CN101637911A - Substrate absorption device - Google Patents
Substrate absorption device Download PDFInfo
- Publication number
- CN101637911A CN101637911A CN200910168038A CN200910168038A CN101637911A CN 101637911 A CN101637911 A CN 101637911A CN 200910168038 A CN200910168038 A CN 200910168038A CN 200910168038 A CN200910168038 A CN 200910168038A CN 101637911 A CN101637911 A CN 101637911A
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- taper pipe
- absorption device
- sealing ring
- flange
- elastic sealing
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Abstract
The invention provides a substrate absorption device comprising a pedestal, an elastic sealing ring, an absorption disk and a taper-pipe-shaped elastic lining. The pedestal comprises a top plate on which a recess part is formed. The peripheral edge of the recess part is provided with a flange stretching towards the center of the recess part. The elastic sealing ring is arranged in the recess part.The absorption disk is arranged on the elastic sealing ring and comprises an absorption surface which projects out of the top plate, and one part of the absorption disk is positioned in the recess part and can compress the elastic sealing ring to move relative to the pedestal. The taper-pipe-shaped elastic lining is provided with a narrow opening rim and a broad opening rim, wherein the narrow opening rim is connected with a part of the absorption disk, which projects out of the flange, and the broad opening rim can be adhered to the top plate in a sliding manner and cover a gap between the absorption disk and the flange. When the absorption disk compresses the elastic sealing ring inwards to enter the recess part and simultaneously drives the narrow opening rim to compress the taper-pipe-shaped elastic lining to deform. Such design prevents dust, scraps or other impurities from entering the absorption device so as to ensure the absorption force of the substrate absorption device.
Description
Technical field
The present invention relates to a kind of substrate absorption device; Particularly, the present invention relates to a kind of dustproof design of substrate absorption device.
Background technology
LCD (Liquid Crystal Display, LCD), (Plasma DisplayPanel PDP) waits that the normal equipment such as mechanical arm that uses comes carrying substrate in the making processing of device to plasma display panel.Mechanical arm is often fixed carrying substrate thereon by installing vacuum cup thereon in the mode of absorption, waits to be carried to suitable position and substrate is come from vacuum cup release afterwards again.The principle of vacuum cup adsorbent article is to have utilized when keeping vacuum between sucker and the article, and its pressure is less than the atmospheric pressure in the external world, makes to produce relative suction between sucker and the article and produce the effect of adsorbent article.
Figure 1A is the schematic diagram of existing machinery arm carrying substrate.Shown in Figure 1A, each mechanical arm 1 is provided with a plurality of vacuum cups 2, and vacuum cup 2 holds up carrying with the fixing back of glass substrate placed thereon 3 absorption.Shown in Figure 1B, existing vacuum cup comprises pedestal 1, vacuum cup sealing ring 2, vacuum cup liner 3 and vacuum cup liner loam cake 4.Clearance G between vacuum cup liner 3 and the vacuum cup liner loam cake 4
1Make foreign material such as airborne dust invade the structure of vacuum cup thus, if things go on like this can accumulate many foreign material, even influence the operation of vacuum cup.In addition, shown in Fig. 1 C, vacuum cup is in when operation, and vacuum cup liner 3 can descend and make the gap between it and the vacuum cup liner loam cake 4 become greatly G
2, make the intrusion of foreign material be more prone to.Especially in the process of frangible material substrates such as carrying glass, can produce chip unavoidably drops, be easy to the operation of vacuum cup is exerted an influence, so influence sucker and the substrate that is adsorbed between vacuum, when serious even can cause vacuum cup can't adsorb substrate.
Summary of the invention
The object of the present invention is to provide a kind of substrate absorption device, improve the problem in the above-mentioned known technology, prevent the intrusion of foreign material such as dust or chip and influence its suction.
Substrate absorption device of the present invention comprises pedestal, elastic sealing ring, suction tray and Taper Pipe shape resilient bushing.Pedestal comprises top board, and this pedestal forms a depressed part inwardly from this top board, and this top board forms a flange from this depressed part periphery to the center projection; Elastic sealing ring is arranged in the depressed part; Suction tray is arranged on the elastic sealing ring, and part is positioned at depressed part, and has an adsorption plane to protrude in outside the top board, can make the elastic sealing ring compression and moves with respect to pedestal by suction tray; Taper Pipe shape resilient bushing has slot edge and loose peristoma, wherein the slot edge is connected in the part that suction tray protrudes in this flange, when the absorption disk compresses elastic sealing ring makes it when sinking into depressed part, can drive the slot edge simultaneously the compressing of Taper Pipe shape resilient bushing is produced deformation, wide peristoma then fits in the outside of depressed part on the top board slidably, and cover gap between suction tray and flange, prevent that foreign material such as dust or chip from invading substrate absorption device.
