CN101641413A - Conductive resin composition and substrate having conductive pattern obtained by using the same - Google Patents
Conductive resin composition and substrate having conductive pattern obtained by using the same Download PDFInfo
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- CN101641413A CN101641413A CN200880008391A CN200880008391A CN101641413A CN 101641413 A CN101641413 A CN 101641413A CN 200880008391 A CN200880008391 A CN 200880008391A CN 200880008391 A CN200880008391 A CN 200880008391A CN 101641413 A CN101641413 A CN 101641413A
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- organic binder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
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- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Conductive Materials (AREA)
- General Physics & Mathematics (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
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Abstract
Disclosed is a conductive resin composition which is excellent in oxidation resistance at high temperatures and enables to form a conductive pattern during fine pattern formation. Also disclosed is asubstrate having a low-cost conductive pattern using such a conductive resin composition. Specifically disclosed is a conductive resin composition containing an organic binder (A) and a conductive powder (B), which is characterized in that the conductive powder (B) contains a two-layer-coated copper particle (C) having a core of a copper particle, a first metal coating layer formed on the surfaceof the copper particle and a second metal coating layer as the outermost layer. The conductive resin composition is further characterized in that the first metal coating layer is composed of at leastone element selected from Ni, Co, Mn and Cr, and the second metal coating layer is composed of Ag. Also specifically disclosed is a substrate having a conductive pattern formed by using the conductiveresin composition.
Description
Technical field
The present invention relates to be used to form the conductive resin composition of the various conductive patterns that constitute ltcc substrate, printed circuit board (PCB), slim display panel and have the substrate that uses the conductive pattern that said composition obtains.
Background technology
All the time, contain the conductive resin composition of metal-powders such as silver powder owing to having shown that good electrical conductivity is widely used in the electronic instrument part.For example, be used to form the circuit of circuit substrate.By conductive resin composition is coated on the substrate, after carrying out the exposure of drying, selectivity and developing, burn till, on substrate, form this circuit thus.
As such conductive resin composition, use the composition of organic binder bonds such as containing heat-curing resin, electroconductive powder, solvent usually.Especially as electroconductive powder, low and viewpoint that also can burn till air atmosphere considers that silver powder is widely used from resistance value.
Yet,, therefore, just studying with other more cheap electroconductive powders and replacing because the price change of silver powder is big.For example, copper powder is more cheap than silver powder, but compares with silver powder, and there is the resistance value height in copper powder, easy oxidized shortcoming when pyroprocessing.In addition,, have the advantage lower, but the same, still have the resistance value height, an oxidized shortcoming easily when pyroprocessing with copper powder than silver powder price although though nickel, aluminium, tungsten or molybdenum powder are higher than copper on price.That is, when in atmosphere, burning till above-mentioned each powder, can not obtain to tolerate scale resistance and low-resistance conductive pattern of the high-temperature technology that surpasses 500 ℃.
In addition, in order to improve the problems referred to above, to with metal powders such as copper powders as core, electroconductive powder at its surface-coated other metals also has various researchs (patent documentation 1 and patent documentation 2), a kind of electroconductive powder has especially been proposed in patent documentation 3, it is coated with tin on the copper powder of core, surface-coated silver arranged at it again.
Patent documentation 1: TOHKEMY 2006-86123 communique (claims)
Patent documentation 2: TOHKEMY 2005-330535 communique (claims)
Patent documentation 3: TOHKEMY 2004-156062 communique (claims)
Summary of the invention
The problem that invention will solve
Yet, the reasons such as oxidation of core metals such as use is poor owing to the adhesion stability of coated metal as the conductive resin composition that core and 1 layer such clad metal powder of lining silver form with copper powder, copper powder, still there is the problem that can not obtain satisfied resistance value in the conductive pattern that is fired into.
In addition, the tin that is covered on the copper powder of core has two-layer coating though coat copper powders at 2 layers of its surface-coated silver again, can not give copper powder enough scale resistances, still has the problem that can not obtain the resistance value of being satisfied with.
