CN203196648U - Device for realizing digital microfluid fracture by adopting acoustic surface wave - Google Patents

Device for realizing digital microfluid fracture by adopting acoustic surface wave Download PDF

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Publication number
CN203196648U
CN203196648U CN 201320157523 CN201320157523U CN203196648U CN 203196648 U CN203196648 U CN 203196648U CN 201320157523 CN201320157523 CN 201320157523 CN 201320157523 U CN201320157523 U CN 201320157523U CN 203196648 U CN203196648 U CN 203196648U
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digital micro
fluid
interdigital transducer
hydrophobic layer
acoustic wave
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章安良
査燕
付相庭
尉一卿
韩庆江
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Ningbo University
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Ningbo University
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Abstract

The utility model discloses a device for realizing digital microfluid fracture by adopting an acoustic surface wave. The device comprises a piezoelectric substrate and a signal generator, wherein an interdigital transducer, a first hydrophobic layer, a sound absorption coating and a second hydrophobic layer are arranged on the piezoelectric substrate; the interdigital transducer is used for stimulating the acoustic surface wave; the first hydrophobic layer is used for placing digital microfluid to be raptured; the sound absorption coating is used for damping the strength of the acoustic surface wave stimulated by the interdigital transducer; the second hydrophobic layer is used for receiving the raptured digital microfluid; the first hydrophobic layer, the sound absorption coating and the second hydrophobic layer are orderly arranged on a sound transmission path of the acoustic surface wave; the digital microfluid raptures when the power of a radio frequency (RF) electric signal loaded to the interdigital transducer by the signal generator is instantaneously reduced to be greater than or equal to 15 dBm; the raptured digital microfluid flies out and falls off on the second hydrophobic layer. The device has the advantages that the device adopts an un-weighted interdigital transducer, so that rapture of the digital microfluid can be achieved just by low power of the RF electric signal. In addition, the device is simple in structure, small in volume and easy to integrate.

Description

A kind of surface acoustic wave is realized the device that digital micro-fluid breaks
Technical field
The utility model relates to the digital micro-fluid bursting technologies in a kind of micro-fluidic chip, especially relates to the device that a kind of surface acoustic wave realizes that digital micro-fluid breaks.
Background technology
Microfluidic technology can be integrated on the miniflow substrate such as sampling, sample pretreatment, separation, reaction, detection and data analysis a series of, greatly reduced microflow analysis cost, shortened the time of microflow analysis, thereby obtained fast development.Correspondingly, also be widely applied gradually take the microfluidics of microfluidic technology as the basis, especially reach analysis time and analysis precision requiring relatively high occasion to obtain application in the expensive analytical reagent of the needs such as medical diagnosis on disease, health care, expensive analytical instrument.With respect to traditional analytical system, microfluidics has advantages of more, such as shorter reaction time, lower analysis cost, flexile device architecture, few miniflow volume and system dimension of less etc., thereby microfluidics is widely used in the fields such as dna sequencing, protein analysis, single cell analysis, illicit drugs inspection and food security.Divide according to the microfluid working forms in the microfluidics, it has two types, comprises Continuous Flow form and digital stream form.In general, the microfluidics that works in the digital stream form have reagent volume still less, analysis time is shorter and the more high advantage of analysis precision, thereby miniflow operation and the microflow analysis such as the microfluidics that works in the digital stream form has been applied to that miniflow transports, mixes, fusion, separation and analysis.
In the microfluidics that works in the digital stream form, for reducing reagent or amount of samples, often need the on-chip digital micro-fluid of miniflow is broken, to reduce the volume of digital micro-fluid, reduce the cost of microflow analysis.
In the microfluidics that works in the digital stream form, a kind of method of the digital micro-fluid that breaks commonly used is the microchannel of adopting " T-shaped knot " structure, digital micro-fluid to be analyzed is floating to be stated from the immiscible with it carrying object, carrying object is the pressure-driven current downflow externally, and the transmission of digital microfluid in the drive carrying object, when the process of the digital micro-fluid in the carrying object " T-shaped knot ", deformation occurs owing to being subject to " T-shaped knot " and carrying object acting in conjunction in digital micro-fluid, the shearing force that causes when deformation is during greater than the surface tension of digital micro-fluid, and digital micro-fluid breaks.The advantage of the method is that the volume that digital micro-fluid breaks can carry out flexible modulation according to the flowing velocity of carrying object and the physical dimension of " T-shaped knot ", but the method needs carrying object extra, that be used for carrying transmission of digital microfluid, and need to add such as compression pump equal pressure drive source, this has not only increased cost, and compression pump is difficult to be integrated on the miniflow substrate, increased the size of microfluidics.
