CN101639475B - Device and method for realizing transmission of digital microfluid between two microfluidic chips - Google Patents
Device and method for realizing transmission of digital microfluid between two microfluidic chips Download PDFInfo
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- CN101639475B CN101639475B CN200910101606A CN200910101606A CN101639475B CN 101639475 B CN101639475 B CN 101639475B CN 200910101606 A CN200910101606 A CN 200910101606A CN 200910101606 A CN200910101606 A CN 200910101606A CN 101639475 B CN101639475 B CN 101639475B
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Abstract
The invention discloses a device and a method for realizing the transmission of digital microfluid between two microfluidic chips. The device comprises an arc organic polymer transmission component, wherein a first end of the transmission component is connected with a side end of an upper microfluidic chip close to an opening; a second end of the transmission component is positioned above a second drainage layer and close to the second drainage layer; the surface of the transmission component is provided with a transmission drainage layer which is communicated with the first drainage layer, thus when the digital microfluid on the first drainage layer needs to be transmitted onto the second drainage layer, a RF electric signal can be loaded onto a first interdigital transducer through a signal generating device; the first interdigital transducer generates a surface acoustic wave which drives the microfluid on the first drainage layer to move and enables the microfluid to move close to the opening; under the action of inertia force, the microfluid moves onto the transmission drainage layer; and under the action of gravity, the microfluid falls onto the second drainage layer along the transmission drainage layer, thereby realizing the transmission of the digital microfluid between the two microfluidic chips.
Description
Technical field
The present invention relates to a kind of microfluid and transport technology, especially relate to a kind of device and method of between two micro-fluidic chips, realizing transmission of digital microfluid.
Background technology
Micro-fluidic chip is because of having small size, operative intelligenceization, lower reagent consumption, little volume, short reaction time and plurality of advantages such as integrated; Make it in fields such as chemistry, biochemistry and bioanalysis, obtain increasing application, and new micro-fluidic chip is constantly arranged in the life of reality with scientific research is medium is applied.Micro-fluidic chip is to adopt micro electronmechanical method on substrates such as silicon, glass or organism, to process various microfluidic procedures unit; Like little valve, Micropump, microchannel, micro-mixer, microreactor etc.; To realize the sequence of operations such as sample introduction, pre-service, mixing, reaction, detection and aftertreatment of sample or reagent, realize the complete testing process of micro-biochemical quantity.Micro-fluidic chip is two types of the micro-fluidic chips of the operation format of microfluid in the micro-fluidic chip micro-fluidic chip and the digital stream that are divided into continuous stream according to operand.Micro-fluidic chip with respect to continuous stream; The micro-fluidic chip of digital stream have amount of samples still less, analysis speed is faster, degree of accuracy is higher, sample or reagent cross pollution still less wait plurality of advantages and have more development prospect, has obtained various countries expert's extensive great attention.
At present, be that the surface acoustic wave techniques of substrate has advantages such as technology is simple ripe, cheap and more and more receives micro-fluidic expert's attention with the piezoelectric.With the piezoelectric is the micro-fluidic chip of substrate, is the micro-fluidic chip of substrate with respect to silicon, glass, organic polymer etc., has more development potentiality, is that the micro-fluidic chip of substrate has obtained fast development in recent years with the piezoelectric.But be that the micro-fluidic chip of substrate also has certain limitation with the piezoelectric, with respect to other substrate simultaneously; Relative difficult is carried out micro electronmechanical processing on the piezoelectric substrate of being processed by piezoelectric; Mostly can only be on piezoelectric substrate photoetching interdigital transducer array, realize open micro-fluidic chip, and the finger logarithm of interdigital transducer array is limited; Feasible like this analysis and the detection micro-fluidic system to micro-biochemical substances often is difficult in a micro-fluidic chip, realize; Possibly need two or more micro-fluidic chips could satisfy actual needs, at this moment, microfluid just transporting unavoidably between micro-fluidic chip.And existing micro-fluidic chip based on piezoelectric substrate also is confined to transporting of microfluid in the two-dimensional plane of a micro-fluidic chip, does not find between micro-fluidic chip, to realize the report that microfluid transports as yet.Like 2007 the 54th volumes of periodical " ultrasonic, the ferroelectric and frequency control of IEEE proceedings is divided proceedings " the 10th phase 2146-2151 page or leaf (IEEE Transactions on ultrasonics; Ferroelectrics; And frequency control Vol.54 (10); " utilization surface acoustic wave system detects and the little drop of hi-Fix " (" Detection andhigh-precision positioning of liquid droplets using SAW systems ") 2007:2146-2151) disclosed; It is based on surface acoustic wave techniques and realizes digital micro-fluid transporting in two-dimensional plane; On 128 ° of Y rotation X direction of propagation lithium niobate substrates, adopt microelectronic technique to make 2 * 2 interdigital transducer arrays; Add the RF electric signal on the interdigital transducer in the horizontal direction and excite surface acoustic wave, this surface acoustic wave drives the digital micro-fluid on the acoustic path, so that microfluid transports in the plane of piezoelectric substrate; To definite, this transmission