CN101644639B - Method and apparatus for rapid sample preparation in a focused ion beam microscope - Google Patents
Method and apparatus for rapid sample preparation in a focused ion beam microscope Download PDFInfo
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- CN101644639B CN101644639B CN2009101646570A CN200910164657A CN101644639B CN 101644639 B CN101644639 B CN 101644639B CN 2009101646570 A CN2009101646570 A CN 2009101646570A CN 200910164657 A CN200910164657 A CN 200910164657A CN 101644639 B CN101644639 B CN 101644639B
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Abstract
A coupon for preparing a TEM sample holder comprises a sheet of material that includes a TEM sample holder form. There is at least one section of the sheet connecting the TEM sample holder form to other portions of the sheet. A TEM sample holder is formed by cutting the TEM sample holder form from the coupon in a press. The cutting joins the tip point of a nano-manipulator probe tip with the formed TEM sample holder. The tip point of the probe has a sample attached for inspection in a TEM.
Description
The application be the applying date be November 3, international application no in 2004 be 200480033062.7 for PCT/US2004/036560, national applications number, denomination of invention divides an application for the application for a patent for invention of " in focused ion beam microscope, carrying out the method and apparatus of quick sample preparation ".
Priority request
The application requires the U.S. Provisional Patent Application No.60/19 of submission on November 11st, 2003,046 right of priority.
Technical field
The present invention relates to the microscopical use of FIB (FIB), it is used to prepare sample, supplies in transmission electron microscope (TEM), to carry out subsequent analysis, also relates to and is convenient to carry out these movable devices.
Background technology
In the device area and interconnect stack of current IC-components; Structurized artifact; Or even some structured layer may diminish to the auxiliary electron image or the FIB that can not use in the scanning electron microscope (SEM) and carries out reliable detection, and this microscope can provide the surface that is about 3nm image resolution ratio.By comparison, TEM check can provide meticulousr image resolution ratio (<0.1nm), but the sample that need be installed on the 3mm diameter grid dish has the part that can see through electronics (electrontransparent) (<100nm thickness).
The technology of development can be used to cut out or remove sample to be used for inspection afterwards, carried out the preliminary preparation mechanical of initial semiconductor dies sample before this inspection seldom needs or need in FIB, not prepare.These sampling techniques are included in " offing normal " method that the outdoor face of FIB carries out, and " original position " method of in FIB, carrying out.
This in-situ sampling technology is that a series of FIB grind and sample moves step, is used to produce the concrete sample relevant with the position, is used for carrying out observation subsequently at TEM or other analytical instrument.In position in the sampling process, the material sample (normally wedge shape) that comprises area-of-interest is at first separated from piece sample such as semiconductor wafer or mould through the ion beam process of lapping among the FIB fully.This sample is generally 10 * 5 * 5 μ m size.Use inside to receive executor then and combine with ion beam-assisted chemical vapor deposition (CVD) technology and carry out the removal of sampled sample, this CVD technology can use the FIB instrument to obtain.The suitable effector system of receiving is by Dallas, the Omniprobe Inc. of Texas, the Omniprobe AutoProbe 200 of manufacturing.The material that in CVD technology, is deposited is generally metal or oxide.
Then the TEM specimen holder is positioned in the visual field of FIB, and makes sampled sample drop to the edge of specimen holder with receiving executor.With the CVD metal deposition in the FIB vacuum chamber sample is fixed on the TEM specimen holder then.In case sample is connected on this TEM specimen holder, probe tip just grinds and sample separation through ion.The part that relates to the operation that comprises the TEM specimen holder in this method is called as " specimen holder connection " step.Can use traditional FIB grinding steps that sample is ground then,, be used to carry out TEM check or other analyses to prepare out a thin zone.Can be about the detailed introduction of in-situ sampling method at United States Patent(USP) No. 6,420,722 and 6,570, find in 170 the instructions.The content of these patent specifications is incorporated herein by reference, but they should not be considered to constitute with respect to prior art of the present invention owing in this background parts, mentioning.
