CN101698257A - Soldering tin jet device - Google Patents
Soldering tin jet device Download PDFInfo
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- CN101698257A CN101698257A CN200910035689A CN200910035689A CN101698257A CN 101698257 A CN101698257 A CN 101698257A CN 200910035689 A CN200910035689 A CN 200910035689A CN 200910035689 A CN200910035689 A CN 200910035689A CN 101698257 A CN101698257 A CN 101698257A
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- tin
- jet device
- soldering tin
- soldering
- jet
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Abstract
The invention discloses a soldering tin jet device, comprising a wave source generator (1), an accommodation cavity (2) arranged above and communicated with the wave source generator (1) and a jet stream plate (4) arranged on the top end of the accommodation cavity (2), wherein the wave source generator (1) is provided with an inflow hole for soldering tin (3), the jet stream plate (4) is provided with a plurality of holes, and a groove (5) arranged above the jet stream plate (4) is internally provided with a layer for the soldering tin (3). In order to solve the problems in prior art, the soldering tin jet device provides a soldering tin jet device with full and uniform tin posts and stable tin output.
Description
Technical field
The present invention relates to a kind of soldering tin jet device, especially relate to a kind of soldering tin jet device that is used for crest welder.
Background technology
Wave-soldering is meant the solder with fusing, be generally terne metal, become the solder wave of designing requirement through electrodynamic pump or electromagnetic pump jet flow, also can be by forming to the solder pot nitrogen injection, make the printed board that components and parts are housed in advance by solder wave, realize machinery and the solder that is electrically connected between components and parts weldering end or pin and the printed board pad.
Wave-soldering need be placed on crest welder to the circuit board of handling well and weld.Crest welder is by the spray scaling powder, and circuit board preheating and wave soldering three parts are formed, and its major part is a wave soldering, and principle is that the tin that melts is blown out by the aperture on the soldering tin jet device with gas according to actual needs, finally finishes welding.Wave-soldering solder joint gloss seldom has rosin joint. and advanced can also own handle the components and parts pin.
Under the prior art, the tin post that wave soldering part tin cream forms after the nozzle ejection can be vacillated now to the left, now to the right and be caused the tin post not full evenly, can not form even tin post, and in the process that the tin post sprays, tin cream also can overflow around spray orifice, the tin output amount instability that has caused the tin post to spray influences welding effect, causes few weldering.
Summary of the invention
For solving the problems of the technologies described above, it is full evenly to the invention provides a kind of tin post, the soldering tin jet device that tin output amount is stable.
For achieving the above object, the invention provides a kind of soldering tin jet device, comprise the wave source generator, be arranged on wave source generator top and coupled logical cavity volume, be arranged on the jet plate on cavity volume top, has a tin cream inflow entrance on the wave source generator, has plurality of holes on the jet plate, the jet plate top also has a groove, is provided with tin paste layer in the groove.
More excellent, the hole on the jet plate is circular, is designed to circular hole, makes solder joint also for circular, attractive in appearance, the economical with materials of solder joint.
More excellent, the bore dia on the jet plate increases from front to back gradually, makes the tin post that sprays in the jet plate become stepped even distribution, and the tin post increases gradually and forms a ramp rate near desirable scolding tin angle, can effectively reduce to connect weldering and leak weldering.
More excellent, depth of groove is 1.5mm, has controlled the height of tin paste layer, saves the tin cream consumption.
The beneficial effect of a kind of soldering tin jet device of the present invention is: 1, leave groove on jet plate, tin cream is evenly distributed in wherein, when tin cream when the jet plate nozzle bore sprays, the tin cream of groove the inside plays a supportive role, tin cream is after the nozzle bore ejection, can form full uniform tin post, guarantee welding quality; 2, the tin cream that also works to stop ejection of the tin cream in the groove to around diffusion, guarantee the paste volume of each nozzle bore, guarantee the height of tin post, further guarantee the soldering quality.
Description of drawings
Fig. 1 is the main cutaway view of a kind of soldering tin jet device embodiment of the present invention;
Fig. 2 is the operation principle schematic diagram of a kind of soldering tin jet device embodiment of the present invention.
Among the figure
1-wave source generator, 2-cavity volume, 3-tin cream, 4-jet plate, 5-groove, 6-PCB.
The specific embodiment
Below in conjunction with accompanying drawing, specify the present invention.
Be illustrated in figure 1 as the front view of a kind of soldering tin jet device embodiment of the present invention, a kind of soldering tin jet device, comprise wave source generator 1, be arranged on wave source generator 1 top and coupled logical cavity volume 2, be arranged on the jet plate 4 on cavity volume 2 tops, have tin cream 3 inflow entrances on the wave source generator 1, the hole that has a plurality of circles on the jet plate 4, bore dia on the jet plate 4 increases from front to back gradually, jet plate 4 tops also have a groove 5, groove 5 degree of depth are 1.5mm, are provided with tin paste layer in the groove 5.
