CN101599470A - Sensor cluster and the method that is used to make sensor cluster - Google Patents
Sensor cluster and the method that is used to make sensor cluster Download PDFInfo
- Publication number
- CN101599470A CN101599470A CNA2009101470361A CN200910147036A CN101599470A CN 101599470 A CN101599470 A CN 101599470A CN A2009101470361 A CNA2009101470361 A CN A2009101470361A CN 200910147036 A CN200910147036 A CN 200910147036A CN 101599470 A CN101599470 A CN 101599470A
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- China
- Prior art keywords
- carrier body
- sensor cluster
- housing
- sensor assembly
- manufacturing step
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims abstract description 39
- 238000000576 coating method Methods 0.000 claims abstract description 39
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 24
- 238000001746 injection moulding Methods 0.000 claims description 7
- 230000005611 electricity Effects 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/141—Monolithic housings, e.g. molded or one-piece housings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The present invention relates to sensor cluster and the method that is used to make sensor cluster, a kind of sensor cluster with carrier body and sensor assembly has specifically been proposed, wherein said sensor assembly is arranged on first of carrier body, described carrier body and sensor assembly are surrounded by housing at least in part, and second face of described carrier body has metal coating at least in part.
Description
Technical field
The present invention relates to a kind of sensor cluster.
Background technology
This sensor cluster is generally known.For example patent documentation DE 100 58 593A1 disclose a kind of packaged electronic component, the chip that its chips is fixed on lead frame is installed on the end face of pad (Diepad) and is surrounded chip by plastics pad and chip are installed, and wherein also is being provided with gel on the chip end face and on chip is installed rebasing.
Summary of the invention
According to the present invention, a kind of sensor cluster with carrier body and sensor assembly has been proposed, wherein said sensor assembly is arranged on first of carrier body and goes up and described carrier body and sensor assembly are surrounded by housing at least in part, and second face of described carrier body has metal coating at least in part.
According to the present invention, a kind of method that is used to make described sensor cluster has also been proposed, wherein, in first manufacturing step, second face of carrier body applied and in second manufacturing step injection moulding seal described carrier body.
Compared with prior art have following advantage according to sensor cluster of the present invention with according to the method that is used to make sensor cluster of the present invention, promptly by the simple relatively and standard method that can carry out economically and the additional manufacturing step that especially need not to be used for to apply metal coating just can realize the decoupling of carrier body and housing in the metal level zone.This realizes in the following manner, promptly suppresses material between housing and the carrier body in conjunction with the formation that is connected in the metal level zone, and especially suppresses the formation of described material in conjunction with connection by the metal coating on the carrier body during making housing.Described carrier body especially comprises lead frame, and this lead frame is used for electricity and connects sensor assembly, and applies the metal coating that is used for producing joint face and/or printed circuit cable on lead frame at least in part according to standard.Lead frame is being carried out coating when forming printed circuit cable, preferably simultaneously metal coating is being applied on second of carrier body, compared with prior art need not to be used between housing and lead frame, adding the other step of decoupling layer thus.Therefore significantly reduced the manufacturing cost of sensor cluster.Especially when being encapsulated in micro mechanical sensor in the molded shell, suppressed because the STRESS VARIATION that case material produces housing from second layering of carrier body makes the variation of stress state can not apply any influence to sensor element thus by the decoupling layer.Particularly advantageously, carrier body can be realized substantially invariable stress state with the decoupling of housing in housing in the metal coating zone, because prevented substantially at the material between metal coating zone middle shell and the carrier body in conjunction with being connected and can layering not occurring in this zone ever after by metal coating.Metal coating preferably includes the silver layer of plating, and carrier body preferably includes material metal or nonmetallic.
Can draw favourable design of the present invention and improvement project by enlargement technology and with reference to the description of accompanying drawing.
