CN101599470B - Sensor assembly and method for manufacturing the same - Google Patents
Sensor assembly and method for manufacturing the same Download PDFInfo
- Publication number
- CN101599470B CN101599470B CN200910147036.1A CN200910147036A CN101599470B CN 101599470 B CN101599470 B CN 101599470B CN 200910147036 A CN200910147036 A CN 200910147036A CN 101599470 B CN101599470 B CN 101599470B
- Authority
- CN
- China
- Prior art keywords
- carrier body
- housing
- sensor
- sensor assembly
- sensor cluster
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000000576 coating method Methods 0.000 claims abstract description 39
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 31
- 239000011248 coating agent Substances 0.000 claims description 38
- 239000000463 material Substances 0.000 claims description 24
- 210000000746 body region Anatomy 0.000 claims description 12
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 230000006872 improvement Effects 0.000 description 8
- 239000004020 conductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/141—Monolithic housings, e.g. molded or one-piece housings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Pressure Sensors (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
The present invention relates to a sensor assembly and a method for manufacturing the same, in particular provides a sensor assembly having a carrier component and a sensor module, wherein the sensor module is arranged on a first surface of the carrier component, the carrier component and the senser module are at least partially surrounded by a housing, and a second surface of the carrier component at least partially comprises metal coatings.
Description
Technical field
The present invention relates to a kind of sensor cluster.
Background technology
This sensor cluster is generally known.Such as patent documentation DE 100 58 593 A1 discloses a kind of packaged electronic component, the end face that its chips is fixed on the chip mount pad (Diepad) of lead frame surrounds chip mount pad and chip by plastics, wherein on chip end face, on chip mount pad bottom surface, is also provided with gel.
Summary of the invention
According to the present invention, propose a kind of sensor cluster with carrier body and sensor assembly, on the first surface that wherein said sensor assembly is arranged on carrier body and described carrier body and sensor assembly surrounded by housing at least in part, the second face of described carrier body has metal coating at least in part.
According to the present invention, also proposed a kind of method for the manufacture of described sensor cluster, wherein, in the first manufacturing step, the second face of carrier body is applied and in the second manufacturing step carrier body described in injection encapsulated.
According to sensor cluster of the present invention and according to the method for the manufacture of sensor cluster of the present invention compared with prior art tool have the following advantages, namely especially just can realize carrier body and the decoupling of housing in metal layer region without the need to the Additional manufacturing steps for applying metal coating by the relatively simple and standard method that can perform economically.This realizes in the following manner, in metal layer region, namely suppress the material between housing with carrier body to be combined the formation connected, and especially during manufacturing housing, suppresses described material to combine the formation connected by the metal coating on carrier body.Described carrier body especially comprises lead frame, and this lead frame is used for electrically connecting sensor assembly, and applies the metal coating for producing joint face and/or printed circuit cable on lead frame at least in part according to standard.When carrying out coating to form printed circuit cable to lead frame, preferably metal coating is applied on second of carrier body, thus compared with prior art without the need to the other step for adding decoupling layer between housing and lead frame simultaneously.Therefore the manufacturing cost of sensor cluster is significantly reduced.Especially when micro mechanical sensor is encapsulated in molded shell, inhibit the STRESS VARIATION because case material produces in the housing from carrier body second layering by decoupling layer, make the change of stress state can not apply any impact to sensor element thus.Particularly advantageously, carrier body can realize substantially invariable stress state in the housing with the decoupling of housing in metal coating region because by metal coating substantially prevent the metal coating region material of middle shell between carrier body be combined connect and layering can not be there is in this region ever after.Metal coating preferably includes the silver layer of plating, and carrier body preferably includes metal or nonmetallic material.
Expedients scheme of the present invention and improvement project can be drawn by enlargement technology and with reference to the description of accompanying drawing.
According to the preferred improvement project regulation of one, described second face is arranged on especially opposed with first surface on the direction of the main extended surface perpendicular to the carrier body face of carrier body.Thus prevent and on the back side that carrier body is relatively large, produce material between carrier body with housing be combined connection, this is particularly advantageous, because the layering of housing on relatively large area can cause STRESS VARIATION relatively large in housing.
