CN101667780A - High frequency switching power supply applied to electroplating process - Google Patents
High frequency switching power supply applied to electroplating process Download PDFInfo
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- CN101667780A CN101667780A CN200910179658A CN200910179658A CN101667780A CN 101667780 A CN101667780 A CN 101667780A CN 200910179658 A CN200910179658 A CN 200910179658A CN 200910179658 A CN200910179658 A CN 200910179658A CN 101667780 A CN101667780 A CN 101667780A
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Abstract
The embodiment of the invention discloses a high frequency switching power supply applied to the electroplating process, comprising a DC bus voltage rectifier, a buck amplitude modulator, a two-phasebridge type inverter, a high frequency transformer and a high frequency rectifier, wherein after the amplitude of the DC bus voltage output by the DC bus voltage rectifier is adjusted by the buck amplitude modulator, the DC bus voltage is transmitted into the two-phase bridge type inverter; after the duty ratio of the DC bus voltage is adjusted by the two-phase bridge type inverter, the DC bus voltage is transmitted into the high frequency transformer and then into the high frequency rectifier; and finally, a high frequency switching power supply signal having adjustable amplitude and duty ratio can be output by the high frequency rectifier. The embodiment of the invention can lead the coated metal to be uniform and improves the electroplating effect.
Description
Technical field
The present invention relates to switching power unit, particularly relate to a kind of high frequency switch power that is applied to electroplating process.
Background technology
Plating is a very crucial technology in field of metallurgy.Electroplating promptly is the process that plates other metal or alloy of skim on some metal surface.During plating, coated metal is done anode, is oxidized to cation and enters electroplate liquid; Metallic article to be plated is done negative electrode, and the cation of coated metal is reduced formation coating in the metal surface.Normally adopt DC power supply that negative and positive the two poles of the earth are applied certain current potential in electroplating process, yet when adopting DC power supply to electroplate, coated metal is often inhomogeneous, electroplating effect is bad.When adopting high frequency switch power to electroplate, can make coated metal very even, electroplating effect is good.
But, existing high frequency switch power can only be regulated among both one of the amplitude of potential pulse or duty ratio, that is, existing high frequency switch power can only be regulated duty ratio under the constant situation of sustaining voltage amplitude, is perhaps keeping the constant situation downward modulation economize on electricity pressure amplitude value of duty ratio.Yet the inventor finds under study for action, in the practical application of electroplating, particularly in dynamic electroplating process, if reach the uniform electroplating effect of coating, often needs voltage magnitude and duty ratio both are regulated.
Therefore, in electroplating process, the problem that presses for solution is at present: a kind of high frequency switch power that can regulate voltage magnitude and duty ratio is provided.
Summary of the invention
In order to solve the problems of the technologies described above, the embodiment of the invention provides a kind of high frequency switch power that is applied to electroplating process, so that coated metal is even, improves electroplating effect.
The embodiment of the invention discloses following technical scheme:
A kind of high frequency switch power that is applied to electroplating process, comprise the DC bus-bar voltage rectifier, the Buck amplitude regulator, the two-phase bridge-type inverter, high frequency transformer and hf rectifier, wherein, the DC bus-bar voltage of described DC bus-bar voltage rectifier output is transported to described two-phase bridge-type inverter after described Buck amplitude regulator is regulated amplitude, after regulating duty ratio, described two-phase bridge-type inverter is transported to described high frequency transformer again, deliver to described hf rectifier then, last high frequency switch power signal by described hf rectifier output amplitude and EDM Generator of Adjustable Duty Ratio.
Preferably, described Buck amplitude regulator is by insulated gate bipolar power IGBT pipe (A1), diode (D1), inductance (L1), the electric capacity (C1) and the first pulse regulation control unit are formed, wherein, the collector electrode of IGBT pipe (A1) links to each other with the forward output of described DC bus-bar voltage rectifier, the emitter of IGBT pipe (A1) links to each other with an end of inductance (L1) and the negative electrode of diode (D1) respectively, the other end of inductance (L1) links to each other with an end of electric capacity (C1), the anode of the other end of electric capacity (C1) and diode (D1) all links to each other with the negative sense output of described DC bus-bar voltage rectifier, and the control utmost point of IGBT pipe (A1) links to each other with the output of the described first pulse regulation control unit.