In the microfluidics that works in the digital stream form, the method of the digital micro-fluid that breaks that another kind is common is that the little barrier of isolated PDMS is set in microchannel, the little barrier of PDMS is fixed in the microchannel, when impressed pressure drives, digital micro-fluid transports in microchannel with carrying object, when running into the little barrier of PDMS that is fixed in the microchannel, digital micro-fluid produces deformation and causes shearing force, breaks under the rolling action of carrying object.The advantage of the method is with respect to " T-shaped knot ", its structure is comparatively simple, and the volume that digital micro-fluid breaks can be regulated according to the isolated little barrier of PDMS and the distance between microchannel, but the method needs the impressed pressure drive source, is not easy to be integrated on the miniflow substrate.
The weak point that above-mentioned two kinds of common methods that the realization digital micro-fluid breaks in microchannel are mentioned except it is above-mentioned, also often be difficult to be applied to open digital micro-fluidic system.Open digital micro-fluidic system is that digital micro-fluid to be operated directly is placed on the surface of miniflow substrate, moves in the surperficial two-dimensional plane of miniflow substrate under External Force Actings such as sound, electricity, realizes the microflow analysis of digital micro-fluidic system.The advantage of open digital micro-fluidic system is simple in structure, and need not carrying object and carry.Common open digital micro-fluidic system is based on the wetting open digital micro-fluidic system of dielectric electricity, its electric wetness degree that utilizes electric field to change the miniflow substrate surface realizes that digital micro-fluid breaks, but this system need to make electrod-array by lithography on the surface of miniflow substrate, and each electrode in the electrod-array carried out the switching electric control, operation is comparatively complicated.
Open digital micro-fluidic system based on surface acoustic wave can overcome above-mentioned based on the wetting existing some shortcomings part of open digital micro-fluidic system of dielectric electricity.Digital micro-fluid is realized operating in the two-dimensional plane along the piezoelectric substrate surface under the acoustic radiation force effect.Existing method of breaking based on the surface acoustic wave digital micro-fluid is to adopt larger signal of telecommunication voltage to be added to focus on the interdigital transducer, focuses on interdigital transducer and excites breaking of the surface acoustic wave of higher-strength realization digital micro-fluid so that digital micro-fluid to be broken flies to escape.This method is owing to will make digital micro-fluid fly ease, the higher electric signal power of interdigital transducer loading need to focused on, exciting the surface acoustic wave of higher-strength, therefore the normal piezoelectric ceramics that adopts is as substrate, and like this so that this method be difficult to be widely applied.Such as periodical " microelectromechanical systems " the 17th volume the 1st phase 147-156 page or leaf (Journal of microelectromechanical systems in 2008, Vol. 17 (1), 2008:147-156) disclosed " sealing microreactor based on little drop oil " (" Droplet-Based Microreactions With Oil Encapsulation "), it is to place the oil phase digital micro-fluid on the surface of glass substrate, the reactant liquor digital micro-fluid of question response is placed on the PZT piezoelectric substrate, the RF signal of telecommunication after power amplifier amplifies is loaded on the focusing interdigital transducer that is arranged on the PZT piezoelectric substrate and excites strong surface acoustic wave, so that the reactant liquor digital micro-fluid on the acoustic propagation path breaks and flies to escape on the oil phase digital micro-fluid of the glass substrate that is positioned at PZT piezoelectric substrate top, form oil and seal the reactant liquor digital micro-fluid, evaporate to reduce reactant liquor, and in the oil phase microfluid, finish chemical reaction.The method of this digital micro-fluid that breaks needs higher electric signal power, thereby often adopt piezoelectric ceramics as substrate, yet in the piezoelectric micromotor streaming system, general larger, the lower-cost lithium niobate substrate of electromechanical coupling factor that adopts is if excite surface acoustic wave very easily to make lithium niobate substrate chipping with the high-power signal of telecommunication like this; Simultaneously, focus on the interdigital transducer design comparatively complicated, thereby the break method of digital micro-fluid of this surface acoustic wave is difficult to be widely applied.