Main purpose of the present invention is, the conductive resin composition of the electroconductive powder that contains low cost, low resistance and scale resistance excellence is provided.
In addition, other purposes of the present invention are, a kind of substrate with the conductive pattern that uses conductive resin composition and obtain is provided, and wherein said conductive composition contains the electroconductive powder of low cost, low resistance and scale resistance excellence.
The scheme that is used to deal with problems
Therefore, the inventor etc. further investigate above-mentioned prior art problems, found that, has the coating metal layer that constitutes by at least a metal that is selected among Ni, Co, Mn, the Cr by using as core and on the surface of this copper powder with copper powder, and the multilayer that has the coating metal layer that the Ag by high electroconductibility and scale resistance constitutes at outermost layer coats copper powder as conductive material, the conductive pattern of the scale resistance excellence in the time of can forming low cost, low resistance and high temperature.At this, the formed coating metal layer in core surface is characterised in that the metallic substance higher than firing temperature by fusing point forms.
The words that are described more specifically, conductive resin composition of the present invention is the conductive resin composition that contains organic binder bond and electroconductive powder, it is characterized in that, as aforementioned electroconductive powder, the use multilayer coats copper powder and forms, wherein said multilayer coating copper powder, has the coating metal layer that is made of at least a metal that is selected among Ni, Co, Mn, the Cr, and has the coating metal layer that is made of Ag at outermost layer as core with copper powder on the surface of this copper powder.
In the such conductive resin composition of the present invention, aforementioned organic binder bond is any one in drying property organic binder bond, Thermocurable organic binder bond, the light solidified organic binder bond.
In addition, the bed thickness of the coating metal layer on aforementioned copper powder surface is preferably 0.1～1.0 μ m, and the bed thickness of aforementioned outermost coating metal layer is preferably 0.1～0.6 μ m.
Substrate with conductive pattern of the present invention uses above-mentioned conductive resin composition and obtains.
The invention effect
According to the present invention, can provide the scale resistance excellence that contains when high temperature, the conductive resin composition of also favourable electroconductive powder aspect cost.In addition, according to the present invention, can form cheap conductive pattern.
Embodiment
Below, the present invention will be described.
The maximum of conductive resin composition of the present invention is characterised in that, as the electroconductive powder that constitutes composition, used multilayer to coat copper powder, wherein said multilayer coat copper powder with copper powder as core, have the coating metal layer that constitutes by at least a metal that is selected among Ni, Co, Mn, the Cr on the surface of this copper powder, and have the coating metal layer that constitutes by Ag at outermost layer.
Here, in the surface-coated method that is selected from the metal level of at least a metal among Ni, Co, Mn, the Cr as the copper powder of core, can enumerate methods such as electroless plating method, electrochemical plating, dip process, vapour deposition method, consider that from the viewpoint of the excellent in stability of the easiness made, quality electroless plating method is suitable the use.
Can adopt known method commonly used that this copper powder is implemented electroless plating, it is 0.1～1.0 μ m that preferably treatment becomes the bed thickness of coating.When this bed thickness was lower than 0.1 μ m, the scale resistance during high temperature was poor, and the remarkable increase of resistance value takes place, and in addition, storage stability is impaired, and gelation, viscosity that paste takes place easily increase.On the other hand, when bed thickness surpasses 1.0 μ m, during the surface treatment of copper powder, form the reunion powder easily, therefore not preferred.
In addition, the coating metal layer by outermost Ag constitutes with above-mentioned the same, also can adopt known common chemical plating method to form, and in this plating, it is 0.1～0.6 μ m that preferably treatment becomes the bed thickness of coating.When this bed thickness was lower than 0.1 μ m, the scale resistance during high temperature was poor, and the remarkable increase of resistance value takes place, and in addition, storage stability is impaired, and gelation, viscosity that paste takes place easily increase.On the other hand, when bed thickness surpasses 0.6 μ m, during the surface treatment of copper powder, form the reunion powder easily, therefore not preferred.
