The LED module
Technical field
The present invention relates to a kind of LED module.
Background technology
The same with conventional light source, light emitting diode (LED) also can produce heat during operation, and how much it depends on and whole luminous efficiency.Under the effect of external energy, the radiation recombination generation electroluminescent in electronics and hole, the light that radiates at the P-N knot also need just can arrive at external (air) through the semiconductor medium and the encapsulation medium of eyeglass itself.Comprehensive electric current injection efficiency, radioluminescence quantum efficiency, wafer exterior light are taken out efficient etc., have quite a few energy mainly to transform heat energy with the form of the lattice vibration of non-radiative compound generation.The rising of two chip temperatures then can strengthen non-radiative meeting, and further weakens luminous efficiency.
If great power LED is carried out the words of connection in series-parallel combination, because great power LED is taked the heatsink transverse mode, be that fin by the LED base distributes the heat that PN junction produces, because the chip of great power LED adopts stack to pile up and places, so the heat that PN junction produced is by distributing that fin is concentrated, because heat flow rate per unit area is limited, so also is easy to cause heat build-up, the PN junction temperature increases, and causes bad phenomenon such as LED light decay.
Summary of the invention
For overcoming the poor radiation of existing great power LED, easily cause the shortcoming of heat build-up, it is good to the invention provides a kind of thermal diffusivity, simple in structure, LED module with low cost.
The LED module, comprise pedestal, the front of described pedestal is fixed with led module, described pedestal is connected with the face frame by screw, be provided with light-passing board between described frame and the described led module, described light-passing board is connected with light-passing board by the printing opacity seal washer, and the back side of described pedestal is fixed with the high-capacity LED driver that starts described led module; The back side of described pedestal is evenly distributed with some fin;
It is characterized in that: have difference in height between the adjacent fin root.
Further, that described pedestal is provided with is corresponding one by one with described fin, make the boss that occurs difference in height between the fin root, and described fin and described boss are integrated.
Further, be evenly distributed with the ventilation slot that is beneficial to circulation of air on the described fin.
Further, the spread geometry of the shape of described pedestal and described led module is suitable.
Further, described led module comprises substrate, is integrated in led array and secondary optical lens and lens carrier on the described substrate, that be made up of many high brightness LED chips; Described substrate is provided with the plug connector that is connected with other led module.
Further, described light-passing board and described frame one.
Perhaps, described light-passing board is connected with described frame by screw, is provided with silicone rubber gasket between described light-passing board and the face frame.
Further, be provided with silicone rubber gasket between described pedestal and described frame.
Further, be provided with lip limit and fixing hole around the described pedestal.
Technical conceive of the present invention is: the height of fin root boss can be provided with as required, makes that the height between the fin root differs; And offer ventilation slot on the fin and flow, thereby make heat radiation reach optimum efficiency to produce air.
The present invention has good, simple in structure, the with low cost advantage of thermal diffusivity.
Description of drawings
Fig. 1 is a structural representation of the present invention
Fig. 2 is a decomposing schematic representation of the present invention
Fig. 3 is the schematic diagram at the pedestal back side
Fig. 4 is the decomposing schematic representation of led module
The specific embodiment
With reference to accompanying drawing, further specify the present invention:
The LED module, comprise pedestal 1, the front of described pedestal 1 is fixed with led module 11, described pedestal 1 is connected with face frame 2 by screw, be provided with light-passing board 3 between described frame 2 and the described led module 11, described light-passing board 3 is connected with light-passing board 3 by printing opacity seal washer 4, and the back side of described pedestal 1 is fixed with the high-capacity LED driver 12 that starts described led module 11; The back side of described pedestal 1 is evenly distributed with fin 13; There is difference in height between adjacent fin 13 roots.
That described pedestal 1 is provided with is corresponding one by one with described fin 13, make the boss 132 that occurs difference in height between fin 13 roots, and described fin 13 is integrated with described boss 132.
Be evenly distributed with the ventilation slot 131 that is beneficial to circulation of air on the described fin 13.
The spread geometry of the shape of described pedestal 1 and described led module 11 is suitable.
Described led module 11 comprises substrate 111, is integrated in led array 112 and secondary optical lens 113 and lens carrier 114 on the described substrate 111, that be made up of many high brightness LED chips; Described substrate 111 is provided with the plug connector 115 that is connected with other led module.
Described light-passing board 3 is connected with described frame 2 by screw, is provided with silicone rubber gasket between described light-passing board 3 and the face frame 2.
Be provided with silicone rubber gasket between described pedestal 1 and described frame 2.
Be provided with lip limit 14 and fixing hole 15 around the described pedestal 1.
Light-passing board 3 and face frame 2 among the present invention also can adopt integrative-structure.
The described content of this specification embodiment only is enumerating the way of realization of inventive concept; protection scope of the present invention should not be regarded as only limiting to the concrete form that embodiment states, protection scope of the present invention also reach in those skilled in the art conceive according to the present invention the equivalent technologies means that can expect.