CN101667525A - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

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Publication number
CN101667525A
CN101667525A CN200910008795A CN200910008795A CN101667525A CN 101667525 A CN101667525 A CN 101667525A CN 200910008795 A CN200910008795 A CN 200910008795A CN 200910008795 A CN200910008795 A CN 200910008795A CN 101667525 A CN101667525 A CN 101667525A
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CN
China
Prior art keywords
substrate
parts
induction heating
insulating member
heat insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN200910008795A
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Chinese (zh)
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CN101667525B (en
Inventor
李浩喆
崔善弘
李丞浩
李智训
李东奎
李太浣
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Jusung Engineering Co Ltd
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Jusung Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020080087775A external-priority patent/KR20100028845A/en
Priority claimed from KR1020090077726A external-priority patent/KR20100032819A/en
Application filed by Jusung Engineering Co Ltd filed Critical Jusung Engineering Co Ltd
Priority to CN201310524521.2A priority Critical patent/CN103594396B/en
Publication of CN101667525A publication Critical patent/CN101667525A/en
Application granted granted Critical
Publication of CN101667525B publication Critical patent/CN101667525B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering

Abstract

A substrate processing apparatus includes a chamber having a reaction space therein, a substrate seating member disposed in the reaction space of the chamber to seat a substrate thereon, an inductionheating unit to heat the substrate seating member, and at least one altitude adjusting unit to selectively adjust the altitude of the induction heating unit at the outside of the chamber according toa temperature adjusting region of the substrate seating member. Therefore, it is possible to constantly control a temperature of the substrate seating member by adjusting the distance length between the substrate seating member and the induction heating unit at the outside of the chamber.

Description

Substrate-treating apparatus
The cross reference of related application
The application's case is advocated the priority of 10-2008-91716 korean patent application case that the 10-2008-87774 korean patent application case of application on September 5th, 2008, the 10-2008-87775 korean patent application case of application on September 5th, 2008, on September 18th, 2008 apply for and the 10-2009-77726 korean patent application case of applying on August 21st, 2009, and according to 35 U.S.C. § 119 and from its generation benefit, the mode that the content of described patent application case is quoted in full is incorporated herein.
Technical field
The present invention relates to a kind of substrate-treating apparatus, and more particularly, relate to substrate in a kind of chamber of heating, vacuum equably and lay parts and minimizing and be used for the substrate-treating apparatus of power consumption that heated substrate is laid the induction heating unit of parts.
Background technology
In general, semiconductor device, organic device and solar battery apparatus are to make by depositing a plurality of films and it being etched with the acquisition characteristic of wanting.Substrate-treating apparatus is being equal to or greater than the process of carrying out deposition and etch thin film under about 300 ℃ high temperature.In this, the substrate temperature that deposits film is above served as important factors in film deposition process.That is, under the uneven situation of substrate temperature, depositing of thin film speed may descend.In addition, lower or substrate temperature is under situation about not keeping equably during the film deposition process at depositing temperature, and the characteristic of film may change or the quality of film may worsen.
Therefore, conventional substrate-treating apparatus is laid parts by the substrate of laying substrate in the heating, vacuum chamber and is come heated substrate.This heating unit uses with substrate and lays the integrated electric heater of parts, or uses optics heater, described optics heater to use the radiant heat of chamber outside to heat the substrate that is placed in the chamber and lay parts.
Recently, being placed in high-frequency induction heating unit in the vacuum chamber by use lays parts with substrate and is heated to and is equal to or greater than about 400 ℃ high temperature.This is by using the induced field that is produced by the induction heating unit to make the induced current substrate of flowing through lay parts and come heated substrate to lay the scheme of parts.Therefore, unless the induction heating unit is heated to higher temperature, be heated to target temperature otherwise only substrate may be laid parts.
In general, the induction heating unit is installed in and is adjacent to substrate and lays in the district of parts.That is, the induction heating unit is placed in substrate and lays parts belows and have the larger area substrate with heating and lay parts.Yet, because the induction heating unit is not heated to higher temperature as mentioned above, therefore is placed in substrate and lays under the situation below the parts in the induction heating unit, the substrate that is heated to higher temperature is laid the heat of parts and may be taken away by sensed heating unit.That is, the induction heating unit serves as the main cause that substrate is laid the thermal loss of parts.And, need more power to compensate the thermal loss that substrate is laid parts.
Another problem is that substrate lays the temperature of the center of parts and lay the induction heating unit of parts belows and become the temperature that is higher than the marginal zone because of being placed in substrate.Therefore, when deposit film, the uniformity of film worsens.
Summary of the invention
The invention provides and a kind ofly can lay and prevent between parts and the induction heating unit that substrate from laying the thermal loss of parts, and make the substrate-treating apparatus of the maximizing efficiency of substrate heating by the power loss that reduces the induction heating unit by independent insulating unit being placed in substrate.
The present invention further provides a kind of can be by heat guard being placed in the insulating unit to prevent that reaction compartment that heat guard is exposed to chamber from reducing because the particle that heat guard causes or the generation of dust, and therefore prolong the substrate-treating apparatus of the replacement time of heat guard.
The present invention further provides a kind of again can control the temperature that substrate is laid parts equably by the distance of laying between parts and the induction heating unit at the outside adjusting of chamber substrate, and improves the substrate-treating apparatus of the efficient of equipment uptime.
According to one exemplary embodiment, a kind of substrate-treating apparatus comprises: chamber wherein has reaction compartment; Substrate is laid parts, and it is placed in the described reaction compartment of described chamber so that substrate is laid thereon; The induction heating unit, it lays parts in order to heat described substrate; And at least one height adjusting unit, the height of described induction heating unit is optionally regulated in its equalizing section in order to lay parts according to described substrate in the outside of described chamber.
The penetrable described chamber of described height adjusting unit, and can be connected to the described induction heating unit that is placed in the pedestal below.
Described height adjusting unit can comprise: the coil stationary strutting piece; Insulator, it twines the bottom part of described coil stationary strutting piece; Axle, it is towards the described chamber of the bottom of described insulator partial penetration; Upper support element and lower support, it is installed in the outside and the inboard of described chamber respectively, and wherein said axle is placed between described upper support element and the described lower support; Bellows, it is used so that described bottom part towards described lower support moves; And apart from controller, it is in order to control described coil stationary strutting piece moving towards the bottom part of described bellows.
Substrate-treating apparatus can further comprise: a plurality of drive motors, its corresponding to described apart from controller; And sensor support, sensing apparatus is attached to described sensor support, and described sensor support is placed in described bellows and described apart from the space between the controller, and wherein said sensing apparatus uses one in transducer and the measurer.
Described insulator can comprise one in quartzy and the ceramic material, comprises AlO, AlN, BN or SiC.
Substrate-treating apparatus can further comprise and is placed in described induction heating unit and described substrate and lays heat insulating member between the parts, and wherein said heat insulating member can use one or more in opaque quartz, SiC and the pottery.
Substrate-treating apparatus can further comprise and is placed in described induction heating unit and described substrate and lays heat insulating member between the parts, wherein said heat insulating member can comprise: heat guard, be placed in the sub-body of in the reaction compartment and wherein collecting described heat guard, and the upper cap that covers described sub-body, and described heat guard is used one or more in the heat guard of heat guard, silica serial of aluminium oxide series and the carbon felt.
The induction heating unit can be placed in the described chamber; Window member can be placed in top, described induction heating unit; Heat insulating member can be placed in described window member top; And a plurality of support wheel shafts can be placed between described window member and the described heat insulating member.
Substrate-treating apparatus can further comprise and is placed in described substrate and lays parts belows and wherein collect the heat insulating member of heat guard, described heat guard is used one or more in the heat guard of heat guard, silica serial of aluminium oxide series and the carbon felt, wherein said induction heating unit can be placed in the described heat insulating member, and the part of the penetrable described chamber of described height adjusting unit is to be connected to described heat insulating member.
The induction heating unit can comprise: at least one induction coil, and it is placed in the heat insulating member below; And the power source of supply, it is in order to provide high frequency power to described induction coil, and wherein said height adjusting unit is connected to described induction coil.
According to another one exemplary embodiment, a kind of substrate-treating apparatus comprises: chamber wherein has reaction compartment; Substrate is laid parts, and it is placed in the described chamber so that substrate is laid thereon; The induction heating unit, it lays parts in order to heat described substrate by induction heating; Window member, it is placed in top, described induction heating unit; And at least one heat insulating member, it is placed between described induction heating unit and the described window member.
Substrate-treating apparatus can further comprise a plurality of support wheel shafts that are placed between described window member and the described heat insulating member.
But heat insulating member block radiation heat, and use one or more in opaque quartz, SiC and the pottery do not influence induction heating.