The operation principle of the embodiment of a kind of soldering tin jet device of the present invention is as follows:
As the operation principle schematic diagram of Fig. 2 for a kind of soldering tin jet device embodiment of the present invention, tin cream 3 is arranged in wave-soldering body scolding tin containing cavity 7, PCB6 to be welded places soldering tin jet device top etc. to be welded, the a plurality of elements of the last grafting of PCB6, it is to be welded that the pin of element passes hole on the PCB6 etc., when the PCB6 that tape welding connects places the soldering tin jet device top, there is a side of element to deviate from soldering tin jet device, the side that pin is arranged is to soldering tin jet device, after starting the welding order, wave source generator 1 starts, promote to spray in the nozzle bore of tin cream 3 from soldering tin jet device, tin cream 3 is applied on the splint of pin and connection pin through the pin of to-be-welded elements, and element is fixed in the purpose that PCB6 went up and realized conducting.
In the present embodiment, be provided with groove 5 on jet plate 4, tin cream 3 is evenly distributed in wherein, when tin cream 3 during from the ejection of the nozzle bore of jet plate 4, the tin cream 3 of groove 5 the insides plays a supportive role on the one hand, and tin cream 3 is after the nozzle bore ejection, can form full uniform tin post, guarantee welding quality; On the other hand the tin cream 3 of 5 li of the grooves tin cream 3 that works to stop ejection to around diffusion, guarantee the paste volume of each nozzle bore, guarantee the height of tin post, further guarantee the soldering quality.
In the present embodiment, the bore dia on the jet plate 4 increases from front to back gradually, makes the tin post of ejection in the jet plate 4 become stepped even distribution, and the tin post increases gradually and forms a ramp rate near desirable scolding tin angle, can effectively reduce to connect weldering and leak weldering.
If groove 5 degree of depth are too small, can cause the support force of tin post too small, can't stop effectively that also the tin post is to excessive all around, and then do not reach and form full tin post, guarantee the purpose of tin post height, cause welding quality not good, few easily weldering even leakage weldering, if groove 5 degree of depth are excessive, tin paste layer will be blocked up, not only nozzle bore caused excessive resistance, and the tin post that influences nozzle bore sprays, and excessive tin cream 3 rests in the groove 5 oxidized easily, cause the waste of tin cream 3, in the present embodiment, groove 5 degree of depth are 1.5mm, both guaranteed support force to the tin post, effectively stop the tin post to excessive all around, and save the consumption of tin cream 3, avoid waste.
Below only be specific embodiments of the invention, any those skilled in the art can think variation all drop within protection scope of the present invention.
Claims (4)
1. soldering tin jet device, comprise wave source generator (1), be arranged on described wave source generator (1) top and coupled logical cavity volume (2), be arranged on the jet plate (4) on described cavity volume (2) top, has a tin cream (3) inflow entrance on the described wave source generator (1), described jet plate has plurality of holes on (4), it is characterized in that: described jet plate (4) top also has a groove (5), is provided with tin cream (3) layer in the described groove (5).
2. a kind of soldering tin jet device according to claim 1 is characterized in that: the hole on the described jet plate (4) is for circular.
3. a kind of soldering tin jet device according to claim 1 is characterized in that: the bore dia on the described jet plate (4) increases from front to back gradually.
4. a kind of soldering tin jet device according to claim 1 is characterized in that: described groove (5) degree of depth is 1.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910035689A CN101698257A (en) | 2009-09-30 | 2009-09-30 | Soldering tin jet device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910035689A CN101698257A (en) | 2009-09-30 | 2009-09-30 | Soldering tin jet device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101698257A true CN101698257A (en) | 2010-04-28 |
Family
ID=42146723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910035689A Pending CN101698257A (en) | 2009-09-30 | 2009-09-30 | Soldering tin jet device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101698257A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103068183A (en) * | 2011-10-21 | 2013-04-24 | 佛山市顺德区顺达电脑厂有限公司 | Versatile wave-soldering nozzle |
-
2009
- 2009-09-30 CN CN200910035689A patent/CN101698257A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103068183A (en) * | 2011-10-21 | 2013-04-24 | 佛山市顺德区顺达电脑厂有限公司 | Versatile wave-soldering nozzle |
| CN103068183B (en) * | 2011-10-21 | 2015-04-29 | 佛山市顺德区顺达电脑厂有限公司 | Versatile wave-soldering nozzle |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20100428 |