CN101600294B - Anisotropic conducting film and circuit board using same - Google Patents
Anisotropic conducting film and circuit board using same Download PDFInfo
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- CN101600294B CN101600294B CN2009101489635A CN200910148963A CN101600294B CN 101600294 B CN101600294 B CN 101600294B CN 2009101489635 A CN2009101489635 A CN 2009101489635A CN 200910148963 A CN200910148963 A CN 200910148963A CN 101600294 B CN101600294 B CN 101600294B
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Abstract
The invention is named as an anisotropic conducting film and a circuit board using the same. The anisotropic conducting film exists among circuit electrodes arranged opposite, the circuit electrodes arranged opposite are pressurized, and electrodes in the pressurization direction are electrically connected. The anisotropic conducting film is characterized in that the conducting film is formed by overlapping a first bonding thin film layer containing a polymerized photopolymerization resin, a thermosetting resin, a curing agent for the thermosetting resin and conductive particles and a second bonding thin film layer containing the thermosetting resin and the curing agent for the thermosetting resin.
Description
The application be based on the applying date be that May 11, application number in 2005 are 200510068794.6, denomination of invention is dividing an application that the application of " anisotropic conducting film and use the circuit board of this film " is submitted to.
Technical field
The present invention relates to circuit substrate each other or anisotropic conducting film that uses in being connected of the electronic component of integrated circuit (IC) chip etc. and circuit base plate and the circuit board that uses this film.
Background technology
For make circuit substrate each other or the electronic component of IC chip etc. and circuit substrate electricity connect, can use conducting particles to be dispersed in anisotropic conducting film in the adhesive.This occasion is configured in anisotropic conducting film between the electrode of face-off mutually, after by heating, pressurization electrode being connected each other, makes compression aspect keep conductivity, connects thereby can carry out electricity.Anisotropic conducting film plays an important role as the connection material that the drive IC that LCD (LCD:Liquid CrystalDisplay) is installed is used aspect practical application.
Now, the medium and small plate that the big template of using from notebook computer or monitor and TV uses to portable machines such as portable phone or personal digital assistant (PDA:Personal Digital Assistant), game machines, LCD is applicable to diversified purposes, and these LCD use anisotropic conducting film (ACF:Anisotropic Conductive Film) that drive IC is installed.Drive IC among the LCD is installed, and by with drive IC carrier band encapsulationization (TCP:Tape Carrier Packag), uses anisotropic conducting film with itself and LCD plate or the electric connection of printed circuit board (PCB) (PWB:PrintedWiring Board) then.In addition, the medium and small LCD of portable phone etc. adopts and directly naked drive IC (ベ ア De ラ イ バ IC) is installed in COG (the Chip on Glass) mode on the LCD plate by anisotropic conducting film.
The LCD height becomes more meticulous and develops, and the LCD plate is connected or the miniaturization of COG connection request connection spacing with TCP's.Especially COG connect since with the projection of IC chip as connection electrode, thereby connect area and connect for a short time than TCP, so will guarantee conducting on small connection electrode, how to catch the conducting particles of sufficient amount, this obtain on the high connecting reliability very important.
Therefore, for example, Te Kaiping 8-279371 communique, disclose by forming the two-layer structure of the adhesive layer (conducting particles layer) will be dispersed with conducting particles and single adhesive layer (adhesive layer) lamination, compare with single layer structure in the past, can on microelectrode (projection), catch conducting particles expeditiously, can provide applicability, the anisotropic conducting film that the connectivity of small connection spacing is good minute protrusions.
Summary of the invention
Yet, this two-layer structure ACF with compare in the past, though the capturing efficiency on microelectrode improved because conducting particles flows with adhesive when connecting, so use occasion (for example, following interval, the 2600 μ m of 15 μ m of the IC that connects the spacing miniaturization
2Following electrode size), though guarantee the electrode insulating properties to each other of adjacency, not talkatively can guarantee 2600 μ m
2Enough conducting particles numbers (more than 5) on the following electrode also have room for improvement aspect connection reliability.
The present invention is the invention of finishing in view of above-mentioned condition, its objective is the insulating properties height when narrow interval is provided, and the anisotropic conducting film of the connection reliability can improve fine connection spacing time the and use the circuit board of this film.
Anisotropic conducting film of the present invention is to be present between the circuit electrode of face-off mutually, to opposed circuit electrode pressurization, anisotropic conducting film with electricity connection between the electrode of compression aspect, it is characterized in that, this conductive film by contain the optical polymerism resin that is aggregated, thermosetting resin, thermosetting resin the 1st adhesive film layer with curing agent and conducting particles, with contain thermosetting resin and thermosetting resin the 2nd adhesive film layer laminate and form with curing agent.