The in-situ sampling technology is widely used, because this method allows people to utilize the unique ability of FIB, and these abilities is expanded to structure in the device of future generation and defective are tested.Because new FIB instrument can obtain the little ion beam spot size (spatial resolution so for example<10hm) present FIB sample technology of preparing can offer the best in the place that position feature is had demand.
The variation of this in-situ sampling method relates to sampled sample " grinding back surface ".This variation proposes according to " shower curtain (shower curtain) " this problem of effect, wherein, can behind the final thinning process of TEM preparation, on sampled sample, produce uneven face at the non-homogeneous high density material on the integrated circuit surface.These uneven masks have the vertical ridge parallel with ion beam direction, and this is because near the sample top closeer material has slower ion grinding rate, and herein, the top is restricted to the edge near ion beam source.This heterosphere is quite general in integrated circuit, for example, and copper or aluminium interconnection wiring and tungsten contacts.Is very important at the plane surface on the sampled sample in for the zone of TEM check attenuate for the TEM technology, for example electronic holography art.Grinding back surface is included in before the final thinning process sample is inverted, thus among the active layer of integrated circuit or near high density material can not grind the result to ion again and not exert an influence.
The in-situ sampling process can be reduced to three continuous steps.The first step is to use FIB to grind sample separation and sample is taken out from its raceway groove.Second step was " specimen holder connection " step, and in this step, sample is being moved on the probe tip on the TEM specimen holder.Be connected on the TEM specimen holder metal deposition of ion beam induced (usually with) then and separate with probe tip then.The 3rd step also was that final step is to use FIB to grind the thin part that sample attenuate one-tenth can be seen through electronics.
The most important part flower of used T.T. is on the specimen holder Connection Step in the process with in-situ sampling completion TEM sample.Used relative time amount depends on sampled sample and the required time quantum (ion beam grinding rate) of original block sample mechanical separation, but can between the 30%-60% of T.T. of TEM specimen preparation, change.If remove the specimen holder Connection Step, then can produce some crucial incomes and the benefit relevant with resource, carry sample and the TEM sample is connected to the step on the TEM specimen holder because removed.
For example, when not having the specimen holder Connection Step, semiconductor wafer can turn back in the technological process of the tight back of sampling.Attenuate to sample can carry out in an off-line FIB subsequently.This has reduced the crucial last load of online (clean room) FIB, this feasible process control of implementing sampling more easily, and reduced the required professional standards of process engineering personnel of operating online FIB.
In order to remove the specimen holder Connection Step; The probe tip that is connected with sample can directly link to each other with the material that will form the TEM specimen holder through appropriate method; This appropriate method can keep being connected between sampled sample and the probe tip, and prevents that probe tip and sample from separating with specimen holder in storage or the process in TEM, checked.Assembly should be not and the operation interference of TEM or other analytical instrument that will use, and should in the internal environment of TEM or other analytical instrument that will use, preserve finely.These appropriate method include but not limited to, make specimen holder material or probe tip material or the two mechanically deform; The electricity of probe tip and TEM specimen holder material or thermal (for example, electric welding); With suitable glue or cementing agent with probe tip therewith material combine; With CVD or evaporating materials probe tip is combined with TEM specimen holder material; Or other suitable means.This probe tip that will be connected with sample and TEM specimen holder carry out direct-connected method can within the vacuum chamber of FIB or other analytical instrument or outside carry out.
Summary of the invention
The preferred embodiments of the present invention comprise the appearance base that is used to prepare the TEM specimen holder.This kind base comprises a sheet material, is preferably copper or molybdenum, and its surface can be put down or have a corrugated structure.This sheet material comprises TEM specimen holder template, and this sheet material has at least a part this TEM specimen holder template to be connected to other parts of this sheet material.
In a further advantageous embodiment, TEM specimen holder template comprises a sheet material with C shape hole.Said C shape hole limits the periphery of a ring, and the opening in C shape hole limits the material piston ring land.This piston ring land is connected to ring on this sheet material, and has a passage to pass this sheet material, and it is connected to C shape hole at the edge of sheet material.
