CN201525749U - Device for realizing digital micro-flow transmission between two micro-flow control chips - Google Patents
Device for realizing digital micro-flow transmission between two micro-flow control chips Download PDFInfo
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- CN201525749U CN201525749U CN2009201919732U CN200920191973U CN201525749U CN 201525749 U CN201525749 U CN 201525749U CN 2009201919732 U CN2009201919732 U CN 2009201919732U CN 200920191973 U CN200920191973 U CN 200920191973U CN 201525749 U CN201525749 U CN 201525749U
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Abstract
The utility model discloses a device for realizing digital micro-flow transmission between two micro-flow control chips, comprising an arc organic polymer transmission unit with a first end connected with the side end of the micro-flow control chip closed to an opening and a second end above a second hydrophobic layer and near to a second hydrophobic layer, wherein a transmission hydrophobic layer is arranged on the surface and communicated with a first hydrophobic layer, thus RF electric signal is loaded on a first interdigital transducer by the signal generation device when the digital micro-flow on the first hydrophobic layer is transmitted to the second hydrophobic layer; the first interdigital transducer generates an acoustic surface wave and the acoustic surface wave drives the movement of the micro-flow on the first hydrophobic layer and makes the micro-flow move near to the opening and then the micro-flow moves to the transmission hydrophobic layer under inertial force action and then slides to the second hydrophobic layer under gravity action, thereby realizing the digital micro-flow transmission between two micro-flow control chips.
Description
Technical field
The utility model relates to a kind of microfluid and transports technology, especially relates to a kind of device of realizing transmission of digital microfluid between two micro-fluidic chips.
Background technology
Micro-fluidic chip is because of having small size, operative intelligenceization, lower reagent consumption, little volume, short reaction time and plurality of advantages such as integrated, make it in fields such as chemistry, biochemistry and bioanalysis, more and more be used, and new micro-fluidic chip is constantly arranged in the life of reality with scientific research is medium is applied.Micro-fluidic chip is to adopt micro electronmechanical method to process various microfluidic procedures unit on substrates such as silicon, glass or organic matter, as little valve, Micropump, microchannel, micro-mixer, microreactor etc., to realize the sequence of operations such as sample introduction, preliminary treatment, mixing, reaction, detection and post processing of sample or reagent, realize the complete testing process of micro-biochemical quantity.Micro-fluidic chip is micro-fluidic chip two classes that the operation format of microfluid in micro-fluidic chip is divided into the micro-fluidic chip and the digital stream of Continuous Flow according to operand.Micro-fluidic chip with respect to Continuous Flow, the micro-fluidic chip of digital stream have amount of samples still less, analysis speed is faster, accuracy is higher, sample or reagent cross pollution still less wait plurality of advantages and have more development prospect, has obtained various countries expert's extensive great attention.
At present, be that the surface acoustic wave techniques of substrate has the attention that advantages such as technology is simple ripe, cheap more and more are subjected to micro-fluidic expert with the piezoelectric.With the piezoelectric is the micro-fluidic chip of substrate, is the micro-fluidic chip of substrate with respect to silicon, glass, organic polymer etc., has more development potentiality, is that the micro-fluidic chip of substrate has obtained fast development in recent years with the piezoelectric.But simultaneously, the micro-fluidic chip that with the piezoelectric is substrate also has certain limitation, with respect to other substrate, relative difficult is carried out micro electronmechanical processing on the piezoelectric substrate of being made by piezoelectric, mostly can only be on piezoelectric substrate photoetching interdigital transducer array, realize open micro-fluidic chip, and the finger logarithm of interdigital transducer array is limited, feasible like this analysis and the detection micro-fluidic system to micro-biochemical substances often is difficult to realize in a micro-fluidic chip, may need two or more micro-fluidic chips could satisfy actual needs, at this moment, microfluid just transporting unavoidably between micro-fluidic chip.And existing micro-fluidic chip based on piezoelectric substrate also is confined to transporting of microfluid in the two-dimensional plane of a micro-fluidic chip, does not find to realize between micro-fluidic chip the report that microfluid transports as yet.As periodical " IEEE proceedings ultrasonic, ferroelectric and FREQUENCY CONTROL is divided proceedings " 2007 years the 