of digital microfluid method can only make digital micro-fluid in two-dimensional plane, move by the vertical direction interdigital transducer in the microfluid position.But along with the micro-fluidic chip to digital stream is in depth studied; Must need integrated increasing operating unit on micro-fluidic chip; Especially complicated microfluidic analytical system; Be difficult to all microfluidic procedures collection of units are formed in the micro-fluidic chip; But each operating unit that microfluidic analytical system is required is integrated in respectively in two or more micro-fluidic chips by function, involved the problem that between a plurality of micro-fluidic chips, transports digital micro-fluid thus, and the micro-fluidic chip of existing digital stream generally includes a piezoelectric substrate; Piezoelectric substrate is provided with interdigital transducer group and the hydrophobic layer that is used for the digital micro-fluid motion; The interdigital transducer group is made up of several interdigital transducers, and interdigital transducer is provided with around piezoelectric substrate, and interdigital transducer is connected with the external signal generating means; Be provided with reflecting grating near the outside side of interdigital transducer on the piezoelectric substrate; Reflecting grating is used to reduce the external signal generating means and outputs to the RF electric signal power on the interdigital transducer, and a micro-fluidic chip from same microfluidic analytical system transports or transmit digital micro-fluid to another micro-fluidic chip if desired, and then the inevitable requirement micro-fluidic chip has an opening that is used for the digital micro-fluid transmission; Even be used for the opening that digital micro-fluid transmits yet two micro-fluidic chips all have one, above-mentioned existing transmission of digital microfluid method also can't be implemented in transporting or transmitting of two digital micro-fluids between the micro-fluidic chip.
Summary of the invention
Technical matters to be solved by this invention provides a kind of simple to operation, reliable operation, and can effectively realize the device and method that digital micro-fluid transports between two micro-fluidic chips.
The present invention solves the problems of the technologies described above the technical scheme that is adopted: a kind of device of between two micro-fluidic chips, realizing transmission of digital microfluid; Two micro-fluidic chips are respectively micro-fluidic chip and following micro-fluidic chip; The described upper surface of going up micro-fluidic chip has an opening that is used to export digital micro-fluid; The device of between two micro-fluidic chips, realizing transmission of digital microfluid comprises that the arc organic polymer transports parts; First end that described arc organic polymer transports parts is connected with the side of described upward micro-fluidic chip near described opening part; Second end that described arc organic polymer transports parts is positioned at the top of the described hydrophobic layer of micro-fluidic chip down and near the described hydrophobic layer of micro-fluidic chip down; The surface that described arc organic polymer transports parts is provided with the hydrophobic layer that transports that is used for the digital micro-fluid conveying, and the described hydrophobic layer that transports is connected with the described hydrophobic layer of going up micro-fluidic chip.
The radius-of-curvature size that described arc organic polymer transports parts is 2 to 3 millimeters.
The thickness that described arc organic polymer transports parts is 0.5～1 millimeter.
Described arc organic polymer transports spacing between the hydrophobic layer of second end and described down micro-fluidic chip of parts for greater than the maximum gauge of digital micro-fluid and less than two to three times of the maximum gauge of digital micro-fluid.
The described material that transports the hydrophobic layer employing is Teflon AF 1600 hydrophobic materials.
The described thickness that transports hydrophobic layer is more than or equal to 3 μ m.
A kind of method that between two micro-fluidic chips, realizes transmission of digital microfluid may further comprise the steps:
1. with the micro-fluidic chip that is used in two micro-fluidic chips export digital micro-fluid as last micro-fluidic chip; With the micro-fluidic chip that is used to receive the digital micro-fluid that transports in two micro-fluidic chips as time micro-fluidic chip; Last micro-fluidic chip comprises first piezoelectric substrate; Four side arrays of the upper surface of first piezoelectric substrate have first interdigital transducer that is connected with the external signal generating means; The upper surface of first piezoelectric substrate has first reflecting grating corresponding with first interdigital transducer near the arranged outside of first interdigital transducer; And a side of the upper surface of first piezoelectric substrate has an opening that is used to export digital micro-fluid; The upper surface of first piezoelectric substrate is provided with first hydrophobic layer that is used for the digital micro-fluid motion, and following micro-fluidic chip comprises second piezoelectric substrate, and four side arrays of the upper surface of second piezoelectric substrate have second interdigital transducer that is connected with the external signal generating means; The upper surface of second piezoelectric substrate has second reflecting grating corresponding with second interdigital transducer near the arranged outside of second interdigital transducer; The upper surface of second piezoelectric substrate is provided with second hydrophobic layer that is used for the digital micro-fluid motion, and the external signal generating means comprises the signal generator and the power amplifier that is connected with signal generator that is used to produce the RF electric signal, and power amplifier is connected with change-over switch;