Heat insulating member can comprise: heat guard, be placed in the described reaction compartment and wherein collect the sub-body of described heat guard, and the upper cap that covers described sub-body, and described heat guard can be used one or more in the heat guard of heat guard, silica serial of aluminium oxide series and the carbon felt.
Substrate-treating apparatus can further comprise height adjusting unit, and described height adjusting unit moves up and down described induction heating unit, lays distance between the parts to control described induction heating unit and described substrate.
According to an one exemplary embodiment again, a kind of substrate-treating apparatus comprises: chamber wherein has reaction compartment; Substrate is laid parts, and it is placed in the described chamber so that substrate is laid thereon; Heat insulating member, it is placed in described substrate and lays the parts below and wherein collect heat guard; And the induction heating unit, it is placed in the described heat insulating member, lays parts to heat described substrate by induction heating.
Described heat insulating member can comprise: be placed in the described reaction compartment and wherein collect the sub-body of described heat guard, and the upper cap that covers described sub-body, and described heat guard can be used one or more in the heat guard of heat guard, silica serial of aluminium oxide series and the carbon felt.
Description of drawings
Can understand one exemplary embodiment in more detail from the description of carrying out below in conjunction with accompanying drawing, wherein:
Fig. 1 explanation is according to the cross-sectional view of the substrate-treating apparatus of first embodiment of the invention;
Fig. 2 explanation is according to the conceptual perspective view of heat insulating member and the window member of first embodiment;
Fig. 3 explanation is according to the concept nature plane graph of the heat insulating member of first embodiment;
Fig. 4 explanation is according to the concept nature plane graph of the induction heating unit of the modification of first embodiment;
Fig. 5 is used to explain concept nature cross-sectional view according to the shape of the heat insulating member of the modification of first embodiment to Fig. 9 explanation;
Figure 10 explanation is according to the cross-sectional view of the substrate-treating apparatus of second embodiment of the invention;
Figure 11 explanation is according to the decomposition diagram of the heat insulating member of second embodiment;
Figure 12 explanation is according to the plane graph of the heat insulating member of second embodiment;
Figure 13 explanation is according to the plane graph of the heat insulating member of the modification of second embodiment;
Figure 14 is used to explain concept nature cross-sectional view according to the shape of the heat insulating member of the modification of second embodiment to Figure 16 explanation;
Figure 17 explanation is according to the cross-sectional view of the substrate-treating apparatus of third embodiment of the invention;
Figure 18 explanation is according to the cross-sectional view of the substrate-treating apparatus of fourth embodiment of the invention;
Figure 19 explanation is according to the view of the height adjusting unit of the induction heating scheme of the 4th embodiment;
The plane graph of parts is laid in Figure 20 explanation according to the substrate of the 4th embodiment;
Figure 21 explanation is according to the decomposition diagram of the height adjusting unit of the 4th embodiment;
The cross-sectional view that Figure 22 explanation intercepts along the B-B ' line described in Figure 21;
The cross-sectional view that Figure 23 explanation is laid parts according to heat generation unit and the substrate of the 4th embodiment;
Figure 24 explanation is according to the perspective view of the coil fixing device of the 4th embodiment; And
Figure 25 explanation is according to the heat generation unit of the modification of the 4th embodiment and the plane graph that substrate is laid parts.
Embodiment
Hereinafter, will describe specific embodiment in detail referring to accompanying drawing.Yet the present invention can multi-formly implement, and should not be construed as limited to the embodiment that this paper states.On the contrary, it is in order to make the present invention with detailed and complete that these embodiment are provided, and scope of the present invention is conveyed to the those skilled in the art fully.In addition, same or similar reference number is represented same or analogous element, although they different embodiments of the invention or graphic in occur.
Fig. 1 explanation is according to the cross-sectional view of the substrate-treating apparatus of first embodiment of the invention.Fig. 2 explanation is according to the conceptual perspective view of heat insulating member and the window member of first embodiment.Fig. 3 explanation is according to the concept nature plane graph of the heat insulating member of first embodiment.Fig. 4 explanation is according to the concept nature plane graph of the induction heating unit of the modification of first embodiment.Fig. 5 is used to explain concept nature cross-sectional view according to the shape of the heat insulating member of the modification of first embodiment to Fig. 9 explanation.
Arrive Fig. 3 referring to Fig. 1, substrate-treating apparatus according to first embodiment comprises: the substrates that have the chamber 100 in internal-response space, substrate 10 are placed in the chamber 100 are laid parts 200, are come heated substrate to lay the induction heating unit 300 of parts 200 by high-frequency induction heating, and are placed in substrate and lay heat insulating member 400 between parts 200 and the induction heating unit 300.Described in Fig. 1, substrate-treating apparatus further comprises: be installed in the window member 500 of 300 tops, induction heating unit, and will handle gas and be expelled to gas injection member 600 on the heated substrate 10.Although not shown, substrate-treating apparatus can further comprise: regulate the pressure regulating unit of the pressure in the chamber 100, and the exhaust unit of the inside of emptying chamber 100.
Chamber 100 forms with the tubular in shape with inner space.In this article, chamber 100 can cylinder form or the formation of polygon tube shape.Although not shown, chamber 100 can comprise chamber body and chamber front pilot, and its combination with one another is with detachably.
Substrate 10 is placed in the reaction compartment of chamber 100.In this article, provide substrate to lay parts 200 so that substrate 10 is placed in the reaction compartment.In this embodiment, use the electromagnetic induction principle of high-frequency current to lay parts 200, thereby the substrate 10 that substrate is laid on the parts 200 is heated to up to treatment temperature with the electromagnetic field heated substrate.
As shown in Figure 1, substrate is laid parts 200 and is comprised: the top main disk 210 of laying substrate 10, be connected to the live axle 220 at the center of main disk 210 and the driving element 230 that moves main disk 210 by live axle 220.
Main disk 210 forms with the plate shape shape identical with the shape of substrate 10.Main disk 210 comprise wherein lay at least one substrate lay the district be effective.Main disk 210 uses and can be heated to the material that is equal to or greater than about 300 ℃ temperature by high-frequency induction heating (that is the electromagnetic induction of high-frequency current).Preferably, main disk 210 is formed by the material that can be heated to maximum 1400 ℃.
Live axle 220 is connected to the main disk 210 in the reaction compartment, and extends to the outside of chamber 100.In this, live axle 220 penetrates the base plate of chamber 100 and is connected to driving element 230.Therefore, the base plate of chamber 100 can have the groove of penetrating.Although not shown, can provide for example potted component such as bellows to the circumference that penetrates groove, thus the inside of sealed chamber 100.In this article, live axle 220 is formed by the material with low heat conductivity.This is because an end of live axle 220 is connected to heated main disk 210, and if therefore the thermal conductivity of live axle 220 is higher, and the thermal loss of main disk 210 may increase so.
Driving element 230 provides up and down power or revolving force to live axle 220, so that main disk 210 up or down or rotation.Driving element 230 can use the level that comprises a plurality of motor.
Although not shown, substrate is laid parts 200 can further comprise a plurality of stripper pins (lift pin) to help loading and unloading substrate 10.
In this embodiment, substrate-treating apparatus comprises induction heating unit 300, and it is placed in main disk 210 belows that substrate is laid parts 200, to heat main disk 210 by high-frequency induction heating.Mention as mentioned, induction heating unit 300 uses the electromagnetic induction principle of high-frequency current to heat main disk 210.
Induction heating unit 300 comprises: the induction coil 310 that high-frequency current is flowed through, in order to the high frequency power source of supply 320 of high frequency power to be provided to induction coil 310, and in order to the cooling element 330 of cooling induction coil 310.
As shown in Figure 3, induction coil 310 is with spiral-shaped layout.Therefore, might lay parts 200 to substrate and produce uniform high frequency magnetic field.In this, the surface temperature of main disk 210 can be laid changing apart from length and/or the interval between the circle coil between the parts 200 according to induction coil 310 and substrate.Fig. 3 shows to be constant at interval between the circle coil.Yet, the invention is not restricted to this embodiment, and along with from the center of induction coil 310 to the marginal zone, can reduce at interval.Therefore, might prevent that heat from concentrating on the center that substrate is laid parts 200.
Fig. 1 explanation has spiral-shaped induction coil 310 and is placed on the plane parallel with the lower surface of main disk 210.That is, between induction coil 310 and the main disk 210 keep apart from length constant.Yet, the invention is not restricted to this embodiment, and the center place induction coil 310 of laying parts 200 at substrate and substrate lay between the parts 200 apart from length can greater than the marginal zone of laying parts 200 at substrate locate induction coil 310 and substrate lay between the parts 200 apart from length.Therefore, might keep the Temperature Distribution that substrate is laid the top surface of parts 200 equably.This is to change according to the height of induction coil 310 because lay induced magnetism that parts 200 provide to substrate.
