CN101692475A - Combined encapsulating method for non-square LED chip - Google Patents
Combined encapsulating method for non-square LED chip Download PDFInfo
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- CN101692475A CN101692475A CN200910180051A CN200910180051A CN101692475A CN 101692475 A CN101692475 A CN 101692475A CN 200910180051 A CN200910180051 A CN 200910180051A CN 200910180051 A CN200910180051 A CN 200910180051A CN 101692475 A CN101692475 A CN 101692475A
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Abstract
The invention discloses a combined encapsulating method for a non-square LED chip, which mainly comprises the following steps: determining a mode of an LED chip or a multi-chip combination of proper specifications suitable for specific illumination application; determining a primary optical design of a free lens and a matching relation between the chip and the lens; coating a fluorescent powder material to the LED chip as required; and designing a primary optical lens through optical software optimization, comprising the shape and size of a free surface of the lens and the like, and encapsulating the lens and the chip. The combined encapsulating method has the advantages that the optical distribution of a single LED illumination unit in a far field can directly realize an approximately rectangular or zonal illumination area of a target light source, and an optical field with even brightness can be acquired at the same time; optical loss brought by a secondary lens does not exist, the light emergence efficiency is promoted, the volume is reduced, and the cost is saved; and because of the application of the specific non-square LED chip, the optical field and light brightness distribution of a target illumination area are easier to be acquired, and the optical dispersion loss is reduced.
Description
Technical field
The present invention relates to a kind of led chip method for packing, relate in particular to a kind of combined encapsulating method of non-square LED chip.
Background technology
Light-emitting diode is that a kind of solid-state photoelectricity transforms semiconductor device, because of it is efficient, environmental protection, numerous advantages such as energy-conservation, has substituted incandescent lamp and fluorescent lamp in the traditional lighting application gradually, become the 4th generation the novel illumination light source.General LED dealer is in order to reach high brightness, high-power abundant illumination effect, equal active development large scale led chip product, in this technology development process, also face many problems, for example cost is too high, the beam projecting of chip internal generation can seriously be decayed to external procedure consequently fails to reach the light meeting quilt conversion generation heat energy of expecting that illumination effect, chip internal absorb, and cause reducing useful life and performance etc.; In addition, the large scale led chip more need overcome the inhibition temperature rise, guarantees useful life, improve the uniformity coefficient of luminous efficiency and light-emitting area etc. if will reach high light flux output, high power to replace the traditional lighting target.
LED is applied to also have a lot of technology barriers in the process in general illumination field, traditional great power LED adopts the luminous of single square chip usually, be equipped with the dome-type lens, although can guarantee high light-emitting efficiency, but its light type circular symmetry distributes and the irregularity in brightness of light, makes it can not be applied directly to specific lighting field.For example with the LED road lighting, requiring the field of illumination of light source is a uniform rectangular area of Illumination Distribution, still utilize traditional LED lamp this moment, then need optional equipment to meet the lens of secondary optics design, its consequence is to have aggravated light loss, increased LED lighting module volume, increased design and produced used cost.A series of problems of being brought for fear of the secondary optics design, LED at present general illumination field, only proposed to simulate and designed the LED lens by optical numerical value, only the LED lens by primary optical design are to reach the light type demand of needed rectangle or bar shaped, purpose has been only for having promoted light extraction efficiency, reduced volume and saved cost, and do not relate to the influence of chip to light type and Luminance Distribution itself.
The present invention considered for the chip dimension effect problem: traditional LED encapsulation, especially at small-power type LED, the size of chip is far smaller than the optical design configurations part, be similar to and think point light source light-emitting, this moment, the shape of chip did not have influence with the difference of size to going out light effect, and the light type of acquisition and Luminance Distribution only are subjected to out the influence of luminescent material and lens shape and structure; And along with chip technology constantly develops, the integrated encapsulation technology maturation of raising, multicore sheet of appearance of high power large scale led chip (is the chip of 45mil * 45mil as specification) and lens processing technology precision, if the specification of chip own is suitable with respect to the size of optical design configurations part, this moment, chip light emitting can be considered near-field effect, thus obtained smooth type and Luminance Distribution not only are subjected to the influence that lens etc. go out luminescent material, also are subjected to the restriction of the size shape of chip itself simultaneously.