Last micro-fluidic chip is connected in one to be used for fixing on the upper substrate that connects lead; First pin is set on upper substrate; First interdigital transducer is connected with first pin through lead, following micro-fluidic chip is connected in one is used for fixing on the infrabasal plate that connects lead, and second pin is set on infrabasal plate; Second interdigital transducer is connected with second pin through lead; Between upper substrate and infrabasal plate, back-up block is set, will goes up micro-fluidic chip through back-up block and be integral, first pin is connected with change-over switch respectively with second pin with the vertical parallel arranged of following micro-fluidic chip;
2. will be provided with and transport hydrophobic layer and radius-of-curvature size is that first end that 2 to 3 millimeters arc organic polymer transports parts is fixedly connected with the side of first piezoelectric substrate near opening part; Make and transport hydrophobic layer and be connected with first hydrophobic layer of last micro-fluidic chip; Second end that keeps the arc organic polymer to transport parts simultaneously is positioned at the top of following second hydrophobic layer of micro-fluidic chip and near second hydrophobic layer, and second end that the arc organic polymer transports parts and the spacing between second hydrophobic layer are greater than the maximum gauge of digital micro-fluid and less than two to three times of the maximum gauge of digital micro-fluid;
3. switching change-over switch makes power amplifier pass through change-over switch to be connected with first pin on the upper substrate; Start signal generator and power amplifier; Signal generator is exported the RF electric signal and the RF electric signal is transferred to power amplifier; Power amplifier carries out processing and amplifying to the RF electric signal that receives; And the RF electric signal after will amplifying through change-over switch is transferred to first interdigital transducer of micro-fluidic chip, and first interdigital transducer of last micro-fluidic chip produces surface acoustic wave after inserting the RF electric signal;
4. the surface acoustic wave of going up first interdigital transducer generation of micro-fluidic chip drives the digital micro-fluid to be transported on first hydrophobic layer that is placed in micro-fluidic chip; Make digital micro-fluid to be transported along the SAW propagating path movement near opening; Digital micro-fluid to be transported moves to the arc organic polymer and transports transporting on the hydrophobic layer of parts under the inertial force effect; Shutdown signal generator and power amplifier then switch change-over switch power amplifier are not connected with first pin on the upper substrate through change-over switch;
5. be positioned on the digital micro-fluid to be transported that transports on the hydrophobic layer is slipped to following micro-fluidic chip under action of gravity second hydrophobic layer, accomplish digital micro-fluid transporting between two micro-fluidic chips.
Compared with prior art; The invention has the advantages that apparatus of the present invention comprise that an arc organic polymer transports parts; First end that the arc organic polymer transports parts is connected with the side of last micro-fluidic chip near opening part; Second end that the arc organic polymer transports parts is positioned at the top of second hydrophobic layer of micro-fluidic chip down and near second hydrophobic layer; The surface that the arc organic polymer transports parts is provided with and is used for the hydrophobic layer that transports that digital micro-fluid carries, and transports hydrophobic layer and is connected with first hydrophobic layer of last micro-fluidic chip, will be positioned at transmission of digital microfluid on first hydrophobic layer to second hydrophobic layer the time when need like this; Can load the RF electric signal to first interdigital transducer of last micro-fluidic chip through the external signal generating means; First interdigital transducer produces surface acoustic wave, and surface acoustic wave drives the digital micro-fluid that is positioned on first hydrophobic layer in the motion of first hydrophobic layer and it is moved near the opening, is connected with first hydrophobic layer owing to transport hydrophobic layer; Digital micro-fluid moves under the inertial force effect when moving near the opening and transports on the hydrophobic layer; Under action of gravity, be positioned at the digital micro-fluid that transports on the hydrophobic layer and be slipped on second hydrophobic layer again, realized digital micro-fluid transporting between two micro-fluidic chips along transporting hydrophobic layer; Become a reality thereby make the microfluidic analytical system that can not be integrated in a micro-fluidic chip relative complex can be integrated in two micro-fluidic chips, greatly improved the range of application of micro-fluidic chip.In addition, apparatus of the present invention and method can be applicable to fields such as medical diagnosis on disease, drug screening, environmental monitoring and national security.
Description of drawings
Fig. 1 is the structural representation of apparatus of the present invention.
Embodiment
Embodiment describes in further detail the present invention below in conjunction with accompanying drawing.
In comparatively complicated microfluidic analytical system; Generally include two or more micro-fluidic chips; Be integrated with a plurality of operating units in each micro-fluidic chip; Each micro-fluidic chip might realized operation with the digital micro-fluid that is positioned at other micro-fluidic chips when being arranged in wherein digital micro-fluid and carrying out associative operation jointly; Common like this need the transmission of digital microfluid on some micro-fluidic chips the need to another on micro-fluidic chip of this digital micro-fluid; Present transmission of digital microfluid method can't be implemented in transporting of two digital micro-fluids between micro-fluidic chip, therefore the present invention proposes a kind of device of between two micro-fluidic chips, realizing transmission of digital microfluid.