High frequency power source of supply 320 provides high frequency power to induction coil 310.In this, high frequency power arrives in the frequency range of about 1MHz to power level scope and the about 10KHz of about 400kW at about 10kW.The high frequency magnetic field that is produced by induction coil 310 changes according to the power level and the frequency of high frequency power.Therefore, substrate can be laid parts 200 and be heated to all temps.
High frequency power source of supply 320 is placed in the outside of chamber 100 in this embodiment and is electrically connected to induction coil 310 by individual conductor is effective.
The structure of induction heating unit 300 is not limited thereto embodiment, and can change by different way.In particular, induction coil 310 can disposed in various ways.That is, as illustrated in fig. 4, induction heating unit 300 can comprise a plurality of induction coil 310a to 310d, and it is concentric and toroidal that have the tool different-diameter respectively.And induction coil 310a can operate individually to 310d.For this purpose, as shown in Figure 4, can further use to be connected respectively to induction coil 310a and to come to a plurality of high frequency power source of supply 320a of 310d to 320d independently to induction coil 310a to 310d supply high frequency power.Therefore, frequency that might be by changing high frequency power as required and power level come equably heated substrate to lay parts 200.In addition, substrate might be laid parts 200 and be divided into a plurality of districts, and induction coil is placed in each district below in the described district, the induction coil that wherein is placed in below, described a plurality of district is operated independently.By doing like this, can regulate the temperature of laying described a plurality of districts of parts 200 through the substrate of dividing independent of one another.
In this article, induction coil 310 is positioned to be adjacent to that substrate lays parts 200 be heated to the bottom part of higher temperature by high-frequency induction heating.Therefore, the substrate heat of laying parts 200 can be transferred to induction coil 310.Induction coil 310 forms by having good conductive metal material (for example copper).Yet, for example easy temperature distortion of metal material such as copper.Therefore, in this embodiment, further at the inside or the externally-arranged cooling element 330 that is used to cool off induction coil 310 of induction coil 310, wherein cooling element 330 uses cooling fluid.That is, cooling element 330 can cool off induction coil 310 by the inner space that cooling fluid is expelled to induction coil 310.And although not shown, cooling element 330 can further comprise the main body covered separately of winding induction coil 310, and therefore cools off induction coil 310 by cooling fluid being expelled in the space between main body covered and the induction coil 310.
In this article, although induction coil 310 by cooling element 300 cooling, the heat that substrate is laid parts 200 element 330 that also is cooled is taken away.The heat that substrate is laid parts 200 can be transferred to the base plate of chamber 100 by the space between the circle induction coil.Therefore, should supply thermal loss reflection power thereon is heated to up to mouth mark temperature substrate is laid parts 200.Therefore, power consumption may increase.
In this embodiment, heat insulating member 400 is installed in substrate and lays between parts 200 and the induction heating unit 300, lays the thermal loss of parts 200 so that prevent substrate.In addition, in this embodiment, to illustrated in fig. 3, window member 500 is placed between heat insulating member 400 and the induction heating unit 300, is supplied to the processing gaseous contamination of chamber 100 to prevent induction heating unit 300 as Fig. 1.
In this embodiment, heat insulating member 400 is placed in window member 500 tops, that is, and and below substrate is laid parts 200.Therefore, the thermal loss of laying the bottom part of parts 200 to substrate can be cut off, and the power consumption of induction heating unit 300 reduces.
Window member 500 has through hole at the center as shown in Figure 2, and lays the plate shape shape formation of parts 200 to be similar to substrate.In this embodiment, window member 500 forms with the circular slab shape.Window member 500 is formed by the material that can see through electromagnetic force.That is, window member 500 uses can be by the material of high-frequency induction heating.Therefore, window member 500 can not be induction heated the high-frequency induction heating phenomenon influence of unit 300.And, might make the distortion of high frequency magnetic field or stop and reduce to minimum.
Forming window member 500 with the material that does not produce particle in chamber 100 is effectively, because window member 500 is placed in the reflection space of chamber 100.Using quartzy is effective as window member 500.
Window member 500 can have the diameter around the whole diameter of circle induction coil 310 greater than induction heating unit 300.This is because window member 500 is placed in induction coil 310 tops of induction heating unit 300, is attached to induction coil 310 to prevent the accessory substance in the reaction compartment.
Then, heat insulating member 400 is placed in window member 500 tops.
Heat insulating member 400 is formed by the material with low heat conductivity.Described thermal conductivity can be less than about 10W/mk.By doing like this, might reduce the thermal loss that the substrate that is heated to higher temperature is laid parts 200.Preferably, use can block radiation heat (that is infrared ray) or have a material of low transmissivity for heat insulating member 400.That is, might prevent that the base plate of chamber 100 or induction heating unit 300 from being heated by radiant heat by block radiation heat.
It is effective forming heat insulating member 400 with the material of induction heating phenomenon heating that can not sensed heating unit 300.Preferably, heat insulating member 400 is formed by the material that does not influence high frequency magnetic field.Therefore, might not disturb and lay the induction heating that parts 200 provide to substrate.
Heat insulating member 400 is formed by the material that does not produce particle in chamber 100.That is, heat insulating member 400 is placed in the reaction compartment of chamber 100.Therefore, heat insulating member 400 reacts with the processing gas that is fed in the chamber 100, and therefore serves as sources of particles.
In this embodiment, heat insulating member 400 can use one or more in opaque quartz, SiC and the pottery.
As shown in Fig. 2 and Fig. 3, heat insulating member 400 forms with the plate shape shape that has through hole at the center.That is, heat insulating member 400 can be similar to the circular slab shape formation that substrate is laid parts 200.
As shown in FIG., the available a plurality of parts that make up for the simplicity of making form heat insulating member 400.For instance, as shown in Figure 3, form heat insulating member 400 by making up 4 adiabatic main bodys with fan-shaped.The invention is not restricted to this embodiment.Constitute heat insulating member 400 adiabatic main body number can less than or greater than 4.
To illustrated in fig. 3, the adiabatic main body of each of heat insulating member 400 is attached to window member 500 by a plurality of support wheel shafts 501 as Fig. 1.Heat insulating member 400 separates with window member 500 by supporting wheel shaft 501.Might separate the insulation effect that strengthens heat insulating member 400 with window member 500 by making heat insulating member 400.In this article, to use the quartz with rod shape shape be effective to a plurality of support wheel shafts 501.Support wheel shaft 501 and can serve as fixed component.As required, can further use fixed part to fix and support wheel shaft 501, and heat insulating member 400 and window member 500.
As illustrated in fig. 1, the diameter of heat insulating member 400 is similar to substrate, and to lay the diameter of bottom side of the main disk 210 of parts 200 be effective.Preferably, the diameter of heat insulating member 400 is greater than the maximum gauge of the induction coil 310 of induction heating unit 300.Therefore, might lay the whole bottom side of parts 200 and stop and pass the thermal loss that substrate is laid the bottom side of parts 200 by covering substrate.
Heat insulating member 400 is not limited to shape mentioned above, and can form by different shape.To the various modifications of substrate-treating apparatus being done according to the change of heat insulating member 400 be described to Fig. 9 referring to Fig. 5.
At first, in the modification described in Fig. 5, heat insulating member 400 comprises: adiabatic main body 410, and its plate shape shape with the bottom side of laying parts 200 corresponding to substrate forms; And stressing main 420, its place, marginal zone in adiabatic main body 410 projects upwards, to lay the sidewall of parts 200 corresponding to substrate.Might prevent to pass the thermal loss that substrate is laid the sidewall of parts 200 by the sidewall of laying parts 200 with stressing main 420 covering substrates.The sidewall that substrate is laid parts 200 is arranged to be adjacent to the internal side wall of chamber 100.Therefore, the substrate thermal loss of laying parts 200 may take place owing to the internal side wall of chamber 100.Can be positioned to the sidewall of laying parts 200 corresponding to substrate by the stressing main 420 that will have insulating characteristics as shown in Figure 5 and prevent thermal loss.In this revised, adiabatic main body 410 and stressing main 420 formed with monomeric form.Yet, the invention is not restricted to this modification.That is, adiabatic main body 410 can be separated with stressing main 420.
In the illustrated modification of Fig. 5, a plurality of substrates can be placed in substrate and lay on the parts 200.And window member 500 can be attached to the bottom side of heat insulating member 400.Groove can be formed at the bottom side of window member 500, and therefore the induction coil 310 of induction heating unit 300 can enter and withdraw from described groove.By doing like this, can prevent pollution to induction coil 310.