According to a kind of preferred improvement project regulation, described second face be arranged on carrier body especially on perpendicular to the direction of the main extended surface of carrier body with first opposed on.Prevented from thus producing material between carrier body and the housing in conjunction with being connected on the relatively large back side of carrier body, this is particularly advantageous, because the layering meeting of housing on relatively large area causes STRESS VARIATION relatively large in the housing.
According to another preferred improvement project regulation, described housing comprises molded shell.Advantageously, the manufacturing of molded shell is a relatively economical, wherein by moulding material or case material injection moulding encapsulation vehicle at least in part parts and sensor assembly, this especially causes, and housing is sealed with the shape between the sensor element with carrier body or housing, being connected of force closure and/or material combination.Material between the coating area that the carrier body that applies by metal coating to small part has advantageously prevented carrier body and the molded shell is in conjunction with being connected.
According to another advantageous modification regulation, described sensor assembly and/or housing are arranged in the module region of carrier body, wherein this module region is compared with remaining carrier body zone and is preferably included recessed perpendicular to main extended surface, sensor assembly is compared with remaining carrier body zone be integrated in the carrier body and sensor assembly is configured to optimize stress in the neutral fibre of carrier body in the compact especially mode of structure space.Can also simplify the preferred step that in molding process, produces housing thus significantly particularly advantageously with sensor assembly centering on carrier body thus around sensor assembly.
According to another preferred improvement project regulation, described all the other carrier body zones comprise the join domain that is particularly useful for electricity connection sensor assembly, make carrier body particularly advantageously not only play simultaneously the mechanically effect of fixation of sensor module and housing thus, and play the effect that electricity is connected sensor assembly.Described join domain is preferably configured as electric interface and/or is configured for forming the male component of detachable socket connection.
According to another preferred improvement project regulation, only on first, only on first and in all the other carrier body zones on second or only in all the other carrier body zones, have on second at the material between housing and the carrier body in conjunction with being connected.Therefore, go up and/or in all the other carrier body zones, be fixed on second in conjunction with connecting first of in an advantageous manner housing additionally being fixed on carrier body by material, and in module region, not existing material between carrier body and the housing in conjunction with being connected on second, the material between carrier body and the housing is in conjunction with being connected the STRESS VARIATION that can cause in the housing.
According to another preferred improvement project regulation, described metal coating is arranged in the zone, and congruent basically overlay module zone, this zone is perpendicular to the projection on the direction of main extended surface.Therefore, only prevent at least in part in module region in an advantageous manner that preferably material between second of housing and the carrier body is in conjunction with being connected.Usually on the carrier body back side, in module region, form the directly surperficial of carrier body, thereby the housing that forms owing to the metal coating in this zone plays the relative effect that suppresses STRESS VARIATION in the housing well with the decoupling meeting of carrier body in the face of the maximum of housing.
Another content of the present invention is a kind of method that is used to make sensor cluster, and wherein second face to carrier body carries out coating and the parts of injection moulding encapsulation vehicle at least in part in second manufacturing step in first manufacturing step.As mentioned above, play in second manufacturing step material that forms between housing and the carrier body in conjunction with the effect that is connected with case material injection moulding encapsulation vehicle parts at least in part.At least prevent material between housing and the carrier body in the coating area that in first manufacturing step, applies in conjunction with being connected, in this zone, suppressed at least thus because the layering of housing that may occur later on and carrier body and the STRESS VARIATION that in housing, causes.Like this carrier body is carried out coating in this external first manufacturing step, make on carrier body, to be formed for making the electric conductor structure of connecting of sensor assembly simultaneously.Therefore, particularly advantageous is to need not the STRESS VARIATION that takes place in housing after other processing step suppresses, because forming conductor structure by the metal coating by carrier body when giving carrier body metallizing coating.Metal coating especially comprises the silver layer of plating.
According to a kind of preferred improvement project regulation, in first manufacturing step, apply metal coating by electroplated coating, sputter, adhesion and/or injection.Particularly advantageous is especially can control and carry out economically coating relatively preferably by electroplating.