This TEM specimen holder comprises a ring, and said ring has circumferential clearance; Said circumferential clearance forms through TEM specimen holder template being pressed in two moulds centres and cutting out circumferential clearance from TEM specimen holder template.This TEM specimen holder can further comprise the one or more probe tips that are embedded in this ring, and wherein each probe tip further comprises a continuous sample.Can flow thereby make through exerting pressure and probe tip is embedded in the ring, or they can use cementing agent or receive on the TEM specimen holder through electricity or thermal weld technical battery to ring with one or more tips around the ring material of this needle point (shank).
In a further advantageous embodiment, this TEM specimen holder comprises rectangle or other any geometric configuratioies, and it can be used for maintaining one or more probe tips, and each probe tip comprises a continuous sample.
The method of the sample that a kind of preparation is used for checking at TEM also is provided, may further comprise the steps: the tip that sample is connected to probe; Probe tip is joined on the TEM specimen holder; And form the TEM specimen holder by probe tip and TEM appearance base.
The preferred embodiments of the present invention also comprise a kind of press, be used for cutting out the TEM specimen holder from TEM appearance base, and the probe tip that will be connected with sample join on this TEM specimen holder, and said press comprises: outer mold; Be positioned at the inner mold of outer mold; The profiling bar relative with inside and outside mould; The drift of cutting with the profiling bar coaxial arrangement; With the following pressing spring of profiling bar towards the inner mold biasing; One in response to the trigger that contact or other mechanism of profiling bar with internal mold, and the actuator in response to this trigger, is used for inwardly, outer mold drives and cut drift.This press can be positioned within the vacuum chamber of FIB or other analytical instrument or outside.
Description of drawings
Fig. 1 is the planimetric map of the TEM appearance base of the preferred embodiment of the present invention, and wherein, specimen holder is an annular, and will use a probe tip.
Fig. 2 is the planimetric map of the TEM appearance base of Fig. 1, shows the probe tip of before embedding and cutting, crossing this kind base location.
Fig. 3 is the planimetric map of the TEM appearance base of optional embodiment, and wherein, specimen holder is an annular, and will use four probe tip.
Fig. 4 is the planimetric map of the subassembly of the TEM specimen holder that forms of the TEM appearance base by Fig. 1 and probe tip, has the ring opening, allows end face to sampled sample to carry out the FIB ion and grinds.
Fig. 5 is the TEM specimen holder that forms of the TEM appearance base by Fig. 2 and the planimetric map of four probe tip subassemblies, has the ring opening, allows end face to sampled sample to carry out the FIB ion and grinds.
Fig. 6 is the cut-open view that is embedded into the probe tip in the TEM appearance base.
Fig. 7 is the cut-open view of the probe tip that links to each other with TEM corrugation appearance base through electricity or thermal.
Fig. 8 is the cut-open view of the probe tip that uses cementing agent and link to each other with the TEM specimen holder.
Fig. 9 is the cut-open view of the probe tip that links to each other with the TEM specimen holder with CVD or evaporating materials.
Figure 10 is the press and the partial sectional view of cutting drift of preferred embodiment.
Figure 11 is the press and the local amplification view of cutting drift of Figure 10.
Figure 12 is the skeleton view of cutting drift and inside and outside mould of Figure 10.
Figure 13 shows and is combined with an appearance base and a probe tip for the skeleton view of cutting drift of Figure 10.
Figure 14 is probe tip, be positioned at terminal profiling bar and the cross-sectional view of TEM specimen holder of the preferred embodiment of probe tip top, and wherein, probe tip is embedded in the TEM specimen holder.
Figure 15 is the planimetric map of the subassembly of TEM specimen holder shown in Figure 4 and probe tip, wherein in the specimen holder ring, has the circumferential clearance that is used for grinding back surface.