Apparatus of the present invention are mainly used between two micro-fluidic chips, are used to realize transporting of two digital micro-fluids between the micro-fluidic chip.Fig. 1 has provided the annexation of apparatus of the present invention and two micro-fluidic chips; This micro-fluidic chip that is used to export digital micro-fluid in two micro-fluidic chips as on micro-fluidic chip 1, be used to receive in two micro-fluidic chips transport the digital micro-fluid that comes micro-fluidic chip as time micro-fluidic chip 2.Last micro-fluidic chip 1 comprises first piezoelectric substrate 11; The upper surface of first piezoelectric substrate 11 is a working surface; Four side arrays of the upper surface of first piezoelectric substrate 11 have first interdigital transducer 12 that is connected with external signal generating means 3; The upper surface of first piezoelectric substrate 11 also is provided with first hydrophobic layer 14 that is used for the digital micro-fluid motion; One side of the upper surface of first piezoelectric substrate 11 has an opening 15 that is used to export digital micro-fluid; In fact on the upper surface of first piezoelectric substrate 11, during array first interdigital transducer 12, one first interdigital transducer is set on the side therein less promptly forms opening 15, one first interdigital transducer on the relative side with opening 15 positions of this opening 15 is corresponding; Each first interdigital transducer, 12 cooperatings on the upper surface of such first piezoelectric substrate 11 can make digital micro-fluid move towards opening part; Also can be provided for reducing the first reflecting grating (not shown) that external signal generating means 3 outputs to the RF electric signal power on first interdigital transducer 12 on the upper surface of first piezoelectric substrate 11; The position of first reflecting grating is near the outside of first interdigital transducer 12 and corresponding with first interdigital transducer 12; At this; After first reflecting grating is set; The RF electric signal that is loaded into first interdigital transducer 12 can be more relatively low, if do not have under the situation of first reflecting grating, needs to load more powerful RF electric signal to first interdigital transducer 12.The lower surface of first piezoelectric substrate 11 is connected with one and can be used in the upper substrate 16 that is fixedly connected lead, and upper substrate 16 is provided with first pin, 17, the first interdigital transducers 12 and is connected with first pin 17 through lead.
Following micro-fluidic chip 2 comprises second piezoelectric substrate 21; The upper surface of second piezoelectric substrate 21 is a working surface; Four side arrays of the upper surface of second piezoelectric substrate 21 have the upper surface of second interdigital transducer, 22, the second piezoelectric substrates 21 that are connected with external signal generating means 3 to be provided with to be used for second hydrophobic layer 24 of digital micro-fluid motion; Also can be provided for reducing the second reflecting grating (not shown) that external signal generating means 3 outputs to the RF electric signal power on second interdigital transducer 22 on the upper surface of second piezoelectric substrate 21; The position of second reflecting grating is near the outside of second interdigital transducer 22 and corresponding with second interdigital transducer 22; At this; After second reflecting grating is set; The RF electric signal that is loaded into second interdigital transducer 22 can be more relatively low, if do not have under the situation of second reflecting grating, needs to load more powerful RF electric signal to second interdigital transducer 22.Second piezoelectric substrate 21 is connected with one and can be used in the infrabasal plate 26 that is fixedly connected lead, and infrabasal plate 26 is provided with second pin, 27, the second interdigital transducers 22 and is connected with second pin 27 through lead.
External signal generating means 3 comprises the signal generator 31 and the power amplifier 32 that is connected with signal generator 31 that is used to produce the RF electric signal; Power amplifier 32 is connected with change-over switch 33; Change-over switch 33 is connected with second pin 27 with first pin 17 respectively; Power amplifier 32 is connected with first pin 17 or second pin 27 through change-over switch 33 or breaks off through switching change-over switch 33, signal generator 31, power amplifier 32 and change-over switch 33 are prior art.The RF electric signal of signal generator 31 output after power amplifier 32 amplifies again through the switching of change-over switch 33 respectively timesharing be added on each second interdigital transducer 22 of each first interdigital transducer, 12 upper and lower micro-fluidic chips 2 of micro-fluidic chip 1, realize that digital micro-fluid moves any position in first hydrophobic layer 14 or second hydrophobic layer 24 respectively.