If use this anisotropic conducting film, the insulating properties height during then narrow interval, and the connection reliability can improve fine connection spacing the time.Moreover so-called narrow interval is meant that the interval between the circuit electrode of adjacency is narrow.
The heat release that aforementioned the 1st adhesive film layer and the 2nd adhesive film layer adopt DSC to measure begin temperature preferably more than 60 ℃ and the temperature of finishing 80% curing reaction be below 260 ℃.When heat release begins temperature less than 60 ℃, begin temperature with heat release and compare, the tendency that has keeping quality to reduce in the occasion more than 60 ℃.In addition, when the temperature of finishing 80% curing reaction surpasses 260 ℃, compare in the occasion below 260 ℃, can not connect in the short time, may produce infringement circuit at low temperature with this temperature.
As the aforementioned hot thermosetting resin, preferably use epoxy resin.
In addition, as above-mentioned thermosetting resin curing agent,, preferably use the potentiality curing agent from the viewpoint that keeping quality improves.
Aforementioned the 1st adhesive film layer and the 2nd adhesive film layer preferably contain film formation property macromolecule.At this moment, easier formation film.
In addition, be dispersed in conducting particles amount 0.2～30 volume % preferably in aforementioned the 1st adhesive film layer.The conducting particles amount is compared with the occasion more than the 0.2 volume % during less than 0.2 volume %, and the tendency of conduction step-down is arranged, and when surpassing 30 volume %, compares with the occasion below the 30 volume %, and the tendency of the insulating properties step-down between the circuit electrode of adjacency is arranged.
In addition, the invention is characterized in, be to dispose first circuit block with first binding post and second circuit parts with second binding post, and make aforementioned first binding post and aforementioned second binding post opposed, between aforementioned first binding post of arranged opposite and aforementioned second binding post, there is anisotropic conducting film, after the heating and pressurizing, make aforementioned first binding post of arranged opposite and the circuit board that aforementioned second binding post electricity is connected, aforementioned anisotropic conducting film is above-mentioned anisotropic conducting film.
If adopt circuit board of the present invention, the connection reliability the when good insulating during then narrow interval, fine wiring spacing improves.
If adopt anisotropic conducting film of the present invention, then form contain the optical polymerism resin that is aggregated, thermosetting resin, thermosetting resin with the 1st adhesive film layer of curing agent and conducting particles, with contain the ACF that thermosetting resin and the thermosetting resin two-layer structure with the 2nd adhesive film layer of curing agent constitutes, and use up and make the 1st adhesive film layers of polymer that contains conducting particles, therefore, the flowability in the time of can suppressing this layer connection.Therefore, except catching efficiently the conducting particles, flow into narrow interval owing to can also suppress conducting particles on the semi-conductive projection that connects, so the good insulating during narrow interval, the connection reliability during fine connection spacing improves.
The purposes of only connecting when therefore, anisotropic conducting film of the present invention is suitable for the LCD plate is connected with the IC chip with TAB, LCD plate at the compression aspect electricity.
In addition, adopt circuit board of the present invention, the connection reliability the when good insulating during narrow interval, fine connection spacing improves.
Embodiment
Anisotropic conducting film of the present invention, it is present between the circuit electrode of face-off mutually, to opposed circuit electrode pressurization, electricity between the electrode of compression aspect is connected, it is characterized in that, this conductive film by contain the optical polymerism resin that is aggregated, thermosetting resin, thermosetting resin the 1st adhesive film layer with curing agent and conducting particles, with contain thermosetting resin and thermosetting resin the 2nd adhesive film layer laminate and form with curing agent.Here, anisotropic conductive film is by opposed circuit electrode, promptly laying respectively at the film of the circuit electrode pressurization of these anisotropic conducting film both sides, is between the electrode with compression aspect, promptly along the electric each other film of connecting of the circuit electrode that compression aspect disposed.
Adopt this anisotropic conductive film, the insulating properties height during narrow interval, the connection reliability in the time of can improving fine connection spacing.
The 2nd adhesive film layer preferably also contains conducting particles.
As the 1st adhesive film layer and the 2nd adhesive film layer, the preferred temperature that to use the heat release of adopting DSC to measure to begin temperature be more than 60 ℃ and finish 80% curing reaction is the thin layer below 260 ℃.Wherein, the 1st adhesive film layer and the 2nd adhesive film layer temperature of finishing 80% curing reaction can adopt DSC (programming rate: 10 ℃/min) measure.