Present led chip is square chip, and the light that square chip light source sent is by the collimation of primary optical design lens, obtain strip or rectangular illumination zone, since the influence of square chip itself, the reduction that will bring chromatic dispersion and light extraction efficiency; Therefore the mode of problem to be solved can be based on two angles from chip and primary optical design lens now.
Summary of the invention
At above defective, the combined encapsulating method that the purpose of this invention is to provide a kind of non-square LED chip, two angles based on chip and primary optical design lens are set out, pattern by direct employing non-square chip or the combination of multicore sheet, utilize the shape and the specification of chip itself to mate the illumination Design requirement, simultaneously in conjunction with chip and multicore sheet combined shaped, optimization by numerical simulation and optics software, adopt the primary optical design lens to change the luminous optical field distribution of LED, also can reduce cost, improve the efficient of bright dipping.
For achieving the above object, the present invention is achieved through the following technical solutions:
A kind of combined encapsulating method of non-square LED chip, its step mainly comprises:
(1) investigates specific general illumination field to designing requirement that led light source proposed: as road lighting, Grille lamp, area source, back light etc., the field of illumination that needs led light source to obtain is the even light type of strip, band shape or rectangle, choose the chip specification in view of the above or the multicore sheet makes up integrated packaged type, determine to be fit to the primary optical design of the free lens that specific illumination uses and the matching relationship between chip and the lens;
(2) determine the chip of appropriate size or the pattern of multicore sheet combination: according to the target light source requirement, obtain band shape or rectangular illumination area size with reference to desire, select the specification of rectangular dies or many chipsets, its length-width ratio meets the requirement in rectangular illumination zone, and scope can be determined arbitrarily;
(3) on led chip, apply phosphor material powder according to specific needs.
(4) carry out numerical simulation and calculating, design optical lens No. one time by the optics software optimization; The surface configuration of optical lens and specification are made of the free form surface of optimization process, and the optical lens surface configuration is according to chip or optical material and choose;
(5) primary optical design lens and Chip Packaging: according to led chip the be fixed specification and the shape of position and chip, there is particular space in lens bottom after primary optical design, its inner surface is the free form surface after optimization process, specification is identical with chip size or multicore sheet integrated mode, lens and chip monomer or chipset overall package and as a LED unit; The primary optical design lens adopt total silicon glue mode or are with the transparent optical materials such as the interior perfusion of shell silica gel of optical design; If wafer level packaging can adopt packing forms such as direct glue, injection moulding to come molded lens, its lens shape can be hemisphere, class sphere or oval arbitrarily.
The beneficial effect of the combined encapsulating method of non-square LED chip of the present invention is: adopt single led lighting unit, approximate rectangular or the banded field of illumination that light type in the far field distributes and can directly realize target light source obtains the even brightness optical field distribution simultaneously; Compare with additional traditional secondary optics design lens, the light loss that the lens of the primary optical design that this method adopts do not exist secondary lens to bring is compared with the application of the square chip of tradition, and the light extraction efficiency of whole system is improved, and volume has reduced.Also saved simultaneously design cost, the application of specific non-square chip is easier to obtain the light field and the distribution of the light uniformity in target illumination zone, has reduced the optical dispersion loss.
Embodiment
The combined encapsulating method of non-square LED chip of the present invention, this scheme is when carrying out Preliminary design, at specific general illumination field and with the road lighting is example, need target light source can obtain to have the rectangle or the banded field of illumination of illuminance distribution this moment, and existing common high-power LED encapsulation form is imitative lumen type, its lens are semi-spherical shape, can get " central area brighter and spherical light field luminance shortage all around " with this, need its LED is done the secondary optics design, obtain the rectangular illumination zone of illuminance distribution by the form that adds lens, but this moment, light extraction efficiency reduced, light loss is obvious, volume increases with cost and rises; The reduction that LED square chip brings chromatic dispersion and light extraction efficiency on the contrary.
