CN101653828B - 银纳米颗粒及其制备方法 - Google Patents
银纳米颗粒及其制备方法 Download PDFInfo
- Publication number
- CN101653828B CN101653828B CN200910166514.3A CN200910166514A CN101653828B CN 101653828 B CN101653828 B CN 101653828B CN 200910166514 A CN200910166514 A CN 200910166514A CN 101653828 B CN101653828 B CN 101653828B
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- China
- Prior art keywords
- silver
- grain
- approximately
- mixture
- silver nano
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000000034 method Methods 0.000 title claims abstract description 42
- 230000008569 process Effects 0.000 title claims abstract description 8
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 title abstract description 6
- -1 amine compound Chemical class 0.000 claims abstract description 60
- 239000000203 mixture Substances 0.000 claims abstract description 60
- OAKJQQAXSVQMHS-UHFFFAOYSA-N hydrazine Substances NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims abstract description 31
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims abstract description 22
- 239000002904 solvent Substances 0.000 claims abstract description 22
- 229940100890 silver compound Drugs 0.000 claims abstract description 21
- 150000003379 silver compounds Chemical class 0.000 claims abstract description 21
- 229910052709 silver Inorganic materials 0.000 claims description 82
- 239000004332 silver Substances 0.000 claims description 81
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 77
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 45
- 239000002105 nanoparticle Substances 0.000 claims description 30
- 125000000217 alkyl group Chemical group 0.000 claims description 26
- 150000001412 amines Chemical class 0.000 claims description 25
- 229910052739 hydrogen Inorganic materials 0.000 claims description 23
- 239000001257 hydrogen Substances 0.000 claims description 23
- 238000009826 distribution Methods 0.000 claims description 22
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 21
- 125000004432 carbon atom Chemical group C* 0.000 claims description 20
- 125000003118 aryl group Chemical group 0.000 claims description 15
- 239000010409 thin film Substances 0.000 claims description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 11
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 9
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 9
- 150000002431 hydrogen Chemical class 0.000 claims description 9
- 125000000547 substituted alkyl group Chemical group 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 125000003107 substituted aryl group Chemical group 0.000 claims description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 6
- 150000003378 silver Chemical class 0.000 claims description 5
- 239000008139 complexing agent Substances 0.000 claims description 4
- GSNUFIFRDBKVIE-UHFFFAOYSA-N DMF Natural products CC1=CC=C(C)O1 GSNUFIFRDBKVIE-UHFFFAOYSA-N 0.000 claims description 3
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 2
