CN101617327B - 具有隐私和安全能力的射频识别标签 - Google Patents

具有隐私和安全能力的射频识别标签 Download PDF

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CN101617327B
CN101617327B CN2006800568723A CN200680056872A CN101617327B CN 101617327 B CN101617327 B CN 101617327B CN 2006800568723 A CN2006800568723 A CN 2006800568723A CN 200680056872 A CN200680056872 A CN 200680056872A CN 101617327 B CN101617327 B CN 101617327B
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rfid
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彼得·S·阿瑟顿
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    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07756Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being non-galvanic, e.g. capacitive
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    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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Abstract

一种可沿大体横向的折叠线(101)折叠的RFID标签(100)。线(101)将该标签(100)分成区域1和区域2。区域1具有RFID集成电路(104)和导电材料区域(105)。区域2具有提供有效RFID天线的导电区域(107)。在折叠结构中,区域(107)与集成电路(104)操作性地关联起来,而在展开结构中,区域(107)在功能上不与集成电路(104)相关。因此,在展开结构中,标签(100)失效或者其RFID性能被充分劣化。标签(100)可以在展开和折叠结构之间可逆地变更。

Description

具有隐私和安全能力的射频识别标签
背景技术
低成本无源射频识别(RFID)标签被寄期望于将来用于识别和跟踪各种产品,包括消费品。典型的无源RFID标签包括施加了RFID集成电路(或芯片)和射频(RF)天线的薄柔性基板。RF天线耦合到RFID芯片,用于实现RFID芯片与远程RFID读取装置之间的通信。标签通常包括附着装置——典型地是一层压敏胶——以将标签附着到产品。RFID芯片包含电子存储器,该电子存储器通常存储独一无二的芯片识别码,且也可以具有存储其他数据的附加存储能力。
RFID技术提供了优于现有自动识别技术(诸如条形码技术)的若干关键优点,包括:
-无需视线能达到标签就能相隔一段距离地读取RFID标签的能力;
-高速读取多个RFID标签的能力;
-(依赖于RFID芯片的类型)向RFID标签写入信息的能力。
在消费品上使用RFID标签方面出现的问题是消费者的隐私问题。一种顾虑在于,在产品被购买之后,带有标签的产品上的RFID标签仍可以被读取,而消费者并不会意识到发生了标签被读取的事实。由于可以监控消费者的购物习惯、活动或产品使用习惯,这可能会侵犯消费者的隐私权。
一种解决方法是在购买加标签的消费品之后,毁坏RFID标签或者使得RFID标签永久失效。尽管这解决了隐私方面的顾虑,但它具有这样的缺点:如果消费品被退还,商店不再能够使用该RFID标签来识别它。
已经提出了其他解决方法,比如在购买了加标签产品之后将标签的RFID性能永久性劣化,使得RFID标签仅能在很短的距离内被读取,由此实际上防止了在标签被修改之后对加标签产品的任何跟踪。尽管这类解决方法解决了隐私问题,并允许退还的产品能通过RFID标签来识别,但它具有这样的缺点:由于经修改的标签的可读取距离有限,退还的产品不再能够通过零售商的RFID系统被进一步处理,因而很可能需要将退还的产品重新加上标签。