54th volume the 10th phase 2146-2151 page or leaf (IEEE Transactions on ultrasonics, ferroelectrics, and frequency control Vol.54 (10), " utilization surface acoustic wave system detects and the little drop of hi-Fix " (" Detection andhigh-precision positioning of liquid droplets using SAW systems ") 2007:2146-2151) disclosed, it is based on surface acoustic wave techniques and realizes digital micro-fluid transporting in two-dimensional plane, on 128 ° of Y rotation X direction of propagation lithium niobate substrates, adopt microelectronic technique to make 2 * 2 interdigital transducer arrays, add the RF signal of telecommunication on the interdigital transducer in the horizontal direction and excite surface acoustic wave, this surface acoustic wave drives the digital micro-fluid on the acoustic path, so that microfluid transports in the plane of piezoelectric substrate, to definite, this transmission of digital microfluid method can only make digital micro-fluid move in two-dimensional plane by the vertical direction interdigital transducer in the microfluid position.But along with the micro-fluidic chip to digital stream is in depth studied, must need integrated increasing operating unit on micro-fluidic chip, especially complicated microfluidic analytical system, be difficult to all microfluidic procedures unit are integrated in the micro-fluidic chip, but each operating unit that microfluidic analytical system is required is integrated in respectively in two or more micro-fluidic chips by function, involved the problem that between a plurality of micro-fluidic chips, transports digital micro-fluid thus, and the micro-fluidic chip of existing digital stream generally includes a piezoelectric substrate, piezoelectric substrate is provided with the interdigital transducer group and is used for the hydrophobic layer of digital micro-fluid motion, the interdigital transducer group is made up of several interdigital transducers, interdigital transducer is provided with around piezoelectric substrate, interdigital transducer is connected with the external signal generating means, be provided with reflecting grating near the outside side of interdigital transducer on the piezoelectric substrate, reflecting grating is used to reduce the external signal generating means and outputs to RF electric signal power on the interdigital transducer, a micro-fluidic chip from same microfluidic analytical system transports or transmits digital micro-fluid to another micro-fluidic chip if desired, then the inevitable requirement micro-fluidic chip has an opening that is used for the digital micro-fluid transmission, even be used for the opening that digital micro-fluid transmits yet two micro-fluidic chips all have one, above-mentioned existing transmission of digital microfluid method also can't be implemented in transporting or transmitting of two digital micro-fluids between the micro-fluidic chip.
Summary of the invention
Technical problem to be solved in the utility model provides a kind of simple to operation, reliable operation, and can effectively realize the device that digital micro-fluid transports between two micro-fluidic chips.
The utility model solves the problems of the technologies described above the technical scheme that is adopted: a kind of device of realizing transmission of digital microfluid between two micro-fluidic chips, two micro-fluidic chips are respectively micro-fluidic chip and following micro-fluidic chip, the described upper surface of going up micro-fluidic chip has an opening that is used to export digital micro-fluid, it is characterized in that the device of realizing transmission of digital microfluid between two micro-fluidic chips comprises that the arc organic polymer transports parts, first end that described arc organic polymer transports parts is connected with the described side of going up the close described opening part of micro-fluidic chip, second end that described arc organic polymer transports parts is positioned at the top of the described hydrophobic layer of micro-fluidic chip down and near the described hydrophobic layer of micro-fluidic chip down, the surface that described arc organic polymer transports parts is provided with the hydrophobic layer that transports that is used for the digital micro-fluid conveying, and the described hydrophobic layer that transports is connected with the described hydrophobic layer of going up micro-fluidic chip.
The radius of curvature size that described arc organic polymer transports parts is 2～3 millimeters.
The thickness that described arc organic polymer transports parts is 0.5～1 millimeter.
Described arc organic polymer transports spacing between the hydrophobic layer of second end of parts and described down micro-fluidic chip for greater than the maximum gauge of digital micro-fluid and less than two to three times of the maximum gauge of digital micro-fluid.
The described material that transports the hydrophobic layer employing is TeflonAF 1600 hydrophobic materials.
The described thickness of hydrophobic layer that transports is more than or equal to 3 μ m.