Above-mentioned optical polymerism resin is to have to use the free radical that functional groups such as acryloyl group, methacryl are arranged to carry out the material of the functional group of polymerization; as such optical polymerism resin, can enumerate acrylate, methacrylate, maleimide compound etc.Free-radical polymerised material both can use the material that is monomer, any state of oligomer, also monomer can be used with oligomer.Concrete example as acrylate (methacrylate), acrylic acid urethane ester is arranged, methyl acrylate, acrylic acid epoxy ester, acrylic acid polybutadiene ester, the silicon Acrylote ketone ester, acrylic polyester, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, ethylene glycol diacrylate, the diacrylate binaryglycol ester, trimethyol propane triacrylate, tetrapropylene acid tetrahydroxy methane ester, 2-hydroxyl-1,3-two propylene acyloxy propane, 2, two [4-(acryloyl-oxy ylmethoxy) phenyl] propane of 2-, 2, two [4-(the acryloyl-oxy Quito ethyoxyl) phenyl] propane of 2-, the acrylic acid dicyclopentenyloxyethyl methacrylate, the acrylic acid tricyclodecenyl esters, two (acryloxy ethyl) esters of isocyanuric acid, 6-caprolactone modification three (acryloxy ethyl) chlorinated isocyanurates, isocyanuric acid three (acryloxy ethyl) ester, isocyanuric acid three (acryloxy ethyl) ester etc.As required, also can suitably use the polymerization inhibitor of hydroquinones, methyl ether hydroquinone type etc.In addition, the optical polymerism resin has the occasion of double cyclopentenyl and/or tricyclic decenyl and/or triazine ring, because the raising of the thermal endurance of anisotropic conducting film, thereby preferred.Maleimide compound is so long as contain the compound of 2 above dimaleoyl iminos at least and get final product in molecule, as maleimide compound, for example, can enumerate 1-methyl-2,4-bismaleimides benzene, N, N '-meta-phenylene bismaleimide, N, N '-TOPOT 2,2 maleimide, N, a N '-methylene phenyl-bismaleimide, N, N '-4,4-biphenylene bismaleimides, N, N '-4,4-(3,3 '-dimethyl-biphenylene) bismaleimides, N, N '-4,4-(3,3 '-dimethyl diphenylmethane) bismaleimides, N, N '-4,4-(3,3 '-diethyl diphenyl methane) bismaleimides, N, N '-4,4-diphenyl methane bismaleimides, N, N '-4,4-diphenyl propane bismaleimides, N, N '-4,4-diphenyl ether bismaleimides, N, N '-3,3 '-diphenyl sulfone bismaleimides, 2, two (4-(the 4-maleimide phenoxy group) phenyl) propane of 2-, 2, two (3-sec-butyl-4-8 (the 4-maleimide phenoxy group) phenyl) propane of 2-, 1, two (4-(the 4-maleimide phenoxy group) phenyl) decane of 1-, 4,4 '-cyclohexylidene-two (1-(4-maleimide phenoxy group)-2-cyclohexyl benzene, 2, two (4-(4-maleimide phenoxy group) phenyl) HFC-236fa of 2-etc.These can separately or merge use, also can use with allyl compounds such as allyl phenol, allyl phenyl ether, benzoic acid allyl esters.
Anisotropic conducting film of the present invention also can contain light trigger.As this light trigger, can use the known initator that produces free radical by rayed.Light trigger as the cracking type; can preferably use benzoin isobutyl ether, diethoxy acetophenone, hydroxycyclohexylphenylketone, benzyl dimethyl ketal, 2-hydroxy-2-methyl-1-phenyl-propane-1-ketone, 4-methyl mercapto-2,2-dimethyl-2-morpholino acetophenone, 4-morpholino-2-ethyl-2-dimethylamino-2-benzyl acetophenone, aminomethyl phenyl glyoxylic ester, acylphosphine oxide etc.As the light trigger of dehydrogenation type, can preferably use benzophenone, 2-EAQ, 2-clopenthixal ketone, 2-isopropyl thioxanthone, 1,7,7-trimethyl-2,3-dioxo-bicyclo (2,2, the 1-heptane), 4,4 '-two (dimethylamino) benzophenone, 4-benzyl-4 '-methyldiphenyl thioether etc.