使用标准RFID标签识别消费品的另一缺点在于,标准RFID标签并不包含任何物理安全部件,所以容易被从一个产品转移到另一产品,而标签的RFID功能不受影响。因此,在购买产品之后,可将产品的RFID标签转移到另一产品,然后将该另一产品带回零售商处作为退货。如果RFID标签用于识别退还的产品,则商店可能会面临错误产品的信用问题。
本发明的目的是克服或者基本消除上述缺点。
发明内容
本发明公开了一种RFID标签,包括:
基板;
固定到所述基板的REID集成电路;
也固定到所述基板的RFID天线;其中所述标签可以以第一结构和第二结构布置,在该第一结构中,所述集成电路和所述天线操作性地电耦合以提供RFID功能,且在该第二结构中,所述天线和电路的电耦合被变更以改变所述功能,所述标签可以从所述第一结构变更到所述第二结构,并且可以从所述第二结构变更到所述第一结构,以至少部分地逆转对所述功能的改变。
优选地,相对于所述标签处于所述第一结构时的所述功能,当所述标签处于所述第二结构时所述功能被劣化或失效。
优选地,当所述天线操作性地电耦合到所述集成电路时,不包括电导耦合。
优选地,所述天线经由电容耦合或电感耦合操作性地电耦合到所述集成电路。
优选地,所述标签是无源RFID标签。
优选地,所述标签是有源或半有源RFID标签。
优选地,所述RFID标签包括电源。
优选地,当所述标签从所述第二结构重新布置成所述第一结构时,所述基板自身折叠,从而从展开结构变为合拢折叠结构。
优选地,所述天线在所述第一结构中被设置成邻近于所述集成电路,而在所述第二结构中被移动远离所述集成电路。
优选地,所述标签包括粘合剂,以可释放地保持标签处于第一结构。
优选地,所述标签包括篡改指示部件,该篡改指示部件在标签被从其附着的物体上移除时劣化所述功能。
优选地,当所述标签被从其附着的物体上移除时,所述天线和电路的耦合被永久性地破坏。
优选地,所述标签是具有纵轴的矩形,在所述第一和第二结构之间,横向于所述轴折叠标签。
附图说明
图1是具有可更改RFID性能的RFID标签的示意图;
图2是图1的RFID标签在施加到表面上之后处于展开结构时的示意图,其中相对于标签处于合拢结构时的性能,标签的RFID性能失效或者被充分劣化;
图3是具有可更改RFID性能的RFID标签的第二实施例的示意图;
图4是图3的RFID标签在施加到表面上之后处于展开结构时的示意图,其中相对于标签处于合拢结构时的性能,标签的RFID性能失效或者被充分劣化;
图5是具有可更改RFID性能和篡改指示安全性的RFID标签的示意图,该篡改指示部件使得当标签被从所附着的表面上移除时,该标签的RFID功能被不可逆转地失效或充分劣化。
具体实施方式
现在参考图1至5中示意性说明的实施例以非限制性举例的方式描述本发明。
图1是作为本发明的主题的RFID标签的示意图。
图1的RFID标签100最初以具有纵轴的扁平矩形标签的形式产生,如图1A所示。图1A的扁平标签沿横向于纵轴的折叠线101折叠成施加到表面102上的图1B的折叠结构。
折叠线101将RFID标签分成两个区域——区域1和区域2——如图1A所示。区域1和区域2并不需要具有相同的尺寸和形状。
所描述和说明的图1的优选实施例涉及RFID标签,该RFID标签包含射频(RF)天线,从而实现与远程RFID读取装置的通信。应当理解,图1中示出的天线设计仅是说明性的,可以使用RFID标签天线的各种不同设计,而仍然能实现本文描述的发明。
在某些射频处,RFID标签使用所谓的近场效应与读取装置通信,且在RFID标签中包含感应线圈天线而不是更常规的RF天线(例如,偶极天线)。如下文更详细描述,应当理解,本文描述的原理等同地应用于使用感应线圈天线的RFID标签。
图1A中示出的未折叠RFID标签结构包含标签基板103,RFID集成电路或芯片104在标签的区域1中附着到该基板103的上表面。至少一个导电材料区域105施加到基板103的区域1的上表面上,使得导电材料区域105电连接到RFID集成电路(IC)104的连接点,且在基板103的区域1的上表面上延伸一定距离。导电区域105被设计为自身能为RFID集成电路104提供不良天线。基板沿着折叠线101是柔性的,以供折叠。
在基板103的区域1的下表面上施加粘附层106,如图1A所示。粘附层106优选地是能将RFID标签100附着到表面102的强力粘合剂或永久性粘合剂。
至少一个导电材料区域107施加到基板103的区域2的上表面上。粘附层108在区域2中施加到基板103的上表面上,位于导电材料区域107之上。