Summary of the invention
Technical problem to be solved in the utility model provides the device that a kind of surface acoustic wave realizes that digital micro-fluid breaks, and it is simple in structure, volume is little, it is integrated to be easy to, and only needs lower electric signal power just can realize breaking of digital micro-fluid.
The utility model solves the problems of the technologies described above the technical scheme that adopts: a kind of surface acoustic wave is realized the device that digital micro-fluid breaks, it is characterized in that comprising piezoelectric substrate and for generation of the signal generation apparatus of the RF signal of telecommunication, the upper surface of described piezoelectric substrate is working surface, be provided with the interdigital transducer that is connected and is used for exciting surface acoustic wave with described signal generation apparatus on the working surface of described piezoelectric substrate, be used for placing the first hydrophobic layer of digital micro-fluid to be broken, the sound absorption coating of the intensity of the surface acoustic wave that the described interdigital transducer that is used for decaying excites and be used for receiving the second hydrophobic layer of the digital micro-fluid after breaking, described the first hydrophobic layer, described sound absorption coating and described the second hydrophobic layer are positioned on the sound transmission path of the surface acoustic wave that described interdigital transducer excites successively, the digital micro-fluid that power moment that described signal generation apparatus is loaded into the RF signal of telecommunication on the described interdigital transducer is positioned on described the first hydrophobic layer when reducing more than or equal to 15 dBm breaks, and the digital micro-fluid after breaking flies effusion and falls within on described the second hydrophobic layer.
Described signal generation apparatus is by forming for generation of the adjustable signal generator of the RF signal of telecommunication and the power amplifier that is connected with described adjustable signal generator, and described power amplifier is connected with described interdigital transducer.
Before being positioned over digital micro-fluid on described the first hydrophobic layer and breaking, the power that described adjustable signal generator is loaded into the RF signal of telecommunication on the described interdigital transducer after by described power amplifier is 12dBm~18 dBm, the power moment that is loaded into the RF signal of telecommunication on the described interdigital transducer after continuing 0.5s~2s after making described adjustable signal generator by described power amplifier is down to-3dBm~3dBm, is positioned over digital micro-fluid on described the first hydrophobic layer and breaks and fly to overflow.
Be connected with pcb board on the lower surface of described piezoelectric substrate, be provided with a plurality of terminal pins on the described pcb board, described interdigital transducer comprises two busbars, described busbar is connected with described terminal pin by wire, and described terminal pin is connected with described power amplifier by wire.
Also be provided with the reflecting grating that loads on the power of the RF signal of telecommunication on the described interdigital transducer for minimizing on the working surface of described piezoelectric substrate.
The thickness of described sound absorption coating is 100 μ m~1mm.
The width of described sound absorption coating is consistent with the aperture of described interdigital transducer.
Described sound absorption coating is polyimides sound absorbent rubber layer or PDMS coat.
Be provided with the baffle plate that falls within after the digital micro-fluid that breaks flies to overflow on the described piezoelectric substrate be used to stopping on described the second hydrophobic layer, described baffle plate is provided with hydrophobic thin film on a side of described interdigital transducer, the height of described baffle plate is more than or equal to 3cm.
Described baffle plate is fixed on described the second hydrophobic layer by the fixed block of being made by the PDMS material.