Therefore, beneficial effect of the present invention is, prevents foreign material intrusion substrate absorption devices such as dust or chip.
Description of drawings
Figure 1A is the schematic diagram of existing mechanical arm carrying substrate;
Figure 1B is the cutaway view of existing vacuum cup;
Cutaway view when Fig. 1 C is the operation of existing vacuum cup;
Fig. 2 A is the schematic diagram of an embodiment of substrate absorption device of the present invention;
Fig. 2 B is the stereogram of the substrate absorption device embodiment shown in Fig. 2 A;
Fig. 2 C is the cutaway view of the substrate absorption device embodiment shown in Fig. 2 A;
Fig. 3 is the cutaway view of another embodiment of the substrate in the substrate absorption device shown in Fig. 2 A;
Fig. 4 A is the explosive view of another embodiment of the fixed form of the Taper Pipe shape resilient bushing in the substrate absorption device shown in Fig. 2 A;
Fig. 4 B is the cutaway view of the embodiment of the substrate absorption device shown in Fig. 4 A;
Fig. 5 is the cutaway view of another embodiment of the Taper Pipe shape resilient bushing in the substrate absorption device shown in Fig. 2 A;
Fig. 6 is the cutaway view in substrate absorption device when operation shown in Fig. 2 A;
Fig. 7 is the vertical view of the adsorption plane in the substrate absorption device shown in Fig. 2 A.
Wherein, description of reference numerals is as follows:
10 pedestals, 11 top boards
111 depressed parts, 112 flanges
Aspirating hole 13 loam cakes in 12
14 chassis, 20 elastic sealing rings
21 bleed-off passages, 30 suction trays
Convex ridge in 31 adsorption planes 311
312 outer convex ridge 32 Taper Pipe walls
321 annular recess, 33 root edges
34 outer aspirating hole 40 Taper Pipe shape resilient bushings
41 slot edge, 42 wide peristomas
50 ring plates, 100 substrates
The specific embodiment
The invention provides a kind of substrate absorption device.In preferred embodiment, substrate absorption device of the present invention is applied to the processing that various needs utilize vacuum cup absorption, carrying substrate assembly, for example in the processing of equipment such as LCD, plasma display panel, this substrate absorption device is arranged on the mechanical arm of dust free room, in order to absorption and the carrying of carrying out glass substrate.
Fig. 2 A is the schematic diagram of an embodiment of substrate absorption device of the present invention.Fig. 2 B is the stereogram of the embodiment of substrate absorption device shown in Fig. 2 A, and Fig. 2 C then is the cutaway view of the substrate absorption device embodiment shown in Fig. 2 A.Shown in Fig. 2 B, Fig. 2 C, this substrate absorption device comprises pedestal 10, elastic sealing ring 20, suction tray 30 and Taper Pipe shape resilient bushing 40.Pedestal 10 comprises top board 11, on the pedestal 10 and a portion that is absorbed in corresponding to the shape of top board 11 is arranged, top board 11 is contained in wherein.Be formed with depressed part 111 on the top board 11 towards pedestal 10 sunken insides, top board 11 forms flange 112 on the periphery of depressed part 111.Shown in Fig. 2 B, depressed part 111 forms discoid being absorbed on top board 11.Shown in Fig. 2 C, flange 112 protrudes in top board 11 surfaces, and towards depressed part 111 central horizontal projections.The internal diameter of its flange 112 is less than the internal diameter of depressed part 111, makes the part of opening of depressed part 111 be covered by flange 112, forms shape space, a cave.In different embodiment, as shown in Figure 3, be provided with chassis 14 on the pedestal 10 in addition, comprise that 13 correspondences of loam cake of top board 11 cover on the chassis 14 this moment.111 of depressed parts are formed by loam cake 13 and chassis 14 common encirclements.