- 229960001760 dimethyl sulfoxide Drugs 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- 239000011541 reaction mixture Substances 0.000 abstract 1
- 229940009188 silver Drugs 0.000 description 70
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 30
- 229910052757 nitrogen Inorganic materials 0.000 description 17
- 239000004065 semiconductor Substances 0.000 description 16
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 15
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 14
- 238000003756 stirring Methods 0.000 description 13
- 239000000758 substrate Substances 0.000 description 13
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 10
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 10
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 10
- ZQPPMHVWECSIRJ-MDZDMXLPSA-N elaidic acid Chemical compound CCCCCCCC\C=C\CCCCCCCC(O)=O ZQPPMHVWECSIRJ-MDZDMXLPSA-N 0.000 description 10
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 10
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 description 10
- 229940071536 silver acetate Drugs 0.000 description 10
- 238000000151 deposition Methods 0.000 description 9
- 125000004433 nitrogen atom Chemical group N* 0.000 description 9
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 8
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 8
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 8
- 239000005642 Oleic acid Substances 0.000 description 8
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 8
- HKOOXMFOFWEVGF-UHFFFAOYSA-N phenylhydrazine Chemical compound NNC1=CC=CC=C1 HKOOXMFOFWEVGF-UHFFFAOYSA-N 0.000 description 8
- 229940067157 phenylhydrazine Drugs 0.000 description 8
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 8
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 7
- 238000009434 installation Methods 0.000 description 7
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- 239000007788 liquid Substances 0.000 description 7
- AUHZEENZYGFFBQ-UHFFFAOYSA-N 1,3,5-trimethylbenzene Chemical compound CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 6
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 150000002429 hydrazines Chemical class 0.000 description 5
- 239000007791 liquid phase Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 125000000962 organic group Chemical group 0.000 description 5
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- MEJAPGGFIJZHEJ-UHFFFAOYSA-N 5-acetamido-1,3,4-thiadiazole-2-sulfonyl chloride Chemical compound CC(=O)NC1=NN=C(S(Cl)(=O)=O)S1 MEJAPGGFIJZHEJ-UHFFFAOYSA-N 0.000 description 4
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 4
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 4
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 4
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 4
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 4
- GVWISOJSERXQBM-UHFFFAOYSA-N n-methylpropan-1-amine Chemical compound CCCNC GVWISOJSERXQBM-UHFFFAOYSA-N 0.000 description 4
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 description 4