Compared with prior art, the utility model has the advantage of: by piezoelectric substrate and signal generation apparatus are set, and arrange at piezoelectric substrate and to be connected with signal generation apparatus and for the interdigital transducer that excites surface acoustic wave, be used for placing the first hydrophobic layer of digital micro-fluid to be broken, be used for the surface acoustic wave that the decay interdigital transducer excites intensity sound absorption coating and be used for receiving the second hydrophobic layer of the digital micro-fluid after breaking, make simultaneously the first hydrophobic layer, sound absorption coating and the second hydrophobic layer are positioned on the sound transmission path of the surface acoustic wave that interdigital transducer excites successively, the surface acoustic wave that excites of interdigital transducer directly acts on the digital micro-fluid that is seated on the first hydrophobic layer like this, produce acoustic streaming and form acoustic streaming power this moment in digital micro-fluid, so that there is a kind of trend that moves upward by certain angle in digital micro-fluid, but can not move at the first hydrophobic layer, this state continuance power that the control signal generating means is loaded into the RF signal of telecommunication on the interdigital transducer after a period of time descends more than 15 dBm, being positioned over digital micro-fluid on the first hydrophobic layer this moment breaks and flies to overflow, and finally fall within on the second hydrophobic layer, this device has been realized breaking of digital micro-fluid by the power that the control signal generating means is loaded into the RF signal of telecommunication on the interdigital transducer, owing to need not interdigital transducer is weighted design, namely adopt to wait to refer to long evenly spaced interdigital transducer, thereby the interdigital transducer designing and making is simple; Simultaneously, only need lower RF electric signal power can realize breaking of digital micro-fluid; On the other hand, this device need not the impressed pressure drive source, and is simple in structure, volume is little, it is integrated to be easy to, and can be used for the piezoelectricity micro flow chip and carries out miniflow pre-treatment operation.
Description of drawings
Fig. 1 is the structural representation of the utility model device;
Fig. 2 is the enlarged diagram of A part among Fig. 1.
The specific embodiment
Embodiment is described in further detail the utility model below in conjunction with accompanying drawing.
A kind of surface acoustic wave that the utility model proposes is realized the device that digital micro-fluid breaks, as shown in the figure, it comprises piezoelectric substrate 1 and for generation of the signal generation apparatus 2 of the RF signal of telecommunication, the upper surface of piezoelectric substrate 1 is working surface, be provided with the interdigital transducer 3 that is connected and is used for exciting surface acoustic wave with signal generation apparatus 2 on the working surface of piezoelectric substrate 1, be used for placing the first hydrophobic layer 4 of digital micro-fluid to be broken 8, the sound absorption coating 5 that is used for the intensity of the surface acoustic wave that decay interdigital transducer 3 excites, be used for receiving the second hydrophobic layer 6 of the digital micro-fluid after breaking and be used for reducing the reflecting grating 7 that signal generation apparatus 2 loads on the power of the RF signal of telecommunication on the interdigital transducer 3, the first hydrophobic layer 4, sound absorption coating 5 and the second hydrophobic layer 6 are positioned on the sound transmission path of the surface acoustic wave that interdigital transducer 3 excites successively, reflecting grating 7 is positioned on the opposite direction in sound transmission path of the surface acoustic wave that interdigital transducer 3 excites, be the both sides that reflecting grating 7 and the first hydrophobic layer 4 lay respectively at interdigital transducer 3, the digital micro-fluid 8 that power moment that signal generation apparatus 2 is loaded into the RF signal of telecommunication on the interdigital transducer 3 is positioned on the first hydrophobic layer 4 when reducing more than or equal to 15 dBm breaks, and the digital micro-fluid after breaking flies effusion and falls within on the second hydrophobic layer 6.At this, interdigital transducer 3 and reflecting grating 7 all are to adopt existing microelectronic technique photoetching on the working surface of piezoelectric substrate 1, and reflecting grating 7 is used for reflecting surface acoustic wave that interdigital transducer 3 excites to reduce the power of the RF signal of telecommunication.