According to another preferred improvement project regulation, in the 3rd manufacturing step, especially on the time before second manufacturing step and on the time after first step, placement sensor module on carrier body particularly advantageously makes carrier body thus at least in part and sensor assembly is surrounded by housing in second manufacturing step.
Description of drawings
Shown in the drawings and the explanation in detail in following specification of embodiments of the invention.In the accompanying drawing:
Fig. 1 illustrates the schematic plan according to the sensor cluster of first embodiment of the invention,
Fig. 2 illustrates the schematic side elevation that is used to make according to first prototype structure of the sensor cluster of first embodiment of the invention,
Fig. 3 illustrates the schematic side elevation that is used to make according to second prototype structure of the sensor cluster of first embodiment of the invention.
Embodiment
The schematic plan of the sensor cluster 1 according to exemplary first execution mode of the present invention shown in Figure 1, wherein said sensor cluster 1 has carrier body 2 and sensor assembly 3, and sensor assembly 3 is arranged on first 10 of carrier body 2 and described carrier body 2 and sensor assembly 3 are surrounded by housing 9, especially molded shell at least in part.Described sensor assembly 3 and housing 9 are arranged in the module region 5 of carrier body 2, and wherein this module region 5 is compared with remaining carrier body zone 6 and comprised perpendicular to recessed 7 of the main extended surface 100 of carrier body 2.Described carrier body 2 also has on perpendicular to the direction of main extended surface 100 and first 10 opposed second 11, wherein is provided with metal coating 4 on second 11 at least in part.This metal coating 4 especially is configured to, and makes the projection perpendicular to main extended surface 100 of module region 5 cover by metal coating 4 congruences.All the other carrier body zones 6 comprise the join domain 8 that is used for electricity connection sensor assembly 3.Connect in order to form conduction, described carrier body 2 preferably has the layer of being made by the material of metal coating 4 equally, and this layer is particularly useful for forming the conductor structure of conduction on carrier body 2.Described metal coating 4 prevents from the zone of metal coating 4 to form material in conjunction with being connected between housing 9 and carrier body 2.Described carrier body 2 comprises that especially " lead frame " and module region 5 comprise middle pad (die paddle) on lead frame.Described in addition metal coating 4 preferably includes the silver layer of plating on lead frame.
The schematic side elevation that is used to make according to first prototype structure 1 ' of the sensor cluster 1 of first execution mode of the present invention shown in Figure 2, wherein in first manufacturing step, give second 11 metallizing coating 4 of described carrier body 2 and in first manufacturing step preferred simultaneously apply on the carrier module 2 be used for after the conductor structure of electricity connection sensor assembly 3.
Claims (10)
1. sensor cluster (1) with carrier body (2) and sensor assembly (3), go up first (10) that wherein said sensor assembly (3) is arranged on carrier body (2) and described carrier body (2) and sensor assembly (3) are surrounded by housing (9) at least in part, it is characterized in that second (11) of described carrier body (2) have metal coating (4) at least in part.
2. sensor cluster as claimed in claim 1 (1) is characterized in that, described second (11) be arranged on carrier body (2) especially on perpendicular to the direction of the main extended surface (100) of carrier body (2) with described first (10) opposed on.
3. as each described sensor cluster (1) in the above-mentioned claim, it is characterized in that described housing (9) comprises molded shell.
4. as each described sensor cluster (1) in the above-mentioned claim, it is characterized in that, described sensor assembly (3) and/or housing (9) are arranged in the module region (5) of carrier body (2), and wherein this module region (5) is compared recessed (7) that preferably include perpendicular to main extended surface (100) with all the other carrier body zones (6).
5. as each described sensor cluster (1) in the above-mentioned claim, it is characterized in that described all the other carrier body zones (6) comprise the join domain (8) that is particularly useful for electricity connection sensor assembly (3).