- ISYWECDDZWTKFF-UHFFFAOYSA-N nonadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCCC(O)=O ISYWECDDZWTKFF-UHFFFAOYSA-N 0.000 description 4
- FJDUDHYHRVPMJZ-UHFFFAOYSA-N nonan-1-amine Chemical compound CCCCCCCCCN FJDUDHYHRVPMJZ-UHFFFAOYSA-N 0.000 description 4
- FBUKVWPVBMHYJY-UHFFFAOYSA-N nonanoic acid Chemical compound CCCCCCCCC(O)=O FBUKVWPVBMHYJY-UHFFFAOYSA-N 0.000 description 4
- SECPZKHBENQXJG-FPLPWBNLSA-N palmitoleic acid Chemical compound CCCCCC\C=C/CCCCCCCC(O)=O SECPZKHBENQXJG-FPLPWBNLSA-N 0.000 description 4
- DPBLXKKOBLCELK-UHFFFAOYSA-N pentan-1-amine Chemical compound CCCCCN DPBLXKKOBLCELK-UHFFFAOYSA-N 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 4
- 239000013049 sediment Substances 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910001923 silver oxide Inorganic materials 0.000 description 4
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- BGHCVCJVXZWKCC-UHFFFAOYSA-N tetradecane Chemical compound CCCCCCCCCCCCCC BGHCVCJVXZWKCC-UHFFFAOYSA-N 0.000 description 4
- IIYFAKIEWZDVMP-UHFFFAOYSA-N tridecane Chemical compound CCCCCCCCCCCCC IIYFAKIEWZDVMP-UHFFFAOYSA-N 0.000 description 4
- SZHOJFHSIKHZHA-UHFFFAOYSA-N tridecanoic acid Chemical compound CCCCCCCCCCCCC(O)=O SZHOJFHSIKHZHA-UHFFFAOYSA-N 0.000 description 4
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 4
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- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 125000003368 amide group Chemical group 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
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- 239000011248 coating agent Substances 0.000 description 3
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- 229910052802 copper Inorganic materials 0.000 description 3
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- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 3
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- 229940042795 hydrazides for tuberculosis treatment Drugs 0.000 description 3
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- BITHHVVYSMSWAG-KTKRTIGZSA-N (11Z)-icos-11-enoic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCC(O)=O BITHHVVYSMSWAG-KTKRTIGZSA-N 0.000 description 2
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- RHUYHJGZWVXEHW-UHFFFAOYSA-N 1,1-Dimethyhydrazine Chemical group CN(C)N RHUYHJGZWVXEHW-UHFFFAOYSA-N 0.000 description 2
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- ZXSQEZNORDWBGZ-UHFFFAOYSA-N 1,3-dihydropyrrolo[2,3-b]pyridin-2-one Chemical compound C1=CN=C2NC(=O)CC2=C1 ZXSQEZNORDWBGZ-UHFFFAOYSA-N 0.000 description 2
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- 229910017944 Ag—Cu Inorganic materials 0.000 description 2
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 2
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- KAJZYANLDWUIES-UHFFFAOYSA-N heptadecan-1-amine Chemical compound CCCCCCCCCCCCCCCCCN KAJZYANLDWUIES-UHFFFAOYSA-N 0.000 description 2
- 125000001072 heteroaryl group Chemical group 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