Figure 16 is the planimetric map of the subassembly of TEM specimen holder shown in Figure 5 and four probe tips, wherein, has the ring opening that is used to carry out grinding back surface.
Figure 17 is the cross-sectional view of corrugation TEM appearance base.
Figure 18 is the cross-sectional view that is embedded in the probe tip in the corrugation appearance base.
Figure 19 is the planimetric map of the TEM appearance base of preferred embodiment, and wherein, specimen holder is a rectangle, and will use four probe tip, has permission the sample end face is carried out the opening that FIB grinds.
Figure 20 is the planimetric map of the TEM appearance base of preferred embodiment, and wherein, specimen holder is a rectangle, and will use four probe tip, has permission the opening that back side FIB ion grinds is carried out in the bottom surface of sampled sample.
Embodiment
The preferred embodiments of the present invention comprise the method and apparatus that the probe tip that is connected with sample is linked to each other with the TEM specimen holder, and it has replaced the specimen holder Connection Step in the classic method.In the preferred embodiment, this mechanical process is carried out in vacuum chamber outside, but it also can carry out in that FIB is indoor.In the preferred embodiment, the first step of in-situ sampling process (detachment process of sample) is accomplished in FIB, and the probe tip that will be connected with sample is then removed from the FIB chamber.This is removed process and can realize through many means; Include but not limited to; Pass the sample gate of the FIB that is provided with door and remove probe and connect sample; Pass the vacuum pressure transfer chamber of receiving on the manipulator device and move said probe tip and connects sample, perhaps in the box in a vacuum transition cabin of passing the FIB chamber mobile said probe tip and connect sample.Only listed first kind of means do not need the FIB vacuum chamber to lead to atmosphere, and it can make reduce cycling time, makes equipment have long-term reliability.
The appearance base
In a preferred embodiment, receiving probe tip 160 mechanical molding through a combination of executor probe 150 links to each other with TEM appearance base 100 with cutting operation.As shown in Figure 1, this TEM appearance base 100 is about sheet materials that have same thickness with final sample frame 170.This TEM appearance base 100 comprises the shape (the preparatory template of TEM) of final sample frame 170, but this preparatory template is not also separated by complete mechanical.Can in sheet material, produce most of net shapes of common 3mm TEM specimen holder 170 in advance, as consumable appearance base 100.This preparatory template still links to each other with appearance base 100 through other parts 120 of fin, piston ring land or specimen holder material.This preparatory template has ring 180, and it will become the part of final TEM specimen holder 170.Therefore this ring 180 is limited in the C shape hole 135 in the appearance base 100.The opening in C shape hole 135 is the piston ring lands 120 that connect usefulness.Also can use other close-shaped, for example rectangle.
The specimen holder material is soft copper preferably, but also can be molybdenum, aluminium, gold, silver, nickel or beryllium, as long as it is suitable for the application scenario.In the mechanical step of detachment process, appearance base 100 makes specimen holder template 170 orientations and holds it in the appropriate location, is described below.Fig. 2 show one cross that kind base 100 places receive executor probe tip 150.This probe 150 has probe tip 160, and it maintains sample 140, is used for analyzing.Usually, probe tip 160 is meticulous tungsten pins.
All the other fins, the piston ring land 120 of appearance base material are connected to partially-formed TEM specimen holder 170 on kind base 100, and in the mechanical molding of said combination and cutting operation process, are cut, and are described below.Said TEM specimen holder 170 preferably forms the shape of ring 180; Its circumferential clearance 190 makes and can carry out the grinding of FIB ion to the perhaps end face or the bottom surface of the sample in the plane of TEM specimen holder 170 140 afterwards, thereby the thin part that can see through electronics of the plane almost parallel of generation and TEM specimen holder 170.Also can use permission in the ring 180 of the TEM specimen holder 170 that forms, to have other shapes of circumferential clearance 190.For example Figure 19 and 20 shows the TEM specimen holder 170 with two gaps 190, wherein, TEM specimen holder 170 be shaped as rectangle.