In the illustrated modification of Fig. 6, the extension main body 430 that heat insulating member 400 can comprise adiabatic main body 410 and extend downwards at the place, marginal zone of adiabatic main body 410.Can be by induction heating unit 300 being placed in the pollution that prevents in the inner space of extending main body 430 and adiabatic main body 410 induction coil 310 of induction heating unit 300.Therefore, in revising, this can omit window member 500 described in the foregoing description.That is, induction coil 310 is placed in adiabatic main body 410 belows, and therefore lays parts 200 heat with the substrate that is in high temperature and isolate.Be placed on the side direction of induction coil 310 owing to extend main body 430, therefore might stop that byproduct of reaction or unreacting gas flow on the side direction of induction coil 310.
In the illustrated modification of Fig. 7, heat insulating member 400 can be formed the thickness of the thickness at its place, center greater than its marginal zone.Use this heat insulating member 400 in the time of can much more thermal loss may taking place at the center place that substrate is laid parts 200.That is, can strengthen the insulation effect at the place, center of heat insulating member 400 greater than the thickness at place, marginal zone by the thickness that heat insulating member 400 is formed the place, center.
In Fig. 7, heat insulating member 400 and window member 500 are fixed on the live axle 220.Therefore, when substrate was laid parts 200 risings or descended, heat insulating member 400 and window member 500 also rose simultaneously and descend.By doing like this, substrate is laid and can be kept constant apart from length between parts 200 and the heat insulating member 400.The invention is not restricted to this modification.Heat insulating member 400 and window member 500 can be fixed on the base plate of chamber 100 by independent fixed component.
In the illustrated modification of Fig. 8, heat insulating member 400 can be formed the thickness of the thickness at its place, marginal zone greater than its place, center.Use this heat insulating member 400 in the time of can much more thermal loss may taking place at the marginal zone place that substrate is laid parts 200.That is, can reduce the thermal loss that substrate is laid the place, marginal zone of parts 200 by the thickness that the thickness that heat insulating member 400 is formed the place, marginal zone is located greater than the center.
In the illustrated modification of Fig. 9, heat insulating member 400 formed have along with from the center to the marginal zone and become big thickness.
Be not limited to description above, substrate-treating apparatus can further comprise a plurality of heat insulating members.The heat insulating member 400 of single layer is showed in description above.Yet, the invention is not restricted to this, and can further strengthen insulation effect by using a plurality of layers heat insulating member 400.
Hereinafter, will explain according to the Comparative Example of not using heat insulating member 400, use first embodiment of opaque quartz, and use the experimental result of pottery as second embodiment of heat insulating member 400 as heat insulating member 400.
Table 1 is described to measure and is provided to induction heating unit 300 so that substrate is laid the result that the temperature of the main disk 210 of parts 200 is elevated to the power up to 800 ℃.
[table 1]
Power Insulation effect
Comparative Example ??66kW 1 times
First embodiment ??42kW 1.57 doubly
Second embodiment ??38kW 1.74 doubly
As shown in table 1, under the situation of the Comparative Example of not using heat insulating member 400, the main disk 210 that needs the power of 66kW that substrate is laid parts 200 is heated to up to 800 ℃.Yet, in using first embodiment of opaque quartz, need the power of 42kW as heat insulating member 400.In second embodiment that uses pottery as heat insulating member 400, need the power of 38kW.That is, note that power consumption under the situation of using heat insulating member 400 is lower than the power consumption under the situation of not using heat insulating member 400.Therefore, might strengthen power efficiency by using heat insulating member 400.This means and to be heated to up to target temperature by using much lower power that substrate is laid parts 200.
As indicated above, substrate is laid parts 200 by 300 heating of induction heating unit.Lay on the parts 200 by substrate 10 being placed in heated substrate, substrate 10 also is heated to up to higher temperature.
Be expelled to being heated on the substrate 10 in the chamber 100 and form film by will handle gas via gas injection member 600.
The description of the modification of being showed among the embodiment above can be applicable to other modification.Hereinafter, other embodiments of the invention will be described.Hereinafter will omit and the explaination overlapping the explaination of first embodiment.And hereinafter the description that will show can be applicable to first embodiment.
Figure 10 explanation is according to the cross-sectional view of the substrate-treating apparatus of second embodiment of the invention.Figure 11 explanation is according to the decomposition diagram of the heat insulating member of second embodiment.Figure 12 explanation is according to the plane graph of the heat insulating member of second embodiment.Figure 13 explanation is according to the plane graph of the heat insulating member of the modification of second embodiment.Figure 14 is used to explain concept nature cross-sectional view according to the shape of the heat insulating member of the modification of second embodiment to Figure 16 explanation.
, comprise to Figure 12 referring to Figure 10 according to the substrate-treating apparatus of second embodiment: chamber 1100, it has the internal-response space; Substrate is laid parts 1200, and it makes substrate 1010 be placed in described substrate in chamber 1100 and lays on the parts 1200; Induction heating unit 1300, it comes heated substrate to lay parts 1200 by high-frequency induction heating; And heat insulating member 1400, it is placed in substrate and lays between parts 1200 and the induction heating unit 1300 and wherein collect heat guard 1410.
In this embodiment, the heat insulating member 1400 of wherein collecting heat guard 1410 is placed in substrate and lays between parts 1200 and the induction heating unit 1300, lays the thermal loss of parts 1200 to prevent substrate, makes the power consumption of induction heating unit 1300 to reduce.
Might prevent that induction coil 1310 is supplied to the processing gaseous contamination of the reaction compartment of chamber 1100 by above the induction coil 1310 of induction heating unit 1300, settling heat insulating member 1400.
To illustrated in fig. 12, heat insulating member 1400 comprises as Figure 10: heat guard 1410, wherein collect the sub-body 1420 of heat guard 1410 and the upper cap 1430 that covers sub-body 1420.
Heat guard 1410 forms with the plate shape shape that heart district therein has through hole.Heat guard 1410 be placed in the induction heating unit 1300 of carrying out induction heating and by induction heating heated substrate lay between the parts 1200.Therefore, preferably, the diameter of heat guard 1410 is equal to or less than the diameter that substrate is laid the main disk 1210 of parts 1200.According to another embodiment, the diameter of heat guard 1410 can be greater than the diameter of main disk 1210.Yet when the size of considering chamber 1100 and sub-body 1420 and upper cap 1430 big or small, the diameter that the diameter of heat guard 1410 is laid parts 1200 less than substrate is effective.
Heat guard 1410 is formed by the material with low heat conductivity.Described thermal conductivity can be less than about 10W/mK.Therefore, might reduce the thermal loss that the substrate that is heated to higher temperature is laid parts 1200.
The material of preferably, can block radiation heat (that is infrared ray) or having a low transmissivity is used as heat guard 1410.That is, might prevent that the base plate of chamber 1100 or induction heating unit 1300 from being heated by radiant heat by block radiation heat.
It is effective forming heat guard 1410 with the material of induction heating phenomenon heating that can not sensed heating unit 1300.Preferably, heat guard 1410 is formed by the material that does not influence high frequency magnetic field.Therefore, might not disturb and lay the induction heating that parts 1200 provide to substrate.
For satisfying above-mentioned characteristic, heat guard 1410 is used one or more in the heat guard of heat guard, silica serial of aluminium oxide series and the carbon felt.Heat guard 1410 has the advantage that adiabatic function is good and price is lower.
Yet, be exposed in the prior art of inside of chamber 1100 in heat guard 1410, because of particle ejection phenomenon (particle blowing phenomenon) appears in the soft of heat guard 1410.And, because the density of heat guard 1410 is lower, thus heat contained in the pore that produces owing to low-density, and therefore it has reduced thermal conductivity.Because the pore in the heat guard 1410 contains the various materials that exist in the air, therefore pollute because of the venting of described material.Accessory substance in heat guard 1410 and the chamber 1100 or processing gas react, and therefore the corrosion or the etching of heat guard 1410 take place.Therefore, the replacement of heat guard 1410 often takes place.Yet, in this embodiment, solve the problems referred to above by using sub-body 1420 and upper cap 1430 sealed, thermally insulated bodies 1410.Sub-body 1420 and upper cap 1430 have thermal endurance, and therefore at high temperature indeformable.In addition, sub-body 1420 and upper cap 1430 have chemical resistance, and therefore not with manufacture process in employed chemical substance react.
Therefore, can be by heat guard 1410 being placed in by sub-body 1420 and upper cap 1430 are combined in the inner space of the main body of constructing, prevent the pollution that causes owing to the ejection of the venting that causes by heat guard 1410 or particle, and prevent heat guard 1410 etched or corrosion.
By sub-body 1420 and upper cap 1430 being combined the main body that forms heat guard 1410 and its outside (that is the internal environment of chamber 1100) are isolated fully.Therefore, protection heat guard 1410 is not subjected to external action, and can prevent the pollution to chamber 1100 inside that causes to the pollution of heat guard 1410 and owing to heat guard 1410.
