CN101656222B - 嵌套顶柱设备 - Google Patents
嵌套顶柱设备 Download PDFInfo
- Publication number
- CN101656222B CN101656222B CN2009100415136A CN200910041513A CN101656222B CN 101656222 B CN101656222 B CN 101656222B CN 2009100415136 A CN2009100415136 A CN 2009100415136A CN 200910041513 A CN200910041513 A CN 200910041513A CN 101656222 B CN101656222 B CN 101656222B
- Authority
- CN
- China
- Prior art keywords
- fore
- fixed head
- support pillar
- set fixed
- location
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- 238000000926 separation method Methods 0.000 claims description 26
- 230000033001 locomotion Effects 0.000 claims description 24
- 230000000712 assembly Effects 0.000 claims description 12
- 238000000429 assembly Methods 0.000 claims description 12
- 230000001360 synchronised effect Effects 0.000 claims description 8
- 230000006835 compression Effects 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 5
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- 238000000034 method Methods 0.000 description 10
- 238000013016 damping Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000004807 localization Effects 0.000 description 3
- 230000002459 sustained effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 206010034703 Perseveration Diseases 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Furnace Charging Or Discharging (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (7)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009100415136A CN101656222B (zh) | 2009-07-29 | 2009-07-29 | 嵌套顶柱设备 |
PCT/CN2009/076050 WO2011011954A1 (zh) | 2009-07-29 | 2009-12-25 | 具有嵌套顶柱组件的装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009100415136A CN101656222B (zh) | 2009-07-29 | 2009-07-29 | 嵌套顶柱设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101656222A CN101656222A (zh) | 2010-02-24 |
CN101656222B true CN101656222B (zh) | 2011-07-27 |
Family
ID=41710433
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009100415136A Expired - Fee Related CN101656222B (zh) | 2009-07-29 | 2009-07-29 | 嵌套顶柱设备 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN101656222B (zh) |
WO (1) | WO2011011954A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7116550B2 (ja) * | 2018-02-08 | 2022-08-10 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
CN110525978A (zh) * | 2019-09-20 | 2019-12-03 | 深圳市信濠光电科技股份有限公司 | 一种玻璃盖板换架装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001127143A (ja) * | 1999-10-27 | 2001-05-11 | Applied Materials Inc | 基板支持装置 |
JP4270434B2 (ja) * | 2002-11-29 | 2009-06-03 | シャープ株式会社 | 基板移載装置並びに基板の取り出し方法および基板の収納方法 |
CN1922087A (zh) * | 2004-03-01 | 2007-02-28 | 平田机工株式会社 | 基板输出输入装置以及基板输出输入方法 |
CN100469680C (zh) * | 2006-02-20 | 2009-03-18 | 友达光电股份有限公司 | 基板升降设备及其顶柱机构 |
-
2009
- 2009-07-29 CN CN2009100415136A patent/CN101656222B/zh not_active Expired - Fee Related
- 2009-12-25 WO PCT/CN2009/076050 patent/WO2011011954A1/zh active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2011011954A1 (zh) | 2011-02-03 |
CN101656222A (zh) | 2010-02-24 |
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Effective date of registration: 20131205 Granted publication date: 20110727 |
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PD01 | Discharge of preservation of patent |
Date of cancellation: 20140905 Granted publication date: 20110727 |
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Effective date of registration: 20140905 Granted publication date: 20110727 |
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RINS | Preservation of patent right or utility model and its discharge | ||
PD01 | Discharge of preservation of patent |
Date of cancellation: 20150905 Granted publication date: 20110727 |
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PP01 | Preservation of patent right |
Effective date of registration: 20150905 Granted publication date: 20110727 |
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RINS | Preservation of patent right or utility model and its discharge | ||
PD01 | Discharge of preservation of patent | ||
PD01 | Discharge of preservation of patent |
Date of cancellation: 20210905 Granted publication date: 20110727 |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110727 Termination date: 20130729 |