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- YAQXGBBDJYBXKL-UHFFFAOYSA-N iron(2+);1,10-phenanthroline;dicyanide Chemical compound [Fe+2].N#[C-].N#[C-].C1=CN=C2C3=NC=CC=C3C=CC2=C1.C1=CN=C2C3=NC=CC=C3C=CC2=C1 YAQXGBBDJYBXKL-UHFFFAOYSA-N 0.000 description 2
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- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 125000001425 triazolyl group Chemical group 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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Abstract
公开了制备银纳米颗粒的方法。任选地加热一种含有银化合物、羧酸、胺化合物和任选的溶剂的反应混合物。然后添加一种肼化合物,并使混合物进一步反应,从而制得银纳米颗粒。
Description
相关专利和申请的相互参引
参引以下八篇相关的共同转让的专利申请,所述专利申请的内容通过引用全部纳入本文:
Yiliang Wu等人2003年12月11日提交的名为“NANOPARTICLEDEPOSITION PROCESS”的美国申请,序列号No.10/733,136
Yuning Li等人的名为“STABILIZED SIL VER NANOPARTICLESAND THEIR USE”的美国专利No.7,270,694
Yiliang Wu等人的名为“METHODS TO MINIMIZE CONTACTRESISTANCE”的美国专利No.7,306,969
Yuning Li等人2006年10月5日提交的名为“SILVER-CONTAINING NANOPARTICLES WITHREPLACEMENT STABILIZER”的美国申请,序列号No.11/543,661
Yuning Li等人2006年12月15日提交的名为“DEVICESCONTAINING ANNEALED STABILIZED SILVERNANOPARTICLES”的美国申请,序列号No.11/611,228
Yuning Li等人2007年8月10日提交的名为“STABILIZEDSILVER NANOPARTICLES AND THEIR USE”的美国申请,序列号No.11/837,023
Yuning Li等人2007年11月29日提交的名为“SILVERNANOPARTICLE COMPOSITIONS”的美国申请,序列号No.11/946,923
Yuning Li等人2008年8月18日提交的名为“METHODS FORPRODUCING CARBOXYLIC ACID STABILIZED SILVERNANOPARTICLES”的美国申请,序列号No.12/193,225
技术领域
本文在多个实施方案中公开了稳定的高性能银纳米颗粒组合物以及制备和/或使用该组合物的方法和装置。
背景技术
使用液相沉积技术制造电子电路元件可能是有益的,因为该技术提供了对诸如薄膜晶体管(TFT)、发光二极管(LED)、RFID标签、光伏件等电子用途方面的常规主流非晶硅技术的潜在的低成本替代技术。但是,满足实际应用对于电导率、加工和成本要求的功能电极、像素板(pixel pad),以及传导轨迹(conductive trace)、传导线和传导线路(conductive track)的沉积和/或图案生成一直是一个极大的挑战。银作为电子装置的传导元件尤其受到关注,因为银的成本比金低很多并且银具有比铜好很多的环境稳定性。因此,迫切需要适于制造电子装置的导电元件的可液相加工的、稳定的含银纳米颗粒组合物的低成本制备方法,这也正是本发明实施方案所致力解决的。
发明内容
本申请在多个示例性实施方案中公开了制备含银纳米颗粒组合物的方法,以及由此制备的组合物。还公开了使用纳米颗粒组合物的装置,例如薄膜晶体管。
一些实施方案中公开了一种制备银纳米颗粒的方法,该方法包括:
形成一种含有银化合物、羧酸、胺化合物和任选的溶剂的混合物;
任选地加热该混合物;
向该混合物中添加一种肼化合物;和
使该混合物反应从而形成银纳米颗粒。
所述银化合物可选自氧化银(I)、氧化银(II)、乙酸银、硝酸银、乙酰丙酮银、苯甲酸银、溴酸银、溴化银、碳酸银、氯化银、柠檬酸银、氟化银、碘酸银、碘化银、乳酸银、亚硝酸银、高氯酸银、磷酸银、硫酸银、硫化银和三氟乙酸银。
所述羧酸可具有至少4个碳原子。在一些实施方案中,所述羧酸具有4至约20个碳原子。或者,所述羧酸可选自丁酸、戊酸、己酸、庚酸、辛酸、壬酸、癸酸、十一烷酸、十二烷酸、十三烷酸、肉豆蔻酸、十五烷酸、棕榈酸、十七烷酸、硬脂酸、油酸、十九烷酸、二十烷酸(icosanoic acid)、二十碳烯酸、反油酸、亚油酸和棕榈油酸。
所述胺化合物可含有一个、两个或多个以下胺基:
其中A、B和C独立地选自氢和有机基团,并且至少一个为有机基团。
在更具体的实施方案中,所述胺化合物为下式之一:
NR1R2R3或R1R2N-R5-NR3R4
其中R1、R2、R3、R4和R5独立地选自氢、烷基、芳基、被取代的烷基和被取代的芳基;其中R1、R2和R3中至少一个不为氢;并且R5不可为氢。所述胺化合物可选自丙胺、丁胺、戊胺、己胺、庚胺、辛胺、壬胺、癸胺、十一胺、十二胺、十三胺、十四胺、十五胺、十六胺、十七胺、十八胺、N,N-二甲胺、N,N-二丙胺、N,N-二丁胺、N,N-二戊胺、N,N-二己胺、N,N-二庚胺、N,N-二辛胺、N,N-二壬胺、N,N-二癸胺、N,N-二(十一烷基)胺、N,N-二(十二烷基)胺、甲基丙基胺、乙基丙基胺、丙基丁基胺、乙基丁基胺、乙基戊基胺、丙基戊基胺、丁基戊基胺、三乙胺、三丙胺、三丁胺、三戊胺、三己胺、三庚胺、三辛胺、1,2-乙二胺、N,N,N’,N’-四甲基乙二胺、丙烷-1,3-二胺、N,N,N’,N’-四甲基丙烷-1,3-二胺、丁烷-1,4-二胺和N,N,N’,N’-四甲基丁烷-1,4-二胺。
所述肼化合物可具有下式:
R6R7N-NR8R9
其中R6、R7、R8和R9独立地选自氢、烷基和芳基;并且其中R6、R7、R8和R9中的至少一个不为氢。所述肼化合物可具有式R6R7N-NH2。在一些具体的实施方案中,所述肼化合物为苯肼。
羧酸与银化合物的摩尔比可为约0.05至约10。胺化合物与银化合物的摩尔比可为约0.1至约1000。肼化合物与银化合物的摩尔比可为约0.2至约2.0。
可将混合物在约25℃至约200℃的温度加热。混合物可加热最多约120分钟。
混合物可在约25℃至约200℃的温度反应。混合物可反应约5分钟至约5小时。
所得纳米颗粒可具有约0.5纳米至约1000纳米的平均直径。
本方法还可包括用第一非溶剂从混合物中分离银纳米颗粒;和用第二非溶剂洗涤该银纳米颗粒。