Compared with prior art, advantage of the present utility model is that this device comprises that an arc organic polymer transports parts, first end that the arc organic polymer transports parts is connected with the side of last micro-fluidic chip near opening part, second end that the arc organic polymer transports parts is positioned at the top and close second hydrophobic layer of second hydrophobic layer of micro-fluidic chip down, the surface that the arc organic polymer transports parts is provided with the hydrophobic layer that transports that is used for the digital micro-fluid conveying, transporting hydrophobic layer is connected with first hydrophobic layer of last micro-fluidic chip, like this when needing to be positioned at transmission of digital microfluid on first hydrophobic layer to second hydrophobic layer the time, can load the RF signal of telecommunication to first interdigital transducer of last micro-fluidic chip by the external signal generating means, first interdigital transducer produces surface acoustic wave, surface acoustic wave drives the digital micro-fluid be positioned on first hydrophobic layer in the motion of first hydrophobic layer and it is moved near the opening, because transporting hydrophobic layer is connected with first hydrophobic layer, digital micro-fluid moves under the inertia force effect when moving near the opening and transports on the hydrophobic layer, again under the gravity effect, being positioned at the digital micro-fluid that transports on the hydrophobic layer is slipped on second hydrophobic layer along transporting hydrophobic layer, realized digital micro-fluid transporting between two micro-fluidic chips, become a reality thereby make the microfluidic analytical system that can not be integrated in a micro-fluidic chip relative complex can be integrated in two micro-fluidic chips, greatly improved the range of application of micro-fluidic chip.In addition, the utility model device and method can be applicable to fields such as medical diagnosis on disease, drug screening, environmental monitoring and national security.
Description of drawings
Fig. 1 is the structural representation of the utility model device;
Fig. 2 be the external signal generating means composition and with the annexation schematic diagram of change-over switch.
The specific embodiment
Embodiment describes in further detail the utility model below in conjunction with accompanying drawing.
In comparatively complicated microfluidic analytical system, generally include two or more micro-fluidic chips, be integrated with a plurality of operating units in each micro-fluidic chip, each micro-fluidic chip might need when wherein digital micro-fluid carries out associative operation to realize operation jointly with the digital micro-fluid that is positioned at other micro-fluidic chips to being arranged in, the common like this transmission of digital microfluid on some micro-fluidic chips need the need to another on micro-fluidic chip of this digital micro-fluid, present transmission of digital microfluid method can't be implemented in transporting of two digital micro-fluids between micro-fluidic chip, therefore the utility model proposes a kind of device of realizing transmission of digital microfluid between two micro-fluidic chips.
The utility model device is mainly used between two micro-fluidic chips, is used to realize transporting of two digital micro-fluids between the micro-fluidic chip.Fig. 1 has provided the annexation of the utility model device and two micro-fluidic chips, this micro-fluidic chip that is used to export digital micro-fluid in two micro-fluidic chips as on micro-fluidic chip 1, will be used to receive in two micro-fluidic chips transport the digital micro-fluid that comes micro-fluidic chip as time micro-fluidic chip 2.Last micro-fluidic chip 1 comprises first piezoelectric substrate 11, the upper surface of first piezoelectric substrate 11 is a working surface, four side arrays of the upper surface of first piezoelectric substrate 11 have first interdigital transducer 12 that is connected with external signal generating means 3 shown in Figure 2, the upper surface of first piezoelectric substrate 11 also is provided with first hydrophobic layer 14 that is used for the digital micro-fluid motion, one side of the upper surface of first piezoelectric substrate 11 has an opening 15 that is used to export digital micro-fluid, in fact on the upper surface of first piezoelectric substrate 11 during array first interdigital transducer 12, one first interdigital transducer is set on the side therein less promptly forms opening 15, one first interdigital transducer on the relative side with opening 15 positions of this opening 15 is corresponding, each first interdigital transducer, 12 cooperatings on the upper surface of such first piezoelectric substrate 11 can make digital micro-fluid move towards opening part; Also can be provided for reducing the first reflecting grating (not shown) that external signal generating means 3 outputs to the RF electric signal power on first interdigital transducer 12 on the upper surface of first piezoelectric substrate 11, the outside of close first interdigital transducer 12 in the position of first reflecting grating and corresponding with first interdigital transducer 12, at this, after first reflecting grating is set, the RF signal of telecommunication that is loaded into first interdigital transducer 12 can be more relatively low, if in the absence of first reflecting grating, need to load the more powerful RF signal of telecommunication to first interdigital transducer 12.The lower surface of first piezoelectric substrate 11 is connected with a upper substrate 16 that can be used in fixedly connected lead, and upper substrate 16 is provided with first pin, 17, the first interdigital transducers 12 and is connected with first pin 17 by lead.