Before the optical polymerism resin polymerization, these light triggers are with respect to the use amount of optical polymerism resin, so long as the optical polymerism resin can polymerization amount then do not have particular determination, but can preferably use the light trigger of 0.3～5 weight portion with respect to free-radical polymerised material 100 weight portions.The use amount of light trigger is compared with the occasion more than 0.3 weight portion during less than 0.3 weight portion, and the tendency of responding property deterioration when the use amount of light trigger surpasses 5 weight portions, is compared with the occasion below 5 weight portions, and keeping quality may reduce.
In addition, in order to make the 1st adhesive film layer and the easier formation film of the 2nd adhesive film layer, the film formation property macromolecule that preferably cooperates thermoplastic resins such as phenoxy resin, mylar, polyamide to form.These films form property macromolecules at reaction resin, i.e. optical polymerism resin or the effect of stress relaxation is arranged when thermosetting resin cured.Especially, film forms the occasion that the property macromolecule has functional groups such as hydroxyl, because adhesiveness improves thereby more preferably.
The high molecular use amount of film in the 1st adhesive film layer formation property is preferably 10～150 weight portions with respect to optical polymerism resin 100 weight portions, especially preferably 20～100 weight portions.When film forms the high molecular use amount of property less than 10 weight portions, compare with the occasion more than 10 weight portions, the tendency of self supportive deterioration is arranged, when film forms the high molecular use amount of property and surpasses 150 weight portions, compare with the occasion below 150 weight portions, the tendency of intermiscibility deterioration is arranged.
As the thermosetting resin that uses among the present invention, preferred epoxy.As epoxy resin, the epoxy phenolics that the bisphenol-type epoxy resin that epoxychloropropane and bisphenol-A or Bisphenol F, bisphenol-A D etc. can be derived, epoxychloropropane and phenol linear phenol-aldehyde resin or cresols linear phenol-aldehyde resin are derived or have the naphthalene that contains the naphthalene nucleus skeleton be the glycidyl more than 2 arranged in 1 molecule such as epoxy resin, glycidyl amine, glycidol ether, biphenyl, ester ring type various epoxy compoundss etc. separately or mix use more than 2 kinds.These epoxy resin preferably use foreign ion (Na in order to prevent electron transfer
+, Cl
-Deng) or water-disintegrable chlorine etc. drop to high-purity product below the 300ppm.
As the thermosetting resin curing agent that uses among the present invention, the preferred epoxy curing agent can use the potentiality curing agent such as salt, dicyandiamide of imidazoles system, hydrazides system, boron trifluoride-amine complex, sulfonium salt, amine acid imide, polyamines.
The high molecular use amount of film in the 2nd adhesive film layer formation property with respect to total use amount 100 weight portions of thermosetting resin and curing agent, is preferably 30～100 weight portions, and the spy is 30～60 weight portions preferably.When film forms the high molecular use amount of property less than 30 weight portions, compare with the occasion more than 30 weight portions, the tendency of self supportive deterioration is arranged, when film forms the high molecular use amount of property and surpasses 100 weight portions, compare with the occasion below 100 weight portions, the tendency of intermiscibility deterioration is arranged.
In the present invention, thermosetting resin and curing agent add the use amount that together adds up to respect to the optical polymerism resin in the 1st adhesive film layer, are preferably 60～400 weight portions with respect to optical polymerism resin 100 weight portions, especially preferably 100～250 weight portions.Thermosetting resin and curing agent add and add up to respect to the use amount of optical polymerism resin 100 weight portions than 60 weight portions after a little while together, compare with the occasion more than 60 weight portions, there is difficult tendency of removing resin from connection electrode and conducting particles interface in mobile reduction during connection.In addition, thermosetting resin and curing agent add and add up to respect to the use amount of optical polymerism resin 100 weight portions than 400 weight portions for a long time together, compare with the occasion below 400 weight portions, flowability during connection is too high, exist conducting particles to flow with resin, capturing efficiency on the electrode is reduced, and perhaps conducting particles increases to the inflow of electrode gap portion, the tendency that short circuit generation probability increases.
The conducting particles that uses among the present invention for example is the particle of metals such as Au, Ag, Cu or scolding tin, and the particle of conductive layers such as Ni, Cu, Au, scolding tin more preferably is set on the spherical nuclear material of the contour molecule of polystyrene.Can also on the surface of electroconductive particle, form the superficial layer of Su, Au, scolding tin etc.Grain has the occasion of height tolerance through need be littler than the minimum interval of electrode of substrate on the electrode, preferable particle size is bigger than height tolerance, preferred 1～10 μ m.In addition, the conducting particles amount that is dispersed in the adhesive is 0.1～30 volume %, preferably 0.2～15 volume %.
