CN101634880A - 电磁干扰挡片制造方法 - Google Patents

电磁干扰挡片制造方法 Download PDF

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CN101634880A
CN101634880A CN200810302944.9A CN200810302944A CN101634880A CN 101634880 A CN101634880 A CN 101634880A CN 200810302944 A CN200810302944 A CN 200810302944A CN 101634880 A CN101634880 A CN 101634880A
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electromagnetic interference
rear window
emi
computer housing
housing rear
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叶锦文
彭志坚
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN200810302944.9A priority Critical patent/CN101634880A/zh
Priority to US12/476,758 priority patent/US8261430B2/en
Publication of CN101634880A publication Critical patent/CN101634880A/zh
Priority to US13/632,408 priority patent/US20130025116A1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49025—Making disc drive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49181—Assembling terminal to elongated conductor by deforming

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Drying Of Solid Materials (AREA)

Abstract

一种电磁干扰挡片制造方法，包括以下步骤：用粘合剂将一抗电磁干扰材料的面板粘着在一待加工的电脑机箱后窗上有电磁辐射的区域；用双滚筒压合机将所述抗电磁干扰材料的面板和待加工的电脑机箱后窗压合在一起；用输送式自动干燥机在高温环境下对安装了抗电磁干扰材料的电脑机箱后窗进行加速干燥；用定尺切断机将安装了抗电磁干扰材料的电脑机箱后窗切割成所需的尺寸；用冲压机床将安装了抗电磁干扰材料的电脑机箱后窗冲压成所需的形状。本发明电磁干扰挡片制造方法通过粘着、压合、干燥、切割和冲压在待加工的电脑机箱后窗上一次成型出所需的电磁干扰挡片，生产流程短、生产成本低且生产效率高。

Description

电磁干扰挡片制造方法
技术领域
本发明涉及一种电磁干扰挡片制造方法，尤指一种电脑机箱后窗的电磁干扰(EMI)挡片制造方法。
背景技术
电脑主机内部通常装设多种供电脑运行所必须的电子组件，如中央处理器及图形加速芯片等，电子组件的频率越高，其产生电磁波辐射的强度越强，因电脑主机并非一完全封闭的空间，所以大量电磁波将自电脑主机外泄，过多的电磁波泄漏将对周围人体及周围电子组件造成不良影响，而电脑主机的电脑后窗是电磁波外泄的一个重要区域，所以，业界通常在电脑主机电脑后窗的栅片上装设电脑后窗EMI挡片或接地片来防止电磁波泄漏。传统的EMI挡片的制造是先分别冲压成型出电脑机箱后窗和EMI挡片，然后通过铆合或锁螺丝的方法将EMI挡片固定在电脑机箱后窗上有电磁辐射的区域。传统的制造方法生产流程过长，生产成本高且生产效率不高。
发明内容
鉴于以上内容，有必要提供一种生产流程短、生产成本低且生产效率高的电磁干扰挡片制造方法。
一种电磁干扰挡片制造方法，包括以下步骤：
用粘合剂将一抗电磁干扰材料的面板粘着在一待加工的电脑机箱后窗上有电磁辐射的区域；
用双滚筒压合机将所述抗电磁干扰材料的面板和待加工的电脑机箱后窗压合在一起；
用输送式自动干燥机在高温环境下对安装了抗电磁干扰材料的电脑机箱后窗进行加速干燥；
用定尺切断机将安装了抗电磁干扰材料的电脑机箱后窗切割成所需的尺寸；
用冲压机床将安装了抗电磁干扰材料的电脑机箱后窗冲压成所需的形状。
相对现有技术，本发明电磁干扰挡片制造方法通过粘着、压合、干燥、切割和冲压在待加工的电脑机箱后窗上一次成型出所需的电磁干扰挡片，生产流程短、生产成本低且生产效率高。
附图说明
图1为本发明电磁干扰挡片制造方法的流程图。
具体实施方式
请参阅图1，本发明电磁干扰挡片制造方法用于在一待加工的电脑机箱后窗上制造电磁干扰挡片。所述电磁干扰挡片制造方法包括以下步骤：
步骤一：对一抗电磁干扰材料的面板和所述待加工的电脑机箱后窗进行清洗；
步骤二：用粘合剂将所述抗电磁干扰材料的面板粘着在所述待加工的电脑机箱后窗上有电磁辐射的区域；
步骤三：用输送式自动干燥机在高温环境下对安装了抗电磁干扰材料的电脑机箱后窗进行预干燥；
步骤四：用双滚筒压合机将所述抗电磁干扰材料的面板和待加工的电脑机箱后窗进行预压合；
步骤五：用输送式自动干燥机在高温环境下对安装了抗电磁干扰材料的电脑机箱后窗进行加速干燥；
步骤六：用定尺切断机将安装了抗电磁干扰材料的电脑机箱后窗切割成所需的尺寸；
步骤七：用冲压机床将安装了抗电磁干扰材料的电脑机箱后窗冲压成所需的形状。
在本实施例中，通过输送式自动干燥机对安装了抗电磁干扰材料的电脑机箱后窗进行预干燥和加速干燥可防止电脑机箱后窗在冲压过程中发生变形，所述抗电磁干扰材料的面板为弹性材料。
在另一实施方式中，可将步骤六放到步骤一之后，即先用定尺切断机分别将所述抗电磁干扰材料的面板和待加工的电脑机箱后窗切割成所需的尺寸，然后顺次执行后面的步骤。
本发明电磁干扰挡片制造方法通过粘着、压合、干燥、切割和冲压在待加工的电脑机箱后窗上一次成型出所需的电磁干扰挡片，生产流程短、生产成本低且生产效率高。