Following micro-fluidic chip 2 comprises second piezoelectric substrate 21, the upper surface of second piezoelectric substrate 21 is a working surface, four side arrays of the upper surface of second piezoelectric substrate 21 have the upper surface of second interdigital transducer, 22, the second piezoelectric substrates 21 that are connected with external signal generating means 3 to be provided with to be used for second hydrophobic layer 24 of digital micro-fluid motion; Also can be provided for reducing the second reflecting grating (not shown) that external signal generating means 3 outputs to the RF electric signal power on second interdigital transducer 22 on the upper surface of second piezoelectric substrate 21, the outside of close second interdigital transducer 22 in the position of second reflecting grating and corresponding with second interdigital transducer 22, at this, after second reflecting grating is set, the RF signal of telecommunication that is loaded into second interdigital transducer 22 can be more relatively low, if in the absence of second reflecting grating, need to load the more powerful RF signal of telecommunication to second interdigital transducer 22.Second piezoelectric substrate 21 is connected with an infrabasal plate 26 that can be used in fixedly connected lead, and infrabasal plate 26 is provided with second pin, 27, the second interdigital transducers 22 and is connected with second pin 27 by lead.
External signal generating means 3 shown in Figure 2 comprises the signal generator 31 and the power amplifier 32 that is connected with signal generator 31 that is used to produce the RF signal of telecommunication, power amplifier 32 is connected with change-over switch 33, change-over switch 33 is connected with second pin 27 with first pin 17 respectively, power amplifier 32 is connected with first pin 17 or second pin 27 by change-over switch 33 or disconnects by switching change-over switch 33, signal generator 31, power amplifier 32 and change-over switch 33 are prior art.The RF signal of telecommunication of signal generator 31 output after power amplifier 32 amplifies again through the switching of change-over switch 33 respectively timesharing be added on each second interdigital transducer 22 of each first interdigital transducer, 12 upper and lower micro-fluidic chips 2 of micro-fluidic chip 1, realize that digital micro-fluid moves any position in first hydrophobic layer 14 or second hydrophobic layer 24 respectively.
Wherein, first interdigital transducer 12 and first reflecting grating all adopt existing microelectronic technique photoetching on the working surface of first piezoelectric substrate 11, and second interdigital transducer 22 and second reflecting grating all adopt existing microelectronic technique photoetching on the working surface of second piezoelectric substrate 21; First piezoelectric substrate 11 and second piezoelectric substrate 12 can adopt common LiNbO
3Piezoelectric substrate or optical grade LiNbO
3Piezoelectric substrate; Be connected in the upper substrate 16 of lower surface of first piezoelectric substrate 11 and the infrabasal plate 26 of lower surface that is connected in second piezoelectric substrate 21 by PCB (Printed Circuit Board, printed substrate) plate is made, the easy fixing cord of pcb board, certainly upper substrate 16 and infrabasal plate 26 also can adopt other existing substrates that can fixing cord; First hydrophobic layer 14 is to apply one deck Teflon AF 1600 hydrophobic materials to form on the working surface of first piezoelectric substrate 11, second hydrophobic layer 24 is to apply one deck TeflonAF 1600 hydrophobic materials to form on the working surface of second piezoelectric substrate 21, the controllable thickness of first hydrophobic layer 14 and second hydrophobic layer 24 built in 1 μ m between the 3 μ m, this is in order to make first hydrophobic layer 14 and second hydrophobic layer 24 that the better hydrophobic energy be arranged, if first hydrophobic layer 14 and second hydrophobic layer 24 are too thick, then behind first interdigital transducer 12 or second interdigital transducer, 22 work generation surface acoustic waves, the energy of first thicker hydrophobic layer 14 and second hydrophobic layer, 24 meeting attenuate sound surface waves, the surface acoustic wave that will cause first interdigital transducer 12 or second interdigital transducer 22 to produce like this can't drive digital micro-fluid, if hydrophobic layer is too thin, then its surface tension is bigger, and hydrophobic performance is relatively poor.
