CN101593586A - Electronic building brick - Google Patents
Electronic building brick Download PDFInfo
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- CN101593586A CN101593586A CNA2009102035678A CN200910203567A CN101593586A CN 101593586 A CN101593586 A CN 101593586A CN A2009102035678 A CNA2009102035678 A CN A2009102035678A CN 200910203567 A CN200910203567 A CN 200910203567A CN 101593586 A CN101593586 A CN 101593586A
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- electronics assembly
- assembly element
- spring contact
- electric insulation
- contact plate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/008—Thermistors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Ceramic Engineering (AREA)
- Thermistors And Varistors (AREA)
Abstract
Provide a kind of may be in energising because of electronics assembly element deterioration causes the electronic building brick that destroys, even become under the situation of the fragment that is bordering on pulverizing at the electronics assembly element after the destruction, the energising after also can interrupting automatically destroying.This electronic building brick possesses electronics assembly element, comprise first and second terminal component that is made of spring contact plate and pillar component and support the bracing or strutting arrangement of electronics assembly element and the shell that is used for taking in electronics assembly element and first and second terminal component; First and second pillar component is separately positioned in first and second incorporating section that is made of the electric insulation member, in addition, the volume that comprises the space that forms between the bottom surface of the imaginary cross section of a shell side, supposition of distance of bottom surface in the edge part first and second spring contact plate and shell bottom surface opposite side and shell and shell is greater than the volume of electronics assembly element.
Description
Technical field
The present invention relates to possess the electronic building brick that electrode is formed on the electronics assembly element on the face of facing mutually, particularly relate to by double as and make electronics assembly element support the electronic building brick of electronics assembly element respectively with the bracing or strutting arrangement of the electric supply installation of each electrode Elastic Contact.
Background technology
For the present invention, attractive electronic building brick example is a positive-performance thermo-sensitive resistor device.As in degaussing circuit of the picture tube of the electric motor starting circuit of refrigerator etc., television receiver, monitor display unit etc. etc., positive-performance thermo-sensitive resistor device is used to current limliting.
Fig. 7 shows a structure example of the prior art of such positive-performance thermo-sensitive resistor device.Fig. 7 is a plane graph of seeing positive-performance thermo-sensitive resistor device 100 from the below of housing main body 102, and here, represented is to have removed 103 the state that covers.Positive-performance thermo-sensitive resistor device 100 is provided with housing main body 102, be incorporated in the lower opening of positive temperature coefficient thermis element 104 in the housing main body 102 and first and second terminal components 107,112 and closure main body 102 and the lid 103 that forms.
Positive temperature coefficient thermis element 104 sees it is plate-like on the whole, and its first and second electrode 105,106 toward each other.This positive temperature coefficient thermis element 104 is inserted into the central part in the housing main body 102 under the state of electrode 105,106 in the side.First and second terminal components 107,112 are inserted in the housing main body 102, and hold positive temperature coefficient thermis element 104 under the arm.First and second terminal components 107,112 constitute by having suitable flexible metallic plate respectively.The first terminal member 107 forms two spring contact plates 108 and 109, simultaneously, is received not shown connector pin, and connector pin between be formed with and be used for realizing the connecting portion 111 that is electrically connected.The sheet material that forms spring contact plate 108 and 109 for example gets up by stitch bonds with the sheet material that forms connecting portion 111.Second terminal component 112 also has the structure same with the first terminal member 107, forms two spring contact plates 113,114 and connecting portion 116.
In housing main body 102, the spring contact plate 108 of the first terminal member 107 and 109 relies on its elasticity and imposes roof pressure power towards first electrode 105, on the other hand, the spring contact plate 113 of second terminal component 112 and 114 relies on its elasticity and imposes roof pressure power towards second electrode 106.Like this, first and second terminal components 107,112 support it with regard to flexibly holding positive temperature coefficient thermis element 104 under the arm.
As mentioned above, after being accommodated in positive temperature coefficient thermis element 104 and terminal component 107,112 in the housing main body 102, lid 103 is loaded onto, the lower opening of housing main body 102 is closed.On lid 103, be provided with and allow to aforesaid connecting portion 111 and 116 holes of inserting connector pin.