图1A中示出的展开的RFID标签100沿着折叠线101折叠以产生如图1B所示的工作RFID标签100。可以沿着折叠线101将标签基板103穿孔,或者沿着折叠线101对标签基板101进行某种方式的改变,从而促进沿着折叠线101的折叠。折叠后的RFID标签100通过粘附层106附着到表面102。
在标签100折叠成图1B所示的结构时,使得导电区域107的至少一部分与导电区域105的至少一部分非常接近,从而导致导电区域105和107通过诸如电容耦合或电感耦合的非接触耦合方法彼此电耦合。导电区域107被配置为当耦合到导电区域105时,它们能为RFID集成电路104提供有效的RFID天线,由此,RFID标签100在折叠成如图1B所示那样时才变成有工作能力的标签。标签100可以以这种折叠结构提供。应当理解,提出了利用非接触耦合方法来耦合导电区域105和导电区域107,使得区域105和107不需要有实际物理接触。
在图1A的示意图中,示出了两个分离的导电区域105和两个分离的导电区域107。当标签100折叠成如图1B所示那样时,每个导电区域107的一部分直接邻近两个导电区域105之一的一部分。如果导电区域105和107设计恰当,将能够实现相邻导电区域105和107之间的电容耦合,由此耦合导电区域105和107,从而形成RFID集成电路104的有效RFID天线。例如,在以约900MHz的频率工作的UHF RFID标签——诸如所谓的EPC(电子产品代码)标签的情况下——可以采用这种类型的设计。
可以简单地通过抬高折叠RFID标签100的区域2从而使区域2远离区域1,如图2所示,来刻意使RFID标签100的RFID功能失效或者至少充分劣化。当以这种方式部分展开标签时,导电区域107与导电区域105分离开一定距离,导电区域105和107之间的电耦合的效率由此减小。RFID集成电路104因此不再耦合到RFID标签100内的有效RF天线,使标签100的RFID功能失效或者充分劣化。总的来说,非接触耦合方法的效率随着耦合导电区域之间的距离的增大而迅速减小,使得RFID标签100在其RFID功能被基本上消除之前不需要展开得很大。
将RFID标签100的区域2向下折叠回区域1上,通过再次使导电区域105和107彼此靠近,而恢复标签的RFID功能。
优选地,粘附层108可重复附着,使得RFID标签100的区域2能够多次折叠和附着到RFID标签100的区域1——换言之,RFID标签100能够被多次折叠和展开。
图3示出了作为图1中示出的优选实施例的变型例的RFID标签300。在图3的实施例中,图1的粘附层108不存在,取而代之的是,粘附层301被均匀地施加到基板103的区域1的上表面,RFID集成电路104和导电区域105之上。如图3B所示,基板103的区域2被折叠和施加到粘附层301的顶部上,以将导电区域105耦合到导电区域107,由此使RFID标签300的RFID功能生效。图3中示出的折叠RFID标签300类似于图1B中示出的折叠RFID标签100。与图1和图2中示出的RFID标签的实施例的情况一样,能够通过将基板103的区域2抬离区域1(即,通过从粘附层301抬离基板103的区域2),如图4所示,而刻意地使折叠RFID标签300的RFID功能失效或充分劣化。与图1和图2的实施例一样,优选地,粘附层301可重复附着,使得基板103的区域2能够被抬离粘附层301及再次施加到粘附层301很多次。
应当意识到,参考图1至图4描述的实施例的各种变型例是可行的。下面提供这种变型例的非限制性示例。
可以采用与图1至图4描述的天线不同的RFID标签天线设计(包括感应线圈RFID天线设计)。
可以使用不同的方法将RFID标签100或300的区域2附着到RFID标签100或300的区域1,以使标签的RFID功能生效。
RFID标签100或300的区域2可以具有不同于RFID标签100或300的区域1的形状因素(尺寸和形状)——区域2不必匹配区域1。