Anisotropic conducting film can adopt technology manufacturing as described below.Light trigger, optical polymerism resin, thermosetting resin, thermosetting resin are formed the molecular adhesive compound dissolving of property high score with curing agent, film or be dispersed in the organic solvent, dispersed electro-conductive particle again prepares the 1st adhesive film with film coated solution.The organic solvent that uses this moment is in order to improve the dissolubility of material, optimization aromatic hydrocarbon system and the mixed solvent that contains oxygen system.
Then, the use apparatus for coating in that the one side of thickness 50 μ m was carried out on the surface-treated clear PET film, through the heated-air drying of 70 ℃, 10 minutes kinds, makes the adhesive film that adhesive film thickness is 10 μ m to this solution coat.
Then, use apparatus for coating, using in the preparation of solution in aforementioned film coated, except not dissolving light trigger and optical polymerism resin, film coated that adopting the preparation that uses the same method with solution, be coated on the one side of thickness 50 μ m carried out on the white PET film of surface-treated, heated-air drying through 70 ℃, 10 minutes, the thickness of preparation adhesive film is the 2nd adhesive film of 15 μ m.Again the 1st adhesive film that makes and the 2nd adhesive film are heated down at 40 ℃, use the roll-type laminating machine to carry out lamination simultaneously.
Then, use high-pressure UV lamps, make ultraviolet ray amount 2T/cm
2Ultraviolet ray by the clear PET on the 1st adhesive film layer, shine on the 1st adhesive film layer, with the optical polymerism resin polymerization in the 1st adhesive film layer, make the anisotropic conducting film of two-layer structure.
The optical polymerism resin of the 1st adhesive film layer is used up the occasion of carrying out polymerization, also can be before pressing layer by layer with the 2nd adhesive film, adopt ultraviolet irradiation to carry out polymerization in advance, oxygen hinders and fully polymerization but occur this moment, or the situation of lamination smoothly.On the other hand, as previously mentioned, adopt light-struck method behind the lamination, except the adhesiveness of the 1st adhesive film layer and the 2nd adhesive film layer well, because at both sides lining PET film, so there is not oxygen to hinder, can adopt light to carry out the polymerization of optical polymerism resin fully, so this method of preferred especially employing.
Circuit board of the present invention uses the two-layer structure anisotropic conducting film that makes as mentioned above, can adopt technology manufacturing as described below.Promptly, on the surface of the 1st circuit block that first binding post is arranged, the clear PET film of the 1st adhesive film layer side of this two-layer structure anisotropic conducting film is peeled off, transfer printing the 1st adhesive film aspect, white PET film on the 2nd adhesive layer is peeled off, configuration has first circuit block and the second circuit parts with second binding post of first binding post, make the 1st binding post and the 2nd binding post opposed, anisotropic conducting film is carried out heating and pressurizing, make first binding post and the electric circuit board of connecting of second binding post that make aforementioned arranged opposite.
Moreover to the occasion that anisotropic conducting film heats, heating can be carried out under the temperature more than the thermosetting resin cured temperature in the 1st adhesive film and the 2nd adhesive film.
As first circuit block with first binding post of the present invention, the preferred semiconductor that uses the band projected electrode, as second circuit parts with second binding post, preferred flex circuit application or the printed substrate that is formed with the glass substrate of ITO or metallic circuit or is formed with the Cu circuit of plating Ni/Au that use, the preferred especially glass substrate that is formed with ITO or metallic circuit that uses.
Embodiment
Below, be described more specifically content of the present invention by embodiment, but the present invention is not limited to these embodiment.
(embodiment 1)
The phenoxy resin 20g of acrylic acid phenoxy group ester 30g, hydroxycyclohexylphenylketone 0.3g, weight average molecular weight 40,000 is dissolved among the ethyl acetate 50g, makes adhesive and form solution.
Then, in this solution, cooperate the liquid epoxy resin (epoxide equivalent 185 that contains bisphenol type epoxy (epoxide equivalent 180) 10g and microcapsule-type potentiality curing agent, Asahi Chemical Industry's corporate system, ノ バ キ ユ ア HX-3941) 50g, (diameter: surface 4 μ m) forms conducting particles 10 volume % (30, the 000/mm of projection population during thickness 10 μ m of Au layer to be dispersed in the polystyrene nucleome
2), make film coated solution.Then, use apparatus for coating, this solution of coating on the clear PET film that has simultaneously carried out surface-treated thickness 50 μ m, by 70 ℃, 10 minutes heated-air drying, the thickness that makes adhesive layer was the 1st adhesive film of 10 μ m.It is 80 ℃ that the reaction that the 1st adhesive film adopts DSC to measure begins temperature, and the reaction end temp of finishing 80% curing reaction is 200 ℃.
