CN101667520A - Method for controlling base plate carrying mechanism, base plate treating device and base plate carrying mechanism - Google Patents
Method for controlling base plate carrying mechanism, base plate treating device and base plate carrying mechanism Download PDFInfo
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- CN101667520A CN101667520A CN200910171076A CN200910171076A CN101667520A CN 101667520 A CN101667520 A CN 101667520A CN 200910171076 A CN200910171076 A CN 200910171076A CN 200910171076 A CN200910171076 A CN 200910171076A CN 101667520 A CN101667520 A CN 101667520A
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- lifter
- substrate
- processed substrate
- mounting surface
- placing mechanism
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a method for controlling a base plate carrying mechanism, a base plate treating device and a base plate carrying mechanism. The base plate carrying mechanism can reliably support the treated base plate, and can evenly treat the base plate. The base plate carrying mechanism includes: a first elevator which is equipped for supporting the periphery edge section of the treated base plate and is freely projected or emerged at the inner side of the carrying bench; and a second elevator which can be equipped outside the carrying bench and can be moved to the upper side of the carrying surface of the carrying bench, and is at the position which is more closer to the central part of the treated base plate than the position of the treated base plate for supporting the first elevator, under the state that the backing side of the treated base plate is partly connected to the carrying surface, the treated base plate hands over between the first elevator and the second elevator.
Description
Technical field
The present invention relates to the storage medium that mounting flat-panel monitor (FPD) has the control method of the substrate placing mechanism of flexual processed substrate, the substrate board treatment with this substrate placing mechanism, substrate placing mechanism with glass substrate etc. and the computer of computer-implemented this control method can be read.
Background technology
In the manufacturing process of FPD,, implement etching, sputter, chemical vapor-phase growing various processing such as (CVD) to the glass substrate that the FPD as processed substrate uses.Such processing is carried out under the state that glass substrate is positioned on the mounting table that is arranged in the chamber usually, with respect to the loading and unloading of the substrate of mounting table, generally undertaken by being set to give prominence to a plurality of lifter pins (lifter) that submerge with respect to the mounting surface of mounting table.When mounting substrate, lifter pin is risen, outstanding from the mounting surface of mounting table, will be transferred on the lifter pin by the glass substrate of transport mechanism conveyances such as carrying arm, lifter pin is descended, glass substrate is positioned on the mounting surface of mounting table.In addition, when unloading carried base board, lifter pin is risen, glass substrate is left after the mounting surface of mounting table, the glass substrate on the lifter pin is transferred load to transport mechanisms such as carrying arm.
In recent years, FPD is towards slimming or large scale development, even thickness to have occurred be following thin glass substrate of 1.1mm, 0.7mm, 0.4mm or the huge glass substrate that surpasses 2m on one side.
Thin like this or huge glass substrate bends easily, only depends on the peripheral edge portion of lifter pin supporting glass substrate, is difficult to support reliably.
So,, lifter pin (for example with reference to patent documentation 1) also is set at the central portion of mounting table for supporting glass substrate reliably.
Summary of the invention
But mounting table works as lower electrode when various processing.Therefore, if at the central portion of mounting table lifter pin is set, the position that then is provided with this lifter pin becomes the particular point on the lower electrode, may hinder processed substrate is handled uniformly.
The objective of the invention is to, provide and to support processed substrate and the substrate placing mechanism that can handle uniformly processed substrate, control method reliably with substrate board treatment and substrate placing mechanism of this substrate placing mechanism.
In order to reach above-mentioned purpose, the substrate placing mechanism of a first aspect of the present invention comprises: the mounting table of the processed substrate of mounting; Inboard first lifter of freely giving prominence to the peripheral edge portion that is set up and supports with submerging above-mentioned processed substrate in above-mentioned mounting table; With can above the mounting surface of above-mentioned mounting table, be set up movably in the outside of above-mentioned mounting table, and the position that supporting is supported above-mentioned processed substrate than above-mentioned first lifter is more by second lifter of the middle body of above-mentioned processed substrate, under the state of the back side that makes above-mentioned processed substrate and ground, above-mentioned mounting surface top butt, between above-mentioned first lifter and above-mentioned second lifter, carry out the handing-over of above-mentioned processed substrate.
In addition, the substrate board treatment of a second aspect of the present invention comprises: the chamber of processed substrate being implemented processing; With the inside that is arranged on above-mentioned chamber, the substrate placing mechanism of the above-mentioned processed substrate of mounting, wherein,, use the substrate placing mechanism of above-mentioned first mode as the aforesaid substrate carrying mechanism.
In addition, a third aspect of the present invention provides a kind of control method of substrate placing mechanism, and this substrate placing mechanism comprises: the mounting table of the processed substrate of mounting; Inboard first lifter of freely giving prominence to the peripheral edge portion that is set up, supports with submerging above-mentioned processed substrate in above-mentioned mounting table; With can above the mounting surface of above-mentioned mounting table, be set up movably in the outside of above-mentioned mounting table, and the position that supporting is supported above-mentioned processed substrate than above-mentioned first lifter is more by second lifter of the middle body of above-mentioned processed substrate, the control method of this substrate placing mechanism comprises: above-mentioned second lifter comes the transport mechanism of above-mentioned processed substrate to receive above-mentioned processed substrate above above-mentioned mounting surface from conveyance, makes the back side of above-mentioned received processed substrate and the operation of ground, above-mentioned mounting surface top butt; Under the state of the back side of above-mentioned processed substrate and ground, above-mentioned mounting surface top butt, above-mentioned first lifter lifts the peripheral edge portion of above-mentioned processed substrate, the operation that above-mentioned processed substrate is separated from above-mentioned second lifter; Under the state that above-mentioned processed substrate has separated from above-mentioned second lifter, the operation that above-mentioned second lifter is kept out of the way from the top of above-mentioned mounting surface; Under the state of having kept out of the way above the above-mentioned mounting surface at above-mentioned second lifter, above-mentioned first lifter is with the operation of above-mentioned processed substrate-placing on above-mentioned mounting surface.
