CN101639368A - 机电装置及制造方法 - Google Patents
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Abstract
本发明涉及一种机电装置及制造方法,特别涉及一种包括封装及至少一个表面安装在封装中的组件的机电装置,其特征在于,其包括至少一个基于纳米管的用于在所述组件和封装之间进行振动和热过滤的机械接口。有利的,基于纳米管的接口可以进一步作为与封装所装备的电触头的电和/或热接口。
Description
技术领域
本发明的领域涉及机电装置,特别涉及包括陀螺测试仪或加速计类型的传感器的装置,其被设计为能够安装在飞行器或弹药上从而可能受到高热和高机械应力。
背景技术
一般而言,这样的组件通过模块被表面安装在基板上,而所述组件粘合在模块上。
它们也可以通过焊接被直接表面安装在基板上或封装包(encapsulation package)上。
接口元件时常由于振动、热膨胀或甚至由于撞击阻力的原因受到限制。此外,这些接口组件容易引起在传感器类型组件的层面上产生偏离(drift)的偏差(bias),而上述传感器类型组件也基于相同的原因表现出可靠性方面的问题。
发明内容
在本文中,本发明的主题是一种机电装置,其中通过限制机械或者热量产生的应力表面安装这些组件,其中电子组件通过碳纳米管或者基于碳纳米管的结构添加到支撑物上,对于所述碳纳米管或者基于碳纳米管的结构可以利用其优异的机械阻力以及极佳的导热性和导电性这两方面的性能特征。
更确切地说,本发明的主题是包括至少一个表面安装在支撑物上的组件的机电装置,其特征在于,其进一步包括至少一个机械的或机电的接口,用于基于纳米管所提供的所述组件和支撑物之间的连接过滤振动和热。
根据本发明的一个变化例,该纳米管是碳纳米管。
根据本发明的一个变化例,接口包括纳米管薄膜。
根据本发明的一个变化例,接口由离散的基于纳米管的结构(例如键合型导线(bonding-type wires),薄片等)制成。
根据本发明的一个变化例,接口进一步提供组件和其支撑物之间的电连接。
根据本发明的一个变化例,接口进一步提供组件和其支撑物之间的热连接。
根据本发明的一个变化例,支撑物包含在封装(package)中。
根据本发明的一个变化例,接口包括定向的纳米管(orientednanotubes)层。
根据本发明的一个变化例,装置进一步包括用于提供基于纳米管的接口和支撑物之间的连接的粘合元件,所述接口位于组件的表面上。
根据本发明的一个变化例,装置进一步包括用于提供基于纳米管的接口和支撑物之间的连接的焊接元件,所述接口位于组件的表面上。
根据本发明的一个变化例,粘合元件基于通常被称为“ACAs”的有机粘合导电材料。
根据本发明的一个变化例,封装进一步包括用于电连接(electrically address)所述组件的电触头(contacts),基于纳米管的接口提供机械和电接口的功能。
根据本发明的一个变化例,支撑物进一步包括用于电连接(electrically address)所述组件的电触头(contacts),该装置也包括提供电子组件和所述电触头之间的电接触的第二接口。
根据本发明的一个变化例,封装包括底部基板,横向侧壁以及辅助支撑物,电子组件通过基于纳米管的接口在所述辅助支撑物的平面机械的添加在该辅助支撑物上。
根据本发明的一个变化例,辅助支撑物是印刷电路板。
根据本发明的一个变化例,组件的类型是MEMS(微机电系统)。
根据本发明的一个变化例,组件是惯性传感器。
根据本发明的一个变化例,组件是加速计。
根据本发明的一个变化例,组件是陀螺测量仪。
本发明的一个主题是制造根据本发明的装置的方法,包括下述步骤:
在电子组件的表面上制造基于纳米管的接口;
在纳米管接口一侧将电子组件表面安装在基板上。
有利的,可以通过粘合剂的粘合来执行表面安装,所述粘合剂特别的是基于包含导电颗粒的聚合物类型的粘合剂。
附图说明
通过阅读以下描述给出的非限制性实施例以及通过附图,可以更好的理解本发明,且本发明的其他优点将变得显而易见,其中:
图1a以及1b示意性的显示了本发明的第一变化例,其中基于纳米管的接口具有机械功能;
图2示意性的显示了本发明的包括中间表面安装支撑物的变化例;
图3a以及3b示意性的表示了本发明的变化例,其中基于纳米管的接口提供机械连接和电连接;
图4说明了使用包含导电颗粒的聚合物的粘合剂的方法的步骤,有利的,该步骤在根据本发明的制造装置的方法中使用;
图5a以及5b说明了根据本发明的示例性装置,其包括含有MEMS类型的组件的封装。
具体实施方式
纳米管的优点,更确切地说,此后称作“碳纳米管(CNT)”的优点,特别在于它们的以下特性:
杨氏模量在1Tpa量级;
非常强的机械阻力,达到100GPa量级;
非常好的导电性。
本发明的不同变化例将使用表现基于纳米管的接口的简化图示进行描述。可以通过使用现有技术在组件的表面上生长纳米管或者经过焊接或粘合技术表面安装纳米管而得到这些接口。
还可以通过分散有纳米管的溶液得到这些接口,在组件被表面安装在基板上之前,上述溶液涂在组件的表面上。
更确切地说,基板上被涂有含有碳纳米管的溶液。在环境温度进行该操作,而不是像纳米管生长操作需要在更高的温度进行。由此,具备元件的优异分布的非侵袭性(non-aggressive)操作提供所有电子组件的表面上的热传导。
典型的,为制造纳米管溶液,可以使用下列类型的溶剂:二甲基甲酰胺(dimethylmethylformamide,DMF),或者二氯乙烷(dichloroethane,DCE),或者N-甲基-2-吡咯啉(N-methyl-2-pyrrolidone,NMP),或者二氯(代)苯(dichlorobenzene,DCB),或者水加上十二烷基硫酸钠(sodium dodecyl sulphate,SDS)。
