CN1016049B - Fluxes for soft soldering of aluminum and its alloy - Google Patents
Fluxes for soft soldering of aluminum and its alloyInfo
- Publication number
- CN1016049B CN1016049B CN 88100868 CN88100868A CN1016049B CN 1016049 B CN1016049 B CN 1016049B CN 88100868 CN88100868 CN 88100868 CN 88100868 A CN88100868 A CN 88100868A CN 1016049 B CN1016049 B CN 1016049B
- Authority
- CN
- China
- Prior art keywords
- solder
- alloy
- scaling powder
- soft soldering
- aluminium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
- B23K35/3606—Borates or B-oxides
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Vessels And Coating Films For Discharge Lamps (AREA)
- Powder Metallurgy (AREA)
Abstract
The present invention relates to a formula of a flux for the soft soldering of aluminum and alloy thereof, which aims to develop a demoulding agent, a covering agent and an interfacial active agent, so that a soldering temperature is lower than 350 DEG C, and a soft soldering wire with an active core can be drawn. The flux has the components by weight percent: 1 to 50 wt% of organic matter fluoroborate containing amino groups, 0.5 to 50 wt% of heavy metal fluoroborate and 10 to 98 wt% of amino alcohol. The present invention is also suitable for materials, such as stainless steel, nickel base alloy, galvanized iron, copper, copper alloy, etc., and is especially suitable for the soft soldering of lamp caps made of the materials.
Description
The active core solder silk that the invention relates to aluminium and aluminum alloy soft soldering scaling powder and use this scaling powder to make.The solder of materials such as scaling powder of the present invention is applicable to also that stainless steel, nickel-base alloy, iron are zinc-plated, copper and copper alloy is particularly useful for the solder silk that above-mentioned material is made.
Aluminium is the very active metal of chemical property, oxidation easily, and aluminium and aluminium alloy are placed in the air, and the surface forms the form compact and stable oxide-film of one deck, and its fusing point is difficult to carry out solder up to 2,000 degree.In order to promote solder technology, people are devoted to develop effective scaling powder.For example BP GB1.182 440(1970) has described the scaling powder that is used for aluminium and aluminum alloy soft soldering: triethanolamine 67, monoethanolamine 14, zinc oxide 5(weight 5%).Above-mentioned scaling powder is to aluminium lamp holder solder poor effect, because lamp holder need with material be Al-Mg-Mn alloy, must engage generation aluminium alloy burn-off phenomenon during fabrication with the melten glass of temperature up to 700-800 ℃, make the oxide-film of metal surface complicated more, increased the difficulty of solder.Afterwards, some patent had been reported and has been used the inorganic salt mixt of alkali metal, alkaline-earth metal as scaling powder.For example day disclosure is speciallyyed permit JP61, and 232,092(1986) scaling powder that is used for almag has been described: strontium fluoride 24, potassium fluoride 48, aluminum fluoride 28(mole %).Russian Patent SU944,845 have described the aluminum soft soldering scaling powder: tetrafluoro boric acid zinc 10-15, triethanolamine 85-90(weight %).But this two classes scaling powder is not suitable for the solder of aluminium lamp holder yet.Because one: this scaling powder is in competence exertion effect more than 450 ℃, and bulb glass can not bear so high temperature.Two, this two classes scaling powder to copper and copper alloy help the weldering poor ability, bulb then requires lamp holder (aluminium alloy, corronil etc.) and the firm brazing filler metal of conductive copper wire.Its three: bulb industry streamline requires scaling powder is poured in the hollow cored solder wire, makes the active core cored solder wire.Above-mentioned scaling powder can't become uniform fluid below 130 ℃, is unsuitable for the cored solder wire production line.Its four, this class scaling powder usually requires brazing filler metal in inert gas such as nitrogen, argon gas, has increased the difficulty and the expense of operation.