According to the present invention, can provide and to support processed substrate and the substrate placing mechanism that can handle uniformly processed substrate, control method reliably with substrate board treatment and substrate placing mechanism of this substrate placing mechanism.
Description of drawings
Figure 1A is the horizontal sectional view of the substrate board treatment of the summary substrate placing mechanism of representing to have first execution mode of the present invention, and Figure 1B is the sectional view of the 1B-1B line in Figure 1A.
Fig. 2 A～Fig. 2 C is the stereogram of the example of expression second lifter.
Fig. 3 A～Fig. 3 G is the figure of expression with the action example of substrate-placing on pedestal.
The figure of Fig. 4 A～Fig. 4 G action example that to be expression lift substrate from pedestal.
Fig. 5 A is the figure of expression reference example, and Fig. 5 B is the figure of expression execution mode.
Fig. 6 A and Fig. 6 B are the figure of expression execution mode.
Fig. 7 is the figure of an example of the summary substrate placing mechanism of representing second execution mode of the present invention.
Fig. 8 is the figure of variation that expression is applied to each time of the weight on the weight sensor.
Fig. 9 A～Fig. 9 E is the figure of the state of each substrate constantly of expression.
Figure 10 A～Figure 10 E is the figure of the state of each substrate constantly of expression.
Figure 11 is the figure of an example of the summary substrate placing mechanism of representing the 3rd execution mode of the present invention.
The figure of Figure 12 A～Figure 12 E action example that to be expression lift substrate from pedestal.
Symbol description
2 ... chamber
4 ... pedestal (mounting table)
8a ... first lifter
8b ... second lifter
8c, 8f ... axle
8d ... turning arm
8e ... support unit
8g ... telescopic arm
81a, 81b ... weight sensor
Embodiment
Below, with reference to the description of drawings embodiments of the present invention, when explanation, in all figure, shared part is marked shared reference marks.
(first execution mode)
Figure 1A is the horizontal sectional view of the substrate board treatment of the summary substrate placing mechanism of representing to have first execution mode of the present invention, and Figure 1B is the sectional view of the 1B-1B line in Figure 1A.In this example, as substrate board treatment, for example expression is implemented the plasma-etching apparatus of plasma etching to glass substrate (being designated hereinafter simply as " the substrate ") G as flat-panel monitor (FPD) usefulness of processed substrate, but the present invention is not limited to be applied in the plasma-etching apparatus.
Shown in Figure 1A and Figure 1B, plasma-etching apparatus 1 constitutes substrate G is carried out etched capacitive coupling type parallel flat plasma-etching apparatus.As FPD, can enumerate LCD (LCD), electroluminescence (Electro Luminescence:EL) display, plasma display (PDP) etc.
Plasma-etching apparatus 1 has as the chamber 2 of taking in the container handling of substrate G.Chamber 2 has for example carried out the aluminium formation that alumite is handled (anodized), the corresponding quadrangular barrel shape that forms with the shape of substrate G by the surface.
On the diapire in chamber 2, be provided with pedestal 4 as the mounting table of mounting substrate G.Corresponding Square consisting of two isosceles right-angled triangles shape or the column of forming with the shape of substrate G of pedestal 4 has base material 4a that the conductive material by metal etc. constitutes and the insulating element 4b of the supporting substrate 4a that is provided with in the mode of the bottom of covering substrates 4a.On base material 4a, be connected with the supply lines 23 that is used for supply high frequency electric power, on this supply lines 23, be connected with adaptation 24 and high frequency electric source 25.Apply for example High frequency power of 13.56MHz from high frequency electric source 25 to pedestal 4, thus, pedestal 4 works as lower electrode.In addition, in pedestal 4, be built-in with the not shown Electrostatic Absorption mechanism that is used to adsorb by the substrate G of mounting.
At the top or the upper wall of chamber 2,, be provided with and in chamber 2, supply with the spray head 11 of handling gas and working as upper electrode in the mode relative with pedestal 4.Spray head 11 is formed with the gaseous diffusion space 12 of DIFFUSION TREATMENT gas in inside, and overleaf or be formed with a plurality of squit holes 13 that gas is handled in ejection on the face relative with pedestal 4.This spray head 11 is grounded, and together constitutes the pair of parallel plate electrode with pedestal 4.
Upper surface at spray head 11 is provided with gas introduction port 14, and this gas introduction port 14 is connected with processing gas supply pipe 15, handles on gas supply pipe 15 at this, is connected with by valve 16 and mass flow controller 17 and handles gas supply source 18.Be used for etched processing gas from handling 18 supplies of gas supply source.As handling gas, can use the gas, 0 of halogen
2Gas, Ar gas etc. are generally used for the gas in this field.