如上所述,图1至图4中示出的优选实施例在标签中使用所谓的远场RF天线。相反,某些RFID标签——例如,在所谓的低频带(100kHz周围)和高频带(13MHz周围)工作的标签——使用近场技术来实现RFID标签与读取器之间的通信。在这种情况下,RFID标签可以使用感应线圈天线来实现RFID与读取器之间的通信。应当意识到本文描述的原理等同地应用于使用感应线圈天线的RFID标签和使用任意远场天线设计(例如,偶极天线)的RFID。在感应线圈天线的情况下,导电区域105可以被配置为形成经由两个连接点连接到RFID集成电路104的单个感应线圈。于是,导电区域107可以被配置为形成第二感应线圈,该第二感应线圈在RFID标签100或300如图1B和3B所示那样折叠合拢时,电感性耦合到区域105形成的感应线圈。感应线圈107由此经由感应线圈105耦合到RFID集成电路104,且被配置为实现与远程RFID读取装置的通信。因为使用感应线圈天线的通信范围(主要)取决于线圈的面积,感应线圈105优选地为较小的且仅允许在很短的距离内耦合到感应线圈107,而不能与远程RFID读取装置通信。另一方面,为了实现与远程RFID读取装置的通信,优选地,感应线圈107的总面积较大。如图1至4的实施例所述,当RFID标签100或300的区域2被折叠到RFID标签100或300的区域1上方并被带到与RFID标签100或300的区域1非常接近的位置时,感应线圈105将电感性地耦合到感应线圈107,由此将RFID集成电路104耦合到有效RFID天线,且实现标签100或300的RFID功能。类似地,当RFID标签100或300的区域2被抬离RFID标签100或300的区域1时,感应线圈105不再有效地耦合到感应线圈107,且标签100的RFID功能要么完全失效要么被充分劣化。
在图1至4的实施例的另一变型例中,RFID标签可以包括篡改指示部件,使得当从施加了标签的表面102上移除标签时,标签的RFID功能以不可逆转的方式失效。这种篡改指示部件在确保RFID标签不能从一个产品移动到另一产品方面是有用的,其RFID功能以不可逆转的方式失效或者劣化。
现在将通过图1和2的RFID标签100的变型例,来描述用于提供上述篡改指示能力的一个优选实施例。在美国专利6,888,509中详细描述了用于RFID标签的这种篡改指示技术,但是之前从没有提到过将这种篡改指示技术与本文描述的可更改RFID标签性能发明相组合。可更改RFID标签性能(如参考图1至4实施例所述)和RFID篡改指示是互补特征,当它们一起使用时,每一个可增强另一个对于终端用户的价值。应当意识到,下面描述的篡改指示能力可应用于图3和图4的RFID标签实施例或本文描述的其他RFID标签实施例,或者应用于具有本文描述的可更改RFID标签性能能力的其他RFID标签实施例。
图5是作为图1和2的RFID标签实施例的变型例的RFID标签500的示意图。RFID标签500类似于RFID标签100,只不过在RFID标签500的情况下,RFID集成电路104和导电区域105施加到基板103的区域1的下表面上,且被粘附层106覆盖。当RFID标签500处于其折叠结构且因此有工作能力时,如图5B所示,导电区域105通过粘附层108和基板材料103二者耦合到导电区域107。在图5的实施例中,目标是确保当从施加了标签的表面102上移除标签500时,至少导电区域105或至少导电区域105与集成电路104之间的连接将被破坏,从而使得导电区域105与107之间或者集成电路104与导电区域107之间的耦合失效或者充分劣化,由此使得RFID标签500的RFID功能失效或者被充分劣化。
在RFID标签500的一个优选实施例中,导电区域105使用诸如导电墨水这样的易损导电材料形成。取而代之可以使用其他易损导电材料。为了促进在从表面102上移除标签500时对导电区域105造成的损坏或破坏,可至少在导电区域105附近,在基板103和粘附层106之间施加一个或多个粘附调整层501,从而调整基板103、导电区域105以及粘附层106的相对粘合性,以导致在从表面102上移除标签500时对导电区域105造成损坏或破坏。在图5中,示出粘附调整层501(可存在一个或多个这样的层)位于基板103和导电区域105之间,但是应当意识到,粘附调整层501可以代替地或者同时施加于导电区域105和粘附层106之间。粘附调整层501可以以特定图案(从基板103下方观看)施加,从而形成相对粘附强度不同的多个区域,且由此在从表面102上移除标签500时促使对导电区域105造成损坏或破坏。如果存在粘附调制层501,则粘附调整层501可以调整其分隔开的层的粘合性。粘附调整层501可以增强或者减小其分隔开的两个层的粘合性。优选地但不是必须地,粘附调整层501将减小其分隔开的两个层的粘合性。在图5所示的优选实施例中,粘附调整层501以特定图案施加到基板103和导电区域105之间,在施加了粘附调整层501的区域中减小导电区域105与基板103的粘合性,且由此在从表面102上移除标签500时,在这些区域中促使导电区域105从基板103上分离开。