Device of the present utility model as shown in Figure 1, comprise that the arc organic polymer transports parts 4, first end 41 that the arc organic polymer transports parts 4 is connected with the side of last micro-fluidic chip 1 near opening 15 places, both connections can adopt existing gluing technique to carry out adhesion, also can adopt the interconnection technique of other existing any maturations, second end 42 that the arc organic polymer transports parts 4 is positioned at the top and close second hydrophobic layer 24 of second hydrophobic layer 24 of micro-fluidic chip 2 down, the surface that the arc organic polymer transports parts 4 be provided be used for that digital micro-fluid carries transport hydrophobic layer 43, transport hydrophobic layer 43 and be connected with first hydrophobic layer 14 of last micro-fluidic chip 1.At this, the material that the arc organic polymer transports parts 4 employings is an organic polymer.
Utilize the utility model device between last micro-fluidic chip 1 and following micro-fluidic chip 2, to realize transporting of digital micro-fluid, also needing to go up micro-fluidic chip 1 is integral with following micro-fluidic chip 2 vertical parallel arranged, in this specific embodiment, at least two back-up blocks 19 are set between upper substrate 16 and infrabasal plate 26, like this when adjacent last micro-fluidic chip 1 and following micro-fluidic chip 2 vertically promptly are integral perpendicular to horizontal direction parallel arranged by back-up block 19, back-up block 19 will be gone up micro-fluidic chip 1 and following micro-fluidic chip 2 separates, and effectively ensure the operate as normal of each micro-fluidic chip.In addition, the length of this back-up block 19 need guarantee that second end 42 that the arc organic polymer transports parts 4 is positioned at the top of second hydrophobic layer 24 of micro-fluidic chip 2 down and near second hydrophobic layer 24, and second end 42 that the arc organic polymer transports parts 4 and the spacing between second hydrophobic layer 24 are greater than the maximum gauge of digital micro-fluid and less than two to three times of the maximum gauge of digital micro-fluid.At this, back-up block 19 preferably adopts insulating materials to make.
In this specific embodiment, it is less to require the arc organic polymer to transport the radius of curvature of parts 4, be positioned at the digital micro-fluid that transports on the hydrophobic layer 43 like this and can transport hydrophobic layer 43 landings because of gravity effect edge, at this, the big I of radius of curvature that the arc organic polymer transports parts 4 is located in 2 to 3 millimeters scopes, if it is too big that the arc organic polymer transports the radius of curvature of parts 4, then to transport the surperficial tangential component of parts 4 along the arc organic polymer less and cause the digital micro-fluid can not be along its surperficial landing for the gravity of digital micro-fluid, if it is too little, then wayward digital micro-fluid is transported to down on second hydrophobic layer 24 of micro-fluidic chip 2 smoothly, and the radius of curvature that the arc organic polymer can be transported parts 4 in actual application is made as 2.5 millimeters; The thickness that the arc organic polymer transports parts 4 is 0.5 to 1 millimeter, if it is too thin that the arc organic polymer transports parts 4, then be not easy to adopt existing gluing technique the arc organic polymer to be transported first end 41 and last micro-fluidic chip 1 adhesion of parts 4, if it is too thick, it is heavier that then the arc organic polymer transports the deadweight of parts 4, the adhesion fastness of itself and last micro-fluidic chip will directly be influenced, also can directly adopt the thickness identical in the actual application with last micro-fluidic chip 1, the arc organic polymer transports spacing between second hydrophobic layer 24 of second end 42 of parts 4 and following micro-fluidic chip 2 for greater than the maximum gauge of digital micro-fluid and less than two to three times of the maximum gauge of digital micro-fluid, the twice that can this spacing in the actual application be set to the maximum gauge of digital micro-fluid, so both can guarantee to be positioned at digital micro-fluid on second hydrophobic layer 24 can proper motion on second hydrophobic layer 24, can guarantee again can be slipped to smoothly on second hydrophobic layer 24, and not influence digital micro-fluid by the digital micro-fluid that transports hydrophobic layer 43; Transporting hydrophobic layer 43 forms for applying one deck TeflonAF 1600 hydrophobic materials on the surface that transports parts 4 at the arc organic polymer, transport the thickness of hydrophobic layer 43 can be provided with thicker, transport 4 pairs of influences that transport the hydrophobic property of hydrophobic layer 43 of parts to reduce the arc organic polymer, its surface tension is less like this, hydrophobic performance is better, and the thickness that can transport hydrophobic layer 43 in actual application is set to more than or equal to 3 μ m.
