CN201505782U - Soldering jetting device - Google Patents
Soldering jetting device Download PDFInfo
- Publication number
- CN201505782U CN201505782U CN2009202322470U CN200920232247U CN201505782U CN 201505782 U CN201505782 U CN 201505782U CN 2009202322470 U CN2009202322470 U CN 2009202322470U CN 200920232247 U CN200920232247 U CN 200920232247U CN 201505782 U CN201505782 U CN 201505782U
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- Prior art keywords
- tin
- soldering
- groove
- jet plate
- jet
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Abstract
The utility model discloses a soldering tin jetting device, which comprises a wave source generator (1), a holding cavity (2) which is arranged on and communicated with the wave source generator (1), and a jet plate (4) arranged on the top of the holding cavity (2), wherein the wave source generator (1) is provided with a solder paste (3) inflow opening, the jet plate (4) is provided with a plurality of holes, a groove (5) is also arranged upon the jet plate (4), and the groove (5) is provided with a solder paste (3) layer. The utility model solves the problem of the prior art, and provides the soldering tin hot air leveling device with full solder plug and stable quantity of soldering tin.
Description
Technical field
The utility model relates to a kind of soldering tin jet device, especially relates to a kind of soldering tin jet device that is used for crest welder.
Background technology
Wave-soldering is meant the solder with fusing, be generally terne metal, become the solder wave of designing requirement through electrodynamic pump or electromagnetic pump jet flow, also can be by forming to the solder pot nitrogen injection, make the printed board that components and parts are housed in advance by solder wave, realize machinery and the solder that is electrically connected between components and parts weldering end or pin and the printed board pad.
Wave-soldering need be placed on crest welder to the circuit board of handling well and weld.Crest welder is by the spray scaling powder, and circuit board preheating and wave soldering three parts are formed, and its major part is a wave soldering, and principle is that the tin that melts is blown out by the aperture on the soldering tin jet device with gas according to actual needs, finally finishes welding.Wave-soldering solder joint gloss seldom has rosin joint. and advanced can also own handle the components and parts pin.
Under the prior art, the tin post that wave soldering part tin cream forms after the nozzle ejection can be vacillated now to the left, now to the right and be caused the tin post not full evenly, can not form even tin post, and in the process that the tin post sprays, tin cream also can overflow around spray orifice, the tin output amount instability that has caused the tin post to spray influences welding effect, causes few weldering.
Summary of the invention
For solving the problems of the technologies described above, the utility model provides a kind of tin post full evenly, the soldering tin jet device that tin output amount is stable.
For achieving the above object, the utility model provides a kind of soldering tin jet device, comprise the wave source generator, be arranged on wave source generator top and coupled logical cavity volume, be arranged on the jet plate on cavity volume top, has a tin cream inflow entrance on the wave source generator, has plurality of holes on the jet plate, the jet plate top also has a groove, is provided with tin paste layer in the groove.
More excellent, the hole on the jet plate is circular, is designed to circular hole, makes solder joint also for circular, attractive in appearance, the economical with materials of solder joint.
More excellent, the bore dia on the jet plate increases from front to back gradually, makes the tin post that sprays in the jet plate become stepped even distribution, and the tin post increases gradually and forms a ramp rate near desirable scolding tin angle, can effectively reduce to connect weldering and leak weldering.
More excellent, depth of groove is 1.5mm, has controlled the height of tin paste layer, saves the tin cream consumption.
The beneficial effect of the utility model soldering tin jet device is: 1, leave groove on jet plate, tin cream is evenly distributed in wherein, when tin cream when the jet plate nozzle bore sprays, the tin cream of groove the inside plays a supportive role, tin cream is after the nozzle bore ejection, can form full uniform tin post, guarantee welding quality; 2, the tin cream that also works to stop ejection of the tin cream in the groove to around diffusion, guarantee the paste volume of each nozzle bore, guarantee the height of tin post, further guarantee the soldering quality.
Description of drawings
Fig. 1 is the main cutaway view of the utility model soldering tin jet device embodiment;
Fig. 2 is the operation principle schematic diagram of the utility model soldering tin jet device embodiment.
Among the figure
1-wave source generator, 2-cavity volume, 3-tin cream, 4-jet plate, 5-groove, 6-PCB.
The specific embodiment
Below in conjunction with accompanying drawing, specify the utility model.