Then, use apparatus for coating, aforementioned film coated is used in the formulations prepared from solutions, except not dissolving acrylic acid phenoxy group ester, beyond the hydroxycyclohexylphenylketone, adopt the film coated solution of the preparation that uses the same method, be coated on one side and carried out on the white PET film of surface-treated thickness 50 μ m, by 70 ℃, 10 minutes heated-air drying, the thickness that makes the 2nd adhesive film was the 2nd adhesive film of 15 μ m.It is 80 ℃ that the reaction that the 2nd adhesive film adopts DSC to measure begins temperature, and the reaction end temp of finishing 80% curing reaction is 210 ℃.
In addition, again the 1st adhesive film that makes with the 2nd adhesive film with as the PET film of base material 40 ℃ of heating, carry out lamination with the roll-type laminating machine simultaneously.
Then use high-pressure UV lamps, make ultraviolet ray amount 2J/cm
2Ultraviolet ray by the clear PET on the 1st adhesive film layer, shine on the 1st adhesive film layer, the optical polymerism resin polymerization with in the 1st adhesive film layer makes the two-layer structure anisotropic conducting film.
Then, the anisotropic conducting film of the two-layer structure that use makes is as followsly with the chip of gold bump (area: 45 μ m * 45 μ m, 10 μ m, highly at interval: 15 μ m, projection several 362) (1 * 10mm, thickness: 500 μ m) with the glass substrate of being with the ITO circuit (thickness: being connected 1.1mm).That is (the clear PET film of 1.5 * 12mm) the 1st adhesive film laminar surface is at 80 ℃, 10kgf/cm, to peel the two-layer structure anisotropic conducting film off
2Following the 1st adhesive film aspect of pressure stick on the band ITO circuit glass substrate after, peel the white PET film of the 2nd adhesive film laminar surface off, carry out the projection of chip and the position alignment of band ITO circuit glass substrate.
Then, under 210 ℃, 40g/ projection, 10 seconds condition, above chip, carry out heating and pressurizing, carry out this connection.Conducting particles number on the projection after this connection (500) on average is 24, and minimum is 11.In addition, connecting per 1 projection of resistance the highest is 120m Ω, on average is 58m Ω.In addition, insulation resistance is more than 108 Ω, can guarantee the insulating properties of practical necessary 108 Ω of going up.Do not change even these values also after-40～100 ℃ thermal shock test 1000 circular treatment, high temperature, high humidity (85 ℃/85%RH, 1000h) are tested, demonstrate good connection reliability.
(comparative example 1)
Acrylic acid phenoxy group ester 30g, the phenoxy resin 20g of hydroxycyclohexylphenylketone 0.3g, weight average molecular weight 40,000 is dissolved among the ethyl acetate 50g, makes adhesive and forms solution.
Then, in this solution, cooperate liquid epoxy resin (epoxide equivalent 185, Asahi Chemical Industry's corporate system, the ノ バ キ ユ ア HX-3941) 50g that contains bisphenol type epoxy (epoxide equivalent 180) 10g and microcapsule-type potentiality curing agent, (diameter: surface 4 μ m) has formed conducting particles 4 volume % (30, the 000/mm of projection population during thickness 25 μ m of Au layer to be dispersed in the polystyrene nucleome
2), make film coated solution.Then, use apparatus for coating, thickness 50 μ m one side has been carried out this solution of coating on the surface-treated PET film, by 70 ℃, 10 minutes heated-air drying, the thickness that makes adhesive layer was the adhesive film of 25 μ m.
Then, use high-pressure UV lamps, make ultraviolet ray amount 2J/cm
2Ultraviolet irradiation to this adhesive film, make the anisotropic conductive adhesive film of the optical polymerism resin polymerization in the film.This anisotropic conductive grain closes reaction that film adopts DSC to measure, and to begin temperature be 80 ℃, and the reaction end temp of finishing 80% curing reaction is 200 ℃.