Fig. 4,5 and 19 shows TEM specimen holder 170, and wherein, probe tip 160 is mounted for that sample 140 is carried out the top side ion and grinds.Figure 16,20 shows TEM specimen holder 170, and wherein, probe tip 160 is mounted for sample 140 is carried out grinding back surface.
Form the method for TEM specimen holder
The probe tip 160 that is connected with sample 140 can engage with the material that will form TEM specimen holder 170; Thereby keep the connection between sample 140 and the probe tip 160, and prevent that probe tip 160 from separating from TEM specimen holder 170 in the process of carrying, storing or in TEM, checking with sample 140.This assembly should be not and the normal running interference of TEM or other analytical instrument that will use, and should in the internal environment of TEM or other analytical instrument that will use, preserve finely.
Fig. 6-9 and 18 shows and joins probe tip 160 on the TEM appearance base 100 method.Fig. 6 is the material of kind base 100 or the partial view of probe tip 160 or the mechanically deform of the two.Fig. 7 shows probe tip 160 and for example welds with the electricity or the thermal 320 of appearance base 100.Fig. 7 also shows the corrugation 175 in the TEM specimen holder material; The diameter of corrugation Duan Yueyu probe tip 160 is identical in this case.Fig. 8 shows the process that probe tip 160 is attached to TEM specimen holder 170 materials with suitable glue or cementing agent 330.Fig. 9 shows the process that probe tip 160 is attached to TEM specimen holder 170 materials with CVD or evaporating materials 340.
In case after having TEM specimen holder 170 generations of the one or more probe tips 160 that are connected with sample 140; It just can turn back to FIB and be used for final attenuate operating process; In this process, the part of the expectation of one or more sampled sample 140 is thinned (being generally 50-250nm) to make it to see through electronics.This final thinning process can carry out in off-line FIB, so that the maximize production of online FIB and utilization are effectively specialty or special-purpose off-line FIB lab resources, these off-lines FIB laboratory can be positioned at the clean room outside.But, being positioned at FIB if be used for sample is connected to the device of TEM specimen holder, then final attenuate operation can be carried out immediately.
In an optional method, final attenuate step can be sampling procedure after and is removed to be used for being connected with the TEM specimen holder of FIB outside from FIB at the probe tip that is connected with sample 140 160 and carry out at FIB before.In this method, need the TEM specimen holder 170 that is connected with sample 140 that machinery forms not turned back to FIB and be used for final thinning process.But final thinning process need be spent the extra time in initial FIB.In this method, the probe tip 160 that is connected with sample 140 is moved to the appropriate location among the FIB, and carries out final attenuate step with the ion beam among the FIB then.Then, use foregoing mechanical molding and cutting step, the probe tip 160 that is connected with sample 140 is removed from FIB, and links to each other with TEM specimen holder 170.Recommend but and do not require and make probe tip 160 mechanically stables so that probe tip 160 is reduced to acceptable level with respect to any vibration of FIB chamber, perhaps reduce any mechanical drift of probe tip 160 with respect to the FIB chamber.Can through make among probe tip 160 and the FIB between the moderately stable surface or among sample 140 and the FIB suitably between surface or the object Mechanical Contact make probe tip 160 mechanically stables that are connected with sample 140.The edge or the corner of the physical construction that for example links to each other with the FIB platform, and probe tip 160 can carry out Mechanical Contact.Perhaps, the feather edge of sample 140 carries out Mechanical Contact with the surface of sample stage or any stable mechanical object (for example wafer surface) that links to each other with sample stage.Should stablize object can be rigidity or can be plasticity or elastic deformation, accepting the shape of probe tip 160 or sampled sample 140, and any relative mechanical vibration in the further buffered probe needle point 160.