In such positive-performance thermo-sensitive resistor device 100, along with use to its repetition, positive temperature coefficient thermis element 104 deteriorations, abnormal heating can appear on positive temperature coefficient thermis element 104, therefore, the electrode 105 of positive temperature coefficient thermis element 104 and 106 or edge part on will produce spark, might cause positive temperature coefficient thermis element 104 to destroy.And when positive temperature coefficient thermis element 104 was destroyed, the separation of fragments of positive temperature coefficient thermis element 104 was in by housing main body 102 and lid 103 shells that constitute.
But the result of such malfunction might cause more serious malfunction.That is, in positive-performance thermo-sensitive resistor device shown in Figure 7 100, the result who produces spark makes and has produced in the positive temperature coefficient thermis element 104 under the cracked situation, can not dispersed by the part that spring contact plate 108,109 and 113,114 elasticity are held under the arm.Therefore, proceed energising, and this residual fraction and the terminal component 107,112 of positive temperature coefficient thermis element 104 melted, generate the alloy of conductivity thus via this residual fraction.Its result just becomes the electric short circuit state between terminal component 107,112, further persistent anomaly heating probably can be shifted to producing the softening malfunction that waits of shell.
Above-mentioned problem is not limited to positive-performance thermo-sensitive resistor device, so long as corresponding to the electronics assembly element of positive temperature coefficient thermis element with the same supported and power supply of mode of situation of above-mentioned positive-performance thermo-sensitive resistor device, and can cause destroying because of deterioration, other electronic building brick also all has the possibility that same situation takes place.
Therefore, in as No. 2882322 communique of patent (patent documentation 1), just record attractive technology about solving the above problems.The electronic building brick of being showed in the patent documentation 1 is a kind of electronic building brick that may cause electronics assembly element destruction because of electronics assembly element deterioration, for the energising after interruption destroys automatically, this electronic building brick possesses first and second electrodes relatively and electronics assembly element that forms and elasticity are held this electronics assembly element under the arm and the bracing or strutting arrangement (terminal component) that is used for electronics assembly member supports is lived, and this bracing or strutting arrangement has mutually different locational first and second contact sites that contact respectively at first electrode, and be in across electronics assembly element and relative with first and second contact sites respectively and contact mutually different locational third and fourth contact site respectively at second electrode; The first and the 4th contact site is electrically connected with first and second electrodes respectively and is configured to conductive path to electronics assembly element power supply, and on the other hand, second contacts first and second electrodes with the 3rd contact site respectively with the electric insulation state.
Fig. 8 and Fig. 9 show a structure example of such electronic building brick 200.Here, Fig. 8 is a plane graph of seeing positive-performance thermo-sensitive resistor device 200 from the below of housing main body 202, and represented herein is to have removed 203 the state that covers.Fig. 9 is that direction is seen the figure of positive-performance thermo-sensitive resistor device 200 from the side, dots the configuration status of each inner parts.
In this electronic building brick 200, first to fourth contact site 219 to 222 all is used for flexibly seizing on both sides by the arms electronics assembly element, but have only the first and the 4th contact site 219 and 222 to power, second only contacts on electrode with the electric insulation state with 218 through the first and second electric insulation members 217 respectively with 221 with the 3rd contact site 220.Therefore, when having destroyed electronics assembly element owing to the deterioration of electronics assembly element, be arranged on first and second contact sites 219 and 220 and be arranged on third and fourth contact site 221 and 222 on the terminal component 212 and just maintain former state and seize on both sides by the arms under the state of electronics assembly element on the terminal component 207, and the each several part of being seized on both sides by the arms by elasticity is respectively dispersed away, but only by being in first contact site 219 of "on" position with electrode and not being in the 3rd contact site 221 of "on" position, perhaps by seizing these parts respectively on both sides by the arms with the 4th contact site 222 that is in "on" position with second contact site 220 that is not in the electrifying electrodes state, so, and become open-circuit condition no longer via these part energisings.