Coat in the copper powder in such multilayer,, can use commercially available copper powder known commonly used as the copper powder of core.Preferred use median size is the copper powder of 0.1～7 μ m.
As the surface-coated metal level that at core is copper powder, preferred especially Ni, Co, Mn in Ni, Co, Mn, Cr.
In addition, coating copper powder for multilayer, is more than 3 layers the time at the surface-coated layer of copper, and the middle layer can be the metal level that is selected from least a metal among Ni, Co, Mn, the Cr, and outermost Ag layer also can be multilayer.
Such multilayer coats preferred its powder shape of copper powder for roughly spherical, and median size is 0.5～10 μ m.When median size was lower than 0.5 μ m, the median size that becomes the copper powder of core was lower than 0.1 μ m, was difficult to carry out the even metal lining.On the other hand, when median size surpassed 10 μ m, the shape of conductive pattern became gently, and the formation variation of fine rule is therefore not preferred.
With respect to the organic binder bond of 100 mass parts formation composition, the use level that such multilayer coats copper powder preferably cooperates with the ratio of 50～2000 mass parts.When the use level of multilayer coating copper powder was lower than 50 mass parts, the live width that conductor circuit takes place was easily shunk or broken string, on the other hand, when cooperating in a large number above 2000 mass parts ground, dispersed reduction, the formation difficulty of paste.
Below, the organic binder bond that constitutes conductive resin composition of the present invention is described.
In the present invention, as organic binder bond, can use in drying property organic binder bond, Thermocurable organic binder bond, the light solidified organic binder bond any one.
The drying property organic binder bond here is meant, forms the resin of filming thereby can remove to desolvate by heat drying; The Thermocurable organic binder bond is meant, is heated or the effect of catalyzer, solidifies by intermolecular cross-linking, forms the resin of cured coating film; In addition, the light solidified organic binder bond is meant, is subjected to the effect of ultraviolet ray, electron rays isoreactivity energy-ray, solidifies by intermolecular cross-linking, forms the resin of cured coating film.Can optionally described organic binder bond (resin, oligopolymer or compound) be dissolved or be scattered in the solvent and use to adjust to suitable viscosity.In addition, when organic binder bond itself was aqueous, the use of solvent can be omitted.
Resin as drying property organic binder bond, Thermocurable organic binder bond can use ethylene series hydroxyl polymer-containings such as acrylic acid series multiple alcohol, polyvinyl alcohol, polyvinyl acetal, vinylbenzene-vinyl carbinol resin, resol; Derivatived celluloses such as methylcellulose gum, ethyl cellulose, Natvosol; Various resins such as ethylene-vinyl acetate copolymer, Synolac, alkyd resol, butyral resin, Resins, epoxy, modified epoxy, acrylic resin, urethane resin, vibrin.Especially, during as the Thermocurable organic binder bond, can and use curing catalysts, hot radical polymerization starters such as superoxide, acid catalyst.
As the light solidified organic binder bond; can use the resin of photosensitivity groups such as ethylenic unsaturated bonds such as containing vinyl, allyl group, acryl, methacryloyl, propargyl, the existing known various photoresists (photosensitivity prepolymer) such as resin that for example on side chain, have the acrylic copolymer of ethylenically unsaturated group, unsaturated carboxylic acid-modified Resins, epoxy or itself and the further addition of multi-anhydride are obtained.These organic binder bonds can with molecule in have 1 above ethylenic unsaturated bond compound, be that photopolymerization monomer or oligopolymer merge and use.In addition, this light solidified organic binder bond can be used in combination with Photoepolymerizationinitiater initiater, photopolymerization promoter.
In the conductive resin composition of the present invention,, can merge and use Thermocurable organic binder bond and light solidified organic binder bond as the organic binder bond that constitutes composition.At this moment, composition of the present invention is a light solidifying/heat solidifying resin composition.
Conductive resin composition of the present invention is burnt till when forming conductive pattern, for the intensity that improves described conductive pattern, with the adaptation of substrate, cooperate 1～30 mass parts low melting glass powder in preferred per 100 mass parts electroconductive powders.