Task of the present invention is: the first, develop effective deoxidation film, and it can destroy oxide-film rapidly under brazing temperature, expose parent metal.The second, develop suitable coverture, it can be deposited on the metal surface, forms reactive metal layer, helps combining of parent metal and solder.The 3rd, develop suitable interfacial agent, the surface that it can reduce between molten solder and the metal is powerful, makes solder and parent metal moisten temperature mutually, and by the tight brazing filler metal of reactive metal layer.The 4th, the solder operating temperature should be lower than 350 ℃.The 5th, prescription reasonable in design makes scaling powder be homogeneous (uniform) fluid below 130 ℃, is suitable for pouring in the cored solder wire, is drawn into active core solder silk.For finishing above task, technical solution of the present invention is: the first, and suitable deoxidation film, coverture and interfacial agent, its composition and percentage by weight are:
Triethylene tetramine borofluoride 10
Lead fluoborate 5
Nickel fluoborate 5
Two (B-aminoethyle alcohols) 80
The second, use aluminum alloy soft soldering scaling powder of the present invention, be drawn into active core solder silk, its composition and percentage by weight are:
Solder 97-99
Wherein: plumbous 35-80
Tin 15-60
Zinc 2-10
Scaling powder 1-3
More than describing is major technique feature provided by the present invention, because first, develop by practice and to contain hydroxylamine or amine borofluoride as the deoxidation film, its fusing point and decomposition temperature are lower than inorganic salts, just can decompose rapidly below 300 ℃, catabolite is clamp-oned in the lattice of aluminium oxide, form the complex compound intermediate with metallic aluminium, thereby make oxide-film generation swelling, loosening, cause fine and close oxide-film the crack to occur, expose metallic aluminium, help solder and infiltrate.Another the product-amine that contains the borofluoride decomposes generation of hydroxylamine or amine is a kind of reducing agent; it forms protective atmosphere around solder joint, prevent metallic aluminium oxidation by air again, and aluminium and alloy solder can be carried out in air; simplified operating performance greatly, reduced cost.Simultaneously for the copper and the solder of closing gold, silver, iron zinc-plating material, amine is good scaling powder.The second, helping the welding machine reason to inquire into experiment by solder thinks, the adhesion of parent metals such as aluminium and solder is poor, if can be by combining preferred metal with solder, for example tin, lead, cadmium, zinc, copper etc., earlier generate reactive metal layer, cover base metal surface, will help combining of parent metal and solder with parent metal, the present invention is a coverture with the heavy metal borofluoride, and the reduction potential of these metals (representing with M) is greater than aluminium.Under brazing temperature, coverture is infiltrated by place, oxide-film crack, and rapid and metallic aluminium reaction goes out metal M at the aluminium surface reduction, and newly-generated metal M is deposited on aluminium material surface, forms aluminium-M reactive alloys layer, oxide-film is further broken come off.This reactive alloys layer has improved combining between parent metal and the solder.Three, the present invention is interfacial agent with the amino alcohol, and it can reduce the surface tension between solder and the parent metal, makes molten solder and metal wetting mutually, plays conductive force simultaneously when brazing filler metal.The 4th, scaling powder of the present invention owing to adopt fusing point and the lower deoxidation film of decomposition temperature, makes the solder operating temperature low to 280-350 ℃.The 5th, amino alcohol is a polar organic solvent, and it can dissolve deoxidation film coverture smoothly, makes scaling powder of the present invention can become uniform fluid, can pour into smoothly in the cored solder wire, is drawn into the multicore cored solder wire, also can directly used by the weldering position.
The scaling powder of filling a prescription and making according to the present invention, and this scaling powder is the solder silk that active core is drawn into, solder al-mn-mg alloy smoothly, for example Chinese LF21,304, English, day 3004, U.S. 3003, alloy materials such as Soviet Union AMII, and lamp holder and other device be processed into by these alloy materials, also zinc-plated, copper of the various stainless steels of solder, iron and copper alloy, copper nickel plating, nickel-base alloy and lamp holder and other device be processed into by these alloy materials smoothly.Scaling powder brazing operation temperature of the present invention is lower, and brazing filler metal speed is fast, and is effective, both can use on streamline, also is suitable for quick manual soldering.