Shown in Fig. 2 C, elastic sealing ring 20 is arranged in the depressed part 111, comprises bleed-off passage 21.Suction tray 30 is arranged on the elastic sealing ring 20, comprises adsorption plane 31, Taper Pipe wall 32, root edge 33 and outer aspirating hole 34.Adsorption plane 31 protrudes in the surface of top board 11 for contacting with substrate from depressed part 111.Taper Pipe wall 32 is from ora terminalis being directed downwards and extension outward towards pedestal 10 of adsorption plane 31.Direction towards the sidewall of depressed part 111 outwards stretches out root edge 33 from the bottom of Taper Pipe wall 32.When suction tray 30 is not operated, that is not during bearing substrate, root edge 33 maintains a certain distance with the sidewall of depressed part 111.The end face of root edge 33 and flange 112 is corresponding in the face of an inner face of depressed part 111 bottoms, and its bottom surface then maintains a certain distance with the bottom of depressed part 111.The internal diameter of its medium root edge 33 makes the section of suction tray 30 form the ladder type that a root edge has flange greater than the external diameter of adsorption plane 31; The external diameter of root edge 33 is then greater than the internal diameter of flange 112, makes suction tray 30 be sticked in the depressed part 111 that flange 112 surrounded, and can not break away from depressed part 111.
Shown in Fig. 2 C, the two ends up and down of Taper Pipe shape resilient bushing 40 form slot edge 41 and loose peristoma 42 respectively, the Taper Pipe that makes Taper Pipe shape resilient bushing 40 form a hollow surround around suction tray 30 and under elastic sealing ring 20.In the present embodiment, Taper Pipe shape resilient bushing 40 adopts the rubber material; Yet in different embodiment, can adopt other rubber-like material.Shown in Fig. 2 C, when not operating, folder one first angle A between Taper Pipe shape resilient bushing 40 and the Taper Pipe wall 32
1That is Taper Pipe shape resilient bushing 40 outwards opens first angle A again from Taper Pipe wall 32
1, to reduce the friction between Taper Pipe shape resilient bushing 40 and the Taper Pipe wall 32.In the present embodiment, first angle A
1Between 5 degree are spent to 8, yet in different embodiment, first angle A
1Can be different angles.
This slot edge of this Taper Pipe shape resilient bushing can be connected in the part that this Taper Pipe wall protrudes in this flange.Shown in Fig. 2 C, in the present embodiment, the fixed form of Taper Pipe shape resilient bushing 40 is to form annular recess 321 earlier on Taper Pipe wall 32, slot edge 41 is sticked in the annular recess 321 of Taper Pipe wall 32 then.Yet in different embodiment, shown in Fig. 4 A, Fig. 4 B, can be embedded the ring plate 50 of a metal or other material earlier on Taper Pipe wall 32, the slot edge 41 with Taper Pipe shape resilient bushing 40 is sticked in ring plate 50 belows again, and wherein ring plate 50 can be commercially available C shape clasp.In the present embodiment, the preferable mode with ejection formation of mode of formation annular recess 321 forms; Yet in different embodiment, mode such as can also car cut forms.
Shown in Fig. 2 C, wide peristoma 42 fits in the outside of the depressed part 111 on the top board 11, to cover in the gap between suction tray 30 and the flange 112, prevents foreign material intrusion substrate absorption devices such as dust or chip.Shown in Fig. 2 C, in preferred embodiment, wide peristoma 42 can be fitted in the end face of flange 112; Yet as shown in Figure 5, also wide peristoma 42 can be fitted on the top board 11 in flange 112 outsides in other embodiments.
Fig. 6 is the cutaway view in substrate absorption device when operation shown in Fig. 2 A.As shown in Figure 6, when substrate absorption device is operated, for example substrate 100 is positioned over when being adsorbed on the suction tray 30, can be by suction tray 30 extruding elastic sealing rings 20 downwards, make elastic sealing ring 20 compressions and move and be absorbed in the depressed part 111 towards the bottom of depressed part 111.Elastic sealing ring 20 sustainable being compressed are till the bottom connection of the bottom surface of root edge 33 and depressed part 111 touches.In addition, stressed and when pushing downwards when suction tray 30, can drive slot edge 41 compressing Taper Pipe shape resilient bushings 40 simultaneously and make its compression and be out of shape; During 40 compressions of Taper Pipe shape resilient bushing, wide peristoma 42 can be done relative slip on original institute bonding surfaces, and the angle between Taper Pipe shape resilient bushing 40 and the Taper Pipe wall 32 also correspondingly changes at this moment.