In this article, the hardness of sub-body 1420 and upper cap 1430 is effective greater than the hardness of heat guard 1410.Therefore, might protect heat guard 1410 not influenced by external force.And, because sub-body 1420 and upper cap 1430 are exposed to the reaction compartment of chamber 1100, thus sub-body 1420 and upper cap 1430 to use not with accessory substance or handle the material that gas reacts be effective.
In this embodiment, preferably, use quartzy as sub-body 1420 and upper cap 1430.Can use pottery as sub-body 1420 and upper cap 1430.Can use SiC as sub-body 1420 and upper cap 1430.
As shown in Figure 11, sub-body 1420 comprises: the heart has the base plate 1421 of wheel shaft through hole, the first outstanding sidewall 1422 that projects upwards at place, the marginal zone of base plate 1421 therein, and second gives prominence to sidewall 1423 what the boundary of through hole and base plate 1421 projected upwards.Heat guard 1410 is collected in the space that is formed by base plate 1421 and the first outstanding sidewall 1422 and the second outstanding sidewall 1423.Therefore, as illustrated in fig. 12, heat guard 1410 forms with band shape shape.
In this article, base plate 1421 is laid the circular slab shape of shape of the main disk 1210 of parts 1200 and is formed to be similar to substrate.The shape of base plate 1421 can change according to the shape of main disk 1210.
The live axle 1220 that substrate is laid parts 1200 penetrates the wheel shaft through hole of base plate 1421 centers.Therefore, sub-body 1420 can be placed in substrate and lays in the bottom part of parts 1200.In addition, substrate is laid moving (that is, rise and descend) or rotating heat insulating member 1400 interference that can not comprised sub-body 1420 of parts 1200.
Then, as shown in Figure 11, upper cap 1430 comprises: therein the heart have axle hole upper board 1431, extend downwards at place, the marginal zone of upper board 1431 first extend sidewall 1432, and the second extension sidewall 1433 that extends at the boundary of axle hole and upper board 1431 downwards.That is, in this embodiment, upper cap 1430 and sub-body 1420 form have identical shaped.
Mention as mentioned, heat guard 1410 is placed in the sub-body 1420.Then, with upper cap 1430 and sub-body 1420 combinations, make first of upper cap 1430 extend the first outstanding sidewall 1422 that sidewall 1432 is attached to sub-body 1420, and the second extension sidewall 1433 is attached to the second outstanding sidewall 1423.Therefore, heat insulating member 1400 forms.It is effective as indicated above and heat insulating member 1400 that form being fixed on the base plate of chamber 1100.
As illustrated in fig. 12, for example can using, fixed components 1401 such as adhesive, bolt or screw make up sub-body 1420 and upper cap 1430.In this article, fixed component 1401 is fixed to extension sidewall 1432 and 1433 after can penetrating outstanding sidewall 1423 and 1423 in the bottom from outstanding sidewall 1423 and 1423.
Description shown in heat insulating member 1400 is not limited to above.Can form heat insulating member 1400 in every way.
Hereinafter, will be referring to the graphic modification of describing heat insulating member 1400.The embodiment that the description of the modification that hereinafter will explain be can be applicable to above to be mentioned, and each the description in the described modification be can be applicable to other modification.
In the modification described in Figure 13, heat insulating member 1400 can form and be divided into a plurality of parts.For instance, as shown in Figure 13, can come to form heat insulating member 1400 by making up 4 adiabatic main body 1400a, 1400b, 1400c and 1400d with fan-shaped with a circular slab shape.In this article, each among first to the 4th adiabatic main body 1400a, 1400b, 1400c and the 1400d comprises heat guard 1410, sub-body 1420 and upper cap 1430.Might strengthen the manufacturing and the machinability of heat insulating member 1400 by the heat insulating member 1400 that formation has a plurality of parts through dividing.And, the quantity of electric charge that might be by regulating heat guard 1410 in described a plurality of parts each or thickness or change install to the kind of the heat guard 1410 in described a plurality of part each, change each the insulating characteristics in described a plurality of part.Therefore, can carry out the thermal insulation of laying the hot difference of parts 1200 according to substrate.
As illustrated in fig. 14, heat insulating member 1400 comprises: have the sub-body 1420 of cup-like shape, its top part be opening and wherein contain heat guard 1410; And upper cap 1430, it covers the top part of sub-body 1420.Heat insulating member 1400 further comprises along the laminating flat attached diaphragm seal 1440 of sub-body 1420 with upper cap 1430.
In this article, upper cap 1430 forms with plate shape shape, and is attached to the first outstanding sidewall 1422 and the second outstanding sidewall 1423 of sub-body 1420.In this, diaphragm seal 1440 is attached with the side on the adhesive plane of sub-body 1420 along upper cap 1430.Preferably, as shown in Figure 14, diaphragm seal 1440 is attached to the outside of upper cap 1430 and the first outstanding sidewall 1422 and the second outstanding sidewall 1423 of sub-body 1420.In addition, diaphragm seal 1440 is attached to the part of the top surface of the part on back of the body surface of base plate 1421 of sub-body 1420 and upper cap 1430.
In this article, sub-body 1420 and upper cap 1430 can firmly be made up by diaphragm seal 1440.And, might prevent the venting or the particle ejection of heat guard 1410 effectively.
As illustrated in fig. 14, heat insulating member 1400 is connected to the live axle 1220 that substrate is laid parts 1200, and therefore can lay parts 1200 with substrate and move.By doing like this, heat insulating member 1400 and substrate are laid and can be kept constant apart from length between the parts 1200.A plurality of substrates can be placed in substrate lays on the main disk 1210 of parts 1200.
In the illustrated modification of Figure 15, concave-concave (concavo-concave) pattern 1424 and 1434 can be formed on the combined planar of the sub-body 1420 of heat insulating member 1400 and upper cap 1430.Promptly, as shown in Figure 15, recessed pattern 1424 is formed at the outstanding sidewall 1422 and 1423 places of sub-body 1420, and is formed at the extension sidewall 1432 and 1433 places of upper cap 1430 corresponding to the recessed pattern (concavo pattern) 1434 of recessed pattern (concavepattern) 1424.In this, the position of recessed pattern can change with the position of recessed pattern, perhaps recessed pattern and recessed pattern can in the described sidewall each and stagger each other.
By being formed at the concave-concave pattern on the combined planar, the vertical cross-section of the combined planar of sub-body 1420 and upper cap 1430 can be changed into sweep shape rather than rectilinear form.Therefore, might prevent that handling gas enters in the combined planar, and prevent that venting and particle from passing combined planar and run out of.
In the illustrated modification of Figure 16, induction heating unit 1300 can be placed in the inner area place of the sub-body 1420 of heat insulating member 1400.That is, the induction coil 1310 of induction heating unit 1300 can be installed in the sub-body 1420 of wherein collecting heat guard 1410.This means that induction heating unit 1300 can be placed in the inner space of the main body of being constructed by sub-body 1420 and upper cap 1430, and induction coil 1310 can be placed in the heat guard 1410.
By doing like this, induction coil 1310 is blocked in outside its external environment condition (being the inner space of chamber 1100), and therefore can prevent the pollution to induction coil 1310.In this, to be placed in induction coil 1310 tops be effective to heat guard 1410.Therefore, might prevent that induction coil 1310 is heated.
In this revised, the hole that electric lead penetrated can be placed in a side of sub-body 1420, and wherein said electric lead is electrically connected induction coil 1310 with high frequency power source of supply 1320.
In addition, a plurality of heat guards 1410 can be stacked in the heat insulating member 1400.Therefore, can further strengthen insulation effect.And, can pile up a plurality of heat insulating members.Substrate-treating apparatus can further comprise collection and seal through the sub-body 1420 of combination and the separate housing of upper cap 1430.That is, each in sub-body 1420 and the upper cap 1430 can form and comprise two layers.In this, described two layers can have identical or different quality.For instance, interior layer uses pottery and exterior layer to use quartz.
As indicated above, substrate is laid parts 1200 by 1300 heating of induction heating unit.Substrate 1010 is because just being placed in heated substrate lays on the parts 1200, so also be heated to higher temperature.Can be placed in induction heating unit 1300 and substrate by the heat insulating member 1400 that will comprise heat guard 1410 lays and prevents between the parts 1200 that substrate from laying the heat of parts 1200 and being transferred to induction heating unit 1300.Therefore, can prevent that substrate from laying the thermal loss of parts 1200, and can protect induction heating unit 1300 not received heat invade.
Then, be expelled to being heated on the substrate 1010 in the chamber 1100 and form film by will handle gas via gas injection member 1500.Certainly, can carry out etching by injection treatment gas.