Preferably, described two-phase bridge-type inverter is by IGBT pipe (A2), IGBT manages (A3), IGBT manages (A4), the IGBT pipe (A5) and the second pulse regulation control unit are formed, wherein, IGBT pipe (A2) links to each other with the forward output of described Buck amplitude regulator with the collector electrode of IGBT pipe (A3), the emitter of IGBT pipe (A2) and IGBT pipe (A3) links to each other with the collector electrode of IGBT pipe (A4) with IGBT pipe (A5) respectively, IGBT pipe (A4) links to each other with the negative sense output of described Buck amplitude regulator with the emitter of IGBT pipe (A5), IGBT (A2) links to each other with the positive input of described high frequency transformer, the emitter of IGBT pipe (A3) links to each other with the negative input of described high frequency transformer, and IGBT manages (A2), (A3), (A4) link to each other with the output of the second pulse regulation control unit respectively with the control utmost point of (A5).
As can be seen from the above-described embodiment, present embodiment is disclosed to be applied in the high frequency switch power of electroplating process to realize adjusting to the Switching Power Supply amplitude by the Buck amplitude regulator, simultaneously by the adjusting of two-phase bridge-type inverter realization to the Switching Power Supply duty ratio, therefore, realized a kind of high frequency switch power of the pulsating direct current that can regulate voltage magnitude and duty ratio, this high frequency switch power is applied to electroplating process, can makes coated metal even, improved electroplating effect.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is applied to the principle topological diagram of the high frequency switch power of electroplating process for the present invention.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the embodiment of the invention is described in detail below in conjunction with accompanying drawing.
See also Fig. 1, it is the principle topological diagram of a kind of application of the present invention with the high frequency switch power of electroplating process, as shown in Figure 1, described high frequency switch power comprises the DC bus-bar voltage rectifier, the Buck amplitude regulator, the two-phase bridge-type inverter, high frequency transformer and hf rectifier, wherein, the DC bus-bar voltage of described DC bus-bar voltage rectifier output is transported to described two-phase bridge-type inverter after described Buck amplitude regulator is regulated amplitude, after regulating duty ratio, described two-phase bridge-type inverter is transported to described high frequency transformer again, deliver to described hf rectifier then, last high frequency switch power signal by described hf rectifier output amplitude and EDM Generator of Adjustable Duty Ratio.
Again as shown in Figure 1, described Buck amplitude regulator is by insulated gate bipolar power IGBT pipe (A1), diode (D1), inductance (L1), the electric capacity (C1) and the first pulse regulation control unit are formed, wherein, the collector electrode of IGBT pipe (A1) links to each other with the forward output of described DC bus-bar voltage rectifier, the emitter of IGBT pipe (A1) links to each other with an end of inductance (L1) and the negative electrode of diode (D1) respectively, the other end of inductance (L1) links to each other with an end of electric capacity (C1), the anode of the other end of electric capacity (C1) and diode (D1) all links to each other with the negative sense output of described DC bus-bar voltage rectifier, and the control utmost point of IGBT pipe (A1) links to each other with the output of the described first pulse regulation control unit.
DC bus-bar voltage is through behind the above-mentioned Buck amplitude regulator, the product of the duty ratio of the amplitude of the direct voltage of the output of the Buck amplitude regulator output trigger impulse that to be direct current voltage bus voltage export with the first pulse regulation control unit.Therefore, by the trigger impulse duty ratio of regulating first pulse regulation control unit output be the amplitude of direct voltage of the output output of scalable Buck amplitude regulator.
Again as shown in Figure 1, described two-phase bridge-type inverter is by IGBT pipe (A2), IGBT manages (A3), IGBT manages (A4), the IGBT pipe (A5) and the second pulse regulation control unit are formed, wherein, IGBT pipe (A2) links to each other with the forward output of described Buck amplitude regulator with the collector electrode of IGBT pipe (A3), the emitter of IGBT pipe (A2) and IGBT pipe (A3) links to each other with the collector electrode of IGBT pipe (A4) with IGBT pipe (A5) respectively, IGBT pipe (A4) links to each other with the negative sense output of described Buck amplitude regulator with the emitter of IGBT pipe (A5), IGBT pipe (A2) links to each other with the positive input of described high frequency transformer, the emitter of IGBT pipe (A3) links to each other with the negative input of described high frequency transformer, and IGBT manages (A2), IGBT manages (A3), IGBT pipe (A4) links to each other with the output of the second pulse regulation control unit respectively with the control utmost point of IGBT pipe (A5).
As can be seen from the above-described embodiment, present embodiment is disclosed to be applied in the high frequency switch power of electroplating process to realize adjusting to the Switching Power Supply amplitude by the Buck amplitude regulator, simultaneously by the adjusting of two-phase bridge-type inverter realization to the Switching Power Supply duty ratio, therefore, realized a kind of high frequency switch power of the pulsating direct current that can regulate voltage magnitude and duty ratio, this high frequency switch power is applied to electroplating process, can makes coated metal even, improved electroplating effect.