In another optional method, final attenuate step can be carried out in FIB on the TEM specimen holder after sampling procedure and in the probe tip that is connected with sample 140 160 joins the FIB vacuum chamber to before.In this method, the probe tip 160 that is connected with sampled sample 140 moves to the appropriate location among the FIB, and carries out final attenuate step with the ion beam among the FIB then.Then, the probe tip 160 that has the sample 140 that attenuate crosses can use foregoing mechanical molding and working angles to be connected on the TEM specimen holder 170 in the FIB vacuum chamber.In this method, be used for the device that sample is connected on the TEM specimen holder is positioned at the FIB vacuum chamber.Therefore, in-situ sampling, the probe tip that is connected with sample and TEM specimen holder be connected and final attenuate operation can be carried out in the FIB vacuum chamber as a plurality of steps in the technology.
Specimen holder forms device
Fig. 1 and 2 shows aforesaid TEM appearance base 100.The piston ring land 120 that the specimen holder part 170 of appearance base 100 is linked to each other with the remainder of appearance base 100 will be cut in cutting and shaping operation process, with formation TEM specimen holder 170.The thickness of appearance base 100 by with probe tip 160 embeddings and mechanical caging in appearance base 100 materials and still can make final sample frame 170 have enough intensity folding of undesirable TEM specimen holder 170 to be taken place or separate required thickness at probe tip 160 embedded locations preventing.For example, for the tungsten tipped probe needle point 160 of diameter 125 μ m (.005 "), thickness is that the copper of 250-500 μ m (.010 "-.020 ") is suitable for kind base 100.Specimen holder 170 materials and appearance base 100 materials that center on cut away in the zone 130 at probe tip and all cave in slightly; To allow to be used for the space of cutting surface; Can not stay any part of the cutting probe tip 160 of the 3mm external diameter that extends beyond standard TEM specimen holder 170 with cutting probe tip 160, or extend beyond any part of cutting probe tip 160 of outer boundary of the standard TEM specimen holder 170 of any other suitable shape.
Include mating holes 110, to allow that appearance base 100 is aligned in the mechanical hook-up that is used for cutting with shaping operation.In the situation that adopts C shape TEM specimen holder 170; Probe tip clearance groove 125 (Fig. 3) is the straight trough that passes kind base 100; It surpasses the external diameter of TEM specimen holder 170 to external radiation from the center of TEM specimen holder 170; This has produced the gap that is used for probe tip 160, to allow before cutting and shaping operation, along the surface of TEM specimen holder 170 probe tip 160 is alignd.
In cutting and shaping operation, TEM specimen holder 170 is cut out from appearance base 700 (Fig. 4).As stated; TEM specimen holder 170 can be made C shape template; Or other have the shape of circumferential clearance 190; Ground so that can carry out the FIB ion to the sampled sample in the plane of TEM specimen holder 170 afterwards,, perhaps also can make other shapes that allow to carry out same process to produce approximately and the thin part of TEM specimen holder 170 parallel plane abilities through electronics.In order to carry out the grinding of sample 140 end faces afterwards, gap 190 can cut out from template at the opening part in C shape hole 135, and this opening is limited by the piston ring land 120 that template is linked to each other with appearance base 100.In order to carry out the grinding of sample 140 bottom surfaces afterwards, the gap can cut out from template in the position roughly relative with the opening in hole 135.
In cutting and forming process, harder tungsten tipped probe needle point 160 be pressed into TEM specimen holder 170 than in the soft material, and the part that extends to outside the external diameter of 3mm TEM specimen holder shape 170 on the probe tip 160 is cut off.TEM specimen holder 170 materials are induced with plastic yield, thereby copper product machinery is round probe tip 160, to be locked in position (Fig. 6).
Figure 10-13 shows the conventional process of cutting and shaping operation.The operator is placed on TEM appearance base 100 on the outer mold 280 and (carries out this operation and can manually carry out if this operates in the FIB outside; Perhaps; If it carries out in the FIB vacuum chamber and can carry out automatically); And each probe tip 160 is alignd as follows; That is, each probe tip 160 aligns with probe tip clearance groove 125, and the sample 140 that links to each other with probe tip 160 is oriented to be parallel to the plane of TEM specimen holder 170.Inner mold 290 is all supporting specimen holder 170 and probe tip 160 with outer mold 280.After in case each probe tip fixes; The operator manually or automatically should one or more probe tip, TEM appearance base 100 and all supporting hardwares all are positioned at below the main mounting blocks 220; And activate a pneumatic switch 310, make under the effect of main mounting blocks 220 and the actuator 300 of the hardware that links to each other on be positioned at above-mentioned main mounting blocks 220 to move down.Actuator 300 is preferably pneumatic, but also can be hydraulic pressure or electronic.Also can be useful on the vent line 305 of pneumatic actuator.