Be illustrated in figure 1 as the front view of the utility model soldering tin jet device embodiment, a kind of soldering tin jet device, comprise wave source generator 1, be arranged on wave source generator 1 top and coupled logical cavity volume 2, be arranged on the jet plate 4 on cavity volume 2 tops, have tin cream 3 inflow entrances on the wave source generator 1, the hole that has a plurality of circles on the jet plate 4, bore dia on the jet plate 4 increases from front to back gradually, jet plate 4 tops also have a groove 5, groove 5 degree of depth are 1.5mm, are provided with tin paste layer in the groove 5.
The operation principle of the embodiment of the utility model soldering tin jet device is as follows:
As Fig. 2 is the operation principle schematic diagram of the utility model soldering tin jet device embodiment, tin cream 3 is arranged in wave-soldering body scolding tin containing cavity 7, PCB6 to be welded places soldering tin jet device top etc. to be welded, the a plurality of elements of the last grafting of PCB6, it is to be welded that the pin of element passes hole on the PCB6 etc., when the PCB6 that tape welding connects places the soldering tin jet device top, there is a side of element to deviate from soldering tin jet device, the side that pin is arranged is to soldering tin jet device, after starting the welding order, wave source generator 1 starts, promote to spray in the nozzle bore of tin cream 3 from soldering tin jet device, tin cream 3 is applied on the splint of pin and connection pin through the pin of to-be-welded elements, and element is fixed in the purpose that PCB6 went up and realized conducting.
In the present embodiment, be provided with groove 5 on jet plate 4, tin cream 3 is evenly distributed in wherein, when tin cream 3 during from the ejection of the nozzle bore of jet plate 4, the tin cream 3 of groove 5 the insides plays a supportive role on the one hand, and tin cream 3 is after the nozzle bore ejection, can form full uniform tin post, guarantee welding quality; On the other hand the tin cream 3 of 5 li of the grooves tin cream 3 that works to stop ejection to around diffusion, guarantee the paste volume of each nozzle bore, guarantee the height of tin post, further guarantee the soldering quality.
In the present embodiment, the bore dia on the jet plate 4 increases from front to back gradually, makes the tin post of ejection in the jet plate 4 become stepped even distribution, and the tin post increases gradually and forms a ramp rate near desirable scolding tin angle, can effectively reduce to connect weldering and leak weldering.
If groove 5 degree of depth are too small, can cause the support force of tin post too small, can't stop effectively that also the tin post is to excessive all around, and then do not reach and form full tin post, guarantee the purpose of tin post height, cause welding quality not good, few easily weldering even leakage weldering, if groove 5 degree of depth are excessive, tin paste layer will be blocked up, not only nozzle bore caused excessive resistance, and the tin post that influences nozzle bore sprays, and excessive tin cream 3 rests in the groove 5 oxidized easily, cause the waste of tin cream 3, in the present embodiment, groove 5 degree of depth are 1.5mm, both guaranteed support force to the tin post, effectively stop the tin post to excessive all around, and save the consumption of tin cream 3, avoid waste.
Below only be specific embodiment of the utility model, any those skilled in the art can think variation all drop within the protection domain of the present utility model.
Claims (4)
1. soldering tin jet device, comprise wave source generator (1), be arranged on described wave source generator (1) top and coupled logical cavity volume (2), be arranged on the jet plate (4) on described cavity volume (2) top, has a tin cream (3) inflow entrance on the described wave source generator (1), described jet plate has plurality of holes on (4), it is characterized in that: described jet plate (4) top also has a groove (5), is provided with tin cream (3) layer in the described groove (5).
2. soldering tin jet device according to claim 1 is characterized in that: the hole on the described jet plate (4) is for circular.
3. soldering tin jet device according to claim 1 is characterized in that: the bore dia on the described jet plate (4) increases from front to back gradually.
4. soldering tin jet device according to claim 1 is characterized in that: described groove (5) degree of depth is 1.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202322470U CN201505782U (en) | 2009-09-30 | 2009-09-30 | Soldering jetting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202322470U CN201505782U (en) | 2009-09-30 | 2009-09-30 | Soldering jetting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201505782U true CN201505782U (en) | 2010-06-16 |
Family
ID=42466917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202322470U Expired - Fee Related CN201505782U (en) | 2009-09-30 | 2009-09-30 | Soldering jetting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201505782U (en) |
-
2009
- 2009-09-30 CN CN2009202322470U patent/CN201505782U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100616 Termination date: 20110930 |