According to another preferred improvement project regulation, described housing comprises molded shell.Advantageously, the manufacture of molded shell is relatively economical, wherein by moulding material or case material injection encapsulated carrier body and sensor assembly at least in part, this connection especially causing housing to be combined with carrier body or the positive between housing with sensor element, force closure and/or material.The carrier body applied at least partly by metal coating be advantageously prevent the coating area of carrier body and is combined with the material between molded shell and connects.
Specify according to another advantageous modification, described sensor assembly and/or housing are arranged in a module region of carrier body, what wherein this module region preferably included perpendicular to main extended surface compared with remaining carrier body region is recessed, sensor assembly can be made thus to be integrated in carrier body in the mode that structure space is compact especially compared with remaining carrier body region and sensor assembly is configured to the stress optimized in the neutral fibre of carrier body.Particularly advantageously by sensor assembly centering on carrier body, the step preferably producing housing in a molding process around sensor assembly can also be significantly simplify thus thus.
According to another preferred improvement project regulation, all the other carrier body regions described comprise the join domain being particularly useful for electrically connecting sensor assembly, make carrier body particularly advantageously not only play the effect of mechanically fixation of sensor module and housing thus simultaneously, and play the effect electrically connecting sensor assembly.Described join domain is preferably configured as electric interface and/or is configured for being formed the male component of detachable socket connection.
According to another preferred improvement project regulation, only on the first face, only on the first face and in all the other carrier body regions on the second surface or only in all the other carrier body regions the material had on the second surface between housing with carrier body be combined connection.Therefore, combined by material on the first surface connecting and in an advantageous manner housing is additionally fixed on carrier body and/or in all the other carrier body regions and fix on the second surface, and in module region on the second surface the material do not existed between carrier body with housing be combined connection, the material between carrier body with housing can cause the STRESS VARIATION in housing in conjunction with connection.
According to another preferred improvement project regulation, described metal coating is arranged in a region, and this region is the projection of congruent overlay module region on the direction perpendicular to main extended surface substantially.Therefore, in module region, preferably only prevent the material between housing and carrier body second to be combined in an advantageous manner at least in part to connect.Usually on the carrier body back side, in module region, form the direct maximized surface in the face of housing of carrier body, thus the housing formed due to the metal coating in this region can play the relative effect suppressing STRESS VARIATION in housing well with the decoupling of carrier body.
Another content of the present invention is a kind of method for the manufacture of sensor cluster, wherein in the first manufacturing step, coating is carried out to the second face of carrier body and in the second manufacturing step injection encapsulated carrier body at least in part.As mentioned above, play the material formed between housing with carrier body in the second manufacturing step with case material injection encapsulated carrier body at least in part and be combined the effect connected.Prevent the material between housing with carrier body to be combined connection in the coating area at least applied in the first manufacturing step, inhibit the layering of the housing owing to may occur later and carrier body at least in this region thus and the STRESS VARIATION caused in the housing.Like this coating being carried out to carrier body in this external first manufacturing step, making the conductor structure simultaneously formed on carrier body for making sensor assembly electrically connect.Therefore, the STRESS VARIATION occurred in the housing after particularly advantageously suppressing without the need to other processing step, because by defining conductor structure by the metal coating of carrier body giving while carrier body metallizing coating.Metal coating especially comprises the silver layer of plating.
According to the preferred improvement project regulation of one, in the first manufacturing step, apply metal coating by electroplated coating, sputtering, adhesion and/or injection.Particularly advantageously, can control relatively preferably particularly by plating and perform coating economically.
According to another preferred improvement project regulation, in the 3rd manufacturing step, especially on the time before the second manufacturing step and on the time after the first step, placement sensor module on carrier body, particularly advantageously makes carrier body thus at least in part and makes sensor assembly be surrounded by housing simultaneously in the second manufacturing step.
Accompanying drawing explanation
Embodiments of the invention are shown in the drawings and explain in detail in the following description.In accompanying drawing:
Fig. 1 illustrates the schematic plan of the sensor cluster according to first embodiment of the invention,
Fig. 2 illustrates the schematic side elevation of the first prototype structure for the manufacture of the sensor cluster according to first embodiment of the invention,
Fig. 3 illustrates the schematic side elevation of the second prototype structure for the manufacture of the sensor cluster according to first embodiment of the invention.