As shown in Figure 6, be subjected to suction tray 30 extruding and when being absorbed in the depressed part 111, wide peristoma 42 is outwards opened one second angle A from Taper Pipe wall 32 when elastic sealing ring 20
2, second angle A wherein
2Greater than not preoperative first angle A
1, therefore the friction between Taper Pipe shape resilient bushing 40 and the Taper Pipe wall 32 can not become big after operation as can be known.When the stressed disappearance of suction tray 30, elastic sealing ring 20 can move towards the opposite direction of the bottom of depressed part 111 and be returned to original position, tubulose resilient bushing 40 can produce a screen resilience and reply original shape simultaneously, make to be returned to original angle between wide peristoma 42 and the Taper Pipe wall 32, i.e. first angle A
1
In the present embodiment, cause vacuum, make suction tray absorption substrate placed thereon by the mode of bleeding.As shown in Figure 6, comprise the interior aspirating hole 12 that is communicated in depressed part 111 on the pedestal 10; Form a bleed-off passage 21 in the elastic sealing ring 20 and be communicated in interior aspirating hole 12; 34 of outer aspirating holes on the suction tray 30 are connected with bleed-off passage 21.In other words, interior aspirating hole 12 connects to outer aspirating hole 34 via bleed-off passage 21.When substrate absorption device is operated, produce the outer aspirating hole 34 of a suction on adsorption plane 31 and bleed, be positioned over substrate on the suction tray 30 with absorption.
Fig. 7 is the vertical view of the adsorption plane in the substrate absorption device shown in Fig. 2 A.As shown in Figure 7, on the adsorption plane 31 beyond being formed with aspirating hole 34, form around the aspirating hole 34 outside a plurality of in convex ridges 311, and outside the outer rim of adsorption plane 31 forms convex ridge 312.Outer convex ridge 31 is a ring-type, when outer aspirating hole 34 is bled the absorption substrate, can prevent that the air of outside from entering adsorption plane 31; Convex ridges 311 have discontinuously and are provided with around outer aspirating hole 34 in a plurality of, make that the air on the adsorption plane 31 can enter outer aspirating hole 34 by the gap between the different interior convex ridges 311.
The present invention is described by above-mentioned related embodiment, yet the foregoing description is only for implementing example of the present invention.Must be pointed out that the embodiment that has disclosed does not limit the scope of the invention.On the contrary, being contained in the modification of the spirit of claim and scope and equalization is provided with and all is contained in the scope of the present invention.
Claims (10)
1. substrate absorption device comprises:
One pedestal comprises a top board; Wherein this pedestal forms a depressed part inwardly from this top board, and this top board forms a flange from this depressed part periphery to the center projection;
One elastic sealing ring is arranged in this depressed part;
One suction tray is arranged on this elastic sealing ring, partly is positioned at this depressed part and compressible this elastic sealing ring to move relative to this pedestal, and this suction tray comprises an adsorption plane, and this adsorption plane protrudes in outside this top board; And
One Taper Pipe shape resilient bushing has a slot edge and a wide peristoma; Wherein this slot edge is connected in the part that this suction tray protrudes in this flange, and this wide peristoma then fits in this top board outside slidably, and covers the gap between this suction tray and this flange; When this elastic sealing ring inwards of this absorption disk compresses enters this depressed part, drive this slot edge simultaneously and oppress this Taper Pipe shape resilient bushing generation deformation.
2. substrate absorption device as claimed in claim 1, wherein this suction tray also comprises:
One Taper Pipe wall, the ora terminalis of this adsorption plane extends towards this pedestal certainly; And
One root edge, the outside projection in the bottom of this Taper Pipe wall and certainly to inner face that should flange; Wherein the internal diameter of this root edge is greater than the external diameter of this adsorption plane, and the external diameter of this root edge is greater than the internal diameter of this flange;
Wherein this slot edge of this Taper Pipe shape resilient bushing is connected in the part that this Taper Pipe wall protrudes in this flange.
3. substrate absorption device as claimed in claim 2, wherein this Taper Pipe shape resilient bushing outwards opens one first angle from this Taper Pipe wall.
4. substrate absorption device as claimed in claim 3, wherein this first angle is between 5 degree are spent to 8.
5. substrate absorption device as claimed in claim 3, when this suction tray compresses this elastic sealing ring when being absorbed in this depressed part, this Taper Pipe shape resilient bushing is oppressed outwards to open one second angle from this Taper Pipe wall, and wherein this second angle is greater than this first angle.