Diapire at chamber 2 is connected with blast pipe 19, is connected with exhaust apparatus 20 on this blast pipe 19.Exhaust apparatus 20 has the vacuum pump of turbomolecular pump etc., can will be evacuated to the reduced atmosphere of regulation in the chamber 2 thus.
Be formed with at the sidewall of chamber 2 and be used to move into moving into of substrate G and take out of mouthfuls 21, and be provided with and be used to open and close this and move into and take out of mouthfuls 21 the not shown family of power and influence, take out of mouthfuls 21 when open moving into, substrate G carries out conveyance by the state that is supported with the below as the carrying arm 40 of transport mechanism between the not shown carrying room of itself and adjacency or load locking room.
At the diapire and the pedestal 4 of chamber 2, the inserting hole 7a that connects them is formed on the position of the periphery of pedestal 4.And the diapire at the chamber 2 in the outside of pedestal 4 is formed with inserting hole 7b.
Insert the inserting hole 7a giving prominence to the mode of submerging from the first lifter 8a of below supporting substrates G and lifting with respect to the mounting surface of pedestal 4.The first lifter 8a is a pin, is set to when outstanding and the peripheral edge portion butt of substrate G.
Among the inserting hole 7b, from the second lifter 8b of below supporting substrates G and lifting with can lifting and can constitute to the mode that move the top of the mounting surface of pedestal 4, by the second lifter 8b is moved to the top of the mounting surface of pedestal 4, the second lifter 8b can support than the peripheral edge portion position more in the inner part of the substrate G of first lifter 8a supporting.
The bottom of the first lifter 8a is outstanding to the outside of chamber 2, and the bottom is connected with drive division 9a.Drive division 9a makes the first vertically lifting of lifter 8a.By this lifting action, the first lifter 8a gives prominence to respect to the mounting surface of pedestal 4 and submerges.
The second lifter 8b is also same with the first lifter 8a, and the bottom is outstanding to the outside of chamber 2, and the bottom is connected with drive division 9b.Drive division 9b makes the second vertically lifting of lifter 8b, and the second lifter 8b is moved to the top of the mounting surface of pedestal 4.
Drive division 9a, 9b for example use stepping motor or servomotor respectively and constitute.
By controller 31 controls with microprocessor (computer), thus, the first lifter 8a and the second lifter 8b can move independently of each other respectively in the driving of drive division 9a, 9b.
Be connected with on controller 31: engineering management person carries out the keyboard of input operation of order etc. for the driving of managing drive division 9a, 9b; The user interface 32 that constitutes by display of the driving situation of the 9a of display driver portion, 9b visually etc.; Record the storage part 33 of menu that the control that is used for by controller 31 realizes the control program, drive condition data etc. of the driving of drive division 9a, 9b with storing.As required, according to from the indication of user interface 32 etc. arbitrarily menu access from storage part 33, and by controller 31 enforcements, thereby under the control of controller 31, carry out the driving of drive division 9a, 9b and stop.Above-mentioned menu can use with the state that is stored in the storage medium that computers such as CD-ROM, hard disk, flash memories for example can read, and perhaps also can for example transmit at any time by special circuit from other device and use.
Fig. 2 A～Fig. 2 C is the stereogram of the expression second lifter 8b.
The second lifter 8b1 shown in Fig. 2 A is the structure of amplifying one second lifter 8b shown in expression Figure 1A and Figure 1B.The second lifter 8b1 can carry out particularly, by spinning movement, the second lifter 8b1 being moved to the top of the mounting surface of pedestal 4 to the lifting action of vertical direction with to the spinning movement of horizontal direction.
The second lifter 8b1 like this can constitute, and for example comprises: can be in the vertical direction lifting, and the axle 8c that can rotate in the horizontal direction; Be installed in the fore-end of a 8c, and pass through the rotation of axle 8c, the turning arm 8d that can rotate in the horizontal direction.When turning arm 8d rotated, the front end of turning arm 8d moved to the top of the mounting surface of pedestal 4.Front end at turning arm 8d is equipped with support unit 8e, and support unit 8e for example carries out a supporting to the back side of substrate G.
The second lifter 8b2 shown in Fig. 2 B constitutes and can carry out particularly by expanding-contracting action, the second lifter 8b2 being moved to the top of the mounting surface of pedestal 4 to the lifting action of vertical direction with to the expanding-contracting action of horizontal direction.
The second lifter 8b2 like this can constitute, and for example comprises: can be at the axle 8f of vertical direction lifting; With the fore-end that is installed in a 8c, and the telescopic arm 8g that can stretch in the horizontal direction.When telescopic arm 8g extended, the front end of telescopic arm 8g moved to the top of the mounting surface of pedestal 4.Front end at telescopic arm 8g is equipped with and the same support unit 8e of the second lifter 8b1 shown in Fig. 2 A.
The second lifter 8b3 shown in Fig. 2 C can be rotated action and these two actions of expanding-contracting action.
The second lifter 8b3 like this can constitute, and for example comprises: can be in the vertical direction lifting, and the axle 8c that can rotate in the horizontal direction; Be installed in the fore-end of a 8c, and the turning arm 8d that can rotate in the horizontal direction; Be installed in this turning arm 8d and the telescopic arm 8g that can stretch in the horizontal direction.