; cause the situation of electronics assembly element destruction as deterioration because of electronics assembly element; the state of chapping that the sheet that the spring contact plate elasticity faced mutually as described above seizes on both sides by the arms is not only arranged; but also the electronics assembly element after can destroying splits away off from spring contact plate, becomes the pulverizing situation of the fragment that is bordering on pulverizing.
In this case, the fragment of electronics assembly element is just piled up on the bottom surface in the enclosure, but might make conducting between terminal component 207 and 212 via the fragment of electronics assembly element, even this situation is actually rare.As a result, even if the electronic building brick of showing in the patent documentation 1 also becomes the electric short circuit state between the terminal component 207 and 212, the further abnormal heating of meeting probably also can be to producing the softening malfunction transfer that waits of shell.
No. 2882322 communique of [patent documentation 1] special permission
Summary of the invention
The object of the present invention is to provide in a kind of electronic building brick that in energising, may cause destroying because of electronics assembly element deterioration as described above, even the collapse state of electronics assembly element is the pulverizing state, become under the situation of the fragment that is bordering on pulverizing the energising after also can interrupting automatically destroying at the electronics assembly element after the destruction.
For solving above-mentioned problem, electronic building brick of the present invention possesses first and second electrodes relatively and the electronics assembly element, bracing or strutting arrangement and the shell that form; Bracing or strutting arrangement is flexibly held electronics assembly element under the arm and is supported this electronics assembly element, this bracing or strutting arrangement is provided with first and second terminal components and the first and second electric insulation members of conductivity, the first terminal member of conductivity has first spring contact plate and first column sections that relies on elasticity to impose roof pressure power to described first electrode, this first electric insulation member contacts described first electrode on the position that is different from described the first terminal member, second terminal component of conductivity has and relies on elasticity to impose second spring contact plate and second column sections of roof pressure power to described second electrode, and this second electric insulation member contacts described second electrode on the position that is different from described second terminal component; Described first and second terminal components are electrically connected with described first and second electrodes respectively and constitute the conductive path that described electronics assembly element is powered, and described the first terminal member is relative respectively with described second terminal component with described second electric insulation member and the described first electric insulation member; This shell is used for taking in described electronics assembly element and described first and second terminal components; Wherein, described first and second column sections are set at respectively in first and second incorporating sections that are made of the electric insulation member, the volume that comprises the space in the described shell that forms between the bottom surface of the imaginary cross section of a described shell side, supposition of distance of bottom surface in the edge part in described first and second spring contact plates and the bottom surface opposite side and described shell and described shell is greater than the volume of described electronics assembly element.
In the electronic building brick of the present invention, best described the first terminal member also is provided with and relies on elasticity to impose the 3rd spring contact plate of roof pressure power towards described first electrode, and the described first electric insulation member is inserted between described the 3rd spring contact plate and described first electrode; Preferably described second terminal component also is provided with and relies on elasticity to impose the 4th spring contact plate of roof pressure power towards described second electrode, and the described second electric insulation member is inserted between described the 4th spring contact plate and described second electrode.
In the electronic building brick of the present invention, the insulating material of the most handy lining around described first and second column sections forms described first and second incorporating sections.
In the electronic building brick of the present invention, electronics assembly element is the positive temperature coefficient thermis element preferably.
First and second column sections that relate to electronic building brick of the present invention are set at respectively in first and second incorporating sections that are made of the electric insulation member, and comprise a side of in first and second spring contact plates and edge part shell bottom surface opposite side and the distance shell bottom surface, the volume in the space in the shell that forms between the imaginary cross section of the shell of supposing and the bottom surface of shell, volume greater than electronics assembly element, so, cause the situation of electronics assembly element destruction as deterioration because of electronics assembly element, it is not only the state of chapping of the sheet of being seized on both sides by the arms by relative spring contact plate elasticity, even the electronics assembly element after destroying splits away off from spring contact plate, become the pulverizing state of the fragment that is bordering on pulverizing, the fragment of electronics assembly element is piled up in the enclosure, even also can fully be housed in the fragment of electronics assembly element in the space that surrounds by the electric insulation member in this case.Therefore, can not make conducting between the terminal component, can positively suppress the heating of further persistent anomaly and develop into the softening malfunction that waits of shell takes place, therefore can access the high electronic building brick of reliability via the fragment of electronics assembly element.