所述非溶剂可包括甲醇、乙醇、丙醇、异丙醇、丙酮或N,N-二甲基甲酰胺。
银纳米颗粒可具有约30纳米或更小的粒度分布宽度。
在另一些实施方案中公开了一种制备具有较窄粒度分布的银纳米颗粒的方法,该方法包括:
形成一种含有银化合物、羧酸和螯合二胺化合物的混合物;
任选地加热该混合物;
向该混合物中添加一种肼化合物;和
使混合物反应从而形成银纳米颗粒;
其中银纳米颗粒具有约30纳米或更小的粒度分布宽度。
所述螯合二胺化合物可具有下式:
R1R2N-(CH2)n-NR4R5
其中R1、R2、R4和R5独立地选自氢、烷基、芳基、被取代的烷基和被取代的芳基;并且n为1至4。在具体的实施方案中,所述螯合二胺化合物为四甲基乙二胺。银纳米颗粒可具有约1至约50纳米的平均直径。
还公开了由所述方法得到的银纳米颗粒。还公开了通过沉积所述银纳米颗粒然后加热而制得的薄膜晶体管。
本发明的这些及其他非限制性特征在下文进行更具体的公开。
附图说明
以下是对附图的简要描述,所述附图是为了说明本文公开的示例性实施方案,而不是为了对其进行限制。
图1表示含有本发明纳米颗粒的薄膜晶体管的第一个实施方案。
图2表示含有本发明纳米颗粒的薄膜晶体管的第二个实施方案。
图3表示含有本发明纳米颗粒的薄膜晶体管的第三个实施方案。
图4表示含有本发明纳米颗粒的薄膜晶体管的第四个实施方案。
图5为展示根据本发明方法形成的纳米颗粒的粒度和分布的图。
图6为展示根据本发明方法形成的纳米颗粒的粒度和分布的图。
图7为展示根据本发明方法形成的纳米颗粒的粒度和分布的图。
图8为展示根据本发明方法形成的纳米颗粒的粒度和分布的图。
图9为展示根据现有方法形成的纳米颗粒的粒度和分布的图。
具体实施方式
通过参照附图可更全面地理解本文公开的构件、方法和装置。这些附图仅为方便和易于说明本发明的示意图,因此并不意在指明本发明装置或构件的相对大小及尺寸和/或限定或限制示例性实施方案的范围。
虽然在以下描述中为清楚起见使用了特定术语,但是这些术语仅意在指代选择用来在附图中示出的实施方案的具体结构,而并不意在限定或限制本发明的范围。在以下的附图和下列描述中,应理解的是,相同的附图标记指代相同功能的构件。
“银纳米颗粒”中使用的术语“纳米”指粒度为约1000nm以下。在实施方案中,含银纳米颗粒的粒度为约0.5nm至约1000nm、约1nm至约500nm、约1nm至约100nm,特别是约1nm至约20nm。粒度在本文定义为通过TEM(透射式电子显微镜)测定的除稳定剂外的银颗粒的平均直径。
本发明方法生成银纳米颗粒。该方法包括(a)形成一种含有银化合物、羧酸、胺化合物和任选的溶剂的混合物;(b)任选地加热该混合物;(c)向该混合物中添加一种肼化合物;和(d)使该混合物反应从而形成银纳米颗粒。
所述银化合物含有银(I)或银(II)。示例性银化合物包括氧化银(I)、氧化银(II)、乙酸银、硝酸银、乙酰丙酮银、苯甲酸银、溴酸银、溴化银、碳酸银、氯化银、柠檬酸银、氟化银、碘酸银、碘化银、乳酸银、亚硝酸银、高氯酸银、磷酸银、硫酸银、硫化银、三氟乙酸银等,或其混合物。
混合物中使用的羧酸具有至少4个碳原子。在更具体的实施方案中,所述羧酸具有4至约20个碳原子。示例性羧酸包括丁酸、戊酸、己酸、庚酸、辛酸、壬酸、癸酸、十一烷酸、十二烷酸、十三烷酸、肉豆蔻酸、十五烷酸、棕榈酸、十七烷酸、硬脂酸、油酸、十九烷酸、二十烷酸、二十碳烯酸、反油酸、亚油酸和棕榈油酸。
所述胺化合物起络合剂的功能。胺化合物可为任意伯胺、仲胺或叔胺。胺化合物可为一元胺、二胺(diamine)或多胺。
更具体地,胺化合物可含有一个、两个或更多个以下胺基:
其中A、B和C独立地选自氢和有机基团。并且至少一个为有机基团。当所述叔胺含有多于一个这类胺基时,氮原子相互不直接键合。示例性有机基团包括烷基、芳基、被取代的烷基和被取代的芳基。
在另一些实施方案中,胺化合物通过下式之一描述:
NR1R2R3或R1R2N-R5-NR3R4
其中R1、R2、R3、R4和R5独立地选自氢、烷基、芳基、被取代的烷基和被取代的芳基;其中R1、R2和R3中的至少一个不为氢;并且R5不可为氢。通常,所述烷基具有1至约18个碳原子,并且所述芳基具有6至约20个碳原子。所述烷基和芳基可被诸如卤素、羟基、硝基(-NO2)、烷氧基、巯基(-SH)等的基团取代。示例性胺化合物包括丙胺、丁胺、戊胺、己胺、庚胺、辛胺、壬胺、癸胺、十一胺、十二胺、十三胺、十四胺、十五胺、十六胺、十七胺、十八胺、N,N-二甲胺、N,N-二丙胺、N,N-二丁胺、N,N-二戊胺、N,N-二己胺、N,N-二庚胺、N,N-二辛胺、N,N-二壬胺、N,N-二癸胺、N,N-二(十一烷基)胺、N,N-二(十二烷基)胺、甲基丙基胺、乙基丙基胺、丙基丁基胺、乙基丁基胺、乙基戊基胺、丙基戊基胺、丁基戊基胺、三乙胺、三丙胺、三丁胺、三戊胺、三己胺、三庚胺、三辛胺、1,2-乙二胺、N,N,N’,N’-四甲基乙二胺、丙烷-1,3-二胺、N,N,N’,N’-四甲基丙烷-1,3-二胺、丁烷-1,4-二胺和N,N,N’,N’-四甲基丁烷-1,4-二胺等,或其混合物。
在实施方案中,羧酸与银化合物的摩尔比为约0.05至约10。在更具体的实施方案中,羧酸与银化合物的摩尔比为约0.1至约10,包括约0.1至1。
在实施方案中,胺化合物与银化合物的摩尔比为约0.1至约1000。在更具体的实施方案中,胺化合物与银化合物的摩尔比为约0.2至约10,包括约0.4至4.0。
如果需要,可向初始混合物中添加一种溶剂。所述溶剂可为一种有机溶剂例如戊烷、己烷、环己烷、庚烷、辛烷、壬烷、癸烷、十一烷、十二烷、十三烷、十四烷、甲苯、二甲苯、1,3,5-三甲基苯、四氢呋喃、氯苯、二氯苯、三氯苯、硝基苯、苯甲腈等,或其混合物。
可任选地加热银化合物、羧酸、胺化合物和任选的溶剂的混合物。为使银化合物溶解和使混合物均化,加热可能是必需的。如果银不溶解,则当该过程继续时,银化合物将被还原,从而使银纳米颗粒将不稳定并将形成不溶的凝聚物。
混合物可在约25℃至约200℃的温度进行加热。在更具体的实施方案中,将混合物加热至约25℃至约150℃的温度,或约50℃至约100℃。
可将混合物加热最多约120分钟。在更具体的实施方案中,加热约1分钟至约60分钟。通常,混合物在大气压下加热。
接着,向混合物中添加一种肼化合物。本文所用术语“肼化合物”指例如被取代的肼或它们的适宜的水合物或盐。所述被取代的肼可含有约1个碳原子至约30个碳原子,约1个碳原子至约25个碳原子,约2至约20个碳原子,约2至约16个碳原子。在实施方案中,被取代的肼可包括例如烃基肼、酰肼、肼基甲酸酯(carbazate)和磺酰肼(sulfonohydrazide)。
使用肼化合物作为还原剂可具有许多优点,例如1)根据取代情况,具有在水中、极性或非极性有机溶剂中的可溶性;2)根据取代情况,具有由强到弱的还原能力;和3)不像在其他还原剂例如硼氢化钠中一样存在非挥发性金属离子,这将便于除去副产物或未反应的还原剂。
烃基肼的实例包括例如RNHNH2、RNHNHR’和RR’NNH2,其中一个氮原子被R或R’单取代或二取代,并且另一个氮原子任选被R或R’单取代或二取代,其中每一个R或R’为烃基。烃基肼的实例包括例如甲肼、叔丁基肼、2-羟基乙基肼、苄基肼、苯肼、甲苯肼、溴苯肼、氯苯肼、硝基苯肼、1,1-二甲基肼、1,1-二苯基肼、1,2-二乙基肼和1,2-二苯基肼。