Embodiment
The schematic plan of the sensor cluster 1 according to the first exemplary execution mode of the present invention shown in Figure 1, wherein said sensor cluster 1 has carrier body 2 and sensor assembly 3, on the first surface 10 that sensor assembly 3 is arranged on carrier body 2 and described carrier body 2 and sensor assembly 3 at least in part by housing 9, especially molded shell surround.Described sensor assembly 3 and housing 9 are arranged in the module region 5 of carrier body 2, and wherein this module region 5 comprises recessed 7 of the main extended surface 100 perpendicular to carrier body 2 compared with remaining carrier body region 6.Described carrier body 2 also has the second face 11 opposed with first surface 10 on the direction perpendicular to main extended surface 100, wherein on the second face 11, is provided with metal coating 4 at least in part.This metal coating 4 is especially configured to, and metal coating 4 congruence that is projected through perpendicular to main extended surface 100 of module region 5 is covered.All the other carrier body regions 6 comprise the join domain 8 for electrically connecting sensor assembly 3.In order to form electrical conductive communication, described carrier body 2 preferably has the layer be made up of the material of metal coating 4 equally, and this layer is particularly useful for the conductor structure forming conduction on carrier body 2.Described metal coating 4 prevents from being formed between housing 9 with carrier body 2 material in the region of metal coating 4 and is combined and connects.Described carrier body 2 especially comprises " lead frame " and module region 5 comprises intermediate contact pads (die paddle) on lead frame.In addition described metal coating 4 preferably includes the silver layer of plating on lead frame.
The schematic side elevation of the first prototype structure 1 ' for the manufacture of the sensor cluster 1 according to the first execution mode of the present invention shown in Figure 2, wherein gives the second face 11 metallizing coating 4 of described carrier body 2 and electrically connects the conductor structure of sensor assembly 3 after being preferably simultaneously applied on carrier module 2 in the first manufacturing step in the first manufacturing step.
The second prototype structure 1 for the manufacture of the sensor cluster 1 according to the first execution mode of the present invention shown in Figure 3 " schematic side elevation; wherein the second prototype structure 1 " with in fig. 2 shown in the first prototype structure 1 ' consistent, after the first manufacturing step, perform the 3rd manufacturing step, sensor assembly 3 is arranged in the module region 5 on the first surface 10 of carrier body 2.In unshowned follow-up second manufacturing step, with case material or moulding material injection encapsulated sensor assembly 3 and at least in part injection encapsulated second prototype structure 1 " carrier body 2; to form housing 9; produce the sensor cluster 1 according to the first execution mode of the present invention shown in Figure 1 thus, wherein prevented by metal coating 4 and in the region of metal coating 4, between carrier body 2 with housing 9, to form material be combined and connect.
Claims (12)
1. one kind has the sensor cluster (1) of carrier body (2) and sensor assembly (3), wherein said sensor assembly (3) is arranged on the first surface (10) of carrier body (2) upper and described carrier body (2) and sensor assembly (3) and is surrounded by housing (9) at least in part, it is characterized in that, second (11) of described carrier body (2) have metal coating (4) at least in part, wherein, described metal coating (4) is arranged in a region, the projection perpendicular to main extended surface (100) in this region congruence overlay module region (5).
2. sensor cluster (1) as claimed in claim 1, it is characterized in that, described second (11) are arranged on the face opposed with described first surface (10) of carrier body (2).
3. sensor cluster (1) as claimed in claim 1 or 2, it is characterized in that, described housing (9) comprises molded shell.
4. sensor cluster (1) as claimed in claim 1 or 2, it is characterized in that, described sensor assembly (3) and/or housing (9) are arranged in the module region (5) of carrier body (2), and wherein this module region (5) comprises recessed (7) perpendicular to main extended surface (100) compared with all the other carrier body regions (6).
5. sensor cluster (1) as claimed in claim 1 or 2, it is characterized in that, all the other carrier body regions (6) described comprise join domain (8).
