CN110284119A - A set of insulation cover for preventing heating plate edge thermal loss - Google Patents
A set of insulation cover for preventing heating plate edge thermal loss Download PDFInfo
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- CN110284119A CN110284119A CN201910663986.3A CN201910663986A CN110284119A CN 110284119 A CN110284119 A CN 110284119A CN 201910663986 A CN201910663986 A CN 201910663986A CN 110284119 A CN110284119 A CN 110284119A
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- insulation cover
- chamber
- plate edge
- cover
- heating plate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
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- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
The invention belongs to semiconductive thin film deposition applications and manufacturing technology fields, are related to a set of insulation cover for preventing heating plate edge thermal loss.Insulation cover setting is on cavity inner lining and heating plate edge, it include chamber inner wall insulation cover and heating dish side cover, it is one layer of setting three-dimensional insulation cover around heating dish (8) when doing film deposition that the chamber inner wall insulation cover, which is in the bottom, top, enclosure wall of chamber, the heating dish side cover is that one group of insulation cover, including edge insulation cover (9) and top insulation cover (10) are covered on heating dish (8).The purpose of the present invention is preventing from heating plate edge thermal loss in chamber, and guarantee that wafer process environment temperature is uniform, its quality is not influenced by temperature when making to deposit film very high on temperature requirement.
Description
Technical field
The invention belongs to semiconductive thin film deposition applications and manufacturing technology field, it is related to a set of preventing heating plate edge heat
The insulation cover of loss.
Background technique
Currently, to meet process environments requirement in CVD equipment chamber, chamber indoor material is substantially aluminum or aluminium oxide ceramics,
Chamber and upper cover plate are all by aluminium as basic material production, material property (preferable conduction of the aluminium oxide ceramics due to itself
Property, mechanical strength and heat-resisting quantity, high-frequency insulation) and cost consideration can be used in specific position in chamber, to meet technique
The demands such as required electrical property, radio frequency, temperature, cleanliness.
Cavity inner lining: in 400 DEG C or more of high-temperature technology environment, high work is required particularly with temperature uniformity
Skill is used as its thermal insulation property of chamber inner wall using aluminium or aluminium oxide ceramics (thermal coefficient is 33W/ (mK), and heat is easy to lose)
Or it cannot meet the requirements, it may appear that crystal circle center's temperature is higher than the phenomenon that edge (chamber inner wall heat loss), and then influences
The uniformity of technique film thickness and other technological parameters, and the temperature for the chamber inner wall that changes with time also can be different (initial
Shi Wendu is low, is slowly increased to stablize through temperature after a period of time), to influence the process repeatability and stack membrane of every group of wafer
In every layer of repeatability.
Heating dish side cover: 1) in view of air-flow can take away heating plate edge heat, cause to heat plate edge and centre temperature
Spend inconsistent phenomenon；2) in many cases if the distributed layout of bleeding point it is asymmetric but it is eccentric when will result in heating dish from
The close position temperature of bleeding point is lower than the position remote from bleeding point；3) temperature of heating dish is a range, can have heat not
The performance parameter of uniform phenomenon, this film that process deposits very sensitive to temperature are gone out is poor.
Summary of the invention
In order to solve the above-mentioned technical problem, technological temperature is uniform in holding chamber, and wafer is made to be in one always in operation stage
In the uniform and stable environment of a temperature；Keep heating disk center uniform to lip temperature.
The purpose of the present invention is to provide a set of insulation covers for preventing heating plate edge thermal loss.
The purpose of the present invention can be achieved through the following technical solutions:
A set of insulation cover for preventing heating plate edge thermal loss, setting are wrapped on cavity inner lining and heating plate edge
Chamber inner wall insulation cover and heating dish side cover are included, the chamber inner wall insulation cover is to exist in the bottom, top, enclosure wall of chamber
One layer of three-dimensional insulation cover is set around the heating dish 8 when doing film deposition, and the heating dish side cover is to add in heating dish 8
One group of insulation cover of lid, including edge insulation cover 9 and top insulation cover 10.
The thermal coefficient of its material of three-dimensional insulation cover lower than 5W/ (mK) and can be used for film depositional environment.
The three-dimensional insulation cover is rotatable, can move with heating dish.
The chamber inner wall insulation cover specifically: the top of chamber is from the spray upper plate of shower plate 1 along chamber lid 6, chamber 7
Inner wall is equipped with one layer of heat preservation liner, respectively chamber lid insulating lining 3, chamber sidewall insulating lining 4, cavity bottom insulating lining 5.
The insulation cover further includes heating pan bottom insulation cover.
The edge insulation cover 9 is equipped with 0 ° -360 ° of opening.
The top insulation cover 10 is equipped with 0 ° -360 ° of covering.