The first terminal member also is provided with the 3rd spring contact plate that relies on elasticity to impose roof pressure power towards first electrode, the first electric insulation member is inserted between the 3rd spring contact plate and first electrode, second terminal component also is provided with the 4th spring contact plate that relies on elasticity to impose roof pressure power towards second electrode, the second electric insulation member is inserted between the 4th spring contact plate and second electrode, so, can increase the place of resiliency supported electronics assembly element.Therefore, the state that the electronics assembly element that causes as the deterioration because of electronics assembly element destroys, under the situation that the situation of chapping and pulverizing situation mixing existence has taken place, big fragment is held under the arm between spring contact plate under open-circuit condition, and reduce and reduced to fall into the fragment of the bottom of shell as much as possible, therefore, can further suppress to make conducting between the terminal component, and can improve the reliability of electronic building brick more via the fragment of electronics assembly element.
Owing to reducing the volume of incorporating section under the situation that forms first and second incorporating sections with the insulating material on every side that covers first and second column sections, so form the space that the space that separates with the electric insulation member can further enlarge the fragment of accommodating electronics assembly element in the enclosure.
Because the positive temperature coefficient thermis element is used as electronics assembly element, just can prevent the overheated of electronic installation with the simple mechanism of cheap electronic building brick.
Description of drawings
Fig. 1 is a plane graph of seeing the positive-performance thermo-sensitive resistor device of one embodiment of the present invention below the housing main body removing under the state of lid.
Fig. 2 is that direction is seen the diagrammatic sketch of the positive-performance thermo-sensitive resistor device of one embodiment of the present invention from the side.
Fig. 3 is a sectional drawing of seeing the positive-performance thermo-sensitive resistor device of other execution modes of the present invention from frontal.
Fig. 4 is that direction is seen the sectional drawing of the positive-performance thermo-sensitive resistor device of other execution modes of the present invention from the side.
Fig. 5 is a plane graph of seeing the positive-performance thermo-sensitive resistor device of other execution modes of the present invention below the housing main body removing under the state of lid.
Fig. 6 is the sectional drawing that forms the situation of incorporating section on every side that covers column sections with insulating material.
Fig. 7 is a plane graph of seeing the positive-performance thermo-sensitive resistor device the prior art example under removing the state of lid below housing main body.
Fig. 8 is a plane graph of seeing the positive-performance thermo-sensitive resistor device the other prior art example under removing the state of lid below housing main body.
Fig. 9 is that direction is seen the diagrammatic sketch of the positive-performance thermo-sensitive resistor device in the other prior art example from the side.
[explanation of symbol]
1,1a positive-performance thermo-sensitive resistor device
2 housing main bodies
3 lids
4 positive temperature coefficient thermis elements
5 first electrodes
6 second electrodes
7 the first terminal members
8,9,13,14 spring contact plates
10 first column sections
11,16 connecting portions
12 second terminal components
15 second column sections
17 first electric insulation members
18 second electric insulation members
19 first contact sites
20 second contact sites
21 the 3rd contact sites
22 the 4th contact sites
23 first incorporating sections
24 second incorporating sections
25 the 3rd column sections
The imaginary cross section of S, Sa shell
Embodiment
Followingly describe electronic building brick of the present invention in detail according to Fig. 1 and Fig. 2.
What Fig. 1 and Fig. 2 were represented is the positive-performance thermo-sensitive resistor device 1 of one embodiment of the present invention, and Fig. 1 is a plane graph of seeing positive-performance thermo-sensitive resistor device 1 below the housing main body removing under 3 the state of covering.Fig. 2 is the diagrammatic sketch of direction positive-performance thermo-sensitive resistor device 1 from the side, and with dashed lines is represented the configuration status of each inner parts.