The action of the second lifter 8b3 like this is, at first, makes turning arm 8d rotation, makes the front end of turning arm 8d move to the top of the mounting surface of pedestal 4.Under this state, telescopic arm 8g is extended, the front end of telescopic arm 8g is further extended to the middle body of the mounting surface of pedestal 4.Like this, the front end of telescopic arm 8g is moved further to the middle body of mounting surface.
The example of mounting action of the substrate placing mechanism of first execution mode then, is described.
Fig. 3 A～Fig. 3 G is the figure that expression is positioned in substrate G the action example on the pedestal 4.In addition, in this action example, expression is used the situation of the second lifter 8b1 shown in Fig. 2 A as second lifter, but under the situation of using the second lifter 8b2, the 8b3 shown in Fig. 2 B, Fig. 2 C, also can carry out same action.
At first, as shown in Figure 3A, use carrying arm, from below under the state of central portion of supporting substrates G, with substrate G to the conveyance of the inside of chamber 2.
Then, shown in Fig. 3 B, the axle 8c of the second lifter 8b1 is risen on the mounting surface of pedestal 4, make turning arm 8d afterwards, the support unit 8e of turning arm 8d front end is positioned at below the central portion of substrate G to the mounting surface sideway swivel.
Then, shown in Fig. 3 C, a 8c is risen, support unit 8e is contacted with the back side of substrate G.Then, a 8c is risen, substrate G is transferred load to the second lifter 8b1 from carrying arm 40.
Then, shown in Fig. 3 D, carrying arm 40 is kept out of the way out from the below of substrate G.Then, spool 8c is descended, contact on the central portion that makes crooked substrate G and the mounting surface of pedestal 4.
Then, shown in Fig. 3 E, state of contact on the mounting surface of central portion that makes substrate G and pedestal 4 rises the first lifter 8a, and the ratio at the back side of substrate G is contacted with the first lifter 8a by the part of the more outer circumferential edges of part of above-mentioned support unit 8e supporting.Then, the first lifter 8a is risen, make substrate G leave support unit 8e, substrate G is transferred load to the first lifter 8a from the second lifter 8b1.
Then, shown in Fig. 3 F, left at substrate G under the state of support unit 8e, made the outer sideway swivel of turning arm 8d, turning arm 8d is kept out of the way out from the top of mounting surface, a 8c is descended to the mounting surface of pedestal 4.
Then, shown in Fig. 3 G, the first lifter 8a is descended, substrate G is positioned on the mounting surface of substrate 4.
Like this, the substrate G that utilize carrying arm 40 to move into to the chamber 2 are positioned on the mounting surface of pedestal 4.
Fig. 4 A～Fig. 4 G is the figure of the action example substrate G lifted from the pedestal 4 of expression.The action that substrate G is lifted from pedestal 4 is essentially the order opposite with substrate G being positioned in action on the pedestal 4 and gets final product.
For example, shown in Fig. 4 A, be positioned in state on the pedestal 4, shown in Fig. 4 B, the first lifter 8a risen, keep making state of contact on the mounting surface of the back side middle body of substrate G and pedestal 4, lift the peripheral edge portion of substrate G from substrate G.
Then, shown in Fig. 4 C, the peripheral edge portion of substrate G be picked up can rotate to turning arm 8d substrate G below state after, make turning arm 8d to the rotation of the top of the mounting surface of pedestal 4, make support unit 8e be positioned at the below of substrate G.
Then, shown in Fig. 4 D, the first lifter 8a is descended, make the back side and the support unit 8e butt of substrate G, and then the first lifter 8a is descended, make the back side of the first lifter 8a separating base plate G.Like this, substrate G is transferred load to the second lifter 8b1 from the first lifter 8a.
Then, shown in Fig. 4 E, a 8c is risen, substrate G is left from the mounting surface of pedestal 4.Substrate G be picked up can enter to carrying arm 40 substrate G below state after, make carrying arm 40 enter the below of substrate G.
Then, shown in Fig. 4 F, a 8c is descended, make substrate G and carrying arm 40 butts, and then a 8c is descended, support unit 8e is separated from the back side of substrate G.Like this, substrate G is transferred load to carrying arm 40 from the second lifter 8b1.
Then, shown in Fig. 4 G, under the state that substrate G separates from support unit 8e, make the outer sideway swivel of turning arm 8d, turning arm 8d is kept out of the way out from the top of mounting surface, then, a 8c is descended to the mounting surface of pedestal 4.
Like this, processed in the inside of chamber 2, for example, separate from the mounting surface of pedestal 4 by the substrate G of plasma etching, take out of to carrying room or load locking room from chamber 2 by carrying arm 40.
Substrate placing mechanism according to the first such execution mode, if even the only peripheral edge portion 101 of supporting substrates G and the thin or huge substrate G that causes substrate G overbending to support reliably of the such lifter 100 that uses the pin shape of the reference example shown in Fig. 5 A for example, shown in Fig. 5 B, by by second lifter 8b supporting than peripheral edge portion 101 more near the part 102 of the middle body of substrate G, can support reliably.