用于得到最佳分布的方法如下所述:
在20ml溶剂中添加大约1mg碳纳米管(这些值完全是指示性的,具体的数量可以调整和优化,从而得到所需的导热性)。
使用被称为超声粉碎器(sonicator)的间歇性发送超声波的装置以“超声粉碎”所述溶液。实际上,超声波协助分离纳米管的串,因为由于范德瓦尔斯力,倾向于形成纳米管的串。
在容器中对溶液进行离心处理,从而保持未被超声粉碎所分离的纳米管串以及其他形式的杂质,例如金属催化剂的残渣,留在容器底部。
然后,以上述方式得到的溶液可以以传统方式沉淀在包括电子组件的基板的表面上。
典型的,可以通过溶液喷雾喷洒、或者微滴(microdroplets)、或者通过喷墨设备而涂布溶液。
在溶剂蒸发之后,得到纳米管随机分布的纳米管垫。
为了增强形成在电子组件表面上的碳纳米管垫的热传导性,还可以采用直接涂布的技术。
对此而言,可以使用例如电泳的技术,使用磁场,在沉积之后在定向气流下干燥,等等。
根据本发明,提出了使用基于这种纳米材料的接口从而可以得到热应力更小的组件,同时也能够以很高的质量接收到其控制所需的信号。
根据图1a中所示的本发明的第一变化例,电子组件11表面安装在基板10上,而所述基板10可以是封装的一个整体部分,通过纳米管接口12,提供机械的表面安装功能。通过传统导电元件13实现组件的电连接(addressing),所述导电元件13还连接到封装所具备的连接焊盘(pad)14。
图1b中示出了该变化例的另一种情况;连接焊盘14位于封装的底部平面上,即在基板平面上。
图2中描述了根据本发明的第二变化例,装置可以具备辅助支撑物15,其上机械的添加电子组件11;机械接口包括在中间支撑物和组件之间制造的纳米管。在这种情况下,封装包括中间支撑物所处的中间平面。
上述的本发明的变化例利用了纳米管优异的机械性能,但是也可以同时利用纳米管的电学性能。
图3a中所示的变化例涉及使用纳米管的装置,而所述纳米管既提供机械的表面安装功能,又提供电连接功能。根据该变化例,通过纳米管接口123,组件11被机械和电连接在集成在基板10上的封装上。
图3b所示的变化例涉及使用印刷电路板类型的中间支撑物15的配置。
有利的,纳米管接口首先在其上制造的组件可以通过导电粘合剂(例如ACAs类型的粘合剂)与基板相接触。
为提供该连接,在第一步骤4a中,包含导电颗粒的单体溶液(monomer solution)涂布在基板的表面上,如图4所示。
在第二步骤4b中,单体通过加压或通过升温的方式被聚合,从而产生基于包含导电颗粒的聚合体的导电粘合剂层。
应当注意,在封装平面的组件的表面安装可以要求在具有不同的平面的所述组件的表面上的表面安装。对此,必须制造具备可变长度的纳米管的接口。
对组件在封装中表面安装的内容,本发明进行了非常示意性的描述。
通常,如图5a所示,采用的封装在封装的底部具有一系列的组件Coi,其具有网络连接Ri。
图5b是组件Coi的其中之一的截面图。有利的,根据本发明,组件包括基于纳米管的接口,使用导电粘合剂表面安装在封装的底部,其制备方法如图4所示。
这样在基板S的表面上,装备有属于连接网络Ri的触头(contacts)Ci,安装在芯片Pi上的组件Coi被机械的和电的表面安装。
纳米管接口CTN通过包含导电颗粒pc的聚合物P连接到所述基板。
一般情况下,采用的组件可以基于硅或者任何其他半导体材料。
采用的封装可以是非常广泛变化的类型,特别是可以是二氧化硅(silica),陶瓷或其他类型。
Claims (17)
1、一种包括支撑物(10)和至少一个表面安装在所述支撑物上的组件(11)的机电装置,其特征在于,其包括至少一个基于纳米管(12)的用于振动和热过滤的机械或机电接口,所述纳米管提供所述组件和所述支撑物之间的连接。
2、如权利要求1所述的机电装置,其特征在于,所述纳米管是碳纳米管。
3、如权利要求1或2所述的机电装置,其特征在于,所述支撑物进一步包括能够电连接所述组件的电触头,基于纳米管的所述接口提供机械和电接口功能。
4、根据权利要求1或2的机电和热装置,其特征在于,所述支撑物进一步包括能够电连接所述组件的电触头,基于纳米管的所述接口提供机械、电和热接口功能。
5、如权利要求1到4中任一项所述的机电装置,其特征在于,所述支撑物包含在封装中。
6、如权利要求1到5中任一项所述的机电装置,其特征在于,所述接口包括纳米管薄膜。
7、如权利要求1到6中任一项所述的机电装置,其特征在于,所述接口包括定向纳米管层。
8、如权利要求1到7中任一项所述的机电装置,其特征在于,其进一步包括粘合元件,用于提供所述组件与所述接口、以及所述支撑物与所述接口之间的连接。
9、如权利要求1到7中任一项所述的机电装置,其特征在于,其进一步包括焊接元件,以提供所述组件与所述接口、以及所述支撑物与所述接口之间的连接。
10、如权利要求1到9中任一项所述的机电装置,其特征在于,粘合剂是基于导电颗粒(ACAs)的聚合物类型。
11、如权利要求5到10中任一项所述的机电装置,其特征在于,所述封装进一步包括能够电连接所述组件的电触头,基于纳米管的所述接口提供机械和电接口功能。
12、如权利要求5到11中任一项所述的机电装置,其特征在于,所述封装包括对应于所述支撑物的底部基板、侧壁和辅助支撑物,所述组件通过基于纳米管的所述接口机械的添加到所述辅助支撑物的平面上。
13、如权利要求1到12中任一项所述的机电装置,其特征在于,所述组件是微机电系统类型。