The invention process is as follows:
Embodiment one: (prescription of scaling powder)
Triethylene tetramine borofluoride 10
Nickel fluoborate 5
Lead fluoborate 5
Two (B-aminoethyle alcohols) 80
Embodiment two: (prescription of active core solder silk)
Solder 98
The composition of solder and percentage by weight are:
Plumbous: 75
Tin 23
Zinc 2
Scaling powder 2
The composition of scaling powder and percentage by weight are:
Triethylene tetramine borofluoride 10
Nickel fluoborate 5
Lead fluoborate 5
Two (B-aminoethyle alcohols) 80
Claims (2)
1, a kind of aluminium and aluminum alloy soft soldering scaling powder is characterized in that the composition of this scaling powder and percentage by weight are:
Triethylene tetramine borofluoride 10
Nickel fluoborate 5
Lead fluoborate 5
Two (B-aminoethyle alcohols) 80
2, use the aluminum alloy soft soldering scaling powder that claim 1 limited, the composition and the percentage by weight that are drawn into active core solder silk are:
Solder: 97-99
Wherein: lead: 35-80
Tin: 15-60
Zinc: 2-10
Scaling powder: 1-3
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 88100868 CN1016049B (en) | 1988-02-16 | 1988-02-16 | Fluxes for soft soldering of aluminum and its alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 88100868 CN1016049B (en) | 1988-02-16 | 1988-02-16 | Fluxes for soft soldering of aluminum and its alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1035073A CN1035073A (en) | 1989-08-30 |
| CN1016049B true CN1016049B (en) | 1992-04-01 |
Family
ID=4831542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 88100868 Expired CN1016049B (en) | 1988-02-16 | 1988-02-16 | Fluxes for soft soldering of aluminum and its alloy |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1016049B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1862251A4 (en) * | 2005-03-25 | 2009-07-29 | Jemco Inc | Flux powder for brazing aluminum material and process for producing the flux powder |
| CN101204762B (en) * | 2007-12-25 | 2011-02-16 | 昆山成利焊锡制造有限公司 | Al and Al alloy soft braze welding metal displaced type unleaded welding soldering flux |
| CN101274397B (en) * | 2008-05-21 | 2010-06-02 | 哈尔滨工业大学 | Promoting agent for nickel-base high-temperature alloy TIG weld and method of use thereof |
| CN101480764B (en) * | 2009-02-05 | 2013-11-06 | 深圳市亿铖达工业有限公司 | Water-soluble aluminum and aluminum alloy soft soldering brazing flux as well as preparation method thereof |
| CN102139425B (en) * | 2011-04-13 | 2013-02-06 | 广州瀚源电子科技有限公司 | High-reliability soldering flux for aluminum soft soldering |
| WO2013187363A1 (en) * | 2012-06-11 | 2013-12-19 | 千住金属工業株式会社 | Flux composition, liquid flux, resin flux cored solder, and solder paste |
| CN102922162B (en) * | 2012-11-01 | 2014-11-26 | 青岛英太克锡业科技有限公司 | Aluminum welding tin paste and preparation method thereof |
| CN108620764B (en) * | 2017-03-24 | 2022-03-08 | 苏州昭舜物联科技有限公司 | Soldering paste for low-temperature soldering and preparation method thereof |
| US20190039189A1 (en) * | 2017-08-03 | 2019-02-07 | Honeywell International Inc. | Free flowing potassium aluminum fluoride flux agent |
| CN114871630A (en) * | 2022-06-27 | 2022-08-09 | 浙江亚通焊材有限公司 | Welding material for deep cooling container brazing and deep cooling container brazing process |
-
1988
- 1988-02-16 CN CN 88100868 patent/CN1016049B/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| CN1035073A (en) | 1989-08-30 |
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