In the present embodiment, signal generation apparatus 2 is by forming for generation of the adjustable signal generator 21 of the RF signal of telecommunication and the power amplifier 22 that is connected with adjustable signal generator 21, power amplifier 22 is connected with interdigital transducer 3, the adjustable signal generator 21 output RF signals of telecommunication, this RF signal of telecommunication is loaded on the interdigital transducer 3 after power amplifier 22 amplifies, and interdigital transducer 3 excites surface acoustic wave under the effect of the RF signal of telecommunication; Before being positioned over digital micro-fluid 8 on the first hydrophobic layer 4 and breaking, the power that control adjustable signal generator 21 is loaded into the RF signal of telecommunication on the interdigital transducer 3 after by power amplifier 22 is 12dBm~18 dBm, power moment that control adjustable signal generator 21 is loaded into the RF signal of telecommunication on the interdigital transducer 3 after by power amplifier 22 after continuing 0.5s~2s is down to-3dBm~3dBm, be positioned over digital micro-fluid 8 on the first hydrophobic layer 4 this moment and break and fly to overflow, and finally fall within on the second hydrophobic layer 6.At this, it is the signal generator of 0.1V that adjustable signal generator 21 can adopt existing output voltage degree of regulation; Power amplifier 22 adopts the commercially available prod; In actual mechanical process, open and to control adjustable signal generator 21 behind adjustable signal generator 21 and the power amplifier 22 and be loaded into the power of the RF signal of telecommunication on the interdigital transducer 3 as being 15 dBm after by power amplifier 22, the surface acoustic wave that interdigital transducer 3 excites enters to be positioned over digital micro-fluid to be broken 8 on the first hydrophobic layer 4 with the radiation angle radiation, form acoustic streaming power at digital micro-fluid to be broken 8 interior generation acoustic streamings, so that there is a kind of trend that moves upward by certain angle in digital micro-fluid 8 to be broken, but can not be in 4 motions of the first hydrophobic layer, the power that control adjustable signal generator 21 is loaded into the RF signal of telecommunication on the interdigital transducer 3 after by power amplifier 22 behind this state continuance 0.5s descends more than 15 dBm, as drop to-1dBm, be positioned over digital micro-fluid 8 on the first hydrophobic layer 4 this moment and break and fly to overflow, and finally fall within on the second hydrophobic layer 6.
In the present embodiment, be connected with pcb board 9 on the lower surface of piezoelectric substrate 1, be provided with two terminal pins 91 on the pcb board 9, interdigital transducer 3 comprises two busbars 31, a busbar is connected with a terminal pin through pressure welding or conductive silver glue by wire, another busbar is connected with another terminal pin through pressure welding or conductive silver glue by wire, and two terminal pins 91 are connected with power amplifier 22 by wire.At this, pcb board 9 also can be substituted by other existing substrate that can fixing cord.
In the present embodiment, be provided with the baffle plate 61 that falls within after the digital micro-fluid that breaks flies to overflow on the piezoelectric substrate 1 be used to stopping on the second hydrophobic layer 6, baffle plate 61 is provided with the hydrophobic thin film (not shown) on a side of interdigital transducer 3, this baffle plate 61 can adopt existing thin glass sheet, and the working face at thin glass sheet namely applies Teflon AF 1600 hydrophobic thin film towards a side of interdigital transducer 3, the height of this baffle plate 61 can be designed to more than or equal to 3cm, can be coated with in the bottom of this baffle plate 61 last layer PDMS material man-hour adding, then this baffle plate 61 is adhered on the second hydrophobic layer, perhaps also can be fixed on the second hydrophobic layer 6 by a fixed block 62 of being made by the PDMS material.At this, this baffle plate 61 is arranged on the side of the second hydrophobic layer 6 away from sound absorption coating 5, and it is identical with the aperture of interdigital transducer 3 that the width of baffle plate 61 can be designed to.When design the second hydrophobic layer 6, if the length of the second hydrophobic layer 6 greater than 6cm, does not then arrange baffle plate 61 on the second hydrophobic layer 6, the digital micro-fluid after breaking can not fly away from out the second hydrophobic layer 6 yet.At this, hydrophobic thin film is to apply one deck Teflon AF 1600 hydrophobic materials in a side of baffle plate 61, again through 160 degree insulating box oven dry formation in about 1 hour.