The basic embodiment of the present invention is: the pattern that directly adopts the combination of rectangular dies or multicore sheet, utilize the shape and the specification of chip itself to satisfy the illumination Design requirement, simultaneously in conjunction with chip and multicore sheet combined shaped, optimization by numerical simulation and optics software, adopt the primary optical design lens to change the luminous optical field distribution of LED, factors such as the field of illumination that is obtained, Luminance Distribution, light extraction efficiency, encapsulating structure, consuming cost all can reach optimization thus, and can obtain even more ideal lighting source.
The combined encapsulating method of non-square LED chip of the present invention mainly may further comprise the steps:
(1) at first investigates specific general illumination field to designing requirement that led light source proposed: when considering the practical application in light illumination field, as road lighting, Grille lamp, area source, back light etc., the field of illumination that needs led light source to obtain is the even light type of strip, band shape or rectangle, choose the chip specification in view of the above or the multicore sheet makes up integrated packaged type, determine to be fit to the primary optical design of the free lens that specific illumination uses and the matching relationship between chip and the lens;
(2) determine the chip of appropriate size or the pattern of multicore sheet combination: according to the target light source requirement, obtain band shape or rectangular illumination area size with reference to desire, select the specification of suitable rectangular dies or the encapsulation mode of many chipsets, for specification and size arbitrarily, yi word pattern is arranged or two rows are arranged side by side multicore sheet combination; According to the shape of field of illumination, selected chip specification and shape are not limited only to rectangle, also can be other suitable specification shape simultaneously;
(3) on led chip, apply phosphor material powder according to specific needs;
(4) according to character such as chip specification, target light source illumination light type distribution requirement and lens material refractive indexes, carry out numerical simulation and calculating, design optical lens No. one time by the optics software optimization; The surface configuration of optical lens and specification are made of the free form surface of optimization process, and the surface of optical lens is not limited to shapes such as hemisphere, and its surface configuration is chosen according to the difference of chip or optical material;
(5) primary optical design lens and Chip Packaging: the position that is fixed according to led chip and the specification and the shape of chip, there is particular space in lens bottom after primary optical design, its inner surface is the free form surface after optimization process, specification is identical with chip size or multicore sheet integrated mode, lens and chip or chipset overall package and as a LED unit; Light effect can obtain to meet lighting demand in the far field the light type and the uniformity that go out of this LED unit distributes; From the moulding lens, lens shape can be hemisphere, class sphere or oval arbitrarily if wafer level packaging is directly put glue on the employing non-square chip.
The described primary optical design lens of above-mentioned steps, its implementation is: realize by the optimization of numerical simulation and optics software and by two approach: one, adopt total silicon glue (optical material that other is suitable for) mode, i.e. mould molding, the perfusion demoulding, diamond cutter processing etc.; They are two years old, perfusion silica gel or other transparent optical material in the shell of band optical design, this optical material can be polymethyl methacrylate (PMMA), Merlon (PC), PEI, cyclic olefin copolymerized macromolecule (COC), acrylic (Acrylics) material or other silica gel material etc.; Do not limit according to packaging technology, can directly adopt the encapsulation of COB technology that chip is fixed on the substrate; The optional metal of baseplate material, pottery etc.
The advantage that more than shows and described principal character of the present invention and had.The technical staff of the industry should understand, and the present invention is not restricted to the described embodiments, and the present invention also has some variations and improves under the prerequisite that does not break away from purport of the present invention and scope, and these changes and improvements all fall in the claimed scope of the invention.