Hereinafter, can reduce the substrate-treating apparatus that substrate is laid the thermal loss of parts 1200 with describing according to the 3rd embodiment.Hereinafter will omit the overlapping explaination of explaination with first and second embodiment.And hereinafter the description that will show can be applicable to first and second embodiment.
Figure 17 explanation is according to the cross-sectional view of the substrate-treating apparatus of third embodiment of the invention.
Referring to Figure 17, comprise according to the substrate-treating apparatus of the 3rd embodiment: chamber 1100, it has the internal-response space; Substrate is laid parts 1200, in chamber 1100 substrate 1010 is placed in substrate and lays on the parts 1200; Induction heating unit 1300, it comes heated substrate to lay parts 1200 by high-frequency induction heating; Heat insulating member 1400, it is placed in substrate and lays between parts 1200 and the induction heating unit 1300 and wherein collect heat guard 1410; And annular heat insulating member 1600, its sidewall and substrate that is placed in chamber 1100 is laid between the sidewall of parts 1200, and wherein comprises annular heat guard 1610.
Annular heat insulating member 1600 is laid the annular shape formation of the sidewall of parts 1200 to twine substrate.Preferably, form annular heat insulating member 1600 with the circular rings shape.It is effective that annular heat insulating member 1600 forms with the shape of the shape that is similar to heat insulating member mentioned above 1400.That is, annular heat insulating member 1600 comprises: collect the lower annular main body 1620 of annular heat guard 1610, and the top loop female cap 1630 that covers lower annular main body 1620.
In this embodiment, might be placed in substrate and lay and prevent between the sidewall of the sidewall of parts 1200 and chamber 1100 by encircling heat insulating member 1600 because the thermal loss that the substrate that the sidewall of chamber 1100 causes is laid parts 1200.
Hereinafter, the 3rd Comparative Example that explaination is laid between parts 1200 and the induction heating unit 1,300 second Comparative Example of settling the opaque quartz window, laid arrangement ceramic wafer between parts 1200 and the induction heating unit 1300 at substrate according to first Comparative Example of not using heat insulating member 1400, at substrate, and the experimental result of laying the embodiment of arrangement heat insulating member 1400 between parts 1200 and the induction heating unit 1300 at substrate.In this article, use the heat guard 1410 of the heat guard of aluminium oxide series as heat insulating member 1400.That is, heat guard 1410 has been used Al2O3.
Table 2 describe to be measured and to be provided to induction heating unit 1300 and to be heated to result up to the power of reference temperature (promptly 800 ℃) with the main disk 1210 of substrate being laid parts 1200.
[table 2]
Reference temperature (℃) Power (kW)
First Comparative Example ??800 ??66
Second Comparative Example ??800 ??48
The 3rd Comparative Example ??800 ??38
Embodiment ??800 ??23.4
As shown in table 2, under the situation of first Comparative Example of not using heat insulating member 1400, the main disk 1210 that needs the power of 66kW that substrate is laid parts 1200 is heated to up to 800 ℃.Yet, note that and settling according to embodiment under the situation of heat insulating member 1400, only need the power of 23.4kW just main disk 1210 to be heated to up to identical temperature promptly 800 ℃.Under the situation of using ceramic wafer or opaque quartz window, also realized the power minimizing.But under the situation of the heat guard of using aluminium oxide series according to embodiment, it is minimum that power consumption becomes.That is, might strengthen power efficiency by using heat insulating member 1400.This means that might use much lower power that substrate is laid parts 1200 is heated to up to want temperature.
Hereinafter, can control the substrate-treating apparatus that substrate is laid the temperature on the parts 1200 equably with describing according to fourth embodiment of the invention.Hereinafter will omit the overlapping explaination of explaination with first to the 3rd embodiment.And hereinafter the description that will show can be applicable to first to the 3rd embodiment.
Figure 18 explanation is according to the cross-sectional view of the substrate-treating apparatus of fourth embodiment of the invention.Figure 19 illustrates the view according to the height adjusting unit of the induction heating scheme of the 4th embodiment, and more particularly, the enlarged drawing in the A district among Figure 18 is described.The plane graph of parts is laid in Figure 20 explanation according to the substrate of the 4th embodiment.Figure 21 explanation is according to the decomposition diagram of the height adjusting unit of the 4th embodiment.The cross-sectional view that Figure 22 explanation intercepts along the B-B ' line described in Figure 21.The cross-sectional view that Figure 23 explanation is laid parts according to heat generation unit and the substrate of the 4th embodiment.Figure 24 explanation is according to the perspective view of the coil fixing device of the 4th embodiment.Figure 25 explanation is according to the heat generation unit of the modification of the 4th embodiment and the plane graph that substrate is laid parts.
Referring to Figure 18, comprise according to the substrate-treating apparatus 2105 of the 4th embodiment: chamber 2110, it is for significant components and therefore define the reaction zone R of sealing; Substrate is laid parts 2120, in chamber 2110 substrate 2010 is placed in substrate and lays on the parts 2120, and wherein substrate 2010 is process object; Gas distribution plate 2140 forms a plurality of injection orifices 2118 to penetrate up and down on it, be expelled to reaction zone R equably thereby allow to handle gas; And lifter sub-assembly 2145, the lifting moving that it lays parts 2120 in order to the control substrate.
Substrate-treating apparatus 2105 further comprises induction heating unit 2180, the instant heating production units, and it is operated and is installed in substrate with the induction heating scheme and lays parts 2120 belows, and coil (coil that promptly has a plurality of circles) can be used as induction heating unit 2180.
Provide reacting gas from being mounted to the reacting gas supply route 2160 that passes through chamber 2110 to gas distribution plate 2140.Chamber 2110 further comprises exhaust unit 2165, its remaining reacting gas among the emptying reaction zone R after using by external suction system (not shown).
In this embodiment, substrate-treating apparatus 2105 further comprises a plurality of height adjusting units 2170, its penetrate the base plate of chamber 2110 and optionally sense of control answer the height of heating unit 2180, promptly substrate is laid the distance between parts 2145 and the coil.
The structural advantages that induction heating unit 2180 has is, can be under the situation of not dismantling and assembling chamber 2110, and come sense of control easily to answer the height of heating unit 2180 by the height adjusting unit 2170 that drive motor (not shown) is housed in wherein.
Although there is not detail display among the figure, but move up and down in the space of induction heating unit 2180 below substrate is laid parts 2120 of regulating by height adjusting unit 2170, make the scalable substrate lay between parts 2120 and the induction heating unit 2180 apart from length.This is because during induction heating, and heating-up temperature depends on dissimilating apart from length between induction coil and the heating main body.
Therefore, many temperature conditions that might change by fast temperatures such as satisfy the demand at the outside setting height(from bottom) regulon 2170 of chamber 2110 for example 500 ℃, 600 ℃ and 700 ℃, wherein height adjusting unit 2170 is outer coil system that easy sense of control is answered the height of heating unit 2180.In this, induction heating unit 2180 can be used as and is used for laying parts 2120 by heated substrate and heats and be placed in the member that substrate is laid the substrate 2010 on the parts 2120.
As indicated above, might be under the situation of not dismantling and assembling chamber 2110, by answering the height of heating unit 2180 with sense of control, easily regulate the height of induction heating unit 2180 at the outside setting height(from bottom) regulon 2170 of chamber 2110.
Hereinafter, will describe height adjusting unit in detail referring to accompanying drawing according to the induction heating scheme of fourth embodiment of the invention.
As Figure 19 and illustrated in fig. 20, substrate is laid parts 2120 and is placed in the chamber 2110, and induction heating unit 2180 is placed in substrate and lays parts 2110 belows.In addition, a plurality of height adjusting units 2170 are installed, it is induction heating unit 2180 and pass through hole TH and penetrate chamber 2110 fixedly.
In this article, induction heating unit 2180 is designed to the wound rotor shape, its diameter is laid the central shaft of parts 2120 and is become big based on substrate.Promptly, as illustrated in fig. 25, induction heating unit 2180 comprises: coil 2180a, its be adjacent to support substrates lay parts 2120 back shaft 2182 starting point 2184a and be adjacent to substrate and lay between the end point 2184b of marginal zone of parts 2120 and have a plurality of circles; And power source of supply (not shown), it provides alternating current to coil 2180a.Substrate is laid parts 2120 by the magnetic field indirect that is produced when the coil 2180a supply of current, and the substrate that final substrate 2010 is laid thereon by substrate 2010 is laid parts 2120 heating.