As such low melting glass powder, be fit to using second-order transition temperature (Tg) is that 300～500 ℃, glass softening point (Ts) are 400～600 ℃ glass powder, for example is the glass powder of principal constituent with plumbous oxide, bismuth oxide, zinc oxide or Lithium Oxide 98min.In addition, consider from the viewpoint of resolving power that preferably using median size is the following glass powders of 10 μ m, preferred especially median size is the glass powder of 0.5～3 μ m.
In addition,, can not cause conductive pattern in the scope of bad influence, can in conductive resin composition of the present invention, cooperate SiO 2 powder, particularly synthetic soft silica micropowder in order to improve printing.
When in conductive resin composition of the present invention, using the light solidified organic binder bond, increase, preferably use preserving stabilizer in order to prevent gelation, viscosity as organic binder bond.Particularly, can enumerate organic acid, mineral acid, P contained compound etc.
Further, conductive resin composition of the present invention optionally can cooperate various additives such as defoamers such as silicon-type, acrylic acid series and flow agent, dispersion agent, the silane coupling agent that is used to improve the overlay film adaptation, antioxidant.
More than Shuo Ming conductive resin composition of the present invention can followingly be made: form according to the rules various compositions are in harmonious proportion after, use 3 roller mills, mixing roll with its blending dispersion, perhaps use rotation revolution stirrer high-speed stirring and disperse.
After being printed on the base material by silk screen printing etc. the conductive resin composition of the use drying property organic binder bond of the present invention that makes like this, for example use the hot air type drying oven 100 ℃～150 ℃ following heat dryings 5～10 minutes, remove and desolvate, form conductive pattern.
After being printed on the base material by patterns such as silk screen printings the conductive resin composition of use Thermocurable organic binder bond of the present invention, for example heating makes its thermofixation under 120 ℃～180 ℃ temperature, forms conductive pattern.
In addition, be printed on base material on by patterns such as silk screen printings the conductive resin composition of use light solidified organic binder bond of the present invention after, use active energy beam to make its curing, form conductive pattern.
Especially, at the process exposure imaging, when being fired into conductive pattern, for film forming situation on film in advance, it is laminated on the base material, and the situation for being paste-like is printed on the base material by whole faces such as silk screen printings, use heated air circulation type drying oven, far infrared drying stove etc. then, for example descended dry 5～40 minutes, make organic solvent evaporation, obtain tack-free filming at 60～120 ℃.Afterwards, expose, develop, burn till, form the conductive pattern that constitutes by burned material by carrying out selectivity.
Embodiment
Embodiment and comparative example are shown below the present invention is carried out specific description, the present invention is not subjected to any qualification of following embodiment certainly.In addition, if not otherwise specified, " part " and " % " all is quality criterias.
Adopt various 2 layers shown in the electroless plating method making table 1 of known powder commonly used to coat copper powders.At this moment plating thickness is calculated by following method.
That is, coat copper powder with 2 layers and dissolve, utilize atomic absorption method to analyze the plating element, analyze the content of plating overlay film, calculate the plating thickness according to copper particle grain size, proportion by this content.But, for undissolvable 2 layers element that coats copper powders or do not have light source, with the result that utilizes x-ray fluorescence analysis to obtain as content.
(organic binder bond)
In the flask of being furnished with thermometer, stirrer, dropping funnel and reflux exchanger, adding is as the diethylene glycol ether acetate alone of solvent, as the Diisopropyl azodicarboxylate of catalyzer, under nitrogen atmosphere, be heated to 80 ℃, with the monomer dropping that methacrylic acid and methyl methacrylate was obtained with the mixed in molar ratio of 0.4mol methacrylic acid, 0.6mol methyl methacrylate in about 2 hours in flask, behind the restir 1 hour, temperature is risen to 115 ℃ make its inactivation, obtain resin solution.
