CN101646327A - 散热装置及散热方法 - Google Patents
散热装置及散热方法 Download PDFInfo
- Publication number
- CN101646327A CN101646327A CN200810041372.3A CN200810041372A CN101646327A CN 101646327 A CN101646327 A CN 101646327A CN 200810041372 A CN200810041372 A CN 200810041372A CN 101646327 A CN101646327 A CN 101646327A
- Authority
- CN
- China
- Prior art keywords
- wiper
- cooling agent
- evaporation part
- rotating shaft
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (14)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810041372.3A CN101646327B (zh) | 2008-08-04 | 2008-08-04 | 散热装置及散热方法 |
US12/535,530 US8944150B2 (en) | 2008-08-04 | 2009-08-04 | Dissipation utilizing flow of refrigerant |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810041372.3A CN101646327B (zh) | 2008-08-04 | 2008-08-04 | 散热装置及散热方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101646327A true CN101646327A (zh) | 2010-02-10 |
CN101646327B CN101646327B (zh) | 2013-04-17 |
Family
ID=41607146
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810041372.3A Expired - Fee Related CN101646327B (zh) | 2008-08-04 | 2008-08-04 | 散热装置及散热方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8944150B2 (zh) |
CN (1) | CN101646327B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012142737A1 (en) * | 2011-04-18 | 2012-10-26 | Empire Technology Development Llc | Dissipation utilizing flow of refreigerant |
WO2014190478A1 (en) * | 2013-05-28 | 2014-12-04 | Empire Technology Development Llc | Evaporation-condensation systems and methods of manufacturing and using the same |
CN105324161B (zh) * | 2013-05-28 | 2017-04-26 | 英派尔科技开发有限公司 | 薄膜系统及其使用方法和制造方法 |
CN112991984A (zh) * | 2021-04-13 | 2021-06-18 | 深圳市日航新技术有限公司 | 一种具有散热功能的显示屏 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3764483A (en) | 1970-10-05 | 1973-10-09 | B Tleimat | Rotating disk still with a hydrodynamically applied thin film |
US4121435A (en) | 1974-04-16 | 1978-10-24 | Kantor Frederick W | Rotary thermodynamic apparatus |
US4832114A (en) * | 1987-12-02 | 1989-05-23 | Yeh Hsu Chieh | Device for producing high heat transfer in heat exchanger tubes |
US4966226A (en) | 1989-12-29 | 1990-10-30 | Digital Equipment Corporation | Composite graphite heat pipe apparatus and method |
JP2666547B2 (ja) * | 1990-09-20 | 1997-10-22 | 三菱電機株式会社 | 熱交換装置及びその製造方法 |
US5409576A (en) | 1993-07-16 | 1995-04-25 | Tleimat; Badawi | Rotating evaporator device for the distillation or concentration of liquids |
US5441102A (en) * | 1994-01-26 | 1995-08-15 | Sun Microsystems, Inc. | Heat exchanger for electronic equipment |
US5878808A (en) | 1996-10-30 | 1999-03-09 | Mcdonnell Douglas | Rotating heat exchanger |
US6408937B1 (en) * | 2000-11-15 | 2002-06-25 | Sanjay K. Roy | Active cold plate/heat sink |
US6466442B2 (en) | 2001-01-29 | 2002-10-15 | Ching-Bin Lin | Guidably-recirculated heat dissipating means for cooling central processing unit |
US20030213585A1 (en) | 2002-03-21 | 2003-11-20 | David Reznik | Heating and cooling of viscous food products |
US6668911B2 (en) | 2002-05-08 | 2003-12-30 | Itt Manufacturing Enterprises, Inc. | Pump system for use in a heat exchange application |
US6839234B2 (en) | 2002-05-15 | 2005-01-04 | Matsushita Electric Industrial Co., Ltd. | Cooling device and an electronic apparatus including the same |