As shown in Figure 23, the substrate uniformity of laying the Temperature Distribution at the parts 2120 places second distance T2 that laid between the parts 2120 apart from T1 and coil 2180a and substrate by first between the circle of coil 2180a influences.If first keeps constantly apart among T1 and the second distance T2 each, substrate is laid the top thermal loss of not laying the marginal zone of substrate 2010 of the center of parts 2120 laying parts 2120 because of substrate and is had the temperature higher than the marginal zone so.Therefore, for the inhomogeneities that compensation temperature distributes, first between the circle among the coil 2180a apart from T1 and substrate lay second distance T2 between parts 2120 and the coil 2180a through layout with along with the center of laying parts 2120 from substrate diminishes to the marginal zone.Therefore, induction heating unit 2180 is arranged with helical coil shape.Induction heating unit 2180 is installed in the bottom that substrate is laid parts 2120 and separates about 5mm in the district of about 50mm.Substrate is laid distance between parts 2120 and the induction heating unit 2180 and is not limited to the scope of about 5mm to about 50mm, and can be set to less than 5mm or greater than 50mm.
As shown in Figure 18, a plurality of height adjusting units 2170 are through installing the temperature of laying parts 2120 with the substrate of measuring sensed heating unit 2180 heating, and guarantee that even temperature distributes, wherein can control described a plurality of height adjusting unit 2170 independently, lay second distance T2 between parts 2120 and the coil 2180a with the local modulation substrate.Described a plurality of height adjusting unit 2170 can be placed among the first, second, third and the 4th setting area P1, P2, P3 and the P4, at place, described setting area, passing substrate, to lay the vertical and horizontal line and the coil 2180a at center of parts 2120 crossing, as shown in Figure 20.Among first to the 4th setting area P1, P2, P3 and the P4 each comprises a plurality of points 2186 that described a plurality of height adjusting units 2170 are installed.
Substrate is laid parts 2120 can be by described a plurality of height adjusting unit 2170 local modulation corresponding to described a plurality of points 2186 that are connected to coil 2180a with the second distance T2 of coil 2180a.Described a plurality of height adjusting unit 2170 is operated independently.As illustrated in fig. 25, the height adjusting unit 2170 among Figure 21 can further be installed in coil 2180a place, and the distance between its mid point 2186 is laid in the district of marginal zone of parts 2120 and become bigger being adjacent to substrate.As shown in Figure 25, lay the vertical and horizontal line at center of parts 2120 crossing first to the 4th setting area P1, P2, P3 and the P4 of this place and coil 2180a except passing substrate, height adjusting unit 2170 can further be installed in two perspective rays in the 5th, the 6th, the 7th and the 8th setting area P5, P6, P7 and P8 that this place intersects each other, and each in wherein said two perspective rays is passed vertical line and horizontal line and substrate and laid space between the center of parts 2120.Among the 5th to the 8th setting area P5, P6, P7 and the P8 each comprises a plurality of points 2186, and its number is less than the number of the point that is comprised among first to the 4th setting area P1, P2, P3 and the P4 each.
Therefore a plurality of points 2186 of the described a plurality of height adjusting units 2170 described in Figure 20 and Figure 25 are examples, and can be defined in every way in the district corresponding to the coil 2180a with a plurality of circles.
Although description above is based on the setting area and provides, it is not limited thereto, and can regulate height according to the position of the induction coil of induction heating unit 2180.That is, as indicated above, be that the height of each line can be different under the situation of the shape of the line through dividing rather than wound rotor shape at the induction coil of induction heating unit 2180.In this, mention as mentioned, substrate is laid being regulated by height adjusting unit 2170 apart from length between parts 2120 and the induction heating unit 2180.Therefore, might regulate the temperature of each setting area.
In this embodiment, although any one in the height adjusting unit 2170 has defective or be damaged, can easily only repair and have defective or impaired height adjusting unit 2170 or replace described height adjusting unit 2170 with new height adjusting unit.
Be different from prior art, the present invention can might easily control substrate and lays temperature homogeneity on the parts 2120 by in the outside of chamber 2110 height that drive motor (not shown) easily changes induction heating unit 2180 being installed under the situation of the intraware of not dismantling and assemble chamber 2110, being made.
Therefore, because therefore the intraware that need not to dismantle and assemble chamber 2110 can reduce the time that dismounting and assembling are carried out in unnecessary being used to guarantee temperature homogeneity.And, because therefore temperature does not worry that the inside intraware contaminated and chamber 2110 of chamber 2110 is exposed to the outside by bellows (not shown) control of chamber 2110 outsides.Therefore, can prolong the life-span of the intraware of chamber 2110.
Specifically, even because might be by in the deposition process of the many temperature conditions of needs, also coming height at each the adjustment induction heating unit 2180 in the manufacture process at each thermal tuning uniformity and checking position, but the therefore quality of enhanced film when formation film on substrate.
Hereinafter, with the height adjusting unit of describing in detail according to the 4th embodiment.
Referring to Figure 21 and Figure 22, height adjusting unit 2170 comprises: coil stationary strutting piece 2172, and it is placed in the topmost office; Insulator 2173, the bottom part of its winding around securing supports 2172; Axle 2171, it passes the inside of through hole (for example through hole TH among Figure 19) towards the bottom of insulator 2173 partial penetration chamber (for example chamber among Figure 19 2110); Upper support element 2174 and lower support 2175, it is installed in the outside and the inboard of chamber respectively, and in order to keep the vacuum state of chamber interior, its axis 2171 is placed between upper support element 2174 and the lower support 2175; Bellows 2176, it is placed in lower support 2175 belows with supply that prevents extraneous gas and the lifting moving that is used for axle 2171; And apart from controller 2178, the height of its control coil securing supports 2172 and be placed in bellows 2176 belows.
As illustrated in fig. 24, coil stationary strutting piece 2172 is connected to the coil fixing device 2190 of support coils 2180a.Coil fixing device 2190 comprises around the strutting piece 2190a of coil 2180a and two arrangement component 2109c extending and have connecting hole 2190b from strutting piece 2190a downwards.Coil stationary strutting piece 2172 among Figure 21 comprises: correspond respectively to two the plane of arrangement 2172a of two arrangement component 2190c among Figure 24, and the fixing hole 2172b that penetrates two plane of arrangement 2172a.As shown in Figure 24, if two arrangement component 2190c of the coil fixing device of support coils 2180a 2190 aim at two plane of arrangement 2172a, bolt 2192 penetrates fixing hole 2172b and connecting hole 2190b so, and the end of bolt 2192 is fastening with nut 2194.
Be placed in insulator 2173 in the space between coil stationary strutting piece 2172 and the upper support element 2174 through design with block current flow at coil securing supports 2172 mobile with apart between the controller 2178, therefore and can use one in quartz with superior isolation characteristic and the ceramic material, comprise AlO, AlN, BN or SiC.Upper support element 2174 and lower support 2175 corresponding to the through hole TH among Figure 19 with the inside and outside combination of chamber 2110, and provide and can pass the path that moves up and down that through hole TH carries out axle 2171.
Lower support 2175 corresponding to the through hole TH among Figure 19 is connected to bellows 2176.Bellows 2176 is carried out following function: when axle 2171 penetrates chamber 2110 when moving up and down, the inside of sealed chamber 2110 makes itself and external isolation.Be installed in the below of bellows 2176 and be connected to axle 2171 apart from controller 2178, thus the height of regulating winding securing supports 2172.Owing to be installed in the outside of chamber 2110, therefore can lay distance between parts 2120 and the coil 2180a at local control substrate under the situation of not dismantling chamber 2110 apart from controller 2178.Can operate by drive motor (not shown) apart from controller 2178.
Height adjusting unit 2170 further comprises and is installed in bellows 2176 and apart from the sensor support between the controller 2,178 2177, wherein sensing apparatus (not shown) is attached to sensor support 2177.The effect that is attached to the sensing apparatus of sensor support 2177 is the height of sensing induction heating unit.Sensing apparatus can comprise transducer or measurer.
In this article, the induction heating unit is fixed to coil stationary strutting piece 2172, and the height of induction heating unit can move up and down in chamber and changes along with axle 2171.That is, in the present invention, can be installed in moving up and down axle apart from controller 2178 and 2171 passing bellows 2176 of chamber outside, install to the height of the induction heating unit in the coil stationary strutting piece 2172 in easily controlling by use.Therefore, can be under the situation of not dismantling and assembling chamber sense of control answer the height of heating unit, and manufacture process is simplified.
Therefore be different from prior art, owing to the present invention need or not the intraware of chamber is dismantled and assembled at the tuning process of temperature homogeneity.And, make the process of temperature decline owing to omitted this with the intraware of dismounting chamber, therefore can make the validity maximization of equipment operation; Can not pollute the inside of chamber; And can prolong the life-span of the intraware of chamber.