6. sensor cluster (1) as claimed in claim 1 or 2, it is characterized in that, on second (11) only on first surface (10), only on first surface (10) and in all the other carrier body regions (6) second (11) above or only in all the other carrier body regions (6), the material be provided with between housing (9) with carrier body (2) is combined and connects.
7. sensor cluster (1) as claimed in claim 1, it is characterized in that, described second (11) are arranged on the face opposed with described first surface (10) on the direction of the main extended surface (100) perpendicular to carrier body (2) of carrier body (2).
8. sensor cluster (1) as claimed in claim 5, it is characterized in that, described join domain (8) is for electrically connecting described sensor assembly (3).
9. the method for the manufacture of the sensor cluster (1) such as according to any one of claim 1 to 8, it is characterized in that, in the first manufacturing step, coating is carried out to second (11) of carrier body (2) and in the second manufacturing step carrier body (2) described in injection encapsulated.
10. method as claimed in claim 9, is characterized in that, in the first manufacturing step, apply metal coating (4) by electroplated coating, sputtering, adhesion and/or injection.
11. methods as described in claim 9 or 10, is characterized in that, in the upper placement sensor module (3) of carrier body (2) in the 3rd manufacturing step.
12. methods as claimed in claim 11, is characterized in that, described 3rd manufacturing step is in time before described second manufacturing step.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE200810002268 DE102008002268A1 (en) | 2008-06-06 | 2008-06-06 | Sensor i.e. micromechanical sensor, arrangement, has sensor module arranged on side of carrier element, where carrier element and sensor module are partially enclosed by housing and side of carrier element has metallic coating |
| DE102008002268.3 | 2008-06-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101599470A CN101599470A (en) | 2009-12-09 |
| CN101599470B true CN101599470B (en) | 2014-12-24 |
Family
ID=41268535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910147036.1A Expired - Fee Related CN101599470B (en) | 2008-06-06 | 2009-06-08 | Sensor assembly and method for manufacturing the same |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN101599470B (en) |
| DE (1) | DE102008002268A1 (en) |
| TW (1) | TW201003856A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1479084A (en) * | 2003-07-03 | 2004-03-03 | 太原理工大学 | Manufacture of digitl material level sensor |
| CN1547247A (en) * | 2003-11-28 | 2004-11-17 | 王鸿仁 | Method for manufacturing image sensor |
| KR100643475B1 (en) * | 2005-09-28 | 2006-11-10 | 엘지전자 주식회사 | Optical module and manufacturing method thereof |
| DE102005053682A1 (en) * | 2005-11-10 | 2007-05-16 | Bosch Gmbh Robert | Sensor, sensor component and method for producing a sensor |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10058593A1 (en) | 2000-11-25 | 2002-06-06 | Bosch Gmbh Robert | Packaged electronic component and method for packaging an electronic component |
| JP4335661B2 (en) * | 2003-12-24 | 2009-09-30 | Ｎｅｃエレクトロニクス株式会社 | Manufacturing method of high frequency module |
-
2008
- 2008-06-06 DE DE200810002268 patent/DE102008002268A1/en not_active Withdrawn
-
2009
- 2009-06-04 TW TW98118482A patent/TW201003856A/en unknown
- 2009-06-08 CN CN200910147036.1A patent/CN101599470B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1479084A (en) * | 2003-07-03 | 2004-03-03 | 太原理工大学 | Manufacture of digitl material level sensor |
| CN1547247A (en) * | 2003-11-28 | 2004-11-17 | 王鸿仁 | Method for manufacturing image sensor |
| KR100643475B1 (en) * | 2005-09-28 | 2006-11-10 | 엘지전자 주식회사 | Optical module and manufacturing method thereof |
| DE102005053682A1 (en) * | 2005-11-10 | 2007-05-16 | Bosch Gmbh Robert | Sensor, sensor component and method for producing a sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102008002268A1 (en) | 2009-12-10 |
| CN101599470A (en) | 2009-12-09 |
| TW201003856A (en) | 2010-01-16 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141224 Termination date: 20180608 |
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| CF01 | Termination of patent right due to non-payment of annual fee |