US6894899B2 (en) | 2002-09-13 | 2005-05-17 | Hong Kong Cheung Tat Electrical Co. Ltd. | Integrated fluid cooling system for electronic components |
US7055581B1 (en) | 2003-06-24 | 2006-06-06 | Roy Sanjay K | Impeller driven active heat sink |
TWI229583B (en) * | 2003-08-03 | 2005-03-11 | Hon Hai Prec Ind Co Ltd | Liquid-cooled heat sink device |
DE102004009500B3 (de) | 2004-02-27 | 2005-08-25 | Minebea Co., Ltd. | Kühleinrichtung zur Kühlung elektronischer Komponenten |
US7262967B2 (en) * | 2005-06-29 | 2007-08-28 | Intel Corporation | Systems for low cost coaxial liquid cooling |
JP2007064532A (ja) | 2005-08-30 | 2007-03-15 | Cosel Co Ltd | 放熱システム |
TW200711557A (en) | 2005-09-02 | 2007-03-16 | Sunonwealth Electr Mach Ind Co | Heat dissipation device |
US7424906B2 (en) * | 2006-04-19 | 2008-09-16 | Delphi Technologies, Inc. | High performance thermosiphon with internally enhanced condensation |
US20080142195A1 (en) | 2006-12-14 | 2008-06-19 | Hakan Erturk | Active condensation enhancement for alternate working fluids |
US7980078B2 (en) * | 2008-03-31 | 2011-07-19 | Mccutchen Co. | Vapor vortex heat sink |
-
2008
- 2008-08-04 CN CN200810041372.3A patent/CN101646327B/zh not_active Expired - Fee Related
-
2009
- 2009-08-04 US US12/535,530 patent/US8944150B2/en not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012142737A1 (en) * | 2011-04-18 | 2012-10-26 | Empire Technology Development Llc | Dissipation utilizing flow of refreigerant |
US8863821B2 (en) | 2011-04-18 | 2014-10-21 | Empire Technology Development Llc | Dissipation utilizing flow of refrigerant |
US9568253B2 (en) | 2011-04-18 | 2017-02-14 | Empire Technology Development Llc | Dissipation utilizing flow of refrigerant |
WO2014190478A1 (en) * | 2013-05-28 | 2014-12-04 | Empire Technology Development Llc | Evaporation-condensation systems and methods of manufacturing and using the same |
CN105324161B (zh) * | 2013-05-28 | 2017-04-26 | 英派尔科技开发有限公司 | 薄膜系统及其使用方法和制造方法 |
US10010811B2 (en) | 2013-05-28 | 2018-07-03 | Empire Technology Development Llc | Evaporation-condensation systems and methods for their manufacture and use |
US10065130B2 (en) | 2013-05-28 | 2018-09-04 | Empire Technology Development Llc | Thin film systems and methods for using same |
CN112991984A (zh) * | 2021-04-13 | 2021-06-18 | 深圳市日航新技术有限公司 | 一种具有散热功能的显示屏 |
Also Published As
Publication number | Publication date |
---|---|
US20100025015A1 (en) | 2010-02-04 |
CN101646327B (zh) | 2013-04-17 |
US8944150B2 (en) | 2015-02-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: INPIL SCIENCE + TECHNOLOGY DEVELOPMENT CO., LTD. Free format text: FORMER OWNER: INTELLECTUAL VENTURES ASIA CO., LTD. Effective date: 20130918 Owner name: INTELLECTUAL VENTURES ASIA CO., LTD. Free format text: FORMER OWNER: WANG HAO Effective date: 20130918 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130918 Address after: Delaware Patentee after: EMPIRE TECHNOLOGY DEVELOPMENT LLC Address before: Singapore Singapore Patentee before: Gao Zhi Invention Asia Co.,Ltd. Effective date of registration: 20130918 Address after: Singapore Singapore Patentee after: Gao Zhi Invention Asia Co.,Ltd. Address before: 100871, No. 301, fangzheng building, 298 Cheng Fu Road, Beijing, Haidian District (College of engineering, Peking University) Patentee before: Wang Hao |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130417 Termination date: 20190804 |