从基板103的下表面移除所有或部分的导电区域105,将使得导电区域105与导电区域107之间的耦合失效或者充分劣化,由此使得RFID标签500的RFID性能失效或者充分劣化。在该实施例的变型例中,粘附调整层501可以包含基板103的下表面上的处理,该处理或者以均匀的方式施加或者以特定图案施加,使得通过相对于未执行表面处理的区域中相邻层对于基板103的粘合性增强或减弱经处理的区域中相邻层对于基板103的粘合性,来调整处理区域中相邻层对于基板103的粘合性。在图5的实施例的另一变型例中,除了施加到基板103和导电区域105之间以外,粘附调整层501还可施加到基板103和RFID集成电路104之间,使得如果从表面102移除RFID标签500,则在施加了粘附调整层501的那些区域中,除了导电区域105与基板103相分离之外,RFID集成电路104也将从基板103上移除。在图5的实施例的另一变型例中,RFID集成电路104可应用于基板103的上表面,RFID集成电路104或者直接连接或者耦合到基板103的下表面上的导电区域105,其中当RFID标签500处于如图5B所示的折叠结构时,导电区域105耦合到导电区域107,由此实现RFID标签500的RFID功能,如上所述。
应当意识到,结合图5的RFID标签500描述的篡改指示能力还可以应用于具有可变更RFID性能的其他RFID标签,包括图3和4中说明的RFID标签设计以及本文描述的其他RFID标签设计。
在备选形式中,RFID标签100、300或500是具有诸如电池这样的板上电源的有源或半有源RFID标签。
在图1至5的实施例中,集成电路104和导电区域105处于区域1中,且导电区域107处于区域2中,其中区域1附在表面102上,以将RFID标签100、300或500施加到物体上。在图1至5的所有实施例的变型例中,导电区域107处于区域1中,集成电路104和导电区域105处于区域2中。在图5的优选实施例的这种变型例中,如图5所述,导电区域107以及粘附调整层501位于基板103的底面上。

Claims (11)

1.一种RFID标签,包括:
基板;
固定到所述基板的RFID集成电路;
固定到所述基板的RFID天线;其中所述标签可以布置成第一结构和第二结构,在该第一结构中,所述集成电路和所述天线操作性地电耦合以实现RFID功能,由此所述RFID标签变成有工作能力的标签,在该第二结构中,所述天线和电路的电耦合被变更以使所述功能被劣化或失效,所述RFID标签可以从所述第一结构变更到所述第二结构,并且可以从所述第二结构变更到所述第一结构,以至少部分地实现所述RFID功能,
其中,所述RFID标签包括粘附层,以保持所述标签处于所述第一结构,所述粘附层可重复附着以允许所述RFID标签位于所述第二结构并且随后被返回并保持在所述第一结构中。
2.根据权利要求1所述的标签,其中当所述天线操作性地电耦合到所述集成电路时,所述耦合是不导电的。
3.根据权利要求1所述的标签,其中所述天线经由电容耦合或电感耦合操作性地电耦合到所述集成电路。
4.根据权利要求1所述的标签,其中所述标签是无源RFID标签。
5.根据权利要求1的标签,其中所述标签是有源或半有源RFID标签。
6.根据权利要求5所述的标签,其中所述RFID标签包括电源。
7.根据权利要求1所述的标签,其中当所述标签被从所述第二结构重新布置成所述第一结构时,所述基板自身折叠,从而从展开结构变为合拢折叠结构。
8.根据权利要求1所述的标签,其中所述天线在所述第一结构中被设置成邻近于与所述集成电路,而在所述第二结构中被移动远离所述集成电路。
9.根据权利要求1所述的标签,其中所述标签包括篡改指示部件,该篡改指示部件在所述标签被从该标签所附着的物体上移除时劣化所述功能。
10.根据权利要求1所述的标签,其中当所述标签被从该标签所附着的物体上移除时,所述天线和电路的耦合被永久性地破坏。
11.根据权利要求1所述的标签,其中所述标签是具有纵轴的矩形,在所述第一和第二结构之间,横向于所述轴折叠所述标签。
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ATE511681T1 (de) 2011-06-15
CA2672478C (en) 2015-02-17
US20100230498A1 (en) 2010-09-16
US8381991B2 (en) 2013-02-26
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