When showing and move down along with main mounting blocks 220, Figure 11-13 is shaped and the process of cutting operation.Profiling bar 250 contacts each probe tip 160, and it is pressed downwardly onto in TEM specimen holder 170 materials.This process lasts till that the interface of TEM specimen holder and probe tip produces enough resistances, can overcome the power of pressing spring 230 down.The power of following pressing spring 230 is regulated the power that bolt 240 is set to hope by spring, all is pressed into fully in the TEM appearance base 100 to guarantee each probe tip 160.Lean on bar 250 to comprise one or more teeth 260, this tooth makes it when quilt is downward, and the specimen holder material of this probe tip 160 of probe tip periphery seal is flowed.
In case the resistance of spring 230 is overcome; And when leaning on mobile the stopping of bar 250, cut drift 270 and continue to advance downwards, use the supporting role of inner mold 290 and outer mold 280; Length is on demand sheared each probe tip 160; Cut off the fin 120 that connects TEM specimen holder 170 from the TEM appearance base 100 of remainder, and in this specimen holder 170, produce C shape opening, or any other suitable shaped aperture.The operator discharges pneumatic switch then, so that main mounting blocks 220 turns back to its initial position with the hardware that links to each other, TEM specimen holder 170 is separated with TEM appearance base 100, and makes specimen holder comprise one or more probe tips 160 that are connected with sample 140.
Because those skilled in the art can revise foregoing specific embodiment, claim scope of the present invention has contained this modification and equivalent variations.
Claims (10)
1. assembly that is used to prepare the example of transmission electron microscope frame, said assembly comprises:
Transmission electron microscope appearance base,
At least one probe tip, said probe tip has probe tip; With
Press is used for each probe tip joined on the transmission electron microscope appearance base and from this kind base and cuts out the example of transmission electron microscope frame.
2. assembly according to claim 1 is characterized in that, said appearance base also comprises:
Sheet material; With
One or more probe tip clearance grooves that pass said sheet material are used for example of transmission electron microscope shut die plate is connected to the edge of said sheet material.
3. assembly according to claim 2 is characterized in that, said sheet material is a kind of metal, and it is selected from the group that following material is formed: copper, molybdenum, aluminium, gold, silver, nickel and beryllium.
4. assembly according to claim 2 is characterized in that said sheet material has surperficial corrugation.
5. assembly according to claim 1 is characterized in that, said appearance base also comprises mating holes, is used for the appearance base is aligned in press.
6. assembly according to claim 2 is characterized in that, also comprises:
Be arranged at least one hole of said appearance base, it limits the outer boundary of example of transmission electron microscope shut die plate; Said hole has an opening;
The opening in said hole limits a material piston ring land;
Said piston ring land is connected to said sheet material with example of transmission electron microscope shut die plate; And
Pass at least one probe tip clearance groove of said sheet material, it is connected to said hole at the edge of said sheet material.
7. assembly according to claim 6 is characterized in that, said hole is a C shape.
8. assembly according to claim 6 is characterized in that, said example of transmission electron microscope frame is a rectangle.
9. assembly according to claim 1 is characterized in that, said press also comprises:
Outer mold;
Be positioned at the inner mold of outer mold;
The profiling bar relative with inside and outside mould;
The drift of cutting with the profiling bar coaxial arrangement;
Make the following pressing spring of profiling bar towards the inner mold biasing; With
Actuator is used for cutting drift towards inside and outside mould driving.