When using the utility model device, less for volume as digital micro-fluid less than 5 microlitres, can adopt not miscible oily digital micro-fluid to realize small size digital micro-fluid transporting between two micro-fluidic chips as auxiliary microfluid.
Use the transportation method of said apparatus, specifically may further comprise the steps:
1. export the micro-fluidic chip of digital micro-fluid as last micro-fluidic chip 1 with being used in two micro-fluidic chips, to be used to receive the micro-fluidic chip of the digital micro-fluid that transports in two micro-fluidic chips as following micro-fluidic chip 2, last micro-fluidic chip 1 comprises first piezoelectric substrate 11, four side arrays of the upper surface of first piezoelectric substrate 11 have first interdigital transducer 12 that is connected with external signal generating means 3, the upper surface of first piezoelectric substrate 11 has first reflecting grating corresponding with first interdigital transducer 12 near the arranged outside of first interdigital transducer 12, and a side of the upper surface of first piezoelectric substrate 11 has an opening 15 that is used to export digital micro-fluid, the upper surface of first piezoelectric substrate 11 is provided with first hydrophobic layer 14 that is used for the digital micro-fluid motion, following micro-fluidic chip 2 comprises second piezoelectric substrate 21, four side arrays of the upper surface of second piezoelectric substrate 21 have second interdigital transducer 22 that is connected with external signal generating means 3, the upper surface of second piezoelectric substrate 21 has second reflecting grating corresponding with second interdigital transducer 22 near the arranged outside of second interdigital transducer 22, the upper surface of second piezoelectric substrate 21 is provided with second hydrophobic layer 24 that is used for the digital micro-fluid motion, external signal generating means 3 comprises the signal generator 31 and the power amplifier 32 that is connected with signal generator 31 that is used to produce the RF signal of telecommunication, and power amplifier 32 is connected with change-over switch 33.
Last micro-fluidic chip 1 is connected in one to be used for fixing on the upper substrate 16 that connects lead, first pin 17 is set on upper substrate 16, the busbar of first interdigital transducer 12 is connected with first pin 17 through pressure welding or conductive silver glue by thin wire, following micro-fluidic chip 2 is connected in one to be used for fixing on the infrabasal plate 26 that connects lead, second pin 27 is set on infrabasal plate 26, the busbar of second interdigital transducer 22 is connected with second pin 27 through pressure welding or conductive silver glue by thin wire, between upper substrate 16 and infrabasal plate 26, back-up block 19 is set, to go up micro-fluidic chip 1 by back-up block 19 and be integral, first pin 17 will be connected with change-over switch 33 respectively with second pin 27 with following micro-fluidic chip 2 vertical parallel arranged.Like this, the RF signal of telecommunication of signal generator 31 output after power amplifier 32 amplifies again through the switching of change-over switch 33 respectively timesharing be added on each second interdigital transducer 22 of each first interdigital transducer, 12 upper and lower micro-fluidic chips 2 of micro-fluidic chip 1, realize that digital micro-fluid moves any position in first hydrophobic layer 14 or second hydrophobic layer 24 respectively.
2. will be provided with and transport hydrophobic layer 43 and radius of curvature size is that first end 41 that 2 to 3 millimeters arc organic polymer transports parts 4 is fixedlyed connected near the side at opening 15 places with first piezoelectric substrate 11, make and transport hydrophobic layer 43 and be connected with first hydrophobic layer 14 of last micro-fluidic chip 1, second end 42 that keeps the arc organic polymer to transport parts 4 simultaneously is positioned at the top of following second hydrophobic layer 24 of micro-fluidic chip 2 and near second hydrophobic layer 24, and second end 42 that the arc organic polymer transports parts 4 and the spacing between second hydrophobic layer 24 are greater than the maximum gauge of digital micro-fluid and less than two to three times of the maximum gauge of digital micro-fluid.