After the cooling of this resin solution, use Tetrabutyl amonium bromide as catalyzer, under 95～115 ℃, 30 hours condition, make the carboxyl generation addition reaction of 0.4mol butylglycidyl ether and the equivalent of the resin that obtains, cooling then.Again under 95～105 ℃, 8 hours condition, make the OH base and 0.26mol Tetra Hydro Phthalic Anhydride generation addition reaction of the resin that obtains, its cooling back is taken out, obtain solids component and be 55% organic binder bond A.
(glass paste)
After the glass powder coarse reduction, filter with 300 purpose sieves, the glass powder and 29.16 mass parts 2 that obtain in 70 mass parts, 2,4-trimethylammonium-1, add 0.14 mass parts BYK-410 and 0.7 mass parts BYK-182 as dispersion agent in the 3-pentanediol only son acid esters, broken with the ball mill micro mist, making D 50 is 1.0 μ m, D
MaxThe glass powder content that is 3.9 μ m is the glass paste of 70 quality %.
In addition, as glass powder, use Bi
2O
350%, B
2O
316%, ZnO 14%, SiO
22%, BaO 18%, thermalexpansioncoefficient
300=86 * 10
-7/ ℃, glass softening point is 501 ℃ glass powder.
In addition, when using ball mill to pulverize, the SC50 that uses Mitsui Mining Co Ltd. BJ Offc to make, and the use median particle diameter is the ZrO of 0.3～0.8mm Φ
2The pearl of system, rotating speed is 2000～3300rpm, implements 3～9 hours pulverizing.
Hole field laser diffraction/diffuse transmission type particle size distribution device LA-920 is used in particle size measurement.
2 layers that use aforesaid method to make coat copper powder, organic binder bond, glass paste, in the 1200ml plastic containers, the speed with 500rpm in high speed dispersor stirred 10 minutes with each paste components matching of composition example 1,2 shown below and comparative composition example 1,2.Then,, make its pasteization, make conductive resin composition with mixing 2 times of the pottery system 3 roller machines of 7 inches sizes.
(composition example 1)
100.0 parts of organic binder bonds
75.0 parts of tripropylene glycol monomethyl ethers
(Monsanto Company makes, trade(brand)name: Modaflow) 5.0 parts for flow agent and defoamer
4.0 parts of phosphoric acid ester
98.0 parts of glass pastes
(Exxon Mobil Corporation makes organic solvent, trade(brand)name: Solvesso200) 10.0 parts
730.0 parts in each plating powder ((1) of table 1 and (2))
(composition example 2)
100.0 parts of organic binder bonds
75.0 parts of tripropylene glycol monomethyl ethers
(Monsanto Company makes, trade(brand)name: Modaflow) 5.0 parts for flow agent and defoamer
4.0 parts of phosphoric acid ester
98.0 parts of glass pastes
(Exxon Mobil Corporation makes organic solvent, trade(brand)name: Solvesso200) 10.0 parts
730.0 parts in each plating powder ((3) of table 1～(6))
(comparative composition example 1)
100.0 parts of organic binder bonds
75.0 parts of tripropylene glycol monomethyl ethers
(Monsanto Company makes, trade(brand)name: Modaflow) 5.0 parts for flow agent and defoamer
4.0 parts of phosphoric acid ester
98.0 parts of glass pastes
(Exxon Mobil Corporation makes organic solvent, trade(brand)name: Solvesso200) 10.0 parts
730.0 parts in each plating powder ((7) of table 1～(12))
(comparative composition example 2)
100.0 parts of organic binder bonds
75.0 parts of tripropylene glycol monomethyl ethers
(Monsanto Company makes, trade(brand)name: Modaflow) 5.0 parts for flow agent and defoamer
4.0 parts of phosphoric acid ester
98.0 parts of glass pastes
(Exxon Mobil Corporation makes organic solvent, trade(brand)name: Solvesso200) 10.0 parts
730.0 parts of copper powder
About the various conductive resin compositions that make like this, the line resistance value of conductive pattern and estimate in accordance with the following methods than resistance value.