14、如权利要求1到13中任一项所述的机电装置,其特征在于,所述组件是惯性传感器类型。
15、一种制造如权利要求1到14中任一项所述的装置的方法,其特征在于,其包括下列步骤:
在组件的表面上制造基于纳米管的接口;
在纳米管接口一侧将所述组件表面安装在基板上。
16、如权利要求15所述的制造方法,其特征在于,通过粘合来执行表面安装。
17、如权利要求16所述的制造方法,其特征在于,所述粘合剂基于包含导电颗粒的聚合物。
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FR0804114A FR2933968B1 (fr) | 2008-07-18 | 2008-07-18 | Dispositif electronique comportant des composants electroniques et au moins une interface a base de nanotubes et procede de fabrication |
FR0804114 | 2008-07-18 |
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CN101639368A true CN101639368A (zh) | 2010-02-03 |
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US (1) | US8253209B2 (zh) |
EP (1) | EP2145854B1 (zh) |
CN (1) | CN101639368A (zh) |
CA (1) | CA2672597A1 (zh) |
FR (1) | FR2933968B1 (zh) |
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FR2965875B1 (fr) * | 2010-10-06 | 2013-10-25 | Airbus | Ensemble pour aeronef comprenant un amortisseur de vibrations |
US9499393B2 (en) * | 2015-02-06 | 2016-11-22 | Mks Instruments, Inc. | Stress relief MEMS structure and package |
FR3042064B1 (fr) | 2015-10-05 | 2019-06-14 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif pour connecter au moins un nano-objet associe a une puce permettant une connexion a au moins un systeme electrique externe et son procede de realisation |
TWI691322B (zh) * | 2017-03-24 | 2020-04-21 | 劉德輝 | 具有非導電式遠紅外線發射塗層之結構 |
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CN1632476A (zh) * | 2005-01-14 | 2005-06-29 | 清华大学 | 基于无序多壁碳纳米管的红外激光功率探测器 |
TW200629511A (en) * | 2004-11-04 | 2006-08-16 | Koninkl Philips Electronics Nv | Nanotube-based connection arrangement and approach |
WO2008082362A1 (en) * | 2006-12-28 | 2008-07-10 | Agency For Science, Technology And Research | Encapsulated device with integrated gas permeation sensor |
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FR2778056B1 (fr) * | 1998-04-28 | 2000-07-21 | Sextant Avionique | Structure modulaire simplifiee |
FR2779901B1 (fr) * | 1998-06-12 | 2000-09-01 | Sextant Avionique | Dispositif d'insertion, d'extraction et de verrouillage d'un module dans une baie |
FR2783392B1 (fr) * | 1998-09-15 | 2000-12-08 | Sextant Avionique | Dispositif de connexion pour un ensemble de structures modulaires porte-cartes electroniques et rack equipe d'un tel dispositif, accueillant un tel ensemble |
