CN1323868A - Anisotropic conductive adhesive film - Google Patents
Anisotropic conductive adhesive film Download PDFInfo
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- CN1323868A CN1323868A CN 01118419 CN01118419A CN1323868A CN 1323868 A CN1323868 A CN 1323868A CN 01118419 CN01118419 CN 01118419 CN 01118419 A CN01118419 A CN 01118419A CN 1323868 A CN1323868 A CN 1323868A
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- solidifying agent
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Abstract
The invented anisotropic conductive adhesive film is composed of main agent layer and solidifying agent layer. The main agent layer is composed of mixed resin and conductive particles. The mixed resin is composed of epoxy resin, poly(vinyl butyral) and/or phenolformaldehyde resin. The solidifying agent layer is composed of poly(vinylbutyral) or polyvinyl alcohol resin plus latent solidifying agent 595. The thickness of film is between 30-50 micron. The produced guide conductive adhesive film can be used in the connection of minielectrode in fin circuit.
Description
The invention belongs to a kind of layer of membranaceous Chemicals of structure, have Anisotropically conductive and cementability, be used for the connection of microelectronic fine circuitry microelectrode.
Prior art 1:
The Japan special permission Room disclosed a application for a patent for invention on April 30th, 1996, and publication number is flat 8-111124 for the spy opens, and denomination of invention is the Anisotropically conductive adhering film.Its technical scheme is, sees Fig. 1, coating host layer 1 earlier on polyester film, and it is made up of resin and conducting particles 2, and resin is a kind of hybrid resin, is mixed conducting particles employing nickel powder by Resins, epoxy and polyacrylic acid.After treating that the host layer is done, be coated with sealing coat 3 again, i.e. the lower vibrin of softening temperature.Be coated with solidifying agent layer 4 at last again, this layer is made up of phenoxy resin and solidifying agent, generally selects for use and gathers ethylene glycol dibenzoate, and it is softening in the temperature more than 120 ℃.Solidifying agent is selected BF for use
3
Prior art 2:
The Japan special permission Room disclosed a publication number and has opened the application for a patent for invention that flat 8-3529, name are called Anisotropically conductive caking agent and Anisotropically conductive adhesive sheet for special on January 9th, 1996.Its technical scheme related to the present invention is that the solidifying agent powder that parcel is handled has been done in adding in the host layer, makes the Anisotropically conductive adhering film through coating.The Resins, epoxy in the host layer and the separation of solid formulation are to realize by the integument of solidifying agent powder.This integument is to form like this, with the pure powder mixes of solidifying agent powder and solid polyethylene, it is atomized in a heating chamber sprayed.The heating chamber temperature in is 100～200 ℃, and temperature out is 65～95 ℃.Promptly obtain being enclosed with the solidifying agent powder of polyvinyl alcohol separate layer in the exit.The solidifying agent that is adopted belongs to imidazoles system.
There is following shortcoming in prior art, and about prior art 1, at first it constitutes by three layers, and a special sealing coat 3 is arranged.Secondly, the resin of host layer is formed not good enough, and the toughness of the acrylic resin except that Resins, epoxy, cementability are all undesirable, and price is also higher, and active group also lacks, and therefore, the auxiliary solidification that is risen is obvious inadequately.The 3rd, the solidifying agent BF that is adopted
3Also have at normal temperatures slowly and solidify, make that prepared Anisotropically conductive adhering film can not long storage time.And, at high temperature, BF
3Decomposition, crosslinked also not ideal enough.The 4th, the phenoxy resin of the lower molecular weight (60～70) that the solidifying agent layer is adopted is difficult to find in Chinese market.In addition, it is as a kind of resin, and auxiliary solidification is also not obvious.About prior art 2, except that adopting polyvinyl alcohol not the well auxiliary solidification of tool, forming the polyvinyl alcohol integument on the solidifying agent powder is a process that complexity is difficult.And often there is a certain proportion of solidifying agent powder to fail to form good parcel, causes film system local solidification in advance.
In order to overcome the shortcoming of prior art, promptly design a kind of film layer structure simple in structure, simplify manufacture method, improve the quantity of rete toughness, cementability and active group, thereby improve auxiliary solidification, reduce raw materials cost, pay attention to the universalization of raw material, select ambient stable, pyrolytic decomposition is solidifying agent rapidly, solve the go ahead of the rest problem of local solidification of prepared film, we have invented a kind of anisotropic conductive adhesive film.