Wherein, First interdigital transducer 12 and first reflecting grating all adopt existing microelectronic technique photoetching on the working surface of first piezoelectric substrate 11, and second interdigital transducer 22 and second reflecting grating all adopt existing microelectronic technique photoetching on the working surface of second piezoelectric substrate 21; First piezoelectric substrate 11 and second piezoelectric substrate 12 can adopt common LiNbO
3Piezoelectric substrate or optical grade LiNbO
3Piezoelectric substrate; The infrabasal plate 26 of upper substrate 16 and the lower surface that is connected in second piezoelectric substrate 21 of lower surface that is connected in first piezoelectric substrate 11 is by PCB (Printed Circuit Board; Printed-wiring board (PWB)) plate is made; Pcb board easy fixation lead, certainly upper substrate 16 and infrabasal plate 26 also can adopt other existing substrates that can fixing cord; First hydrophobic layer 14 is on the working surface of first piezoelectric substrate 11, to apply one deck Teflon AF 1600 hydrophobic materials to form; Second hydrophobic layer 24 is on the working surface of second piezoelectric substrate 21, to apply one deck Teflon AF 1600 hydrophobic materials to form; The controllable thickness of first hydrophobic layer 14 and second hydrophobic layer 24 built in 1 μ m between the 3 μ m; This is in order to make first hydrophobic layer 14 and second hydrophobic layer 24 that the better hydrophobic ability arranged; If first hydrophobic layer 14 and second hydrophobic layer 24 are too thick, then behind first interdigital transducer 12 or second interdigital transducer, 22 work generation surface acoustic waves, the first thicker hydrophobic layer 14 and second hydrophobic layer 24 are understood the energy of attenuate sound surface waves; The surface acoustic wave that will cause first interdigital transducer 12 or second interdigital transducer 22 to produce like this can't drive digital micro-fluid; If hydrophobic layer is too thin, then its surface tension is bigger, and hydrophobic performance is relatively poor.
Device of the present invention is as shown in Figure 1; Comprise that the arc organic polymer transports parts 4; First end 41 that the arc organic polymer transports parts 4 is connected with the side of last micro-fluidic chip 1 near opening 15 places; Both connections can adopt existing gluing technique to carry out adhesion; Also can adopt the interconnection technique of other existing any maturations; Second end 42 that the arc organic polymer transports parts 4 is positioned at the top of second hydrophobic layer 24 of micro-fluidic chip 2 down and near second hydrophobic layer 24, the surface that the arc organic polymer transports parts 4 be provided be used for that digital micro-fluid carries transport hydrophobic layer 43, transport hydrophobic layer 43 and be connected with first hydrophobic layer 14 of last micro-fluidic chip 1.At this, the material that the arc organic polymer transports parts 4 employings is an organic polymer.
Utilize apparatus of the present invention between last micro-fluidic chip 1 and following micro-fluidic chip 2, to realize transporting of digital micro-fluid; Also needing to go up micro-fluidic chip 1 is integral with following micro-fluidic chip 2 vertical parallel arranged; In this specific embodiment; At least two back-up blocks 19 are set between upper substrate 16 and infrabasal plate 26; When adjacent last micro-fluidic chip 1 and following micro-fluidic chip 2 vertically promptly are integral perpendicular to horizontal direction parallel arranged through back-up block 19, back-up block 19 will be gone up micro-fluidic chip 1 and separate with following micro-fluidic chip 2, effectively ensure the operate as normal of each micro-fluidic chip like this.In addition; The length of this back-up block 19 need guarantee that second end 42 that the arc organic polymer transports parts 4 is positioned at the top of second hydrophobic layer 24 of micro-fluidic chip 2 down and near second hydrophobic layer 24, and second end 42 that the arc organic polymer transports parts 4 and the spacing between second hydrophobic layer 24 are greater than the maximum gauge of digital micro-fluid and less than two to three times of the maximum gauge of digital micro-fluid.At this, back-up block 19 preferably adopts insulating material to process.
In this specific embodiment; It is less to require the arc organic polymer to transport the radius-of-curvature of parts 4; Be positioned at the digital micro-fluid that transports on the hydrophobic layer 43 like this and can transport hydrophobic layer 43 landings because of the action of gravity edge; At this, the big I of radius-of-curvature that the arc organic polymer transports parts 4 is located in 2 to 3 millimeters scopes, and is too big if the arc organic polymer transports the radius-of-curvature of parts 4; Then to transport the surperficial tangential component of parts 4 along the arc organic polymer less and cause the digital micro-fluid can not be along its surperficial landing for the gravity of digital micro-fluid; If too little, then wayward digital micro-fluid is transported to down on second hydrophobic layer 24 of micro-fluidic chip 2 smoothly, in actual application, can the radius-of-curvature that the arc organic polymer transports parts 4 be made as 2.5 millimeters; The thickness that the arc organic polymer transports parts 4 is 0.5 to 1 millimeter; If it is too thin that the arc organic polymer transports parts 4; Then be not easy to adopt existing gluing technique the arc organic polymer to be transported first end 41 and last micro-fluidic chip 1 adhesion of parts 4; If it is too thick; It is heavier that then the arc organic polymer transports the deadweight of parts 4; With the adhesion fastness that directly influences itself and last micro-fluidic chip, also can directly adopt the thickness identical in the actual application with last micro-fluidic chip 1, the arc organic polymer transports spacing between second hydrophobic layer 24 of second end 42 and following micro-fluidic chip 2 of parts 4 for greater than the maximum gauge of digital micro-fluid and less than two to three times of the maximum gauge of digital micro-fluid; The twice that can this spacing in the actual application be set to the maximum gauge of digital micro-fluid; So both can guarantee to be positioned at digital micro-fluid on second hydrophobic layer 24 can proper motion on second hydrophobic layer 24, can guarantee again can be slipped to smoothly on second hydrophobic layer 24 through the digital micro-fluid that transports hydrophobic layer 43, and not influence digital micro-fluid; Transporting hydrophobic layer 43 forms for applying one deck Teflon AF 1600 hydrophobic materials on the surface that transports parts 4 at the arc organic polymer; Transport the thickness of hydrophobic layer 43 can be provided with thicker; Transport 4 pairs of influences that transport the hydrophobic property of hydrophobic layer 43 of parts to reduce the arc organic polymer; Its surface tension is less like this, and hydrophobic performance is better, and the thickness that in actual application, can transport hydrophobic layer 43 is set to more than or equal to 3 μ m.