(making of test substrate)
The conductive resin composition pattern is printed on the glass substrate, and forming thickness is the line of 0.3cm * 10cm of about 25～30 μ m, and it was descended dry 30 minutes at 90 ℃, obtains dry coating.In atmosphere, the speed of this dry coating with 5 ℃/minute is heated up then, burnt till 10 minutes, make substrate with conductive pattern at 530 ℃.
(mensuration of resistance value)
For the substrate of the conductive pattern that makes like this with 0.3cm * 10cm, use the HIOKI 3540m Ω tester (Hitester) of HIOKI company manufacturing, measure the line resistance value of conductive pattern, calculate by this measured value and compare resistance value.Than being calculated as follows of resistance value.
Than resistance value (Ω cm)
=line resistance value (Ω) * thickness (cm) * line width (cm)/line length (cm)
It the results are shown in table 2.
In addition, in table 2, " can not measure " is meant, surpassed the measures range of tester.
By result shown in the table 2 as can be known, when the paste composition of comparative composition burnt till under air atmosphere, though can make conductive pattern, its resistance value was too high, can not measure.Infer thus and can not obtain enough electroconductibility.
But, compare with other the paste of comparative composition, use the conductive resin composition of the electroconductive powder of two-layer lining of the present invention to have good resistance value and compare resistance value.After having passed through the high-temperature process that is burning till 10 minutes under 530 ℃, the electroconductive powder of two-layer lining still keeps this characteristic, and hence one can see that, and this conductive pattern can obtain electroconductibility.
Table 1
The composition example
| The plating powder | ??(1) | ??(2) | ??(3) | ??(4) | ??(5) | ??(6) |
| The 1st layer: plating Ni | ??0.22μm | ??0.54μm | ??- | ??- | ??- | ??- |
| The 1st layer: plating Co | ??- | ??- | ??0.21μm | ??0.15μm | ??0.78μm | ??0.79μm |
| The 2nd layer: plating Ag | ??0.33μm | ??0.30μm | ??0.12μm | ??0.39μm | ??0.14μm | ??0.25μm |
The comparative composition example
| The plating powder | ??(7) | ??(8) | ??(9) | ??(10) | ??(11) | ??(12) | Copper powder |
| The 1st layer: plating Ni | ??- | ??- | ??- | ??- | ??0.22μm | ??- | ??- |
| The 1st layer: plating Sn | ??0.22μm | ??0.26μm | ??0.68μm | ??0.56μm | ??- | ??- | ??- |
| The 2nd layer: plating Ag | ??0.11μm | ??0.36μm | ??0.18μm | ??0.39μm | ??- | ??0.30μm | ??- |
Table 2
The composition example
| Composition example 1 (1) powder | Composition example 1 (2) powder | Composition example 2 (3) powder | |
| The line resistance value | ??1.86Ω | ??1.05Ω | ??16KΩ |
| Compare resistance value | ??1.28.E·04Ω·cm | ??5.67.E·05Ω·cm | ??9.60.E·01Ω·cm |
| Paste | Composition example 2 (4) powder | Composition example 2 (5) powder | Composition example 2 (6) powder |
| The line resistance value | ??16KΩ | ??18KΩ | ??14KΩ |
| Compare resistance value | ??8.16.E·01Ω·cm | ??1.03.E·01Ω·c?m | ??6.30.E·01Ω·cm |
The comparative composition example
Claims (5)
1. conductive resin composition, it is the conductive resin composition that contains organic binder bond and electroconductive powder, it is characterized in that, as aforementioned electroconductive powder, the use multilayer coats copper powder and forms, wherein said multilayer coating copper powder, has the coating metal layer that is made of at least a metal that is selected among Ni, Co, Mn, the Cr, and has the coating metal layer that is made of Ag at outermost layer as core with copper powder on the surface of this copper powder.
2. conductive resin composition according to claim 1 is characterized in that, aforementioned organic binder bond is any one in drying property organic binder bond, Thermocurable organic binder bond, the light solidified organic binder bond.
3. conductive resin composition according to claim 1 is characterized in that, the bed thickness of the coating metal layer on aforementioned copper powder surface is 0.1～1.0 μ m, and the bed thickness of aforementioned outermost coating metal layer is 0.1～0.6 μ m.