Claims (7)
1. the combined encapsulating method of a non-square LED chip is characterized in that, may further comprise the steps:
(1) investigates specific general illumination field, as road lighting, Grille lamp, area source, back light, the field of illumination that needs led light source to obtain is the even light type of strip, band shape or rectangle, choose suitable chip specification or multicore sheet in view of the above and make up integrated packaged type, determine the primary optical design of the free lens that suitable specific illumination is used and the matching relationship between chip and the lens;
(2) determine the chip of appropriate size or the pattern of multicore sheet combination: according to the target light source requirement, obtain band shape or rectangular illumination area size with reference to desire, select the specification of rectangular dies or multicore sheet integrated mode, its length-width ratio is determined by the requirement in rectangular illumination zone;
(3) be chosen in and apply phosphor material powder on the led chip;
(4) carry out numerical simulation and calculating according to chip specification, target light source illumination light type distribution requirement and lens material refractive index, design optical lens No. one time by the optics software optimization; The surface configuration of optical lens and specification are made of the free form surface of optimization process, and the surface configuration of optical lens is chosen according to the difference of chip or optical material;
(5) lens and Chip Packaging: the position that is fixed according to led chip and the specification and the shape of chip, there is particular space in lens bottom after primary optical design, its inner surface is the free form surface after optimization process, its specification and chip or multicore sheet integrated mode size are suitable, lens and single-chip or the encapsulation of chipset more than and as a LED unit.
2. the combined encapsulating method of non-square LED chip according to claim 1 is characterized in that: it is any specification and size, yi word pattern are arranged or two rows are arranged side by side multicore sheet combination that step (2) is chosen rectangular dies.
3. the combined encapsulating method of non-square LED chip according to claim 1 is characterized in that: according to the demand in target illumination zone, and the pattern of the shape of step (2) chip or the combination of multicore sheet, its specification and shape are not limit.
4. the combined encapsulating method of non-square LED chip according to claim 1, it is characterized in that: if wafer level packaging, adopt on the non-square chip directly some glue and from the moulding lens, lens shape can be hemisphere, class sphere or oval arbitrarily.
5. the combined encapsulating method of non-square LED chip according to claim 1; it is characterized in that: the implementation of described primary optical design lens is the optimization by numerical simulation and optics software; adopt total silicon glue material mode, i.e. mould molding, the perfusion demoulding or diamond cutter processing.
6. the combined encapsulating method of non-square LED chip according to claim 1 or 5, it is characterized in that: the implementation of described primary optical design lens is the optimization by numerical simulation and optics software, perfusion silica gel or other transparent optical material in the process shell of optical design.
7. the combined encapsulating method of non-square LED chip according to claim 6, it is characterized in that: described transparent optical material can be polymethyl methacrylate (PMMA), Merlon (PC), PEI, cyclic olefin copolymerized macromolecule (COC), acrylic (Acrylics) material.
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| Application Number | Priority Date | Filing Date | Title |
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| CN200910180051A CN101692475A (en) | 2009-10-26 | 2009-10-26 | Combined encapsulating method for non-square LED chip |
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| CN200910180051A CN101692475A (en) | 2009-10-26 | 2009-10-26 | Combined encapsulating method for non-square LED chip |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1446380A (en) * | 2000-08-11 | 2003-10-01 | 奥斯兰姆奥普托半导体有限责任公司 | Radiation-emitting semiconductor chip and luminescent diode |
| CN1512601A (en) * | 2002-12-26 | 2004-07-14 | ��ķ�ɷ�����˾ | Luminous device and lighting device |
| CN101440928A (en) * | 2007-11-19 | 2009-05-27 | 胡晓兵 | Free curved surface lens |
| CN101452987A (en) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | Encapsulation structure and method for applying guidance type light emitting diode device |
-
2009
- 2009-10-26 CN CN200910180051A patent/CN101692475A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1446380A (en) * | 2000-08-11 | 2003-10-01 | 奥斯兰姆奥普托半导体有限责任公司 | Radiation-emitting semiconductor chip and luminescent diode |
| CN1512601A (en) * | 2002-12-26 | 2004-07-14 | ��ķ�ɷ�����˾ | Luminous device and lighting device |
| CN101440928A (en) * | 2007-11-19 | 2009-05-27 | 胡晓兵 | Free curved surface lens |
| CN101452987A (en) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | Encapsulation structure and method for applying guidance type light emitting diode device |
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Application publication date: 20100407 |