And as mentioned above, the second lifter 8b moves from the mounting surface of the lateral pedestal 4 of pedestal 4, for example moves horizontally, and therefore, there is no need to be provided with at the central portion of pedestal 4 lifter of pin shape, can not form particular point on pedestal 4.Thereby the pedestal that is provided with the lifter of pin shape with central portion at pedestal 4 is compared, and can handle uniformly substrate G.
And then, according to the second lifter 8b, as shown in Figure 6A, make butt on the mounting surface of the middle body of crooked substrate G and pedestal 4.After butt, shown in Fig. 6 B, use the first lifter 8a that sells shape to lift the peripheral edge portion of substrate G, the support unit 8e of the second lifter 8b is separated from the back side of substrate G.
Separate from the back side of substrate G by the support unit 8e that makes the second lifter 8b like this, ground, the back side of wounded substrate G does not make the second lifter 8b keep out of the way out from the top of the mounting surface of pedestal 4.
And, because make butt on the mounting surface of the middle body of substrate G and pedestal 4, so even the first lifter 8a is for example only supporting the peripheral edge portion of substrate G, substrate G can not come off from the first lifter 8a yet.
Like this, substrate placing mechanism according to first execution mode, can access supporting substrates G reliably and be processed substrate and the substrate placing mechanism that can handle uniformly processed substrate and substrate board treatment with this substrate placing mechanism.
(second execution mode)
Fig. 7 is the figure of an example of the summary substrate placing mechanism of representing second execution mode of the present invention.
As shown in Figure 7, the substrate placing mechanism of second execution mode is respectively arranged with weight sensor 81a, 81b in the part of the supporting substrates G of the part of the supporting substrates G of the first lifter 8a and the second lifter 8b.As the structure of the second lifter 8b, for example can use the structure shown in Fig. 2 A～Fig. 2 C.
Below, the first lifter 8a based on the weight of having measured, the control example of the second lifter 8b are described.
Fig. 8 is the figure of variation that expression is applied to each time of the weight on weight sensor 81a, the 81b.The longitudinal axis of Fig. 8 is the weight of measuring, and transverse axis is the time.In addition, the weight that is applied on the weight sensor 81a represents that with chain-dotted line the weight that is applied on the weight sensor 81b is represented by solid line.
In addition, Fig. 9 A～Fig. 9 E and Figure 10 A～Figure 10 E represent the state of each substrate G constantly.
At first, the state shown in Fig. 9 A is that substrate G is by the state of second lifter 8b supporting.Under this state, weight is not applied on the weight sensor 81a, and the total weight of substrate G is applied on the weight sensor 81b.
Then, shown in Fig. 9 B, the axle 8c of the second lifter 8b is descended, make butt on the mounting surface of the middle body at the back side of substrate G and pedestal 4.Under this state, therefore a part of weight of pedestal 4 burden substrate G be applied to weight on the weight sensor 81b tail off (time t0 among Fig. 8).
Can utilize the weight that is applied on the weight sensor 81b whether to be reduced to the value of regulation and whether the butt amount of substrate G and pedestal 4 of judging reaches the butt amount of regulation.If be applied to the value that weight on the weight sensor 81b reduces to regulation, judge that then the butt amount of substrate G arrives the butt amount of regulation, stops the decline (the time t1 among Fig. 8) of a 8c.
Then, the first lifter 8a is risen.The first lifter 8a rises, shown in Fig. 9 C, and when the butt of the back side of the first butt device 8a and substrate G, and then a part of weight of first lifter 8a burden substrate G.Therefore, the weight that is applied on the weight sensor 81a increases, and on the contrary, is applied to the weight decline (the time t2 among Fig. 8) on the weight sensor 81b.
When the weight on being applied to weight sensor 81b is zero, shown in Fig. 9 D, can judge that the second lifter 8b (the time t3 among Fig. 8) is separated at the back side of substrate G fully.
From the complete after separating in the back side of substrate G, the second lifter 8b is kept out of the way out at the second lifter 8b from the top of the mounting surface of pedestal 4.Then, the first lifter 8a is descended.Along with the decline of the first lifter 8a, the butt amount on substrate G and mounting surface pedestal 4 increases.Therefore, the weight that is applied on the weight sensor 81a reduces (the time t4 among Fig. 8).
When the weight on being applied to weight sensor 81a is zero, shown in Fig. 9 E, can judge that substrate G is positioned on the mounting surface of pedestal 4 (the time t5 among Fig. 8) fully.
Like this, by measuring and grasping the weight that is applied on weight sensor 81a, the 81b, can not need to know that by the state or the recognition image of for example estimating substrate G which kind of state substrate G is.By the measurement result that will be applied to the weight on weight sensor 81a, the 81b control of the first lifter 8a, the second lifter 8b is fed back, can control substrate placing mechanism of the present invention more accurately.
For example, under the situation of the state of range estimation substrate G or recognition image, be difficult to know accurately the minimum butt amount of mounting surface of fractional dose seldom, substrate G and the pedestal 4 of substrate G and the first lifter 8a or the second lifter 8b.
Relative therewith, if operating weight transducer 81a, 81b compare with range estimation or recognition image, can know above-mentioned minimum fractional dose or minimum butt amount with higher precision.Thereby, can control substrate placing mechanism of the present invention more accurately.
In addition, weight sensor 81a, 81b not only can use when being positioned in substrate G on the pedestal 4, also can use when pedestal 4 lifts substrate G.
