CN101650673A - Method of heat dissipation and power consumption assessment of simulating outer plug-in card - Google Patents
Method of heat dissipation and power consumption assessment of simulating outer plug-in card Download PDFInfo
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- CN101650673A CN101650673A CN200910018204A CN200910018204A CN101650673A CN 101650673 A CN101650673 A CN 101650673A CN 200910018204 A CN200910018204 A CN 200910018204A CN 200910018204 A CN200910018204 A CN 200910018204A CN 101650673 A CN101650673 A CN 101650673A
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- outer plug
- test
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- 238000000034 method Methods 0.000 title claims abstract description 9
- 230000017525 heat dissipation Effects 0.000 title abstract 6
- 238000012360 testing method Methods 0.000 claims abstract description 35
- 238000013461 design Methods 0.000 claims abstract description 3
- 230000005855 radiation Effects 0.000 claims description 15
- 238000004088 simulation Methods 0.000 claims description 8
- 238000011156 evaluation Methods 0.000 claims description 3
- 238000012827 research and development Methods 0.000 abstract description 6
- 238000013213 extrapolation Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010205 computational analysis Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000012854 evaluation process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
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Abstract
The invention provides a method of heat dissipation and power consumption assessment of a simulating outer plug-in card, and the power consumption resistance and radiating fins are utilized to form the simulating outer plug-in card to carry out heat dissipation of the outer plug-in card and the test assessment of the power consumption according to the design specification of each outer plug-in card manufacturer. The invention comprises the following steps in particular: 1) utilizing pure power consumption resistance to replace the power consumption of a master control chip, adding radiating fins and simulating heat dissipation of the outer plug-in card according to the specification parameter of each outer plug-in card; and 2) utilizing a dial switch, and selecting the load of simulating outer plug-in card under different loading specifications of 20W, 30W, 60W and 80W to carry out system heat dissipation and power consumption test. Compared with the prior art, the method in the invention can enable convenient heat dissipation and assessment test under the system, thus not only reaching the requirements of test, but also saving research and development costs and improving working efficiency.
Description
Technical field
The present invention relates to the computer communication technology field, specifically is the method for utilizing a kind of load outer plug-in card, solves the problem of system radiating and power consumption test and assessment.
Background technology
Current server product, continuous variation along with client's application demand, the kind of its extrapolation integrated circuit board and specification also change thereupon, at present the extrapolation integrated circuit board of main flow is as SAS card, SAS RAID card, video card, network interface card, HBA card and KVM card or the like, its power consumption is at 30W～80W, the quantity of average every money server extrapolation integrated circuit board is at 3～5, and therefore in the heat radiation of carrying out the server system level and power consumption test, the power consumption and the heat dispersion of test extrapolation integrated circuit board are one of very important work.
In the heat radiation and power consumption test of prior art, the research and development slip-stick artist is directly installed on the testing experiment that dispels the heat in the server system with power consumption with outer plug-in card, wherein in the heat radiation testing experiment, according to test specification, to under low temperature (10 ℃), normal temperature (25 ℃), three kinds of different environment temperatures of high temperature (35 ℃), test, and be continuous several days rugged surroundings test, therefore higher to the aging damage degree of outer plug-in card, often finish test, these integrated circuit boards just can not continue to have used again; In the power consumption test test, owing to need the collocation of the multiple integrated circuit board of test, the research and development slip-stick artist generally can frequently change different integrated circuit boards and test, the phenomenon of damaging when often causing the integrated circuit board plug takes place, and efficient is lower, at above existing problems, by analysing in depth, we have summed up a kind of method of simulating outer plug-in card heat radiation and power consumption assessment.
Summary of the invention
The present invention overcomes the deficiencies in the prior art a kind of method of simulating outer plug-in card heat radiation and power consumption assessment is provided
The objective of the invention is to realize in the following manner, is the theory support point with the design specification of each manufacturer's outer plug-in card, simulates the heat radiation and the power consumption of outer plug-in card by power consumption resistance, heat radiator, and concrete steps are as follows:
C) according to the specifications parameter of each outer plug-in card,, use net work power consumption resistance to replace the power consumption of main control chip, and increase heat radiator, the heat radiation of simulation outer plug-in card by computational analysis;
D) use toggle switch, the simulation integrated circuit board can be selected under different loads specifications such as 20W, 30W, 60W and 80W, carries out the test of system radiating and power consumption;
The invention has the beneficial effects as follows
1) integrated circuit board that utilizes net work rate resistance to simulate extrapolation, and increase heat radiator, guarantee the integrated circuit board of simulating and extrapolation former to be stuck in heat radiation consistent with the power consumption aspect, avoid damage under the situation that guarantees accurately to test to actual outer plug-in card;
2) be adjusted to the fictitious load of different gears by toggle switch, can simulate unequally loaded extrapolation function card such as RAID card, network interface card, one plate is used more, we can carry out heat radiation and evaluation test under the system very easily, not only reached the requirement of test, and saved R﹠D costs, improved work efficiency.