Claims (8)

1.一种电磁干扰挡片制造方法，用于在一待加工的电脑机箱后窗上制造电磁干扰挡片，所述制造方法包括以下步骤：
用粘合剂将一抗电磁干扰材料的面板粘着在所述待加工的电脑机箱后窗上有电磁辐射的区域；
用双滚筒压合机将所述抗电磁干扰材料的面板和待加工的电脑机箱后窗压合在一起；
用输送式自动干燥机在高温环境下对安装了抗电磁干扰材料的电脑机箱后窗进行加速干燥；
用定尺切断机将安装了抗电磁干扰材料的电脑机箱后窗切割成所需的尺寸；
用冲压机床将安装了抗电磁干扰材料的电脑机箱后窗冲压成所需的形状。
2.如权利要求1所述的电磁干扰挡片制造方法，其特征在于：所述制造方法还包括将抗电磁干扰材料的面板粘着在电脑机箱后窗上之前，对抗电磁干扰材料的面板和电脑机箱后窗的清洗步骤。
3.如权利要求2所述的电磁干扰挡片制造方法，其特征在于：所述制造方法还包括用双滚筒压合机进行压合之前的预干燥和预压合步骤。
4.如权利要求3所述的电磁干扰挡片制造方法，其特征在于：所述抗电磁干扰材料的面板为弹性材料。
5.一种电磁干扰挡片制造方法，包括以下步骤：
用定尺切断机将安装了抗电磁干扰材料的电脑机箱后窗切割成所需的尺寸；
用粘合剂将一抗电磁干扰材料的面板粘着在一待加工的电脑机箱后窗上有电磁辐射的区域；
用双滚筒压合机将所述抗电磁干扰材料的面板和待加工的电脑机箱后窗压合在一起；
用输送式自动干燥机在高温环境下对安装了抗电磁干扰材料的电脑机箱后窗进行加速干燥；
用冲压机床将安装了抗电磁干扰材料的电脑机箱后窗冲压成所需的形状。
6.如权利要求5所述的电磁干扰挡片制造方法，其特征在于：所述制造方法还包括将抗电磁干扰材料的面板粘着在电脑机箱后窗上之前，对抗电磁干扰材料的面板和电脑机箱后窗的清洗步骤。
7.如权利要求6所述的电磁干扰挡片制造方法，其特征在于：所述制造方法还包括用双滚筒压合机进行压合之前的预干燥和预压合步骤。
8.如权利要求7所述的电磁干扰挡片制造方法，其特征在于：所述抗电磁干扰材料的面板为弹性材料。
CN200810302944.9A 2008-07-23 2008-07-23 电磁干扰挡片制造方法 Pending CN101634880A (zh)

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CN200810302944.9A CN101634880A (zh) 2008-07-23 2008-07-23 电磁干扰挡片制造方法
US12/476,758 US8261430B2 (en) 2008-07-23 2009-06-02 Method for manufacturing anti-electromagnetic interference shields
US13/632,408 US20130025116A1 (en) 2008-07-23 2012-10-01 Method for manufacturing anti-electromagnetic interference shields

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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US5641438A (en) * 1995-01-24 1997-06-24 Bunyan; Michael H. Method for forming an EMI shielding gasket
JPH0999488A (ja) * 1995-10-06 1997-04-15 Kanegafuchi Chem Ind Co Ltd 接着剤付きポリイミドテープとステンレス鋼板との接着方法
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US20130025116A1 (en) 2013-01-31
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