At first, the state shown in Figure 10 A is that substrate G is positioned in the state on the mounting surface of pedestal 4 fully.Under this state, all do not apply weight on the two at weight sensor 81a, 81b.
Then, shown in Figure 10 B, the first lifter 8a is risen.When the first lifter 8a rises, during the back side butt of the first lifter 8a and substrate G, be applied to the weight increase (moment t6 among Fig. 8) on the weight sensor 81a.
Substrate G is picked up, and can judge whether the butt amount of substrate G and pedestal 4 arrives the butt amount of regulation according to being applied to the value whether weight on the weight sensor 81a increase to regulation.If be applied to the value that weight on the weight sensor 81a increases to regulation, judge that then the butt amount of substrate G arrives the butt amount of regulation, stops the rising (the time t7 among Fig. 8) of the first lifter 8a.
Then, the axle 8c of the second lifter 8b is risen, shown in Figure 10 B, the second lifter 8b is moved to the top of the mounting surface of pedestal 4.
Then, the first lifter 8a is descended.The first lifter 8a descends, shown in Figure 10 C, and when the butt of the back side of the second lifter 8b and substrate G, a part of weight of second lifter 8b burden substrate G.Therefore, the weight that is applied on the weight sensor 81a reduces, and is opposite, and the weight that is applied on the weight sensor 81b increases (the time t8 among Fig. 8).
When the weight on being applied to weight sensor 81a is zero, shown in Figure 10 D, judge that (the time t9 Fig. 8) separated from the first lifter 8a fully in the back side of substrate G.
Then, the axle 8c of the second lifter 8b is risen.Substrate G is picked up, and when the butt amount of substrate G and pedestal 4 reduced, the weight that is applied on the weight sensor 81b increased (the time t10 among Fig. 8).
The weight that is applied on the weight sensor 81b increases, and when the weight that applies is finally stablized, shown in Figure 10 E, judges that substrate G separates (the time t11 Fig. 8) from the mounting surface of pedestal 4 fully.
Afterwards, make among Figure 10 E and to omit between the mounting surface that illustrated carrying arm 40 enters the back side of substrate G and pedestal 4, substrate G is transferred load to carrying arm 40 from the second lifter 8b get final product.
In addition, in the above-described embodiment, part at the supporting substrates G of the part of the supporting substrates G of the first lifter 8a and the second lifter 8b is respectively arranged with weight sensor 81a, 81b, but also can weight sensor be set from one's body in the part of the supporting first lifter 8a and the part that supports the second lifter 8b.
(the 3rd execution mode)
Figure 11 is the figure of an example of the summary substrate placing mechanism of representing the 3rd execution mode of the present invention.
As shown in figure 11, the substrate placing mechanism of the 3rd execution mode is provided with the turning arm 8d of a plurality of second lifter 8b.
Like this, can be provided with the part that moves in the horizontal direction of a plurality of second lifter 8b, for example the telescopic arm 8g shown in turning arm 8d or Fig. 2 B.
Action example under the situation of the part that moves in the horizontal direction that is provided with a plurality of second lifter 8b is described.
Figure 12 A～Figure 12 E is the action example of substrate G is lifted in expression from pedestal 4 figure.
At first, Figure 12 A represents that substrate G is positioned in the state on the mounting surface of pedestal 4 fully.
Then, shown in Figure 12 B, the first lifter 8a is risen, lift the peripheral edge portion of substrate G.Then, the axle 8c of the second lifter 8b is risen, and then make the first turning arm 8d1 rotation of the second lifter 8b, make the first turning arm 8d1 be positioned at the lower rear of substrate G.
Then, shown in Figure 12 C, the first lifter 8a is descended, substrate is transferred load to the second lifter 8b from the first lifter 8a.
Then, shown in Figure 12 D, make the second turning arm 8d2 rotation of the second lifter 8b, make the second turning arm 8d2 be positioned at the lower rear of substrate G.At this moment, be arranged on the support unit 8e of the fore-end of the second turning arm 8d2, than the support unit 8e of the fore-end that is arranged on the first turning arm 8d1, the part of the central authorities of substrate G is more leaned in supporting.
Then, shown in Figure 12 E, the axle 8c of the second lifter 8b is risen, substrate G is separated from the mounting surface of pedestal 4 fully.
The 3rd execution mode according to such uses a plurality of turning arms, uses two turning arm 8d1,8d2 in this example, can be from the peripheral edge portion of substrate G little by little towards middle body supporting substrates G.Therefore,, also can under the state of the amount of bow that keeps inhibition substrate G, substrate G be lifted from pedestal 4, perhaps on the contrary it is positioned on the pedestal 4 even substrate G is thinner or huger, the situation of easier bending.
Certainly, in the 3rd execution mode, also there is no need to be provided with the lifter of pin shape, therefore can not form particular point at pedestal 4 at the central portion of pedestal 4.Thereby, same with first execution mode, can handle uniformly substrate G.
More than, with reference to several embodiments the present invention has been described, but the present invention is not limited to above-mentioned execution mode, can carry out various changes.
For example, in the above-described embodiment, the example of the capacitive coupling type parallel flat plasma-etching apparatus that is applicable to the RIE type that applies High frequency power on lower electrode has been described, but be not limited thereto, also can be applied to other plasma processing apparatus such as ashing, CVD film forming, can be applied to substrate-placing on mounting table and in all substrate board treatments beyond the plasma processing apparatus of handling.