Among Fig. 1, the same with aforesaid positive-performance thermo-sensitive resistor device 200, positive-performance thermo-sensitive resistor device 1 is provided with housing main body 2, be incorporated in positive temperature coefficient thermis element 4 in the housing main body 2 and first and second terminal components 7,12, the lid 3 and the first and second electric insulation members 17,18 of the lower opening of closure main body 2.
Housing main body 2 is equivalent to the good heat resistances such as phenol, polyphenylene sulfide, polybutyleneterephthalate of 94V (UL specification) by anti-flammability resin constitutes.Housing main body 2 also can be made of inorganic material such as aluminium oxide.In order to take in positive temperature coefficient thermis element 4, the top part of housing main body 2 is become outstanding shape.Housing main body 2 also can have can be with the shape of terminal component 7,12 and electric insulation member 17,18 location.
Positive temperature coefficient thermis element 4 sees it is plate-like on the whole, and its first and second electrode 5,6 toward each other.Also can adopt as the square tabular shape that waits other, as positive temperature coefficient thermis element 4.This positive temperature coefficient thermis element 4 is inserted into the central part in the housing main body 2 under the state that makes electrode 5,6 in the side.
And first and second terminal components 7,12 are inserted in the housing main body 2, and positive temperature coefficient thermis element 4 is clamped.First and second terminal components 7,12 are made of metal blanks such as stainless steel, copper alloys respectively, like this, make first and second terminal components 7,12 have suitable elasticity and conductivity.
The first terminal member 7 forms two spring contact plates 8 and 9, simultaneously, is received not shown connector pin with first column sections 10, and connector pin between be formed with and be used for realizing the connecting portion 11 that is electrically connected.The sheet material that forms spring contact plate 8 and 9 for example gets up by stitch bonds with the sheet material that forms first column sections 10 and connecting portion 11.First column sections 10 is set in first incorporating section 23 that is made of insulating material.First column sections 10 is set so just can make first column sections 10 be the state of electric insulation in the enclosure with the space of supporting positive temperature coefficient thermis element 4.
Except that illustrated shape, spring contact plate 8 and 9 changes can be become arbitrary shape.Can also use the sheet material that forms column sections 10 and connecting portion 11 integrally formed by the shape of change spring contact plate 8 and 9 spring contact plate 8 and 9.
In shell 2, the spring contact plate 8 of the first terminal member 7 and 9 relies on its elasticity and imposes roof pressure power towards first electrode 5, and on the other hand, the spring contact plate 13 of second terminal component 12 and 14 relies on its elasticity and imposes roof pressure power towards second electrode 6.Like this, first and second terminal components 7,12 support it with regard to flexibly seizing positive temperature coefficient thermis element 4 on both sides by the arms, and in housing main body 2, positive temperature coefficient thermis element 4 is maintained under the state of suspension.
The first and second electric insulation members 17 and 18 for example are the lamellar members that is made of inorganic matters such as mica, glass, are inserted between the first terminal member 7 sides' the spring contact plate 9 and first electrode 5 respectively and between second terminal component, 12 sides' the spring contact plate 13 and second electrode 6.Also the film that can form with each part that covers first and second electrodes 5,6 constitutes the first and second electric insulation members 17,18, perhaps the film or the tablet of the electric insulating quality that also can form with the inorganic matter or the resin of covering spring contact plate 9,13 constitute the first and second electric insulation members 17,18, to replace the tabular component of individual processing.
In this positive-performance thermo-sensitive resistor device 1, as shown in Figure 2, the spring contact plate 13,14 of the spring contact plate 8,9 of the first terminal member and second terminal component be provided with its bottom surface with respect to shell promptly cover 3 edge part apart from the bottom surface of shell with high.Represent to comprise such edge part and the imaginary cross section of the shell supposed with S, set the space that forms between the bottom surface of this imaginary cross section S and shell volume greater than positive temperature coefficient thermis element 4.
In this embodiment, though the edge part with respect to the bottom surface of shell of each spring contact plate be provided with apart from the bottom surface of shell with high, the height of the edge part of each spring contact plate also can be different high apart from the bottom surface of shell.In this case, suppose that imaginary cross section S comprises the side with the distance of the bottom surface of shell.