In the present embodiment, sound absorption coating 5 applies one deck PDMS(dimethyl silicone polymer for the sound transmission path of the surface acoustic wave that excites at interdigital transducer 3) material, after spontaneous curing in 24 hours, form again, and the thickness of the PDMS coat of requirement formation is 100 μ m~1mm, the thickness that can make the PDMS coat when operating such as reality is 100 μ m, if sound absorption coating 5 adopts the PDMS coat, then the first hydrophobic layer 4 and the second hydrophobic layer 6 can be wholely set, and directly apply the formation of PDMS material at hydrophobic layer and get final product.It is the polyimides sound absorbent rubber layer of 100 μ m~1mm that sound absorption coating 5 also can adopt thickness, if adopt polyimides sound absorbent rubber layer, then generally this polyimides sound absorbent rubber layer can only be arranged on the piezoelectric substrate 1.At this, the width of sound absorption coating 5 is consistent with the aperture of interdigital transducer 3, the width that is sound absorption coating 5 relative the first hydrophobic layers 4 and the direction of the second hydrophobic layer 6 is consistent with the aperture of interdigital transducer 3, so just so that the surface acoustic wave that interdigital transducer 3 excites all passes through sound absorption coating, intensity is attenuated by sound absorption coating 5, certainly in actual design process, the width of sound absorption coating 5 can design greatlyr than the aperture of interdigital transducer 3; The length of sound absorption coating 5 is 4mm~6mm, be the surface acoustic wave that excites of interdigital transducer 3 through the distance of sound absorption coating 5 be 4mm~6mm, in actual design process, can be designed to 5mm, generally do not advise designing too narrowly, strength retrogression's effect of surface acoustic wave is undesirable like this, do not advise designing too widely yet, so not only can waste material, and may so that the digital micro-fluid after breaking fall within on this sound absorption coating 5 after flying to overflow.
At this, the setting of sound absorption coating 5 is to continue to break at the second hydrophobic layer 6 for the digital micro-fluid that prevents from falling within after the breaking on the second hydrophobic layer 6, adopt intensity of wave such as surface such as sound absorption coating 5 attenuate sound such as sound-absorbing material such as grade, sound absorption coating 5 does not affect breaking of original figure microfluid 8 on the first hydrophobic layer 4, but can significantly reduce the intensity that is added to the surface acoustic wave on the digital micro-fluid that is positioned at after the breaking on the second hydrophobic layer 6, thereby the digital micro-fluid after having avoided breaking breaks further.
In the present embodiment, the sound transmission path that the first hydrophobic layer 4 and the second hydrophobic layer 6 are the surface acoustic wave that excites at interdigital transducer 3 applies one deck Teflon AF 1600 hydrophobic materials, again through 160 degree insulating box oven dry formation in about 1 hour, because if the first hydrophobic layer 4 and the second hydrophobic layer 6 are too thick, then the attenuate sound surface wave is too large, required RF signal power increases, if the first hydrophobic layer 4 and the second hydrophobic layer 6 are too thin, then the working surface hydrophobicity of piezoelectric substrate 1 is good not, cause being placed in the first hydrophobic layer 4 and do not become droplet-like with digital micro-fluid on the second hydrophobic layer 6, the digital micro-fluid of small size can't guarantee to break under the surface acoustic wave effect, therefore, carried out a large amount of experiments, experimental result explanation all can obtain good effect when the THICKNESS CONTROL of this first hydrophobic layer 4 and the second hydrophobic layer 6 is in 1~3 m scope.
In the present embodiment, piezoelectric substrate 1 can adopt the slightly large piezoelectric substrate of electromechanical coupling factor, and substantially desirable electromechanical coupling factor is greater than 5.5% piezoelectric substrate, such as 128 0-YX LiNbO 3Piezoelectric substrate.
In the process of this device of specific design, can a plurality of interdigital transducers be set at piezoelectric substrate 1 and form the interdigital transducer array, each interdigital transducer all is connected with signal generation apparatus 2, so just can be transported to break again on the first hydrophobic layer 4 by the interdigital transducer array to the digital micro-fluid after breaking as required and obtain the more digital micro-fluid of small size, also can transport by the digital micro-fluid of interdigital transducer array to the small size after breaking.
The process of utilizing above-mentioned device to realize that digital micro-fluid breaks is:
1. connect the adjustable signal generator 21 and power amplifier 22 of signal generation apparatus 2, connect power amplifier 22 and interdigital transducer 3.
2. digital micro-fluid 8 that will be to be broken is positioned on the first hydrophobic layer 4, and digital micro-fluid to be broken 8 is positioned on the sound transmission path of the surface acoustic wave that interdigital transducer 3 excites.