More than a kind of high frequency switch power of using electroplating process provided by the present invention is described in detail, used specific embodiment herein principle of the present invention and execution mode are set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that all can change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (3)
1, a kind of high frequency switch power that is applied to electroplating process, it is characterized in that, comprise the DC bus-bar voltage rectifier, the Buck amplitude regulator, the two-phase bridge-type inverter, high frequency transformer and hf rectifier, wherein, the DC bus-bar voltage of described DC bus-bar voltage rectifier output is transported to described two-phase bridge-type inverter after described Buck amplitude regulator is regulated amplitude, after regulating duty ratio, described two-phase bridge-type inverter is transported to described high frequency transformer again, deliver to described hf rectifier then, last high frequency switch power signal by described hf rectifier output amplitude and EDM Generator of Adjustable Duty Ratio.
2, high frequency switch power according to claim 1, it is characterized in that, described Buck amplitude regulator is by insulated gate bipolar power IGBT pipe (A1), diode (D1), inductance (L1), the electric capacity (C1) and the first pulse regulation control unit are formed, wherein, the collector electrode of IGBT pipe (A1) links to each other with the forward output of described DC bus-bar voltage rectifier, the emitter of IGBT pipe (A1) links to each other with an end of inductance (L1) and the negative electrode of diode (D1) respectively, the other end of inductance (L1) links to each other with an end of electric capacity (C1), the anode of the other end of electric capacity (C1) and diode (D1) all links to each other with the negative sense output of described DC bus-bar voltage rectifier, and the control utmost point of IGBT pipe (A1) links to each other with the output of the described first pulse regulation control unit.
3, high frequency switch power according to claim 1, it is characterized in that, described two-phase bridge-type inverter is by IGBT pipe (A2), IGBT manages (A3), IGBT manages (A4), the IGBT pipe (A5) and the second pulse regulation control unit are formed, wherein, IGBT pipe (A2) links to each other with the forward output of described Buck amplitude regulator with the collector electrode of IGBT pipe (A3), the emitter of IGBT pipe (A2) and IGBT pipe (A3) links to each other with the collector electrode of IGBT pipe (A4) with IGBT pipe (A5) respectively, IGBT pipe (A4) links to each other with the negative sense output of described Buck amplitude regulator with the emitter of IGBT pipe (A5), IGBT (A2) links to each other with the positive input of described high frequency transformer, the emitter of IGBT pipe (A3) links to each other with the negative input of described high frequency transformer, and IGBT manages (A2), (A3), (A4) link to each other with the output of the second pulse regulation control unit respectively with the control utmost point of (A5).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910179658A CN101667780A (en) | 2009-10-26 | 2009-10-26 | High frequency switching power supply applied to electroplating process |
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| Application Number | Priority Date | Filing Date | Title |
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| CN200910179658A CN101667780A (en) | 2009-10-26 | 2009-10-26 | High frequency switching power supply applied to electroplating process |
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| CN101667780A true CN101667780A (en) | 2010-03-10 |
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| CN200910179658A Pending CN101667780A (en) | 2009-10-26 | 2009-10-26 | High frequency switching power supply applied to electroplating process |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102324852A (en) * | 2011-08-30 | 2012-01-18 | 深圳麦格米特电气股份有限公司 | A kind of heterogeneous misphase parallel connection twin-stage converter |
| CN102545552A (en) * | 2012-02-23 | 2012-07-04 | 崔聪林 | Matching circuit and large-power pulse power supply using same |
| CN102594196A (en) * | 2012-03-21 | 2012-07-18 | 中冶连铸技术工程股份有限公司 | Control device and control method for switching pulsed power supply |
| CN105024583A (en) * | 2014-04-25 | 2015-11-04 | 常州大控电子科技有限公司 | Constant voltage output pulsed power supply with duty ratio adjustable range being 20%-80% |
-
2009
- 2009-10-26 CN CN200910179658A patent/CN101667780A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102324852A (en) * | 2011-08-30 | 2012-01-18 | 深圳麦格米特电气股份有限公司 | A kind of heterogeneous misphase parallel connection twin-stage converter |
| CN102545552A (en) * | 2012-02-23 | 2012-07-04 | 崔聪林 | Matching circuit and large-power pulse power supply using same |
| CN102545552B (en) * | 2012-02-23 | 2014-06-18 | 崔聪林 | Matching circuit and large-power pulse power supply using same |
| CN102594196A (en) * | 2012-03-21 | 2012-07-18 | 中冶连铸技术工程股份有限公司 | Control device and control method for switching pulsed power supply |
| CN105024583A (en) * | 2014-04-25 | 2015-11-04 | 常州大控电子科技有限公司 | Constant voltage output pulsed power supply with duty ratio adjustable range being 20%-80% |
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Open date: 20100310 |