FR2803166B1 (fr) * | 1999-12-28 | 2002-05-31 | Thomson Csf Sextant | Module electronique a haut pouvoir de refroidissement |
WO2001078908A1 (en) * | 2000-04-04 | 2001-10-25 | Parlex Corporation | High speed flip chip assembly process |
FR2845821B1 (fr) * | 2002-10-11 | 2005-12-02 | Thales Sa | Substrat electronique d'un module electronique a trois dimensions a fort pouvoir de dissipation thermique et module electronique |
FR2865888B1 (fr) * | 2004-02-03 | 2008-08-29 | Thales Sa | Systeme de refroidissement d'un boitier electronique |
US20060068195A1 (en) * | 2004-05-19 | 2006-03-30 | Arun Majumdar | Electrically and thermally conductive carbon nanotube or nanofiber array dry adhesive |
US7476982B2 (en) * | 2005-02-28 | 2009-01-13 | Regents Of The University Of California | Fabricated adhesive microstructures for making an electrical connection |
US7467552B2 (en) * | 2005-11-10 | 2008-12-23 | Honeywell International Inc. | Miniature package for translation of sensor sense axis |
FR2894428B1 (fr) * | 2005-12-07 | 2008-02-29 | Thales Sa | Boitier d'appareillage electronique rigide et leger |
US7545030B2 (en) * | 2005-12-30 | 2009-06-09 | Intel Corporation | Article having metal impregnated within carbon nanotube array |
-
2008
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2009
- 2009-07-16 EP EP09165609.0A patent/EP2145854B1/fr active Active
- 2009-07-17 CA CA002672597A patent/CA2672597A1/en not_active Abandoned
- 2009-07-17 US US12/504,718 patent/US8253209B2/en active Active
- 2009-07-20 CN CN200910151635A patent/CN101639368A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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TW200629511A (en) * | 2004-11-04 | 2006-08-16 | Koninkl Philips Electronics Nv | Nanotube-based connection arrangement and approach |
CN1632476A (zh) * | 2005-01-14 | 2005-06-29 | 清华大学 | 基于无序多壁碳纳米管的红外激光功率探测器 |
WO2008082362A1 (en) * | 2006-12-28 | 2008-07-10 | Agency For Science, Technology And Research | Encapsulated device with integrated gas permeation sensor |
Also Published As
Publication number | Publication date |
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US8253209B2 (en) | 2012-08-28 |
US20100013034A1 (en) | 2010-01-21 |
FR2933968B1 (fr) | 2010-09-10 |
CA2672597A1 (en) | 2010-01-18 |
EP2145854A1 (fr) | 2010-01-20 |
EP2145854B1 (fr) | 2018-08-29 |
FR2933968A1 (fr) | 2010-01-22 |
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