Beneficial effects of the present invention:
It is uniform that a set of insulation cover for preventing heating plate edge thermal loss of the present invention is able to maintain intracavitary technological temperature, makes crystalline substance
Circle is in the uniform and stable environment of temperature always in operation stage；Using poor thermal conductivity thermal coefficient < 5W/ (m
K material) does chamber inner wall insulation cover；Chamber inner wall insulation cover 3 D stereo is covered in chamber, reaches thermal loss most
It is small；Insulation cover that is rotatable, can moving with heating dish is covered on heating dish side, upper edge, bottom edge；Heat plate edge insulation cover
Divide 2 parts: the heat preservation side ring with thermovent (0 ° -360 ° are differed) and insulated roof (0 ° -360 ° are differed) are used cooperatively；Heating dish
Position of the edge insulation cover in heating dish can be adjusted as needed, is easy to install, is quick detachable, is reusable.
Detailed description of the invention
In order to facilitate the understanding of those skilled in the art, the present invention will be further described below with reference to the drawings.
Fig. 1 is cavity inner lining two dimension cross-sectional view of the present invention；
Fig. 2 is the structural schematic diagram of heating dish side cover three-dimensional figure of the present invention；
Fig. 3 is that the present invention covers temperature simulation schematic diagram before and after heating plate edge insulation cover；
A, heating dish (no insulation cover) temperature simulation figure B, in heating dish plus insulation cover (position such as left side) temperature simulation afterwards
Figure
Fig. 4 is to cover heating dish side cover front and back plasma in the analogous diagram of heating dish Kernel density estimate；
A, nominal situation (no insulation cover)；B, increase side insulation cover；C, increase top insulation cover；D, each operating condition is relatively close
Degree；
Fig. 5 indicates the analysis chart that 3 points are taken in heating dish；
A, temperature when indicating heating dish P1 point without insulation cover；B, temperature when heating dish P1 point has insulation cover is indicated；
C, temperature when indicating heating dish P2 point without insulation cover；D, temperature when heating dish P2 point has insulation cover is indicated；
E, temperature when indicating heating dish P3 point without insulation cover；F, temperature when heating dish P3 point has insulation cover is indicated；
Fig. 6 is when yttrium stable zirconium oxide (YSZ) and aluminium oxide ceramics insulation cover is respectively adopted in chamber inner wall with respect to technique film
Thick datagram；
Fig. 7 is that chamber inner wall increases process repeatability test data figure before and after insulation cover.
Specific embodiment
Embodiment 1
The structure composition of a set of insulation cover for preventing heating plate edge thermal loss: by cavity inner lining and heating dish side cover
It forms, wherein cavity inner lining: as shown in Figure 1, being bottom, top, enclosure wall in chamber (i.e. in the heating for doing thin film deposition processes
Around disk 8) increase the three-dimensional insulation cover that can be used for film depositional environment that one layer of thermal coefficient is lower than 5W/ (mK), top
Increase one layer of heat preservation liner (chamber lid insulating lining 3, chamber sidewall along chamber lid 6,7 inner wall of chamber from the spray upper plate of shower plate 1
Insulating lining 4, cavity bottom insulating lining 5), thermal loss is prevented, to guarantee that process environments temperature is uniform, makes deposition to temperature
Its quality is not influenced by temperature when spending exigent film.
Heating dish side cover is as shown in Fig. 2, and one group of insulation cover is covered in heating dish 8, and (edge insulation cover 9 and top are protected
Warm lid 10 can increase heating pan bottom insulation cover when necessary), guarantee that heating dish temperature is uniform；It can take away and add especially for air-flow
Hot plate edge heat causes to heat plate edge with the inconsistent phenomenon of medium temperature and to the opposite heating dish of the distributed layout of bleeding point
It is structure that is eccentric and leading to non-uniform temperature, wherein edge insulation cover 9 can design 0 ° -360 ° with heat preservation demand and open
Mouth (for radiating), top insulation cover 10 can also design 0 ° of -360 ° of covering with heat preservation demand.
Embodiment 2
Test material performance parameter:
Influence for verifying insulating power and temperature uniformity to technique, it is 3.2W/ (mK) that thermal coefficient, which is respectively adopted,
Yttrium stable zirconium oxide and the aluminium oxide ceramics of 33W/ (mK) tested, test discovery aluminium oxide ceramics is thermally conductive due to its
Property height is without heat insulation effect, so being the test carried out with yttrium stable zirconium oxide below, the following table 1 is material property parameter:
Radio frequency inspection
If Fig. 4 is to plasma before and after capping heating dish side cover in the emulation of heating dish Kernel density estimate:
As the result is shown: increasing heating dish side cover plasma edge uniformity and have no impact, and increase side and protect
Warm cover plasma density distribution is more evenly.
Heating plate edge insulation cover front and back temperature simulation is covered, as shown in figure 3,
Heating dish temperature asymmetry slightly improves after heating plate edge insulation cover, and bulk temperature increases.
Moreover, as shown in figure 5, be the variation of this 3 points temperature before and after covering insulation cover, as the result is shown:
Indentation, there temperature increase is most slow after heating plate edge insulation cover, and secondly intermediate, capped end increase is most fast, that is, has and protect
Temp effect.