除非另有指明,在确定各种肼化合物的R和R’取代基时,短语“烃基”既包括未被取代的烃基也包括被取代的烃基。未被取代的烃基可包括任何适宜的取代基,例如氢原子、直链或支链烷基、环烷基、芳基、烷基芳基、芳基烷基或其结合。烷基和环烷基取代基可含有约1至约30个碳原子、约5至25个碳原子、约10至20个碳原子。烷基和环烷基取代基的实例包括例如甲基、乙基、丙基、丁基、戊基、己基、庚基、辛基、壬基、癸基、十一烷基、十二烷基、十三烷基、十四烷基、十五烷基、十六烷基、十七烷基、十八烷基、十九烷基或二十烷基,及其结合。芳基取代基可含有约6至约48个碳原子、约6至约36个碳原子、约6至24个碳原子。芳基取代基的实例包括例如,苯基、甲苯基、乙苯基、丙苯基、丁苯基、戊苯基、己苯基、庚苯基、辛苯基、壬苯基、癸苯基、十一烷基苯基、十二烷基苯基、十三烷基苯基、十四烷基苯基、十五烷基苯基、十六烷基苯基、十七烷基苯基、十八烷基苯基,或其结合。被取代的烃基可为被例如卤素(氯、氟、溴和碘)、硝基、氰基、烷氧基(甲氧基、乙氧基和丙氧基)或杂芳基取代一次、两次或更多次的本文所述未被取代的烃基。杂芳基的实例可包括噻吩基、呋喃基、吡啶基、噁唑基、吡咯基、三嗪基、咪唑基、嘧啶基、吡嗪基、噁二唑基、吡唑基、三唑基、噻唑基、噻二唑基、喹啉基、喹唑啉基、1,5-二氮杂萘基、咔唑基,或其结合。
肼化合物的实例可包括例如酰肼,RC(O)NHNH2和RC(O)NHNHR’及RC(O)NHNHC(O)R,其中一个或两个氮原子被式RC(O)的酰基取代,其中每一个R独立地选自氢和烃基,并且一个或两个氮原子任选地被R’单取代或二取代,其中每一个R’为独立选择的烃基。酰肼的实例可包括例如甲酰肼、乙酰肼、苯酰肼、己二酸二酰肼、均二氨基脲、丁酰肼、己酰肼、辛酰肼、草氨酰肼、马来酰肼、N-甲基肼甲酰胺及氨基脲。
肼化合物的实例可包括例如肼基甲酸酯和肼基羧酸酯,例如ROC(O)NHNHR’、ROC(O)NHNH2和ROC(O)NHNHC(O)OR,其中一个或两个氮原子被式ROC(O)的酯基取代,其中每一个R独立地选自氢和烃基,并且一个或两个氮原子任选地被R’单取代或二取代,其中每一个R’为独立选择的烃基。肼基甲酸酯的实例可包括例如肼基甲酸甲酯(肼基羧酸甲酯)、肼基甲酸乙酯、肼基甲酸丁酯、肼基甲酸苄酯和肼基甲酸2-羟乙酯。
磺酰肼的实例包括例如RSO2NHNH2、RSO2NHNHR’和RSO2NHNHSO2R,其中一个或两个氮原子被式RSO2的磺酰基取代,其中每一个R独立地选自氢和烃基,并且一个或两个氮原子任选地被R’单取代或二取代,其中每一个R’为独立选择的烃基。磺酰肼的实例可包括例如甲磺酰肼、苯磺酰肼、2,4,6-三甲基苯磺酰肼和对甲苯磺酰肼。其他肼化合物可包括例如氨基胍、氨基硫脲、肼碳酰亚胺硫羟酸甲酯(methyl hydrazinecarbimidothiolate)和硫代均二氨基脲。
在实施方案中,所述肼化合物具有下式:
R6R7N-NR8R9
其中R6、R7、R8和R9独立地选自氢、烷基和芳基;并且其中R6、R7、R8和R9中的至少一个不为氢。在更具体的实施方案中,肼化合物具有式R6R7N-NH2。示例性肼化合物包括甲肼、叔丁基肼、2-羟基乙基肼、苄基肼、苯肼、甲苯肼、溴苯肼、氯苯肼和硝基苯肼。
在实施方案中,肼化合物与银化合物的摩尔比为约0.2至约2.0。
接着,将包括银化合物、羧酸、胺化合物和任选的溶剂的混合物与所述肼化合物反应,从而形成银纳米颗粒。通常,混合物在提高的温度下反应并且还可在搅动例如搅拌情况下进行反应。混合物可在约25℃至约200℃的温度反应。在更具体的实施方案中,将混合物加热至约50℃至约100℃的温度。
混合物可反应约5分钟至约5小时。在更具体的实施方案中,将混合物加热约10分钟至约2小时。通常,混合物在大气压下反应。
所得纳米颗粒具有约0.5纳米至约1000纳米的平均直径。在更具体的实施方案中,纳米颗粒具有约1纳米至约100纳米的平均直径。
如果需要,可通过使用一种非溶剂即一种不溶解银纳米颗粒的液体将银纳米颗粒与反应混合物分开。然后可用一种非溶剂洗涤银纳米颗粒。示例性非溶剂包括甲醇、乙醇、丙醇、异丙醇、丙酮、乙腈、N,N-二甲基甲酰胺、二甲亚砜等。
如果使用螯合二胺化合物,则得到的银纳米颗粒可具有较窄的粒度分布宽度。示例性螯合二胺化合物具有下式:
R1R2N-(CH2)n-NR4R5
其中R1、R2、R4和R5独立地选自氢、烷基、芳基、被取代的烷基和被取代的芳基;并且n为1至4。在具体的实施方案中,所述螯合二胺化合物为N,N,N’,N’-四甲基乙二胺或TMEDA。
粒度分布宽度指最大纳米颗粒直径和最小纳米颗粒直径之间的差,或最小和最大纳米颗粒之间的范围。在实施方案中,银纳米颗粒的粒度分布宽度为约30纳米或更小。在更具体的实施方案中,粒度分布宽度为约10至30纳米,或约10至25纳米。此外,银纳米颗粒通常较小。在实施方案中,银纳米颗粒可具有约1纳米至约50纳米的平均直径。
使用本发明方法制得的银纳米颗粒在其表面含有作为稳定剂的羧酸。除羧酸稳定剂之外,银纳米颗粒的表面可含有或不含有胺化合物。本发明的方法使得可廉价地、一步法制备银纳米颗粒。相比而言,现有方法需要多个步骤,包括形成一种胺稳定的银纳米颗粒,然后用一种羧酸置换所述胺。
在实施方案中,所述含银纳米颗粒由元素银或银复合物组成。除银之外,银复合物可包括以下之一或两者:(i)一种或多种其他金属,和(ii)一种或多种非金属。适宜的其他金属包括例如Al、Au、Pt、Pd、Cu、Co、Cr、In和Ni,特别是过渡金属例如Au、Pt、Pd、Cu、Cr、Ni,及其混合物。示例性金属复合物为Au-Ag、Ag-Cu、Au-Ag-Cu和Au-Ag-Pd。金属复合物中的适宜非金属包括例如Si、C和Ge。银复合物的各种组分的可存在量在例如约0.01重量%至约99.9重量%、特别是约10重量%至约90重量%的范围内。在实施方案中,银复合物为一种由银和一种、两种或更多种其他金属组成的金属合金,银占纳米颗粒的例如至少约20重量%,特别是纳米颗粒的大于约50重量%。
在实施方案中,可进一步处理银纳米颗粒,例如使其适合(例如用于制造电子装置的)液相沉积技术。所述组合物的这种进一步处理可以是例如将该银纳米颗粒溶解或分散在一种合适的液体中。
可用于分散或溶解银纳米颗粒从而形成银纳米颗粒组合物的液体包括有机液体或水。示例性的有机液体包括烃溶剂,例如戊烷、己烷、环己烷、庚烷、辛烷、壬烷、癸烷、十一烷、十二烷、十三烷、十四烷、甲苯、二甲苯、1,3,5-三甲基苯等;醇类,例如丁醇、戊醇、己醇、庚醇、辛醇等;四氢呋喃;氯苯;二氯苯;三氯苯;硝基苯;苯甲腈;乙腈;及其混合物。可使用一种、两种、三种或更多种液体。在使用两种以上溶剂的实施方案中,每一种溶剂可以例如约99∶1至约1∶99的任何适宜的体积比或摩尔比存在。
由银纳米颗粒制造传导元件在实施方案中可使用任何适宜的液相沉积技术进行,所述液相沉积技术包括i)印刷,例如筛网印刷/刻版印刷、冲压、微接触印刷、喷墨印刷等,和ii)涂敷,例如旋涂、浸涂、刮涂(blade coating)、流延、蘸涂(dipping)等。在该阶段沉积的银纳米颗粒可显示或不显示导电性。