When using apparatus of the present invention, less for volume like digital micro-fluid less than 5 microlitres, can adopt not miscible oily digital micro-fluid to realize small size digital micro-fluid transporting between two micro-fluidic chips as auxiliary microfluid.
Use the transportation method of said apparatus, specifically may further comprise the steps:
1. with the micro-fluidic chip that is used in two micro-fluidic chips export digital micro-fluid as last micro-fluidic chip 1; With the micro-fluidic chip that is used to receive the digital micro-fluid that transports in two micro-fluidic chips as time micro-fluidic chip 2; Last micro-fluidic chip 1 comprises first piezoelectric substrate 11; Four side arrays of the upper surface of first piezoelectric substrate 11 have first interdigital transducer 12 that is connected with external signal generating means 3; The upper surface of first piezoelectric substrate 11 has first reflecting grating corresponding with first interdigital transducer 12 near the arranged outside of first interdigital transducer 12; And a side of the upper surface of first piezoelectric substrate 11 has an opening 15 that is used to export digital micro-fluid; The upper surface of first piezoelectric substrate 11 is provided with first hydrophobic layer 14 that is used for the digital micro-fluid motion; Following micro-fluidic chip 2 comprises second piezoelectric substrate 21; The upper surface that four side arrays of the upper surface of second piezoelectric substrate 21 have second interdigital transducer, 22, the second piezoelectric substrates 21 that are connected with external signal generating means 3 has second reflecting grating corresponding with second interdigital transducer 22 near the arranged outside of second interdigital transducer 22, and the upper surface of second piezoelectric substrate 21 is provided with second hydrophobic layer 24 that is used for the digital micro-fluid motion; External signal generating means 3 comprises the signal generator 31 and the power amplifier 32 that is connected with signal generator 31 that is used to produce the RF electric signal, and power amplifier 32 is connected with change-over switch 33.
Last micro-fluidic chip 1 is connected in one to be used for fixing on the upper substrate 16 that connects lead; First pin 17 is set on upper substrate 16; The bus-bar of first interdigital transducer 12 is connected with first pin 17 through pressure welding or conductive silver glue through thin wire; Following micro-fluidic chip 2 is connected in one to be used for fixing on the infrabasal plate 26 that connects lead; The bus-bar that second pin, 27, the second interdigital transducers 22 are set on infrabasal plate 26 is connected with second pin 27 through pressure welding or conductive silver glue through thin wire, between upper substrate 16 and infrabasal plate 26, back-up block 19 is set; To go up micro-fluidic chip 1 through back-up block 19 and be integral, first pin 17 will be connected with change-over switch 33 respectively with second pin 27 with following micro-fluidic chip 2 vertical parallel arranged.Like this; The RF electric signal of signal generator 31 output after power amplifier 32 amplifies again through the switching of change-over switch 33 respectively timesharing be added on each second interdigital transducer 22 of each first interdigital transducer, 12 upper and lower micro-fluidic chips 2 of micro-fluidic chip 1, realize that digital micro-fluid moves any position in first hydrophobic layer 14 or second hydrophobic layer 24 respectively.
2. will be provided with and transport hydrophobic layer 43 and radius-of-curvature size is that first end 41 that 2 to 3 millimeters arc organic polymer transports parts 4 is fixedly connected with the side of first piezoelectric substrate 11 near opening 15 places; Make and transport hydrophobic layer 43 and be connected with first hydrophobic layer 14 of last micro-fluidic chip 1; Second end 42 that keeps the arc organic polymer to transport parts 4 simultaneously is positioned at the top of following second hydrophobic layer 24 of micro-fluidic chip 2 and near second hydrophobic layer 24, and second end 42 that the arc organic polymer transports parts 4 and the spacing between second hydrophobic layer 24 are greater than the maximum gauge of digital micro-fluid and less than two to three times of the maximum gauge of digital micro-fluid.