As mentioned above, after being accommodated in positive temperature coefficient thermis element 4 and terminal component 7,12 and electric insulation member 17,18 in the housing main body 2, loading onto and cover 3, the lower opening of housing main body 2 is closed.Can be being used for this encapsulation as the embedded structure between housing main body 2 and the lid 3.Can cover 3 with constituting with the same material of aforesaid housing main body 2, lid 3 is provided with allows to connecting portion 11 and 16 holes of inserting connector pins.
In the positive-performance thermo-sensitive resistor device 1 that obtains like this, be configured to flexibly hold under the arm positive temperature coefficient thermis element 4 and with its bracing or strutting arrangement that supports by terminal component 7,12 and electric insulation member 17,18.Be respectively arranged with the spring contact plate 8 and the first electric insulation member 17 at first and second contact sites 19,20 that contact the mutual diverse location on first electrode 5 respectively on this bracing or strutting arrangement, on the other hand, be respectively arranged with the second electric insulation member 18 and spring contact plate 14 across positive temperature coefficient thermis element 4 facing to third and fourth contact site 21,22 first and second contact sites 19,20, that contact the mutual diverse location on second electrode 6.The spring contact plate 8,14 that constitutes the first and the 4th contact site 19,22 is connected on first and second electrodes 5,6, thereby is configured to the conductive path to 4 power supplies of positive temperature coefficient thermis element.On the other hand, constitute second and contact first and second electrodes 5,6 with the electric insulation state respectively with the first and second electric insulation members 17,18 of the 3rd contact site.
In such positive-performance thermo-sensitive resistor device 1, when causing that because of the generation of electric spark etc. the state of chapping of big fragment destroys, owing to rely on elasticity that positive temperature coefficient thermis element 4 is applied with roof pressure power from spring contact plate 8,9,13,14, so the part of seizing on both sides by the arms by spring contact plate 8 and electric insulation member 18 elasticity and exempt from respectively dispersing, and keep such state of seizing on both sides by the arms by the part that spring contact plate 14 and electric insulation member 17 elasticity are seized on both sides by the arms.
Under this state, do not insert electric insulation member 17,18 and respectively the spring contact plate 8,14 of contact electrode 5,6 not only be not in mutually in the face of the position, and since from spring contact plate 8 by residual fraction to the path of its spring contact plate of facing mutually 13, and from spring contact plate 14 by residual fraction to the path of its spring contact plate of facing mutually 9 on be inserted with electric insulation member 17,18 respectively, so energising is interrupted, and becomes open-circuit condition.
Therefore, can positively prevent to produce the alloying phenomenon between the residual fraction of the positive temperature coefficient thermis element 4 that continues to cause because of aforesaid energising and the terminal component 7,12, become the electric short circuit state and still continue abnormal heating and shift to the malfunction of danger.
In such positive-performance thermo-sensitive resistor device 1, the result of generation spark etc. is the positive temperature coefficient thermis element 4 after destroying splits away off such fragment that is bordering on pulverizing from spring contact plate a pulverizing state, and the fragment of positive temperature coefficient thermis element 4 is piled up in the enclosure, even under these circumstances, because first and second column sections 10,15 are set in first and second incorporating sections 23,24 that are made of the electric insulation member, so the fragment of positive temperature coefficient thermis element 4 can not contact first and second column sections 10,15 yet.
In addition, because the space that forms between the bottom surface of setting imaginary cross section S and shell is greater than the volume of positive temperature coefficient thermis element 4, so can fully be housed in the fragment of electronic assemblies element in the space that is surrounded by the electric insulation member.Therefore, the fragment of positive temperature coefficient thermis element 4 can the contact spring contact chip, can be between the terminal component through these fragment conductings, can positively suppress to produce the softening malfunction that waits of shell and shift, so can access the high positive-performance thermo-sensitive resistor device of reliability 1 to further continuation abnormal heating.
Here, at the height of the edge part of each spring contact plate under the different high situations in the bottom surface of shell, suppose that imaginary cross section S comprises and the bottom surface of shell between a side of distance, like this, even the fragment of positive temperature coefficient thermis element 4 is piled up in the enclosure, owing to can not reach the side's spring contact plate with the distance of the bottom surface of shell at least, so can be and conducting between the terminal component through the fragment of electronics assembly element yet.