4. substrate with the conductive pattern that uses each described conductive resin composition of claim 1～3 and obtain.
5. substrate with conductive pattern, it is characterized in that, in conductive layer, contain multilayer and coat copper powder, wherein said multilayer coat copper powder with copper powder as core, have the coating metal layer that constitutes by at least a metal that is selected among Ni, Co, Mn, the Cr on the surface of this copper powder, and have the coating metal layer that constitutes by Ag at outermost layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP209097/2007 | 2007-08-10 | ||
| JP2007209097A JP5421523B2 (en) | 2007-08-10 | 2007-08-10 | Conductive resin composition and substrate having conductive pattern obtained using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101641413A true CN101641413A (en) | 2010-02-03 |
Family
ID=40350683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200880008391A Pending CN101641413A (en) | 2007-08-10 | 2008-08-07 | Conductive resin composition and substrate having conductive pattern obtained by using the same |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5421523B2 (en) |
| KR (1) | KR20090125771A (en) |
| CN (1) | CN101641413A (en) |
| WO (1) | WO2009022630A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104558526A (en) * | 2013-10-28 | 2015-04-29 | 中国石油化工股份有限公司 | Method for preparing medium temperature fast curing epoxy resin composition for melting prepared prepreg |
| CN104559066A (en) * | 2013-10-28 | 2015-04-29 | 中国石油化工股份有限公司 | Mid-temperature curing epoxy resin composition for melting prepared prepreg and preparation method of composition |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014037537A (en) * | 2013-08-27 | 2014-02-27 | Taiyo Holdings Co Ltd | Conductive resin composition and substrate having conductive pattern obtained by using the same |
| JP5854248B1 (en) | 2015-05-27 | 2016-02-09 | 東洋インキＳｃホールディングス株式会社 | Conductive adhesive, and conductive adhesive sheet and electromagnetic wave shielding sheet using the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2660937B2 (en) * | 1990-07-16 | 1997-10-08 | 三井金属鉱業株式会社 | Copper conductive composition |
| JPH04170491A (en) * | 1990-11-02 | 1992-06-18 | Oki Electric Ind Co Ltd | Paste for forming thick-film conductor |
| JP3683506B2 (en) * | 2001-03-23 | 2005-08-17 | 京都エレックス株式会社 | Process for producing conductive paste composition for via filling |
| JP4144695B2 (en) * | 2002-11-01 | 2008-09-03 | 三井金属鉱業株式会社 | Two-layer coated copper powder, method for producing the two-layer coated copper powder, and conductive paste using the two-layer coated copper powder |
-
2007
- 2007-08-10 JP JP2007209097A patent/JP5421523B2/en active Active
-
2008
- 2008-08-07 WO PCT/JP2008/064241 patent/WO2009022630A1/en active Application Filing
- 2008-08-07 CN CN200880008391A patent/CN101641413A/en active Pending
- 2008-08-07 KR KR1020097019314A patent/KR20090125771A/en not_active Application Discontinuation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104558526A (en) * | 2013-10-28 | 2015-04-29 | 中国石油化工股份有限公司 | Method for preparing medium temperature fast curing epoxy resin composition for melting prepared prepreg |
| CN104559066A (en) * | 2013-10-28 | 2015-04-29 | 中国石油化工股份有限公司 | Mid-temperature curing epoxy resin composition for melting prepared prepreg and preparation method of composition |
| CN104559066B (en) * | 2013-10-28 | 2018-01-09 | 中国石油化工股份有限公司 | Hot melt prepreg intermediate temperature setting composition epoxy resin and preparation method thereof |
| CN104558526B (en) * | 2013-10-28 | 2018-02-13 | 中国石油化工股份有限公司 | The preparation method of hot melt prepreg medium temperature fast-curing epoxy resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009022630A1 (en) | 2009-02-19 |
| KR20090125771A (en) | 2009-12-07 |
| JP2009040932A (en) | 2009-02-26 |
| JP5421523B2 (en) | 2014-02-19 |
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