3. switching change-over switch 33 makes power amplifier 32 be connected with first pin 17 on the upper substrate 16 through change-over switch 33; Start signal generator 31 and power amplifier 32; Signal generator 31 is exported the RF electric signal and the RF electric signal is transferred to power amplifier 32; The RF electric signal that 32 pairs in power amplifier receives carries out processing and amplifying; And the RF electric signal after will amplifying through change-over switch 33 is transferred to first interdigital transducer 12 of micro-fluidic chip 1, produces surface acoustic wave after first interdigital transducer 12 of last micro-fluidic chip 1 inserts the RF electric signal.
4. the surface acoustic wave of going up first interdigital transducer, 12 generations of micro-fluidic chip 1 drives the digital micro-fluid to be transported on first hydrophobic layer 14 that is placed in micro-fluidic chip 1; Digital micro-fluid to be transported is moved in first hydrophobic layer 14 along the SAW propagating path; During near digital micro-fluid to be transported moves to opening 15 position; Switch change-over switch 33 again; Make with opening 15 relative positions on the work of first interdigital transducer 12; The surface acoustic wave that should excite with first interdigital transducer 12 on opening 15 relative positions drives the digital micro-fluid to be transported near opening 15 places; Move to the arc organic polymer at digital micro-fluid to be transported under the inertial force effect and transport transporting on the hydrophobic layer 43 of parts 4, shutdown signal generator 31 and power amplifier 32 then switch change-over switch 33 power amplifier 32 are not connected with first pin 17 on the upper substrate 16 through change-over switch 33.
5. be positioned on the digital micro-fluid to be transported that transports on the hydrophobic layer 43 is slipped to following micro-fluidic chip 2 under action of gravity second hydrophobic layer 24, accomplish digital micro-fluid transporting between two micro-fluidic chips.
Claims (2)
1. device of between two micro-fluidic chips, realizing transmission of digital microfluid; Two micro-fluidic chips are respectively micro-fluidic chip and following micro-fluidic chip; The described upper surface of going up micro-fluidic chip has an opening that is used to export digital micro-fluid; The described micro-fluidic chip of going up comprises first piezoelectric substrate; Four side arrays of the upper surface of described first piezoelectric substrate have first interdigital transducer that is connected with the external signal generating means, and the upper surface of described first piezoelectric substrate has first reflecting grating corresponding with described first interdigital transducer near the arranged outside of described first interdigital transducer, and a side of the upper surface of described first piezoelectric substrate has an opening that is used to export digital micro-fluid; The upper surface of described first piezoelectric substrate is provided with first hydrophobic layer that is used for the digital micro-fluid motion; Described micro-fluidic chip down comprises second piezoelectric substrate, and four side arrays of the upper surface of described second piezoelectric substrate have second interdigital transducer that is connected with described external signal generating means, and the upper surface of described second piezoelectric substrate has second reflecting grating corresponding with second interdigital transducer near the arranged outside of described second interdigital transducer; The upper surface of described second piezoelectric substrate is provided with second hydrophobic layer that is used for the digital micro-fluid motion; Described external signal generating means comprises the signal generator and the power amplifier that is connected with described signal generator that is used to produce the RF electric signal, and described power amplifier is connected with change-over switch, and described upward micro-fluidic chip is connected in one and is used for fixing on the upper substrate that connects lead; First pin is set on the described upper substrate; Described first interdigital transducer is connected with described first pin through lead, and described micro-fluidic chip down is connected in one and is used for fixing on the infrabasal plate that connects lead, and second pin is set on the described infrabasal plate; Described second interdigital transducer is connected with described second pin through lead; Between described upper substrate and the described infrabasal plate back-up block is set, through described back-up block described upward micro-fluidic chip and the described vertical parallel arranged of micro-fluidic chip down is integral, described first pin is connected with described change-over switch respectively with described second pin; It is characterized in that the device of between two micro-fluidic chips, realizing transmission of digital microfluid comprises that the arc organic polymer transports parts; The radius-of-curvature size that described arc organic polymer transports parts is 2 to 3 millimeters, and the thickness that described arc organic polymer transports parts is 0.5～1 millimeter, and first end that described arc organic polymer transports parts is connected with the side of described upward micro-fluidic chip near described opening part; Second end that described arc organic polymer transports parts is positioned at the top of the described hydrophobic layer of micro-fluidic chip down and near the described hydrophobic layer of micro-fluidic chip down; Described arc organic polymer transports spacing between the hydrophobic layer of second end and described down micro-fluidic chip of parts for greater than the maximum gauge of digital micro-fluid and less than the twice of the maximum gauge of digital micro-fluid, and the surface that described arc organic polymer transports parts is provided with and is used for the hydrophobic layer that transports that digital micro-fluid carries, described transport hydrophobic layer with described on the hydrophobic layer of micro-fluidic chip be connected; The described material that transports the hydrophobic layer employing is Teflon AF 1600 hydrophobic materials, and the described thickness that transports hydrophobic layer is more than or equal to 3 μ m.