That Fig. 3 to Fig. 5 is represented is the positive-performance thermo-sensitive resistor device 1a of other execution modes of the present invention.Fig. 3 is a sectional drawing of seeing the positive-performance thermo-sensitive resistor device of other execution modes of the present invention from frontal; Fig. 4 is that direction is seen the sectional drawing of the positive-performance thermo-sensitive resistor device of other execution modes of the present invention from the side; Fig. 5 is a plane graph of seeing the positive-performance thermo-sensitive resistor device of other execution modes of the present invention below the housing main body removing under the state of lid.
Among Fig. 3 to Fig. 5, to being equivalent to the same reference marks of element annotation illustrated in figures 1 and 2, and the repetitive description thereof will be omitted.Fig. 3 and shown in Figure 4 be the state that has removed first and second incorporating sections 23,24 among Fig. 5.
In the present embodiment, spring contact plate only is first spring contact plate 8 and second spring contact plate 14 these two, and different with the execution mode of front, electric insulation member 17,18 does not bear the flexible roof pressure power of spring contact plate.That is, the positive temperature coefficient thermis element 4 usefulness second electric insulation member 18 stops the roof pressure power of spring contact plate 8 and the roof pressure power of stopping spring contact plate 14 with the second electric insulation member 17, thereby is maintained in housing main body 2 under the state of suspension.
Be provided with the 3rd column sections 25, and connecting portion 11 ' and 16 ' not be the jack shape of utilizing the shape of the such column sections of the execution mode of front, but the pin terminal shape.
Even in this embodiment, also the execution mode with the front is the same, because the space that forms between the bottom surface of setting imaginary cross section Sa and shell is greater than the volume of positive temperature coefficient thermis element 4, so can fully be housed in the fragment of electronic assemblies element in the space that is surrounded by the electric insulation member.Therefore, the fragment of positive temperature coefficient thermis element 4 can the contact spring contact chip, and can be through these fragment conductings between the terminal component, the malfunction that can positively suppress further to continue heating and develop into the softening grade that shell takes place, therefore, can obtain the high positive-performance thermo-sensitive resistor device 1a of reliability.
Fig. 6 is the sectional drawing that forms the situation of first incorporating section 23 on every side that covers first column sections 10 with insulating material.Owing to like this directly insulating material cover column sections around form the incorporating section, so can reduce the volume of incorporating section, therefore, form the space that the space that separates just can further enlarge the fragment of accommodating electronics assembly element with insulating material.
Abovely the present invention has been described, but within the scope of the invention, other execution mode can have been arranged also in conjunction with illustrated execution mode.
For example, above-mentioned execution mode is the situation that the present invention is applicable to positive-performance thermo-sensitive resistor device, but the present invention is not limited to positive-performance thermo-sensitive resistor device, so long as power according to supporting corresponding to the electronics assembly element of positive-performance thermo-sensitive resistor device and to it with the same mode of the situation of above-mentioned positive-performance thermo-sensitive resistor device, and because of deterioration causes destroying, even for other electronic building bricks, can be suitable for equally.
Claims (5)
1. an electronic building brick is characterized in that, possesses first and second electrodes relatively and the electronics assembly element, bracing or strutting arrangement and the shell that form; Bracing or strutting arrangement is flexibly held electronics assembly element under the arm and is supported this electronics assembly element, this bracing or strutting arrangement is provided with first and second terminal components and the first and second electric insulation members of conductivity, the first terminal member of described conductivity has first spring contact plate and first column sections that relies on elasticity to impose roof pressure power to described first electrode, the described first electric insulation member contacts described first electrode on the position that is different from described the first terminal member, second terminal component of described conductivity has and relies on elasticity to impose second spring contact plate and second column sections of roof pressure power to described second electrode, and the described second electric insulation member contacts described second electrode on the position that is different from described second terminal component; Described first and second terminal components are electrically connected with described first and second electrodes respectively and constitute the conductive path that described electronics assembly element is powered, and described the first terminal member is relative respectively with described second terminal component with described second electric insulation member and the described first electric insulation member; Described shell is used for taking in described electronics assembly element and described first and second terminal components; Described first and second column sections are set at respectively in first and second incorporating sections that are made of the electric insulation member, comprise the volume of the volume in the space in the described shell that forms between the bottom surface of the imaginary cross section of a described shell side, supposition of distance of bottom surface in the edge part in described first and second spring contact plates and the bottom surface opposite side and described shell and described shell greater than described electronics assembly element.