3. the adjustable signal generator 21 of enabling signal generating means 2 and power amplifier 22, the adjustable signal generator 21 output RF signals of telecommunication, and the transmission RF signal of telecommunication is to power amplifier 22, the power of the RF signal of telecommunication of the amplification of simultaneously power ratio control amplifier 22 outputs is 12dBm~18 dBm, can be controlled to be 15 dBm during such as concrete operations.In fact, the power that specifically is loaded into the RF signal of telecommunication on the interdigital transducer 3 can be determined according to the volume size of digital micro-fluid to be broken 8, if the volume of digital micro-fluid 8 to be broken is larger generally speaking, as when being 10 microlitres~20 microlitre, then the power that is loaded into the RF signal of telecommunication on the interdigital transducer 3 can be controlled at about 18dBm, if the small volume of digital micro-fluid to be broken 8, as when being 1 microlitre~10 microlitre, then the power that is loaded into the RF signal of telecommunication on the interdigital transducer 3 can be controlled at about 12dBm.
4. the RF electric signal transmission of the amplification of power amplifier 22 outputs of signal generation apparatus 2 is to interdigital transducer 3, excite surface acoustic wave behind the interdigital transducer 3 access RF signals of telecommunication, the surface acoustic wave that interdigital transducer 3 excites acts on the digital micro-fluid to be broken 8 that is positioned on the first hydrophobic layer 4, this moment, digital micro-fluid 8 interior generation acoustic streamings to be broken formed acoustic streaming power, so that there is the obliquely trend of motion in digital micro-fluid 8 to be broken.
5. behind the trend 0.5s that keeps obliquely motion wait the digital micro-fluid 8 that breaks~2s (as behind 1s), the RF signal of telecommunication of adjustable signal generator 21 outputs of conditioning signal generating means 2, power moment of the RF signal of telecommunication of the amplification of power amplifier 22 output is down to-3dBm~3dBm, during concrete operations as being down to-1 dBm, this moment, digital micro-fluid 8 to be broken broke because inertia overcomes its surface tension effects, and the digital micro-fluid after breaking flies to overflow and fall within on the second hydrophobic layer 6.In fact, the time that keeps the trend that digital micro-fluid 8 to be broken moves obliquely more than 0.5 second can, in order to use convenient and the time saving, generally speaking, selected 1 second; And the scope of the power of the moment reduction RF signal of telecommunication needs more than 15 dBm, if namely originally being loaded into the power of the RF signal of telecommunication on the interdigital transducer 3 is 12 dBm, then need moment to be down to-to get final product below the 3dBm, as be down to-5dBm, if originally being loaded into the power of the RF signal of telecommunication on the interdigital transducer 3 is 18 dBm, then need moment to be down to below the 3dBm, as be down to 1dBm.
6. the adjustable signal generator 21 of shutdown signal generating means 2 and power amplifier 22.
In specific operation process, the power that is loaded into the RF signal of telecommunication of interdigital transducer 3 can not be too little, otherwise the acoustic streaming power that digital micro-fluid 8 to be broken produces is strong not, and inertia is not enough to overcome the surface tension of digital micro-fluid, can not realize breaking of digital micro-fluid; The power that is loaded into the RF signal of telecommunication of interdigital transducer 3 can not be excessive, otherwise the surface acoustic wave that interdigital transducer 3 excites will drive digital micro-fluid to be broken 8 slippage on the first hydrophobic layer 4, even moment is reduced the RF electrical signal intensity, can not realize breaking of digital micro-fluid.When the RF signal of telecommunication that is loaded on the interdigital transducer 3 continued more than 0.5 second, moment can be realized breaking of digital micro-fluid when making the RF signal of telecommunication reduce the intensity of q.s.Show through experiment, the power that is loaded into the RF signal of telecommunication on the interdigital transducer 3 is more than the 15dBm in the power magnitude scope of 12dBm~18dBm scope moment reduction RF signal of telecommunication, can realize breaking of digital micro-fluid.