在约300℃以下、优选在约250℃以下的温度加热该沉积的纳米颗粒,使其聚结从而形成适于用作电子装置中的传导元件的导电层。进行加热的时间在例如约1分钟至约10小时、特别是约5分钟至约1小时的范围内。加热可在约100℃至约300℃的温度进行。在更具体的实施方案中,在约150℃至约200℃或约170℃至约190℃的温度进行加热。
通过加热沉积的银纳米颗粒制得的含银元件的电导率为例如至少1000S/cm。在另一些实施方案中,电导率为至少10,000S/cm,通过四探针方法测得。
所得传导元件可用作电子装置中的传导电极、传导板、传导线、传导线路等,所述电子装置例如薄膜晶体管、有机发光二极管、RFID(射频识别)标签、光伏件,及需要传导元件或构件的其他电子装置。
在图1中,示意示出了一种薄膜晶体管(“TFT”)构型10,其由重度n-掺杂的既用作基底也用作栅极的硅片18、顶部设置有两个金属接触点——源极20和漏极22——的热生长氧化硅绝缘介电层14组成。金属接触点20和22之上和之间为如本文所说明的半导体层12。
图2示意示出了另一种TFT构型30,其由基底36、栅极38、源极40和漏极42、绝缘介电层34及半导体层32组成。
图3示意示出了另一种TFT构型50,其由重度n-掺杂的既用作基底也用作栅极的硅片56、热生长氧化硅绝缘介电层54和顶部设置有一个源极60和一个漏极62的半导体层52组成。
图4示意示出了又一种TFT构型70,其由基底76、栅极78、源极80、漏极82、半导体层72和绝缘介电层74组成。
所述基底可由例如硅、玻璃板、塑料膜或薄片、纸或纤维构成。对于结构柔韧的装置,可使用塑料基底,例如聚酯、聚碳酸酯、聚酰亚胺薄片等。基底的厚度尤其对于柔韧的塑料基底而言可为约10微米至超过10毫米,示例性厚度为约50微米至约2毫米,对于硬质基底例如玻璃或硅为约0.4至约10毫米。
栅极、源极和漏极通过本发明公开的实施方式制造。栅极层厚度范围为例如约10至约2000nm。源极和漏极的典型厚度为例如约40nm至约1微米,更具体的厚度为约60至约400nm。
绝缘介电层通常可为一种无机材料膜或有机聚合物膜。适宜作为绝缘层的无机材料的示例性实例包括氧化硅、氮化硅、氧化铝、钛酸钡、钡锆钛酸盐等;用于绝缘层的有机聚合物的示例性实例包括聚酯、聚碳酸酯、聚乙烯基苯酚、聚酰亚胺、聚苯乙烯、聚甲基丙烯酸酯类、聚丙烯酸酯类、环氧树脂等。根据所用介电材料的介电常数,绝缘层的厚度为例如约10nm至约500nm。绝缘层的示例性厚度为约100nm至约500nm。绝缘层可具有例如小于约10-12S/cm的电导率。
位于例如绝缘层和源极/漏极之间并与它们接触的是半导体层,其中该半导体层的厚度通常为例如约10nm至约1微米,或约40至约100nm。可使用任何半导体材料来形成该半导体层。示例性半导体材料包括区域规整(regioregular)的聚噻吩、低聚噻吩、并五苯,及美国专利No.6,621,099、6,770,904和6,949,762以及C.D.Dimitrakopoulos和P.R.L.Malenfant的“Organic Thin Film Transistors for Large AreaElectronics”,Adv.Mater.,第12卷,第2期,第99-117页(2002)中公开的高分子半导体,所述文献的公开内容通过引用全部纳入本文。可使用任何适宜技术来形成半导体层。一种这类方法为对含有基底和装有粉末形式化合物的源容器的室施以约10-5-10-7托的真空。加热该容器直至所述化合物升华到所述基底上。所述半导体层通常还可通过溶液处理例如半导体溶液或其分散液的旋涂、流延、筛网印刷、冲压或喷射印刷来制造。
绝缘介电层、栅极、半导体层、源极和漏极以任意顺序形成,特别是在栅极和半导体层两者均接触绝缘层并且源极和漏极两者均接触半导体层的实施方案中。短语“以任意顺序”包括相继形成和同时形成。例如,源极和漏极可同时形成或相继形成。薄膜晶体管的组成、制造和运行在Bao等人的美国专利6,107,117中有描述,该专利的公开内容通过引用全部纳入本文。银纳米颗粒可在任何适宜的表面例如基底、介电层或半导体层上沉积成层。
以下实施例是为进一步说明本发明之目的。所述实施例仅为示例性的,并不意欲将依据本发明制得的装置限定在本文所述材料、条件或过程参数。
实施例
实施例1
将乙酸银(0.84g,5mmol)、油酸(2.12g,7.5mmol)和1-丁胺(1.46g,20mmol)在20mL甲苯中混合并在50℃搅拌,直至所有固体溶解(5分钟内)。在剧烈搅拌的情况下向乙酸银溶液中逐滴添加苯肼(0.30g,2.75mmol)的甲苯(5mL)溶液。溶液变为暗红棕色。将溶液在50℃再搅拌10分钟,然后添加到150mL甲醇中。滤出沉淀物,用甲醇、丙酮洗涤,并干燥。
产率:0.63g(99%,基于86%的银含量计,TGA分析)。
实施例2
将乙酸银(0.84g,5mmol)、油酸(2.12g,7.5mmol)和N,N-二丁基胺(2.59g,20mmol)在20mL甲苯中混合并在50℃搅拌。在剧烈搅拌的情况下向乙酸银溶液中逐滴添加苯肼(0.30g,2.75mmol)的甲苯(5mL)溶液。溶液变为暗红棕色。将溶液在50℃再搅拌10分钟,然后添加到150mL甲醇中。滤出沉淀物,用甲醇、丙酮洗涤,并干燥。
产率:0.64g(97%,基于82%的银含量计,TGA分析)。
实施例3
将乙酸银(0.84g,5mmol)、油酸(2.12g,7.5mmol)和N,N,N’N’-四甲基乙二胺(TMEDA)(2.32g,20mmol)在20mL庚烷中混合并在50℃搅拌,直至所有固体溶解(5分钟内)。在剧烈搅拌的情况下向乙酸银溶液中逐滴添加苯肼(0.30g,2.75mmol)的甲苯(5mL)溶液。溶液变为暗红棕色。将溶液在50℃再搅拌10分钟,然后添加到150mL甲醇中。滤出沉淀物,用甲醇、丙酮洗涤,并干燥。
产率:0.61g(96%,基于85%的银含量计,TGA分析)。
实施例4
将氧化银(0.58g,2.5mmol)、油酸(2.12g,7.5mmol)和TMEDA(2.32g,20mmol)在20mL庚烷中混合并在50℃搅拌,直至所有固体溶解(10分钟内)。在剧烈搅拌的情况下向乙酸银溶液中逐滴添加苯肼(0.30g,2.75mmol)的甲苯(5mL)溶液。溶液变为暗红棕色。将溶液在50℃再搅拌10分钟,然后添加到150mL甲醇中。滤出沉淀物,用甲醇、丙酮洗涤,并干燥。
产率:0.63g(91%,基于78%的银含量计,TGA分析)。
对照实施例
酸稳定的银纳米颗粒的两步合成:
a.油胺稳定的银纳米颗粒的合成
将乙酸银(3.34g,20mmol)和油胺(13.4g,50mmol)溶解在40mL甲苯中并在55℃搅拌5分钟。将苯肼(1.19g,11mmol)的甲苯(10mL)溶液逐滴添加到以上溶液中,同时剧烈搅拌。溶液变为暗红褐色。将溶液在55℃再搅拌10分钟,然后逐滴添加到丙酮/甲醇(150mL/150mL)的混合物中。过滤沉淀物并用丙酮和甲醇简单洗涤。得到灰色固体。