Description of drawings
Fig. 1 is simulation outer plug-in card power consumption and heat radiation testing evaluation process flow diagram.
Embodiment
With reference to accompanying drawing method of the present invention is described in more details:
1) the research and development slip-stick artist at first is placed on ready-made analog card in the server system, if the power consumption specification of the outer plug-in card of actual test is 20W, 30W and 50W at present, be adjusted to corresponding load gear by toggle switch, then server be placed on the test of dispelling the heat in the different environment with power consumption;
2) after Shang Mian the test, as change different specifications, use toggle switch to regulate, do not need to change integrated circuit board, the test of proceeding to be correlated with gets final product.
3) data result of simulation test and practical test result can think that the data of simulation test are effective in 5% error range.
Through top detailed test, we can carry out heat radiation and evaluation test under the system very easily, have not only reached the requirement of test, and have saved R﹠D costs, have improved work efficiency.
Claims (1)
1, a kind of method of simulating outer plug-in card heat radiation and power consumption assessment, it is characterized in that, design specification with each outer plug-in card manufacturer is a foundation, uses power consumption resistance and heat radiator to form the simulation outer plug-in card and carries out the heat radiation of outer plug-in card and the testing evaluation of power consumption, and concrete steps are as follows:
A), use net work power consumption resistance to replace the power consumption of main control chip, and increase heat radiator, the heat radiation of simulation outer plug-in card according to the specifications parameter of each outer plug-in card;
B) use toggle switch, be chosen in the load of simulation outer plug-in card under 20W, 30W, 60W and the 80W different loads specification, carry out the test of system radiating and power consumption.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910018204A CN101650673A (en) | 2009-08-25 | 2009-08-25 | Method of heat dissipation and power consumption assessment of simulating outer plug-in card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910018204A CN101650673A (en) | 2009-08-25 | 2009-08-25 | Method of heat dissipation and power consumption assessment of simulating outer plug-in card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101650673A true CN101650673A (en) | 2010-02-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910018204A Pending CN101650673A (en) | 2009-08-25 | 2009-08-25 | Method of heat dissipation and power consumption assessment of simulating outer plug-in card |
Country Status (1)
| Country | Link |
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| CN (1) | CN101650673A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102346704A (en) * | 2010-08-03 | 2012-02-08 | 鸿富锦精密工业（深圳）有限公司 | System for monitoring server simulation loads and method |
| CN102706386A (en) * | 2012-05-23 | 2012-10-03 | 烽火通信科技股份有限公司 | Single disc used for simulating heat consumption of IC (integrated circuit) chip |
| CN104035848A (en) * | 2014-06-14 | 2014-09-10 | 上海威固信息技术有限公司 | Automatic VPX testing system |
| CN109765442A (en) * | 2018-12-28 | 2019-05-17 | 曙光信息产业股份有限公司 | A kind of the heat dissipation test load card and heat dissipation test method of PCIEx4 |
-
2009
- 2009-08-25 CN CN200910018204A patent/CN101650673A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102346704A (en) * | 2010-08-03 | 2012-02-08 | 鸿富锦精密工业（深圳）有限公司 | System for monitoring server simulation loads and method |
| CN102706386A (en) * | 2012-05-23 | 2012-10-03 | 烽火通信科技股份有限公司 | Single disc used for simulating heat consumption of IC (integrated circuit) chip |
| CN104035848A (en) * | 2014-06-14 | 2014-09-10 | 上海威固信息技术有限公司 | Automatic VPX testing system |
| CN109765442A (en) * | 2018-12-28 | 2019-05-17 | 曙光信息产业股份有限公司 | A kind of the heat dissipation test load card and heat dissipation test method of PCIEx4 |
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Open date: 20100217 |