Then, the single layer structure anisotropic conducting film that use makes, as described below with the chip of gold bump (area: 45 * 45 μ m, 10 μ m, highly at interval: 15 μ m, projection several 362) (1 * 10mm, thickness: 500 μ m) be with ITO circuit glass substrate (thickness: being connected 1.1mm).At 80 ℃, 10kgf/cm
2Pasting the single layer structure anisotropic conducting film under the condition on band ITO circuit glass substrate (behind 1.5 * 12mm) the anisotropic conductive adhesive film, peels the PET film off, carries out the projection of chip and the position alignment of band ITO circuit glass substrate.
Then, under 210 ℃, 40g/ projection, 10 seconds condition, heat, pressurize, carry out this connection from the chip top.Conducting particles number on the projection after this connection (500) on average is 14, and minimum is 1.In addition, connecting per 1 projection of resistance the highest is 5300m Ω, on average be 3200m Ω, these values increase-40～100 ℃ thermal shock test 1000 circular treatment, high temperature, high humidity (85 ℃/85%RH, 1000h) test back, and it is bad that conduction takes place the part connecting portion.In addition, insulation resistance shows 106 Ω, can not guarantee the practical above insulating properties of 108 necessary Ω that.
(comparative example 2)
Except not dissolving acrylic acid phenoxy group ester, hydroxycyclohexylphenylketone, and make molecular weight 40,000 phenoxy resin becomes beyond the 50g, the 1st adhesive film film coated solution that adopts method preparation similarly to Example 1, using apparatus for coating to be coated on has carried out on the PET film of surface-treated thickness 50 μ m to one side, by 70 ℃, 10 minutes heated-air drying, the thickness that makes adhesive film was the adhesive film A of 10 μ m.It is 80 ℃ that the reaction that this adhesive film adopts DSC to measure begins temperature, and the reaction end temp of finishing 80% curing reaction is 200 ℃.
Then, the same method of the 2nd adhesive film layer of employing and embodiment 1 made another adhesive film B.It is 80 ℃ that the reaction that this adhesive film adopts DSC to measure begins temperature, and the reaction end temp of finishing 80% curing reaction is 210 ℃.
Again the adhesive film A that obtains and adhesive film B 40 ℃ of heating, carry out lamination with the roll-type laminating machine simultaneously, make the anisotropic conducting film of two-layer structure.
Then, the two-layer structure anisotropic conducting film that use makes, as described below with the chip of gold bump (area: 45 μ m * 45 μ m, 10 μ m, highly at interval: 15 μ m, projection several 362) (1 * 10mm, thickness: 500 μ m) be with ITO circuit glass substrate (thickness: being connected 1.1mm).At 80 ℃, 10kgf/cm
2Pressure under (pellicular front of 1.5 * 12mm) adhesive film A sticks on the band ITO circuit glass substrate, peels the PET film then off, carries out the projection of chip and the position alignment of band ITO circuit glass substrate the two-layer structure anisotropic conducting film.
Then, under 210 ℃, 40g/ projection, 10 seconds condition, heat, pressurize, carry out that this is continuous from the chip top.Conducting particles number on the projection after this connection (500) on average is 18, and minimum is 2.In addition, connect resistance, per 1 projection is the highest to be 2500m Ω, on average is 1200m Ω, these values increase-40～100 ℃ thermal shock test 1000 circular treatment, high temperature, high humidity (85 ℃/85%RH, 1000h) test back, and it is bad that conduction takes place the part connecting portion.In addition, insulation resistance shows 106 Ω, can not guarantee the practical above insulating properties of 108 necessary Ω that.
By the result of above embodiment 1 and comparative example 1,2 as can be known, if adopt anisotropic conducting film of the present invention, then the insulating properties at narrow interval is good, can improve the connection reliability of fine connection spacing.
Claims (12)
1. circuit board, it disposes first circuit block with first binding post and the second circuit parts with second binding post, and makes aforementioned first binding post and aforementioned second binding post opposed,
Between aforementioned first binding post of arranged opposite and aforementioned second binding post, there is anisotropic conducting film, after the heating and pressurizing, aforementioned first binding post of arranged opposite and aforementioned second binding post electricity connected,
It is characterized in that, the interval between the circuit electrode of the adjacency of above-mentioned first circuit block below 15 μ m,
Aforementioned anisotropic conducting film be by contain the optical polymerism resin that is aggregated, thermosetting resin, thermosetting resin the 1st adhesive film layer with curing agent and conducting particles, with contain the anisotropic conducting film that thermosetting resin and thermosetting resin the 2nd adhesive film layer laminate with curing agent forms.