The present invention realizes like this, anisotropic conducting film is made of host layer 5 and solidifying agent layer 6, see Fig. 2, the host layer is mixed conducting particles 7 by hybrid resin and is formed, hybrid resin is by solid epoxy, and polyvinyl butyral resin and/or resol are by 2～4: part by weight mixed in 1: 1.The solidifying agent layer adds latent curing agent 595 by polyvinyl butyral acetal or polyvinyl alcohol and forms, this solidifying agent formal name used at school is 2-(β-dimethylamino ethoxy)-4 methyl isophthalic acid, 3, assorted six rings of 2-Er Evil boron, its consumption depends on the content of epoxy resin in the host layer 5, and weight ratio is: Resins, epoxy: latent curing agent=20: 3.
Effect of the present invention is as follows, owing to cancelled special sealing coat, makes film layer structure simple relatively.Do not adopt simultaneously the separation measure of prior art 2, still adopt the traditional layering coating realization Resins, epoxy and the isolation of solidifying agent, thereby, also be tending towards simple from method.Adopt polyvinyl butyral acetal, resol and solidifying agent layer also to adopt polyvinyl butyral acetal in the host layer, because they are compared with polyacrylic acid of the prior art, price is low, highly versatile, active group are many, therefore, prepared Anisotropically conductive adhering film good toughness, bonding jail, curing are rapidly, curing is preceding stablizes, assists solidification big.The employing of latent curing agent 595 makes prepared film almost can't see the curing phenomenon at normal temperatures, the local solidification phenomenon in advance in the prior art 2 more can not occur.Experiment shows, in 6 months, does not see any curing phenomenon.Prepared each under the Anisotropically conductive adhering film can the low relatively temperature at 150～200 ℃, under the pressure of 0.5～0.8MPa, 30～20 seconds with interior rapid integrally curing, bonding strength reaches 0.21MPa.Laterally non-conductive, vertically electric conductivity is near copper, and resistivity only is 10
-4～10
-3Ω cm.Toughness also has clear improvement, and method is feasible, guarantees that electrode connects, and does not damage electronic original part again.
Fig. 1 is the film layer structure diagrammatic cross-section of prior art 1.Fig. 2 is the present invention's a film layer structure diagrammatic cross-section.
Illustrate the present invention below.Embodiment 1, and the solid epoxy in the host layer is selected the E of molecular weight moderate (900～1400) for use
20Conducting particles is selected copper powder for use, and particle diameter is 15～20 μ m.The component of host layer, proportioning (weight) are as follows:
Resins, epoxy polyvinyl butyral acetal resol copper powder solvent
211 0.1 20 adapt with hybrid resin, and solvent also is a mixed solvent.Require nontoxic, lower boiling, be beneficial to volatilization.Mixed solvent mixes by equal proportion with toluene, ethanol, propyl carbinol, acetone.Adopt ultrasonic method to make copper powder be dispersed in the host layer solution Anisotropically conductive of made membrane to guarantee.The solidifying agent of solidifying agent layer is selected latent curing agent 595 for use, and formal name used at school is 2-(β-dimethylamino ethoxy)-4 methyl isophthalic acid, and 3, assorted six rings of 2-Er Evil boron, structural formula is:
Its consumption depends on the content of epoxy resin in the host layer, and promptly per 100 gram Resins, epoxy add 15 gram latent curing agents 595, and ratio is 20: 3.Resin in the solidifying agent layer is still selected polyvinyl butyral acetal for use, and solvent is alcohols (ethanol, butanols equal proportion are mixed).The consumption of polyvinyl butyral acetal depends on the amount of alcoholic solvent, and promptly 100 gram alcoholic solvents add 10 gram polyvinyl butyral acetals, and weight ratio is 10: 1.Again the latent curing agent 595 that takes by weighing is added, make solidifying agent layer solution.On polyester film, thickness is 20～30 μ m with host layer solution coat in elder generation.After treating that it does, be coated with the solidifying agent layer again, its thickness is 10～20 μ m.Overall film thickness should be thinner than 30 μ m between 30～50 μ m, bonding strength descends, and is thicker than 50 μ m, easily trickles in the process that is heating and curing.
Embodiment 2, and the component of host layer, proportioning (weight) are:
Resins, epoxy resol nickel powder solvent
4 1 0.15 20
Host layer solvent is toluene, acetone mixed solvent.The solvent of solidifying agent layer is an ethanol.All the other situations are identical with embodiment 1.On effect, host layer film formation time prolongs to some extent.Prepared film conductivity, toughness, cementability are constant substantially.
Embodiment 3, and host layer component, proportioning (weight) are:
Resins, epoxy polyvinyl butyral acetal resol silver powder solvent
311 0.05 20 conducting particless change silver powder into, and good because of its electroconductibility, consumption slightly reduces.But the transport property of silver powder is strong, disperses comparatively difficulty, easily precipitates, so host layer solution is as going dispersion again before shelve, being coated with.All the other indexs of conducting particles are identical with copper powder.Solidifying agent layer resin adopts polyvinyl alcohol, with water as solvent.All the other items are identical with embodiment 1.Because solidifying agent layer solution is with water as solvent, after coating, the phenomenon of dissolving each other of host layer and solidifying agent layer alleviates, and the time that prepared film is deposited can be more longer.