6. substrate absorption device as claimed in claim 2 wherein is formed with an annular recess on this Taper Pipe wall, and this slot edge of this Taper Pipe shape resilient bushing is sticked in this annular recess.
7. substrate absorption device as claimed in claim 2 wherein is embedded with a ring plate on this Taper Pipe wall, and this slot edge of this Taper Pipe shape resilient bushing is sticked in this ring plate below.
8. substrate absorption device as claimed in claim 1, wherein this pedestal comprises that aspirating hole is communicated with this depressed part in one, this elastic sealing ring is formed with a bleed-off passage and is communicated in aspirating hole in this, and this suction tray comprises that an outer aspirating hole is communicated with this bleed-off passage to bleed on this adsorption plane certainly.
9. substrate absorption device as claimed in claim 1, wherein this pedestal comprises a loam cake and a chassis, and this top board is positioned at this loam cake, and this loam cake and this chassis surround this depressed part jointly.
10. substrate absorption device as claimed in claim 1, wherein this loose peristoma of this Taper Pipe shape resilient bushing then fits in the end face of this flange.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101680389A CN101637911B (en) | 2009-08-19 | 2009-08-19 | Substrate absorption device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101680389A CN101637911B (en) | 2009-08-19 | 2009-08-19 | Substrate absorption device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101637911A true CN101637911A (en) | 2010-02-03 |
| CN101637911B CN101637911B (en) | 2010-11-03 |
Family
ID=41613188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101680389A Expired - Fee Related CN101637911B (en) | 2009-08-19 | 2009-08-19 | Substrate absorption device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101637911B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102495492A (en) * | 2011-12-02 | 2012-06-13 | 深圳市华星光电技术有限公司 | Chip picking and placing method in universal virtual machine (UVM) manufacture process and chip picking combination device used for implementing same |
| CN103372825A (en) * | 2012-04-27 | 2013-10-30 | 三星钻石工业股份有限公司 | Substrate adsorption unit |
| CN108305610A (en) * | 2018-03-23 | 2018-07-20 | 苏州登堡电子科技有限公司 | The split type wall sound-conducting apparatus that shakes |
| WO2019024608A1 (en) * | 2017-08-01 | 2019-02-07 | 南京协辰电子科技有限公司 | Substrate suction apparatus |
| CN111661376A (en) * | 2020-07-28 | 2020-09-15 | 苏州新派特信息科技有限公司 | Aseptic preparation equipment of moisturizing and whitening mask |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005288595A (en) * | 2004-03-31 | 2005-10-20 | Nippon Pisuko:Kk | Suction pad device |
| JP5065621B2 (en) * | 2006-05-26 | 2012-11-07 | 株式会社アルバック | Vacuum suction pad |
| JP4770789B2 (en) * | 2007-05-01 | 2011-09-14 | 株式会社Ｉｈｉ | Substrate handling device |
-
2009
- 2009-08-19 CN CN2009101680389A patent/CN101637911B/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102495492A (en) * | 2011-12-02 | 2012-06-13 | 深圳市华星光电技术有限公司 | Chip picking and placing method in universal virtual machine (UVM) manufacture process and chip picking combination device used for implementing same |
| WO2013078705A1 (en) * | 2011-12-02 | 2013-06-06 | 深圳市华星光电技术有限公司 | Panel taking and placing method in uvm process, and panel taking combination device for implementing the method |
| CN103372825A (en) * | 2012-04-27 | 2013-10-30 | 三星钻石工业股份有限公司 | Substrate adsorption unit |
| WO2019024608A1 (en) * | 2017-08-01 | 2019-02-07 | 南京协辰电子科技有限公司 | Substrate suction apparatus |
| CN108305610A (en) * | 2018-03-23 | 2018-07-20 | 苏州登堡电子科技有限公司 | The split type wall sound-conducting apparatus that shakes |
| CN108305610B (en) * | 2018-03-23 | 2024-02-20 | 苏州登堡电子科技有限公司 | Split wall vibration sound transmission device |
| CN111661376A (en) * | 2020-07-28 | 2020-09-15 | 苏州新派特信息科技有限公司 | Aseptic preparation equipment of moisturizing and whitening mask |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101637911B (en) | 2010-11-03 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
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Granted publication date: 20101103 Termination date: 20200819 |