2. method that between two micro-fluidic chips, realizes transmission of digital microfluid is characterized in that may further comprise the steps:
1. with the micro-fluidic chip that is used in two micro-fluidic chips export digital micro-fluid as last micro-fluidic chip; With the micro-fluidic chip that is used to receive the digital micro-fluid that transports in two micro-fluidic chips as time micro-fluidic chip; Last micro-fluidic chip comprises first piezoelectric substrate; Four side arrays of the upper surface of first piezoelectric substrate have first interdigital transducer that is connected with the external signal generating means; The upper surface of first piezoelectric substrate has first reflecting grating corresponding with first interdigital transducer near the arranged outside of first interdigital transducer; And a side of the upper surface of first piezoelectric substrate has an opening that is used to export digital micro-fluid; The upper surface of first piezoelectric substrate is provided with first hydrophobic layer that is used for the digital micro-fluid motion, and following micro-fluidic chip comprises second piezoelectric substrate, and four side arrays of the upper surface of second piezoelectric substrate have second interdigital transducer that is connected with the external signal generating means; The upper surface of second piezoelectric substrate has second reflecting grating corresponding with second interdigital transducer near the arranged outside of second interdigital transducer; The upper surface of second piezoelectric substrate is provided with second hydrophobic layer that is used for the digital micro-fluid motion, and the external signal generating means comprises the signal generator and the power amplifier that is connected with signal generator that is used to produce the RF electric signal, and power amplifier is connected with change-over switch;
Last micro-fluidic chip is connected in one to be used for fixing on the upper substrate that connects lead; First pin is set on upper substrate; First interdigital transducer is connected with first pin through lead, following micro-fluidic chip is connected in one is used for fixing on the infrabasal plate that connects lead, and second pin is set on infrabasal plate; Second interdigital transducer is connected with second pin through lead; Between upper substrate and infrabasal plate, back-up block is set, will goes up micro-fluidic chip through back-up block and be integral, first pin is connected with change-over switch respectively with second pin with the vertical parallel arranged of following micro-fluidic chip;
2. will be provided with and transport hydrophobic layer and radius-of-curvature size is that first end that 2 to 3 millimeters arc organic polymer transports parts is fixedly connected with the side of first piezoelectric substrate near opening part; Make and transport hydrophobic layer and be connected with first hydrophobic layer of last micro-fluidic chip; Second end that keeps the arc organic polymer to transport parts simultaneously is positioned at the top of following second hydrophobic layer of micro-fluidic chip and near second hydrophobic layer, and second end that the arc organic polymer transports parts and the spacing between second hydrophobic layer are greater than the maximum gauge of digital micro-fluid and less than the twice of the maximum gauge of digital micro-fluid;
3. switching change-over switch makes power amplifier pass through change-over switch to be connected with first pin on the upper substrate; Start signal generator and power amplifier; Signal generator is exported the RF electric signal and the RF electric signal is transferred to power amplifier; Power amplifier carries out processing and amplifying to the RF electric signal that receives; And the RF electric signal after will amplifying through change-over switch is transferred to first interdigital transducer of micro-fluidic chip, and first interdigital transducer of last micro-fluidic chip produces surface acoustic wave after inserting the RF electric signal;
4. the surface acoustic wave of going up first interdigital transducer generation of micro-fluidic chip drives the digital micro-fluid to be transported on first hydrophobic layer that is placed in micro-fluidic chip; Make digital micro-fluid to be transported along the SAW propagating path movement near opening; Digital micro-fluid to be transported moves to the arc organic polymer and transports transporting on the hydrophobic layer of parts under the inertial force effect; Shutdown signal generator and power amplifier then switch change-over switch power amplifier are not connected with first pin on the upper substrate through change-over switch;
5. be positioned on the digital micro-fluid to be transported that transports on the hydrophobic layer is slipped to following micro-fluidic chip under action of gravity second hydrophobic layer, accomplish digital micro-fluid transporting between two micro-fluidic chips.
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| CN106247006B (en) * | 2016-09-19 | 2018-09-07 | 宁波大学 | A kind of marmem micro-valve and its control method based on surface acoustic wave |
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| WO2007128045A1 (en) * | 2006-05-02 | 2007-11-15 | Monash University | Microfluidic systems using surface acoustic energy and method of use thereof |
| CN101294971A (en) * | 2008-06-05 | 2008-10-29 | 复旦大学 | Digital microcurrent-controlled device and control method based on electrowetting effect on dielectric |
| CN201525749U (en) * | 2009-08-17 | 2010-07-14 | 宁波大学 | Device for realizing digital micro-flow transmission between two micro-flow control chips |
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| WO2007128045A1 (en) * | 2006-05-02 | 2007-11-15 | Monash University | Microfluidic systems using surface acoustic energy and method of use thereof |
| CN101294971A (en) * | 2008-06-05 | 2008-10-29 | 复旦大学 | Digital microcurrent-controlled device and control method based on electrowetting effect on dielectric |
| CN201525749U (en) * | 2009-08-17 | 2010-07-14 | 宁波大学 | Device for realizing digital micro-flow transmission between two micro-flow control chips |
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