b.油酸稳定的银纳米颗粒的合成
将以上制备的胺稳定的银纳米颗粒溶解在50mL己烷中,将其在室温下逐滴添加到油酸(14.12g,50mmol)的己烷(50mL)溶液中。30分钟后,除去己烷并将剩余物倒入搅拌的甲醇(200mL)中。过滤之后,用甲醇洗涤,并干燥(真空),得到灰色固体。
产率:3.05g(96%,基于68%的银含量计,TGA分析)。
结果
使用0.1重量%的银纳米颗粒的庚烷溶液在Zetasizer上测量银纳米颗粒的粒度及其多分散性指数(PDI)。
还测量了由银纳米颗粒制得的薄膜的电导率。使用0.2微米过滤器过滤银纳米颗粒的庚烷溶液(15重量%),然后将其以1000rpm的速度在玻璃基底上旋涂120秒。将具有暗褐色银纳米颗粒薄层的基底在电热板上于空气中在210℃加热30分钟,从而得到有光泽的银薄膜。使用常规四探针技术测量该银薄膜的电导率。
结果示于表1中。
表1
实施例 | 粒度(nm)a | 电导率(×104S/cm) |
1 | 11.3 | 1.0 |
2 | 14.4 | 2.9 |
3 | 13.4 | 1.6 |
4 | 9.29 | 2.7 |
对照 | 12.7 | 2.8 |
a.粒度包括稳定剂。
图5为展示由实施例1形成的粒度和分布的图。
图6为展示由实施例2形成的粒度和分布的图。
图7为展示由实施例3形成的粒度和分布的图。
图8为展示由实施例4形成的粒度和分布的图。
图9为展示由对照实施例形成的粒度和分布的图。
在图中,强度指的是信号的强度,对应于在给定粒度处纳米颗粒的相对量。粒度以下百分比(图的右边)指的是粒度低于给定粒度的纳米颗粒的总百分比。总体上,通过实施例1和2的本发明方法制备的银纳米颗粒具有同对照实施例类似的粒度和分布。然而,使用TMEDA作为络合剂而制备的银纳米颗粒具有窄得多的颗粒分布(见实施例3和4)。电导率范围为1.0×104至2.9×104S/cm,与对照实施例类似。
虽然描述了具体实施方案,但是申请人或本领域其他技术人员仍可想到目前无法预见或可能无法预见的替代、修改、改变、改进及基本等同的方案。因此,所提交的(也可能是经过修改的)权利要求书意欲包括所有这些替代、修改、改变、改进及基本等同的方案。
Claims (10)
1.一种制备银纳米颗粒的方法,包括:
形成一种含有银化合物、羧酸、胺络合剂和任选的溶剂的混合物;
加热该混合物;
向该经加热的混合物中添加一种肼化合物;和
在50℃至100℃的温度下使该混合物反应从而形成银纳米颗粒,所述银纳米颗粒具有10纳米至30纳米的粒度分布宽度。
2.权利要求1的方法,其中所述羧酸具有至少4个碳原子。
3.权利要求1的方法,其中所述羧酸具有4至20个碳原子。
4.权利要求1的方法,其中所述胺络合剂具有下式之一:
NR1R2R3或R1R2N-R5-NR3R4
其中R1、R2、R3、R4和R5独立地选自氢、烷基、芳基、被取代的烷基和被取代的芳基;其中R1、R2和R3中的至少一个不为氢;并且R5不可为氢。
5.权利要求1的方法,其中所述肼化合物具有下式:
R6R7N-NR8R9
其中R6、R7、R8和R9独立地选自氢、烷基和芳基;并且其中R6、R7、R8和R9中的至少一个不为氢。
6.权利要求1的方法,还包括以下步骤:
用第一非溶剂从混合物中分离银纳米颗粒;和
用第二非溶剂洗涤该银纳米颗粒。
其中所述第一非溶剂和第二非溶剂独立地包括甲醇、乙醇、丙醇、异丙醇、丙酮、乙腈、N,N-二甲基甲酰胺或二甲亚砜。
7.一种制备具有较窄粒度分布宽度的银纳米颗粒的方法,包括:
形成一种含有银化合物、羧酸、螯合二胺化合物和任选的溶剂的混合物;
任选地加热该混合物;
向该混合物中添加一种肼化合物;和
在50℃至100℃的温度下使混合物反应5分钟至5小时从而形成银纳米颗粒;
其中所述银纳米颗粒具有1至50纳米的平均直径和10纳米至25纳米的粒度分布宽度。
8.权利要求7的方法,其中所述螯合二胺化合物具有下式:
R1R2N-(CH2)n-NR4R5
其中R1、R2、R4和R5独立地选自氢、烷基、芳基、被取代的烷基和被取代的芳基;并且n为1至4。
9.由权利要求1的方法制得的银纳米颗粒。
10.一种含有由以下方法制备的传导元件的薄膜晶体管,所述方法包括:
将权利要求1的银纳米颗粒沉积在一表面上;和
在300℃以下的温度加热该银纳米颗粒,从而形成所述传导元件。
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JP4822783B2 (ja) * | 2005-09-22 | 2011-11-24 | 株式会社日本触媒 | 金属ナノ粒子の製法および当該製法により得られた粒子のコロイド |
JP2008019461A (ja) * | 2006-07-11 | 2008-01-31 | Fujifilm Corp | 金属ナノ粒子の製造方法、金属ナノ粒子及び金属ナノ粒子分散物 |
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2008
- 2008-08-18 US US12/193,203 patent/US8298314B2/en active Active
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US6878184B1 (en) * | 2002-08-09 | 2005-04-12 | Kovio, Inc. | Nanoparticle synthesis and the formation of inks therefrom |
US7744834B2 (en) * | 2006-07-10 | 2010-06-29 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing metal nanoparticles |
CN1994633A (zh) * | 2006-12-27 | 2007-07-11 | 沈阳工业大学 | 银纳米微粒的化学制备方法 |
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CA2675080C (en) | 2015-10-20 |
CA2675080A1 (en) | 2010-02-18 |
EP2156911A1 (en) | 2010-02-24 |
JP5616597B2 (ja) | 2014-10-29 |
KR101483311B1 (ko) | 2015-01-15 |
US8298314B2 (en) | 2012-10-30 |
KR20100021972A (ko) | 2010-02-26 |
JP2010043355A (ja) | 2010-02-25 |
CN101653828A (zh) | 2010-02-24 |
EP2156911B1 (en) | 2013-02-20 |
US20100037731A1 (en) | 2010-02-18 |
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