Claims (10)

1. a surface acoustic wave is realized the device that digital micro-fluid breaks, it is characterized in that comprising piezoelectric substrate and for generation of the signal generation apparatus of the RF signal of telecommunication, the upper surface of described piezoelectric substrate is working surface, be provided with the interdigital transducer that is connected and is used for exciting surface acoustic wave with described signal generation apparatus on the working surface of described piezoelectric substrate, be used for placing the first hydrophobic layer of digital micro-fluid to be broken, the sound absorption coating of the intensity of the surface acoustic wave that the described interdigital transducer that is used for decaying excites and be used for receiving the second hydrophobic layer of the digital micro-fluid after breaking, described the first hydrophobic layer, described sound absorption coating and described the second hydrophobic layer are positioned on the sound transmission path of the surface acoustic wave that described interdigital transducer excites successively, the digital micro-fluid that power moment that described signal generation apparatus is loaded into the RF signal of telecommunication on the described interdigital transducer is positioned on described the first hydrophobic layer when reducing more than or equal to 15 dBm breaks, and the digital micro-fluid after breaking flies effusion and falls within on described the second hydrophobic layer.
2. a kind of surface acoustic wave according to claim 1 is realized the device that digital micro-fluid breaks, it is characterized in that described signal generation apparatus by forming for generation of the adjustable signal generator of the RF signal of telecommunication and the power amplifier that is connected with described adjustable signal generator, described power amplifier is connected with described interdigital transducer.
3. a kind of surface acoustic wave according to claim 2 is realized the device that digital micro-fluid breaks, before it is characterized in that being positioned over digital micro-fluid on described the first hydrophobic layer and breaking, the power that described adjustable signal generator is loaded into the RF signal of telecommunication on the described interdigital transducer after by described power amplifier is 12dBm~18 dBm, the power moment that is loaded into the RF signal of telecommunication on the described interdigital transducer after continuing 0.5s~2s after making described adjustable signal generator by described power amplifier is down to-3dBm~3dBm, is positioned over digital micro-fluid on described the first hydrophobic layer and breaks and fly to overflow.
4. a kind of surface acoustic wave according to claim 2 is realized the device that digital micro-fluid breaks, it is characterized in that being connected with pcb board on the lower surface of described piezoelectric substrate, be provided with a plurality of terminal pins on the described pcb board, described interdigital transducer comprises two busbars, described busbar is connected with described terminal pin by wire, and described terminal pin is connected with described power amplifier by wire.
According to claim 1 in 4 each described a kind of surface acoustic wave realize the device that digital micro-fluid breaks, it is characterized in that also being provided with the reflecting grating that loads on the power of the RF signal of telecommunication on the described interdigital transducer for minimizing on the working surface of described piezoelectric substrate.
6. a kind of surface acoustic wave according to claim 1 is realized the device that digital micro-fluid breaks, and the thickness that it is characterized in that described sound absorption coating is 100 μ m~1mm.
7. a kind of surface acoustic wave according to claim 6 is realized the device that digital micro-fluid breaks, and it is characterized in that the width of described sound absorption coating is consistent with the aperture of described interdigital transducer.
According to claim 6 or 7 described a kind of surface acoustic waves realize the device that digital micro-fluids break, it is characterized in that described sound absorption coating is polyimides sound absorbent rubber layer or PDMS coat.
9. a kind of surface acoustic wave according to claim 5 is realized the device that digital micro-fluid breaks, it is characterized in that being provided with on described the second hydrophobic layer the baffle plate that falls within after the digital micro-fluid that breaks flies to overflow on the described piezoelectric substrate be used to stopping, described baffle plate is provided with hydrophobic thin film on a side of described interdigital transducer, the height of described baffle plate is more than or equal to 3cm.
10. a kind of surface acoustic wave according to claim 9 is realized the device that digital micro-fluid breaks, and it is characterized in that described baffle plate is fixed on described the second hydrophobic layer by the fixed block of being made by the PDMS material.
CN 201320157523 2013-03-29 2013-03-29 Device for realizing digital microfluid fracture by adopting acoustic surface wave Expired - Fee Related CN203196648U (en)

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CN103223358A (en) * 2013-03-29 2013-07-31 宁波大学 Device and method of achieving digital microfluid cracking of acoustic surface waves

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103223358A (en) * 2013-03-29 2013-07-31 宁波大学 Device and method of achieving digital microfluid cracking of acoustic surface waves

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