10. assembly according to claim 9 is characterized in that said profiling bar has tooth, is used to make the example of transmission electron microscope frame material around probe tip to flow.
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US51904603P | 2003-11-11 | 2003-11-11 | |
US60/519,046 | 2003-11-11 | ||
US10/896,596 | 2004-07-22 | ||
US10/896,596 US7053383B2 (en) | 2003-11-11 | 2004-07-22 | Method and apparatus for rapid sample preparation in a focused ion beam microscope |
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CN2009101646602A Expired - Fee Related CN101644642B (en) | 2003-11-11 | 2004-11-03 | Method and apparatus for rapid sample preparation in a focused ion beam microscope |
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JP5973466B2 (en) | 2011-01-28 | 2016-08-23 | エフ・イ−・アイ・カンパニー | Preparation of TEM sample |
JP6224612B2 (en) | 2011-12-01 | 2017-11-01 | エフ・イ−・アイ・カンパニー | High-throughput TEM preparation process and hardware for backside thinning of cross-section observation slices |
US10465293B2 (en) * | 2012-08-31 | 2019-11-05 | Fei Company | Dose-based end-pointing for low-kV FIB milling TEM sample preparation |
EP2755226B1 (en) * | 2013-01-15 | 2016-06-29 | Fei Company | Sample carrier for an electron microscope |
CN103278357A (en) * | 2013-04-28 | 2013-09-04 | 上海华力微电子有限公司 | Preparation method of fixed-point planar-view TEM sample |
CN103698179B (en) * | 2013-12-17 | 2016-04-13 | 武汉新芯集成电路制造有限公司 | A kind of method preparing specific failpoint transmission electron microscope planar sample |
CN103969105B (en) * | 2014-05-21 | 2017-01-18 | 上海华力微电子有限公司 | Vibration reduction device and method for focusing ion beam machine probe |
CN107576823A (en) * | 2017-09-05 | 2018-01-12 | 浙江大学 | Nanopositioner for transmission electron microscope sample bar |
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JP2001021467A (en) * | 1999-07-08 | 2001-01-26 | Hitachi Ltd | Sample preparing method through use of focusing ion beam and focusing ion beam preparing device |
WO2002095378A1 (en) * | 2000-05-22 | 2002-11-28 | Moore Thomas M | Method for sample separation and lift-out |
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- 2004-11-03 CN CN2009101646585A patent/CN101644640B/en not_active Expired - Fee Related
- 2004-11-03 CN CN200910164659XA patent/CN101644641B/en not_active Expired - Fee Related
- 2004-11-03 CN CN2009101646570A patent/CN101644639B/en not_active Expired - Fee Related
- 2004-11-03 CN CN2009101646602A patent/CN101644642B/en not_active Expired - Fee Related
- 2004-11-03 CN CN2004800330627A patent/CN1879188B/en not_active Expired - Fee Related
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US5270552A (en) * | 1991-08-22 | 1993-12-14 | Hitachi, Ltd. | Method for separating specimen and method for analyzing the specimen separated by the specimen separating method |
JP2001021467A (en) * | 1999-07-08 | 2001-01-26 | Hitachi Ltd | Sample preparing method through use of focusing ion beam and focusing ion beam preparing device |
WO2002095378A1 (en) * | 2000-05-22 | 2002-11-28 | Moore Thomas M | Method for sample separation and lift-out |
US6570170B2 (en) * | 2001-03-01 | 2003-05-27 | Omniprobe, Inc. | Total release method for sample extraction from a charged-particle instrument |
Also Published As
Publication number | Publication date |
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CN1879188A (en) | 2006-12-13 |
CN101644640B (en) | 2012-07-04 |
CN1879188B (en) | 2010-12-08 |
CN101644642A (en) | 2010-02-10 |
CN101644639A (en) | 2010-02-10 |
CN101644640A (en) | 2010-02-10 |
CN101644642B (en) | 2012-03-14 |
CN101644641A (en) | 2010-02-10 |
CN101644641B (en) | 2012-07-04 |
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