2. electronic building brick according to claim 1, it is characterized in that described the first terminal member also is provided with relies on elasticity to impose the 3rd spring contact plate of roof pressure power towards described first electrode, and the described first electric insulation member is inserted between described the 3rd spring contact plate and described first electrode; Described second terminal component also is provided with and relies on elasticity to impose the 4th spring contact plate of roof pressure power towards described second electrode, and the described second electric insulation member is inserted between described the 4th spring contact plate and described second electrode.
3. electronic building brick according to claim 1 and 2 is characterized in that forming described first and second incorporating sections with the insulating material on every side that covers described first and second column sections.
4. electronic building brick according to claim 1 and 2 is characterized in that electronics assembly element is the positive temperature coefficient thermis element.
5. electronic building brick according to claim 3 is characterized in that electronics assembly element is the positive temperature coefficient thermis element.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008-142980 | 2008-05-30 | ||
| JP2008142980A JP4561876B2 (en) | 2008-05-30 | 2008-05-30 | Electronic components |
| JP2008142980 | 2008-05-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101593586A true CN101593586A (en) | 2009-12-02 |
| CN101593586B CN101593586B (en) | 2012-06-06 |
Family
ID=41408184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102035678A Expired - Fee Related CN101593586B (en) | 2008-05-30 | 2009-05-18 | Electronic component |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4561876B2 (en) |
| KR (1) | KR101014146B1 (en) |
| CN (1) | CN101593586B (en) |
| TW (1) | TW200949865A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107658083A (en) * | 2017-10-31 | 2018-02-02 | 常熟市天银机电股份有限公司 | Protector for electric appliances with thermal-sensitive electric resistance device |
| CN111688504A (en) * | 2019-03-15 | 2020-09-22 | 舍弗勒技术股份两合公司 | Electrical structural unit with an electrically insulating housing and drive train |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05299206A (en) * | 1992-04-23 | 1993-11-12 | Murata Mfg Co Ltd | Overvoltage protecting part |
| KR100231796B1 (en) * | 1995-11-07 | 1999-12-01 | 무라타 야스타카 | Electronic devices reduced destruction of internl elements upon malfunction |
| JP3955116B2 (en) | 1996-10-30 | 2007-08-08 | ユー・エム・シー・ジャパン株式会社 | Semiconductor manufacturing apparatus scheduling method |
| JPH11102803A (en) | 1997-09-26 | 1999-04-13 | Tdk Corp | Laminated chip ntc thermistor |
-
2008
- 2008-05-30 JP JP2008142980A patent/JP4561876B2/en not_active Expired - Fee Related
-
2009
- 2009-03-12 TW TW098107993A patent/TW200949865A/en unknown
- 2009-05-18 CN CN2009102035678A patent/CN101593586B/en not_active Expired - Fee Related
- 2009-05-29 KR KR1020090047349A patent/KR101014146B1/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107658083A (en) * | 2017-10-31 | 2018-02-02 | 常熟市天银机电股份有限公司 | Protector for electric appliances with thermal-sensitive electric resistance device |
| CN111688504A (en) * | 2019-03-15 | 2020-09-22 | 舍弗勒技术股份两合公司 | Electrical structural unit with an electrically insulating housing and drive train |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101014146B1 (en) | 2011-02-14 |
| TW200949865A (en) | 2009-12-01 |
| JP2009290096A (en) | 2009-12-10 |
| KR20090124991A (en) | 2009-12-03 |
| CN101593586B (en) | 2012-06-06 |
| JP4561876B2 (en) | 2010-10-13 |
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| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
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