6. as each described sensor cluster (1) in the above-mentioned claim, it is characterized in that, only first (10) go up, only first (10) go up and all the other carrier body zones (6) in second (11) on or only second (11) in all the other carrier body zones (6) be provided with material between housing (9) and the carrier body (2) in conjunction with being connected.
7. as each described sensor cluster (1) in the above-mentioned claim, it is characterized in that described metal coating (4) is arranged in the zone, basic congruent overlay module zone, this zone (5) is perpendicular to the projection of main extended surface (100).
8. method that is used for making as each described sensor cluster (1) of claim 1 to 7, it is characterized in that, in first manufacturing step, second (11) of carrier body (2) carried out coating and in second manufacturing step injection moulding seal described carrier body (2).
9. method as claimed in claim 8 is characterized in that, applies metal coating (4) by electroplated coating, sputter, adhesion and/or injection in first manufacturing step.
10. method as claimed in claim 8 or 9 is characterized in that, in the 3rd manufacturing step, especially went up placement sensor module (3) at carrier body (2) on the time before second manufacturing step.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008002268.3 | 2008-06-06 | ||
| DE200810002268 DE102008002268A1 (en) | 2008-06-06 | 2008-06-06 | Sensor i.e. micromechanical sensor, arrangement, has sensor module arranged on side of carrier element, where carrier element and sensor module are partially enclosed by housing and side of carrier element has metallic coating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101599470A true CN101599470A (en) | 2009-12-09 |
| CN101599470B CN101599470B (en) | 2014-12-24 |
Family
ID=41268535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910147036.1A Expired - Fee Related CN101599470B (en) | 2008-06-06 | 2009-06-08 | Sensor assembly and method for manufacturing the same |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN101599470B (en) |
| DE (1) | DE102008002268A1 (en) |
| TW (1) | TW201003856A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1479084A (en) * | 2003-07-03 | 2004-03-03 | 太原理工大学 | Manufacture of digitl material level sensor |
| CN1547247A (en) * | 2003-11-28 | 2004-11-17 | 王鸿仁 | Method for manufacturing image sensor |
| US20060035613A1 (en) * | 2003-12-24 | 2006-02-16 | Nec Compound Semiconductor Devices, Ltd. | High frequency module and manufacturing method thereof |
| KR100643475B1 (en) * | 2005-09-28 | 2006-11-10 | 엘지전자 주식회사 | Optical module and manufacturing method thereof |
| DE102005053682A1 (en) * | 2005-11-10 | 2007-05-16 | Bosch Gmbh Robert | Sensor, sensor component and method for producing a sensor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10058593A1 (en) | 2000-11-25 | 2002-06-06 | Bosch Gmbh Robert | Packaged electronic component and method for packaging an electronic component |
-
2008
- 2008-06-06 DE DE200810002268 patent/DE102008002268A1/en not_active Withdrawn
-
2009
- 2009-06-04 TW TW98118482A patent/TW201003856A/en unknown
- 2009-06-08 CN CN200910147036.1A patent/CN101599470B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1479084A (en) * | 2003-07-03 | 2004-03-03 | 太原理工大学 | Manufacture of digitl material level sensor |
| CN1547247A (en) * | 2003-11-28 | 2004-11-17 | 王鸿仁 | Method for manufacturing image sensor |
| US20060035613A1 (en) * | 2003-12-24 | 2006-02-16 | Nec Compound Semiconductor Devices, Ltd. | High frequency module and manufacturing method thereof |
| KR100643475B1 (en) * | 2005-09-28 | 2006-11-10 | 엘지전자 주식회사 | Optical module and manufacturing method thereof |
| DE102005053682A1 (en) * | 2005-11-10 | 2007-05-16 | Bosch Gmbh Robert | Sensor, sensor component and method for producing a sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102008002268A1 (en) | 2009-12-10 |
| CN101599470B (en) | 2014-12-24 |
| TW201003856A (en) | 2010-01-16 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141224 Termination date: 20180608 |
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| CF01 | Termination of patent right due to non-payment of annual fee |