2. anisotropic conducting film, it is characterized in that, by contain the optical polymerism resin that is aggregated, thermosetting resin, thermosetting resin the 1st adhesive film layer with curing agent and conducting particles, with contain thermosetting resin and thermosetting resin the 2nd adhesive film layer laminate and form with curing agent
It is used for following circuit board, described circuit board arrangement has first circuit block with first binding post and the second circuit parts with second binding post, and make aforementioned first binding post and aforementioned second binding post opposed, between aforementioned first binding post of arranged opposite and aforementioned second binding post, there is anisotropic conducting film, after the heating and pressurizing, aforementioned first binding post and aforementioned second binding post electricity of arranged opposite are connected
And the interval between the circuit electrode of the adjacency of above-mentioned first circuit block is below 15 μ m.
3. the described anisotropic conducting film of claim 2 is characterized in that, it is more than 60 ℃ that the heat release that aforementioned the 1st adhesive film layer and the 2nd adhesive film layer adopt DSC to measure begins temperature, and the temperature of finishing 80% curing reaction is below 260 ℃.
4. claim 2 or 3 described anisotropic conducting films is characterized in that the aforementioned hot thermosetting resin is made of epoxy resin.
5. claim 2 or 3 described anisotropic conducting films is characterized in that the aforementioned hot thermosetting resin is made of the potentiality curing agent with curing agent.
6. claim 2 or 3 described anisotropic conducting films is characterized in that, the loading that is dispersed in the aforementioned conducting particles in aforementioned the 1st adhesive film layer is 0.2～30 volume %.
7. the described anisotropic conducting film of claim 2 is characterized in that, contains film formation property macromolecule in aforementioned the 1st adhesive film layer and the 2nd adhesive film layer.
8. the described anisotropic conducting film of claim 7 is characterized in that, aforementioned film formation property macromolecule has hydroxyl.
9. claim 7 or 8 described anisotropic conducting films is characterized in that, the high molecular use amount of formation property of the film in aforementioned the 1st adhesive film layer is 10～150 weight portions with respect to optical polymerism resin 100 weight portions.
10. claim 7 or 8 described anisotropic conducting films, it is characterized in that, film in aforementioned the 2nd adhesive film layer forms the high molecular use amount of property, is 30～100 weight portions with respect to the thermosetting resin in the 2nd adhesive film layer and thermosetting resin with total use amount 100 weight portions of curing agent.
11. claim 2 or 3 described anisotropic conducting films, it is characterized in that, thermosetting resin in the 1st adhesive film layer and thermosetting resin are 60～400 weight portions with the use amount of curing agent total with respect to the aforementioned lights polymerism resin in aforementioned the 1st adhesive film layer with respect to aforementioned lights polymerism resin 100 weight portions.
12. claim 2 or 3 described anisotropic conducting films is characterized in that, also contain light trigger, and this light trigger is 0.3～5 weight portions with respect to the use amount of aforementioned lights polymerism resin with respect to aforementioned lights polymerism resin 100 weight portions.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2009101489635A CN101600294B (en) | 2005-05-11 | 2005-05-11 | Anisotropic conducting film and circuit board using same |
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| CN2009101489635A CN101600294B (en) | 2005-05-11 | 2005-05-11 | Anisotropic conducting film and circuit board using same |
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| CNB2005100687946A Division CN100521864C (en) | 2005-05-11 | 2005-05-11 | Anisotropic conducting film and circuitboard using film |
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| CN101600294A CN101600294A (en) | 2009-12-09 |
| CN101600294B true CN101600294B (en) | 2011-09-21 |
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| CN102634286B (en) * | 2012-05-17 | 2013-08-14 | 深圳市飞世尔实业有限公司 | Method for preparing photo-thermal dual curable type anisotropic conductive film |
| KR102569980B1 (en) * | 2017-09-11 | 2023-08-24 | 가부시끼가이샤 레조낙 | Adhesive film for circuit connection and manufacturing method thereof, manufacturing method for circuit connection structure, and adhesive film accommodating set |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0883329A2 (en) * | 1997-06-06 | 1998-12-09 | Bridgestone Corporation | Anisotropic conductive film |
| CN1323868A (en) * | 2001-05-30 | 2001-11-28 | 长春光学精密机械学院 | Anisotropic conductive adhesive film |
-
2005
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0883329A2 (en) * | 1997-06-06 | 1998-12-09 | Bridgestone Corporation | Anisotropic conductive film |
| CN1323868A (en) * | 2001-05-30 | 2001-11-28 | 长春光学精密机械学院 | Anisotropic conductive adhesive film |
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| CN101600294A (en) | 2009-12-09 |
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