And, the example that is applied to the glass substrate that FPD uses has been described in the above-described embodiment, but also can be applied to having in flexual whole substrate beyond the glass substrate that FPD uses.
Claims (11)
1. a substrate placing mechanism is characterized in that, comprising:
The mounting table of the processed substrate of mounting;
Can freely give prominence to first lifter of the peripheral edge portion that is set up and supports with submerging described processed substrate in the inboard of described mounting table; With
Can above the mounting surface of described mounting table, be set up movably in the outside of described mounting table, and the position that supporting is supported described processed substrate than described first lifter is more by second lifter of the part of the central authorities of described processed substrate,
The back portion that makes described processed substrate be connected under the state on the described mounting surface, between described first lifter and described second lifter, carry out the handing-over of described processed substrate.
2. substrate placing mechanism as claimed in claim 1 is characterized in that:
Described second lifter comes the transport mechanism of described processed substrate to receive described processed substrate from conveyance above described mounting surface, make described reception processed substrate back portion be connected on the described mounting surface,
The back portion of described processed substrate be connected under the state on the described mounting surface, described first lifter lifts the peripheral edge portion of described processed grade slab, and described processed substrate is separated from described second lifter,
Under the state that described processed substrate has separated from described second lifter, described second lifter is kept out of the way from the top of described mounting table,
Under the state that described second lifter has been kept out of the way above the described mounting surface, described first lifter with described processed substrate-placing on described mounting surface.
3. substrate placing mechanism as claimed in claim 2 is characterized in that:
The back portion of described processed substrate be connected under the state on the described mounting surface, described first lifter lifts the peripheral edge portion of described processed substrate,
The back portion of described processed substrate be connected on the described mounting surface, and under the upborne state of the peripheral edge portion of described processed substrate, make described second lifter move to the top of described mounting surface,
The back portion of described processed substrate be connected under the state on the described mounting surface, described first lifter is given described second lifter with described processed substrate transfer,
Described second lifter lifts described processed substrate, and described processed substrate is separated from described mounting surface.
4. as claim 1 each described substrate placing mechanism to the claim 3, it is characterized in that:
Described second lifter comprises:
Can vertical direction move and can rotate the axle; With
Be installed in the fore-end of described axle, and turning arm that can rotation above the mounting surface of described mounting table.
5. as claim 1 each described substrate placing mechanism to the claim 3, it is characterized in that:
Described second lifter comprises:
Can vertical direction move the axle; With
Be installed in the fore-end of described axle, can be above the mounting surface of described mounting table flexible telescopic arm.
6. as claim 1 each described substrate placing mechanism to the claim 3, it is characterized in that:
Described second lifter comprises:
Can move in vertical direction, and the axle that can rotate;
Be installed in the fore-end of described axle, turning arm that can rotation above the mounting surface of described mounting table; With
Be installed on the described turning arm can be above the mounting surface of described mounting table flexible telescopic arm.
7. as claim 1 each described substrate placing mechanism to the claim 3, it is characterized in that:
Also be provided with weight sensor at described first lifter and second lifter.
8. as claim 1 each described substrate placing mechanism to the claim 3, it is characterized in that:
Described second lifter has a plurality of parts that can move above the mounting surface of described mounting table.
9. substrate board treatment, it comprises:
Processed substrate is implemented the chamber of processing; With
Be arranged on the inside of described chamber, the substrate placing mechanism of the described processed substrate of mounting,
This substrate board treatment is characterised in that,
Use claim 1 each described substrate placing mechanism to the claim 3 in the described substrate placing mechanism.
10. the control method of a substrate placing mechanism, this substrate placing mechanism comprises:
The mounting table of the processed substrate of mounting;
Can freely give prominence to first lifter of the peripheral edge portion that is set up and supports with submerging described processed substrate in the inboard of described mounting table; With
Can above the mounting surface of described mounting table, be set up movably in the outside of described mounting table, and the position that supporting is supported described processed substrate than described first lifter is more by second lifter of the part of the central authorities of described processed substrate,
The control method of this substrate placing mechanism is characterised in that, comprising:
Described second lifter comes the transport mechanism of described processed substrate to receive described processed substrate from conveyance above described mounting surface, make the described processed substrate that receives back portion be connected to operation on the described mounting surface;
The back portion of described processed substrate be connected under the state on the described mounting surface, described first lifter lifts the peripheral edge portion of described processed substrate, the operation that described processed substrate is separated from described second lifter;
Under the state that described processed substrate has separated from described second lifter, the operation that described second lifter is kept out of the way from the top of described mounting surface; With
Under the state that described second lifter has been kept out of the way above the described mounting surface, described first lifter is with the operation of described processed substrate-placing on described mounting surface.