In addition, owing to might satisfy many temperature conditions by installing with the motor integrated apart from controller 2178, therefore strengthened temperature homogeneity, and can come sense of control accurately to answer the height of heating unit by using height adjusting unit 2170 as outer coil system.And, even since also might be when carrying out manufacture process in the process of the many temperature conditions of needs by at each thermal tuning uniformity and verify that the position comes the height at each temperature change induction heating unit, but the therefore quality of enhanced film.
Mention the embodiment that can be applicable to above to be explained according to the description of this embodiment as mentioned.For instance, the height adjusting unit of being explained among the 4th embodiment can be applicable to first embodiment.That is, the height adjusting unit among the 4th embodiment can make the induction coil among first embodiment move up and down.By doing like this, might distinguish the height of induction coil at center and place, marginal zone.In addition, for example under the situation in the induction heating unit is placed in the heat insulating member that wherein contains heat guard as shown in second enforcement, an end of the penetrable heat insulating member of height adjusting unit is to be connected to the induction coil of induction heating unit.In the case, induction coil moves up and down in the inner space of heat insulating member.The invention is not restricted to this, and the height adjusting unit scalable wherein is mounted with the height of the heat insulating member of induction heating unit.In this article, heat insulating member can be laid the correspondence district of parts and forms with the shape through dividing according to substrate.
Hereinafter, will be used to control the method that substrate is laid the Temperature Distribution of parts 2120 to Figure 25 description referring to Figure 18.
In first step, by to induction heating unit 2180 supply of current substrate is laid parts 2120 be heated to up to the substrate processing process in needed temperature, and locate to measure the temperature that substrate is laid parts 2120 at a plurality of measurement points (not shown), and therefore the temperature that records is categorized as first district and second district, wherein said first district is higher than needed temperature in the substrate processing process, and described second district is lower than needed temperature in the substrate processing process.
In the second straight step, broaden corresponding to the distance that the height adjusting unit 2170 in first district is laid between parts 2120 and the coil 2180a substrate by control, and the distance that substrate is laid between parts 2120 and the coil 2180a by the height adjusting unit of controlling corresponding to second district 2170 narrows down.
In third step, by to induction heating unit 2180 supply of current substrate is laid parts 2120 be heated to up to the substrate processing process in needed temperature, and measure the temperature that substrates are laid parts 2120 in described a plurality of measurement point.Therefore, if guaranteed the even temperature distribution, carry out the substrate processing process so.If produce first district and second district, repeat first and second steps so.
As indicated above, according to the present invention, might settle heat insulating member to prevent that substrate from laying the thermal loss of parts by laying at substrate between parts and the induction heating unit.
And, might lay the thermal loss of parts and come substrate to be laid parts and be heated to by preventing substrate, and therefore reduce the power loss of induction heating unit up to higher temperature with lower induction heating power.
In addition, might keep the Temperature Distribution that substrate is laid parts equably.
In addition, might strengthen the insulation effect that substrate is laid parts by the heat insulating member that formation comprises with the heat guard of material seals such as quartz for example, wherein heat guard has good insulation effect and lower price, and can not use in chamber.
In addition, might be under the situation of not dismantling treatment chamber, by being placed in the height that substrate is laid the induction coil below the parts, guarantee that easily substrate lays the uniform temperature of parts and distribute outside adjusting of treatment chamber.In particular and since when the adjusting substrate lay between parts and the coil apart from the time omitted chamber dismounting, so the dismounting of chamber and built-up time are unnecessary.Therefore, improved the validity of equipment operation.The frequency that chamber interior is exposed to air reduces, and therefore the life-span of chamber can prolong.
Although described depositing device referring to specific embodiment, it is not limited thereto.Therefore, the those skilled in the art will readily appreciate that, can do various modifications and change to it under the situation that does not break away from the spirit and scope of the present invention that defined by appended claims.

Claims (17)

1. substrate-treating apparatus, it comprises:
Chamber wherein has reaction compartment;
Substrate is laid parts, and it is placed in the described reaction compartment of described chamber so that substrate is placed in described substrate lays on the parts;
The induction heating unit, it lays parts in order to heat described substrate; And
At least one height adjusting unit, it optionally regulates the height of described induction heating unit in the outside of described chamber in order to lay the equalizing section of parts according to described substrate.
2. substrate-treating apparatus according to claim 1, wherein said height adjusting unit penetrates described chamber, and is connected to the described induction heating unit that is placed in the pedestal below.
3. substrate-treating apparatus according to claim 1, wherein said height adjusting unit comprises:
The coil stationary strutting piece;
Insulator, it twines the bottom part of described coil stationary strutting piece;
Axle, it is towards the described chamber of the bottom of described insulator partial penetration;
Upper support element and lower support, it is installed in the outside and the inboard of described chamber respectively, and wherein said axle is placed between described upper support element and the described lower support;
Bellows, it is used so that described bottom part towards described lower support moves; And
Apart from controller, it is in order to control described coil stationary strutting piece moving towards the bottom part of described bellows.
4. substrate-treating apparatus according to claim 3, it further comprises:
A plurality of drive motors, its corresponding to described apart from controller; And
Sensor support, sensing apparatus are attached to described sensor support, and described sensor support is placed in described bellows and described apart from the space between the controller, and wherein said sensing apparatus uses one in transducer and the measurer.
5. substrate-treating apparatus according to claim 3, wherein said insulator comprise one in quartzy and the ceramic material, comprise AlO, AlN, BN or SiC.
6. substrate-treating apparatus according to claim 1, it comprises that further being placed in described induction heating unit and described substrate lays heat insulating member between the parts, and wherein said heat insulating member uses one or more in opaque quartz, SiC and the pottery.
7. substrate-treating apparatus according to claim 1, it comprises that further being placed in described induction heating unit and described substrate lays heat insulating member between the parts, wherein said heat insulating member comprises: heat guard, be placed in the described reaction compartment and wherein collect the sub-body of described heat guard, and the upper cap that covers described sub-body, and described heat guard is used one or more in the heat guard of heat guard, silica serial of aluminium oxide series and the carbon felt.
8. substrate-treating apparatus according to claim 1, wherein said induction heating unit is placed in the described chamber; Window member is placed in top, described induction heating unit; Heat insulating member is placed in described window member top; And a plurality of support wheel shafts are placed between described window member and the described heat insulating member.
9. substrate-treating apparatus according to claim 1, it comprises that further being placed in described substrate lays the parts below and wherein collect the heat insulating member of heat guard, described heat guard is used one or more in the heat guard of heat guard, silica serial of aluminium oxide series and the carbon felt, wherein said induction heating unit is placed in the described heat insulating member, and described height adjusting unit penetrates the part of described chamber to be connected to described heat insulating member.
10. substrate-treating apparatus according to claim 1, wherein said induction heating unit comprises:
At least one induction coil, it is placed in the heat insulating member below; And
The power source of supply, it is in order to provide high frequency power to described induction coil, and wherein said height adjusting unit is connected to described induction coil.
11. a substrate-treating apparatus, it comprises:
Chamber wherein has reaction compartment;
Substrate is laid parts, and it is placed in the described chamber so that substrate is placed in described substrate lays on the parts;
The induction heating unit, it lays parts in order to heat described substrate by induction heating;
Window member, it is placed in top, described induction heating unit; And
At least one heat insulating member, it is placed between described induction heating unit and the described window member.
12. substrate-treating apparatus according to claim 11, it further comprises a plurality of support wheel shafts that are placed between described window member and the described heat insulating member.
13. substrate-treating apparatus according to claim 11, wherein said heat insulating member block radiation heat, and use one or more in opaque quartz, SiC and the pottery do not influence described induction heating.
14. substrate-treating apparatus according to claim 11, wherein said heat insulating member comprises: heat guard, be placed in the described reaction compartment and wherein collect the sub-body of described heat guard, and the upper cap that covers described sub-body, and described heat guard is used one or more in the heat guard of heat guard, silica serial of aluminium oxide series and the carbon felt.
15. substrate-treating apparatus according to claim 11, it further comprises height adjusting unit, and described height adjusting unit moves up and down described induction heating unit, lays distance between the parts to control described induction heating unit and described substrate.
16. a substrate-treating apparatus, it comprises:
Chamber wherein has reaction compartment;
Substrate is laid parts, and it is placed in the described chamber so that substrate is placed in described substrate lays on the parts;
Heat insulating member, it is placed in described substrate and lays the parts below and wherein collect heat guard; And
The induction heating unit, it is placed in the described heat insulating member and lays parts to heat described substrate by induction heating.
17. substrate-treating apparatus according to claim 16, wherein said heat insulating member comprises: be placed in the described reaction compartment and wherein collect the sub-body of described heat guard, and the upper cap that covers described sub-body, and described heat guard is used one or more in the heat guard of heat guard, silica serial of aluminium oxide series and the carbon felt.
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