Claims (5)
1, a kind of anisotropic conductive adhesive film, constitute by host layer that is mixed with conducting particles and the solidifying agent that contains solidifying agent, main component is a Resins, epoxy in the host layer, be isolation between Resins, epoxy and the solidifying agent, it is characterized in that, the component of host layer resin is a Resins, epoxy, polyvinyl butyral acetal and/or resol, weight proportion is 2～4: 1: 1, curing agent resin is the polyvinyl butyral acetal or the polyvinyl alcohol of one of host layer resin, solidifying agent is selected latent curing agent 595 for use, formal name used at school is 2-(β-dimethylamino ethoxy)-4 methyl isophthalic acid, 3, and assorted six rings of 2-Er Evil boron.
According to claims 1 described film, it is characterized in that 2, Resins, epoxy is selected the E of molecular weight in 900～1400 scopes for use
20
3, according to claims 1 described film, it is characterized in that the consumption of latent curing agent depends on the consumption of Resins, epoxy in the host layer, the part by weight of the former with the latter is 3: 20.
4, film according to claim 1 is characterized in that, the host tunic is thick to be 20～30 μ m, and the solidifying agent tunic is thick to be 10～20 μ m, and overall film thickness is between 30～50 μ m.
5, film according to claim 1 is characterized in that, when solidifying agent layer resin selected polyvinyl alcohol for use, solvent was selected water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01118419 CN1227319C (en) | 2001-05-30 | 2001-05-30 | Anisotropic conductive adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01118419 CN1227319C (en) | 2001-05-30 | 2001-05-30 | Anisotropic conductive adhesive film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1323868A true CN1323868A (en) | 2001-11-28 |
| CN1227319C CN1227319C (en) | 2005-11-16 |
Family
ID=4663163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01118419 Expired - Fee Related CN1227319C (en) | 2001-05-30 | 2001-05-30 | Anisotropic conductive adhesive film |
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| CN (1) | CN1227319C (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102070994A (en) * | 2010-11-25 | 2011-05-25 | 武汉理工大学 | Semisolid-state reaction-type epoxy adhesive |
| CN101600294B (en) * | 2005-05-11 | 2011-09-21 | 日立化成工业株式会社 | Anisotropic conducting film and circuit board using same |
| CN101600295B (en) * | 2005-05-11 | 2012-03-21 | 日立化成工业株式会社 | Anisotropic conducting film and circuit board using same |
| CN103811102A (en) * | 2014-02-19 | 2014-05-21 | 上海和辉光电有限公司 | Anisotropic conducting film and manufacturing method for same |
| CN104541416A (en) * | 2012-08-24 | 2015-04-22 | 迪睿合电子材料有限公司 | Anisotropic-conductive-film manufacturing method and anisotropic conductive film |
| CN105359342A (en) * | 2013-07-31 | 2016-02-24 | 迪睿合株式会社 | Anisotropically conductive film and manufacturing method therefor |
| CN108471692A (en) * | 2018-03-12 | 2018-08-31 | 上海利正卫星应用技术有限公司 | A kind of lightweight heat sink |
-
2001
- 2001-05-30 CN CN 01118419 patent/CN1227319C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101600294B (en) * | 2005-05-11 | 2011-09-21 | 日立化成工业株式会社 | Anisotropic conducting film and circuit board using same |
| CN101600295B (en) * | 2005-05-11 | 2012-03-21 | 日立化成工业株式会社 | Anisotropic conducting film and circuit board using same |
| CN102070994A (en) * | 2010-11-25 | 2011-05-25 | 武汉理工大学 | Semisolid-state reaction-type epoxy adhesive |
| CN104541416A (en) * | 2012-08-24 | 2015-04-22 | 迪睿合电子材料有限公司 | Anisotropic-conductive-film manufacturing method and anisotropic conductive film |
| CN105359342A (en) * | 2013-07-31 | 2016-02-24 | 迪睿合株式会社 | Anisotropically conductive film and manufacturing method therefor |
| CN105359342B (en) * | 2013-07-31 | 2018-02-23 | 迪睿合株式会社 | Anisotropic conductive film and its manufacture method |
| CN103811102A (en) * | 2014-02-19 | 2014-05-21 | 上海和辉光电有限公司 | Anisotropic conducting film and manufacturing method for same |
| CN108471692A (en) * | 2018-03-12 | 2018-08-31 | 上海利正卫星应用技术有限公司 | A kind of lightweight heat sink |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1227319C (en) | 2005-11-16 |
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