11. the control method of substrate placing mechanism as claimed in claim 10 is characterized in that, also comprises:
The back portion of described processed substrate be connected under the state on the described mounting surface, described first lifter lifts the operation of the peripheral edge portion of described processed substrate;
The back portion of described processed substrate be connected on the described mounting surface, and under the upborne state of the peripheral edge portion of described processed substrate, make described second lifter move to the operation of the top of described mounting surface;
The back portion of described processed substrate be connected under the state on the described mounting surface, described first lifter is with the operation of described processed substrate transfer to described second lifter; With
Described second lifter lifts described processed substrate, the operation that described processed substrate is separated from described mounting surface.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008228751 | 2008-09-05 | ||
| JP2008228751A JP5261085B2 (en) | 2008-09-05 | 2008-09-05 | Substrate placing mechanism, substrate processing apparatus, substrate placing mechanism control method, and storage medium |
| JP2008-228751 | 2008-09-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101667520A true CN101667520A (en) | 2010-03-10 |
| CN101667520B CN101667520B (en) | 2012-04-04 |
Family
ID=41804087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910171076XA Active CN101667520B (en) | 2008-09-05 | 2009-09-04 | Method for controlling base plate carrying mechanism, base plate treating device and base plate carrying mechanism |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5261085B2 (en) |
| KR (2) | KR20100029042A (en) |
| CN (1) | CN101667520B (en) |
| TW (1) | TWI512881B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106165082A (en) * | 2014-03-31 | 2016-11-23 | 东京毅力科创株式会社 | Base plate processing system |
| CN111699143A (en) * | 2017-11-30 | 2020-09-22 | 中国建材国际工程集团有限公司 | Method for determining position of substrate in closed chamber and apparatus for performing the same |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5907681B2 (en) * | 2011-08-02 | 2016-04-26 | 東京エレクトロン株式会社 | Board delivery method |
| JP6226712B2 (en) * | 2013-11-21 | 2017-11-08 | 光洋サーモシステム株式会社 | Substrate support structure |
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| JPS63133545A (en) * | 1986-11-25 | 1988-06-06 | Dainippon Screen Mfg Co Ltd | Substrate transferring transporting device for thermal treatment equipment |
| US4908095A (en) * | 1988-05-02 | 1990-03-13 | Tokyo Electron Limited | Etching device, and etching method |
| JP3711189B2 (en) * | 1997-05-23 | 2005-10-26 | 大日本スクリーン製造株式会社 | Substrate transfer device |
| US6201999B1 (en) * | 1997-06-09 | 2001-03-13 | Applied Materials, Inc. | Method and apparatus for automatically generating schedules for wafer processing within a multichamber semiconductor wafer processing tool |
| US6205870B1 (en) * | 1997-10-10 | 2001-03-27 | Applied Komatsu Technology, Inc. | Automated substrate processing systems and methods |
| EP1174910A3 (en) * | 2000-07-20 | 2010-01-06 | Applied Materials, Inc. | Method and apparatus for dechucking a substrate |
| JP3480442B2 (en) * | 2000-11-21 | 2003-12-22 | ソニー株式会社 | Wafer processing apparatus and wafer processing method |
| JP2002246450A (en) * | 2001-02-20 | 2002-08-30 | Nikon Corp | Substrate-holding device and substrate-transfer method |
| JP2002334922A (en) * | 2001-05-10 | 2002-11-22 | Mitsubishi Electric Corp | Manufacturing system of semiconductor device, and manufacturing method of the semiconductor device |
| JP4344835B2 (en) * | 2002-10-24 | 2009-10-14 | 東京エレクトロン株式会社 | Single wafer processing equipment |
| JP2006005177A (en) * | 2004-06-17 | 2006-01-05 | Tokyo Electron Ltd | Thermal treatment apparatus |
| KR100596327B1 (en) * | 2004-09-08 | 2006-07-06 | 주식회사 에이디피엔지니어링 | Apparatus for processing substrate with plasma |
| JP2006237259A (en) * | 2005-02-24 | 2006-09-07 | Nikon Corp | Laser processing system and processing factory |
| JP2006344675A (en) * | 2005-06-07 | 2006-12-21 | Dainippon Printing Co Ltd | Positioning method and device of substrate |
| JP2008041969A (en) * | 2006-08-08 | 2008-02-21 | Matsushita Electric Ind Co Ltd | Removal method of substrate |
| JP2008091568A (en) * | 2006-09-29 | 2008-04-17 | Fujifilm Corp | Device and method for mounting substrate |
-
2008
- 2008-09-05 JP JP2008228751A patent/JP5261085B2/en not_active Expired - Fee Related
-
2009
- 2009-09-03 KR KR1020090082972A patent/KR20100029042A/en active Application Filing
- 2009-09-04 CN CN200910171076XA patent/CN101667520B/en active Active
- 2009-09-04 TW TW098129876A patent/TWI512881B/en active
-
2012
- 2012-05-09 KR KR1020120049188A patent/KR20120054004A/en not_active Application Discontinuation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106165082A (en) * | 2014-03-31 | 2016-11-23 | 东京毅力科创株式会社 | Base plate processing system |
| CN106165082B (en) * | 2014-03-31 | 2019-03-22 | 东京毅力科创株式会社 | Base plate processing system |
| CN111699143A (en) * | 2017-11-30 | 2020-09-22 | 中国建材国际工程集团有限公司 | Method for determining position of substrate in closed chamber and apparatus for performing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120054004A (en) | 2012-05-29 |
| JP2010062461A (en) | 2010-03-18 |
| TW201027663A (en) | 2010-07-16 |
| TWI512881B (en) | 2015-12-11 |
| JP5261085B2 (en) | 2013-08-14 |
| KR20100029042A (en) | 2010-03-15 |
| CN101667520B (en) | 2012-04-04 |
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