Equipment connects
In the described TOFD-LWTE ultrasonic testing system of Fig. 6, can be divided into four modules:
1. ultrasonic inspection probe module
This module by a ultrasound emission pop one's head in, two ultrasonic receiving transducers and a cmos image sensor constitute.
2. ultrasonic simulation signal conditioner module
Two passages of analog signal conditioner device are except that adopting concentric cable respectively at the ultrasonic receiving transducer connection separately, be connected with embedded system through the ultrasonic signal connector through between pcb board that amplifies, Filtering Processing two passages 22,23 are afterwards exported, the ultrasonic signal after amplifying delivered to analog to digital converter 24,25 respectively carry out analog to digital conversion.
3. ultrasonic emitting machine module
The output of ultrasonic emitting machine module is connected with the ultrasound emission probe, and the input of transmitter adopts concentric cable to be connected with FPGA 26 outputs.FPGA produces the required Transistor-Transistor Logic level pulse signal of defects detection transfers to ultrasonic transmitter through this concentric cable prestage 21 under the control of flush bonding processor.
4. embedded system module
In the embedded system inside modules, LCD display 28 adopts the form of connector between pcb board to be connected with the flush bonding processor mainboard with keyboard 30; CF card apparatus 29 is directly installed on the flush bonding processor mainboard; Mouse 30 and usb communication interface 31 all adopt USB A type or Type B connector.
Claims (4)
1. supersonic damage-free detection method is characterized in that: combine and the structural member inherent vice that draws based on diffraction ultrasound examination and the oval location that crosses, the ultrasonic probe quantity of using is N, N 〉=3, wherein has at least one to be transmitting probe; Obtain N-1 elliptic curve by detecting, resolve by mathematics N-1 elliptic equation group, obtain defective marginal position coordinate points in the rectangular coordinate system in the two dimensional surface that detects, among a plurality of the separating of elliptic equation group, have only separating of reflect structure spare inherent vice marginal point to be only unique truly separating.
2. a kind of supersonic damage-free detection method according to claim 1 is characterized in that: when ultrasonic probe quantity N=3, the detection probe assembly comprises a transmitting probe, two receiving transducers; Form two ellipses by detecting; The y-z plane of detected mechanical structured member is the detection section perpendicular to the mechanical structured member surface; The ultrasound wave part that transmitting probe sent is through the refraction of transmitting probe wedge and incide mechanical structured member inside, and another part ultrasound wave is propagated along mechanical structured member upper surface y direction of principal axis; When the ultrasound wave that incides mechanical structured member inside runs into defective, produce diffraction at the upper and lower edge of defective, utilize two receiving transducers to receive diffracted wave respectively; The detection that two receiving transducers is received the ultrasonic diffraction ripple can obtain travel-time t with measurement
S1And t
S2By three ultrasonic probe location parameters, travel-time t
S1And t
S2Pairing propagation distance TL
1With TL
2Parameter has formed focal length, two ellipses that endpoint parameter is different; Utilize following solution of equation to calculate the coordinate (y of two ellipses then at defective coboundary point position joint
1, z
1) value:
Wherein:
t
S1For launching site to the defective coboundary o'clock to the first acceptance point ultrasonic transmission time;
C is the velocity of sound of detected mechanical structured member inside;
S
1Be half of launching site to the first acceptance point distance, and be known;
t
S2For launching site to defective coboundary was put to the secondary destination ultrasonic transmission time;
S
2Be launching site half, and be known to the secondary destination distance;
Use above-mentioned same method to solve the coordinate (y of defective lower limb point
2, z
2) value, again according to the coordinate figure (y of lower limb on the defective
1, z
1), (y
2, z
2) just calculate length L, inclined angle alpha, the depth of defect d geometric parameter of defective.
3. the pick-up unit of a supersonic damage-free detection method comprises ultrasonic inspection probe module, ultrasonic simulation signal conditioner module, ultrasonic emitting machine module and four modules of embedded system module; It is characterized in that: the ultrasonic inspection probe module is made of a transmitting probe, two receiving transducers and a cmos image sensor, two receiving transducers are connected with the ultrasonic simulation signal conditioner respectively, and transmitting probe is connected with the output of ultrasonic power amplifier; Two passages of ultrasonic simulation signal conditioner module are except that respectively with separately receiving transducer is connected, be connected with embedded system through the ultrasonic signal connector through between pcb board that amplifies, Filtering Processing two passages are afterwards exported, the ultrasonic signal after amplifying delivered to analog to digital converter respectively carry out analog to digital conversion; The output of ultrasonic emitting machine module is connected with the ultrasound emission probe, and the input of transmitter is connected with FPGA output, and FPGA produces the required Transistor-Transistor Logic level pulse signal of defects detection and transfers to prestage under the control of flush bonding processor; The LCD display that constitutes of embedded system module adopts the form of connector between pcb board to be connected with the flush bonding processor mainboard with keyboard, equipment CF card is directly installed on the flush bonding processor mainboard, and mouse and usb communication interface all adopt USB A type or Type B connector.
4. the checkout equipment of supersonic damage-free detection method according to claim 3, it is characterized in that: the place installs cmos image sensor additional at ultrasonic inspection probe; The two dimensional surface displacement data and the Ultrasonic Detection data at ultrasonic probe place are merged.
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