3. switching change-over switch 33 makes power amplifier 32 be connected with first pin 17 on the upper substrate 16 by change-over switch 33, start signal generator 31 and power amplifier 32, signal generator 31 is exported the RF signals of telecommunication and the RF signal of telecommunication is transferred to power amplifier 32, the RF signal of telecommunication that 32 pairs in power amplifier receives amplifies processing, and the RF signal of telecommunication after will amplifying by change-over switch 33 is transferred to first interdigital transducer 12 of micro-fluidic chip 1, produces surface acoustic wave after first interdigital transducer 12 of last micro-fluidic chip 1 inserts the RF signals of telecommunication.
4. go up surface acoustic wave that first interdigital transducer 12 of micro-fluidic chip 1 produces and drive digital micro-fluid to be transported on first hydrophobic layer 14 that is placed in micro-fluidic chip 1, digital micro-fluid to be transported is moved in first hydrophobic layer 14 along the SAW propagating path, during near digital micro-fluid to be transported moves to opening 15 position, switch change-over switch 33 again, make with opening 15 relative positions on the work of first interdigital transducer 12, the surface acoustic wave that should excite with first interdigital transducer 12 on opening 15 relative positions drives the digital micro-fluid to be transported near opening 15 places, move to the arc organic polymer at digital micro-fluid to be transported under the inertia force effect and transport transporting on the hydrophobic layer 43 of parts 4, shutdown signal generator 31 and power amplifier 32 then switch change-over switch 33 power amplifier 32 are not connected with first pin 17 on the upper substrate 16 by change-over switch 33.
5. be positioned on second hydrophobic layer 24 of digital micro-fluid the to be transported micro-fluidic chip 2 under being slipped under the gravity effect that transports on the hydrophobic layer 43, finish digital micro-fluid transporting between two micro-fluidic chips.
Claims (6)
1. device of between two micro-fluidic chips, realizing transmission of digital microfluid, two micro-fluidic chips are respectively micro-fluidic chip and following micro-fluidic chip, the described upper surface of going up micro-fluidic chip has an opening that is used to export digital micro-fluid, it is characterized in that the device of realizing transmission of digital microfluid between two micro-fluidic chips comprises that the arc organic polymer transports parts, first end that described arc organic polymer transports parts is connected with the described side of going up the close described opening part of micro-fluidic chip, second end that described arc organic polymer transports parts is positioned at the top of the described hydrophobic layer of micro-fluidic chip down and near the described hydrophobic layer of micro-fluidic chip down, the surface that described arc organic polymer transports parts is provided with the hydrophobic layer that transports that is used for the digital micro-fluid conveying, and the described hydrophobic layer that transports is connected with the described hydrophobic layer of going up micro-fluidic chip.
2. the device of realizing transmission of digital microfluid between two micro-fluidic chips according to claim 1 is characterized in that the radius of curvature size that described arc organic polymer transports parts is 2～3 millimeters.
3. the device of realizing transmission of digital microfluid between two micro-fluidic chips according to claim 1 is characterized in that the thickness that described arc organic polymer transports parts is 0.5～1 millimeter.
4. according to each described device of between two micro-fluidic chips, realizing transmission of digital microfluid in the claim 1 to 3, it is characterized in that spacing between the hydrophobic layer of second end that described arc organic polymer transports parts and described micro-fluidic chip down is greater than the maximum gauge of digital micro-fluid and less than two to three times of the maximum gauge of digital micro-fluid.
5. the device of realizing transmission of digital microfluid between two micro-fluidic chips according to claim 4 is characterized in that the described material that transports the hydrophobic layer employing is Teflon AF 1600 hydrophobic materials.
6. the device of realizing transmission of digital microfluid between two micro-fluidic chips according to claim 4 is characterized in that the described thickness of hydrophobic layer that transports is more than or equal to 3 μ m.
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| CN101639475B (en) * | 2009-08-14 | 2012-09-05 | 宁波大学 | Device and method for realizing transmission of digital microfluid between two microfluidic chips |
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