2. heating test result before and after plate edge insulation cover:
1) as shown in table 2, wafer temperature measurer temperature measurement data: heating plate edge insulation cover increases temperature, especially heats
Plate edge temperature improves heating dish temperature uniformity.
2) if the following table 3 is that heating dish covers insulation cover front and back engineer testing data；
As the result is shown: influence of the heating plate edge insulation cover to technique: hot plate edge insulation cover, which has uniformity of film, to be changed
It is kind.
3) Fig. 7 is that chamber inner wall increases engineer testing data before and after insulation cover, and as the result is shown: chamber inner wall is stablized using yttrium
Opposite technique film edge film thickness is smaller after zirconium oxide (YSZ) insulation cover.
As the result is shown: the process repeatability that chamber inner wall insulation cover reduces edge film thickness range, improves every group of wafer
With the repeatability of every layer in stack membrane.
Present invention disclosed above preferred embodiment is only intended to help to illustrate the present invention.There is no detailed for preferred embodiment
All details are described, are not limited the invention to the specific embodiments described.Obviously, according to the content of this specification,
It can make many modifications and variations.These embodiments are chosen and specifically described to this specification, is in order to better explain the present invention
Principle and practical application, so that skilled artisan be enable to better understand and utilize the present invention.The present invention is only
It is limited by claims and its full scope and equivalent.
Claims (7)
1. a set of insulation cover for preventing heating plate edge thermal loss, which is characterized in that be arranged in cavity inner lining and heating dish side
It on edge, that is, include chamber inner wall insulation cover and heating dish side cover, the chamber inner wall insulation cover is bottom, the top in chamber
One layer of three-dimensional insulation cover is arranged in portion, enclosure wall around the heating dish (8) i.e. when doing film deposition, the heating dish side cover is
One group of insulation cover, including edge insulation cover (9) and top insulation cover (10) are covered on heating dish (8).
2. a set of insulation cover for preventing heating plate edge thermal loss according to claim 1, which is characterized in that described three
The thermal coefficient of maintenance temperature cover material is lower than 5W/ (mK) and can be used for film depositional environment.
3. a set of insulation cover for preventing heating plate edge thermal loss according to claim 1, which is characterized in that described three
Dimension insulation cover is rotatable, can move with heating dish.
4. a set of insulation cover for preventing heating plate edge thermal loss according to claim 1, which is characterized in that the chamber
Chamber interior walls insulation cover specifically: the top of chamber is equipped with from the spray upper plate of shower plate (1) along chamber lid (6), chamber (7) inner wall
One layer of heat preservation liner, respectively chamber lid insulating lining (3), chamber sidewall insulating lining (4), cavity bottom insulating lining (5).
5. a set of insulation cover for preventing heating plate edge thermal loss according to claim 1, which is characterized in that the guarantor
Temperature lid further includes heating pan bottom insulation cover.
6. a set of insulation cover for preventing heating plate edge thermal loss according to claim 1, which is characterized in that the side
Edge insulation cover (9) is equipped with 0 ° -360 ° of opening.
7. a set of insulation cover for preventing heating plate edge thermal loss according to claim 1, which is characterized in that the top
Portion's insulation cover (10) is equipped with 0 ° -360 ° of covering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910663986.3A CN110284119B (en) | 2019-07-23 | 2019-07-23 | One set of heat preservation cover that prevents heating plate edge calorific loss |
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|---|---|---|---|
| CN201910663986.3A CN110284119B (en) | 2019-07-23 | 2019-07-23 | One set of heat preservation cover that prevents heating plate edge calorific loss |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114855145A (en) * | 2022-05-17 | 2022-08-05 | 天津得瑞伯机电设备有限公司 | Chemical vapor deposition furnace |
| CN115354300A (en) * | 2022-08-25 | 2022-11-18 | 拓荆科技(上海)有限公司 | Thin film deposition apparatus |
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| US5888304A (en) * | 1996-04-02 | 1999-03-30 | Applied Materials, Inc. | Heater with shadow ring and purge above wafer surface |
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| CN101667525A (en) * | 2008-09-05 | 2010-03-10 | 周星工程股份有限公司 | Substrate processing apparatus |
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| CN105420684A (en) * | 2015-12-21 | 2016-03-23 | 东北大学 | Device for preparing REBCO superconducting material based on MOCVD (Metal-organic Chemical Vapor Deposition) technology |
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| CN2228916Y (en) * | 1995-10-23 | 1996-06-12 | 北京美克亚通用技术有限责任公司 | Magneto-controlled sputtering - multi-arc multifunction vacuum plating apparatus |
| US5888304A (en) * | 1996-04-02 | 1999-03-30 | Applied Materials, Inc. | Heater with shadow ring and purge above wafer surface |
| JP2001308084A (en) * | 2000-04-26 | 2001-11-02 | Tokyo Electron Ltd | Heat-treating apparatus and method of heat treating work |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114855145A (en) * | 2022-05-17 | 2022-08-05 | 天津得瑞伯机电设备有限公司 | Chemical vapor deposition furnace |
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