CN101593586B - Electronic component - Google Patents
Electronic component Download PDFInfo
- Publication number
- CN101593586B CN101593586B CN2009102035678A CN200910203567A CN101593586B CN 101593586 B CN101593586 B CN 101593586B CN 2009102035678 A CN2009102035678 A CN 2009102035678A CN 200910203567 A CN200910203567 A CN 200910203567A CN 101593586 B CN101593586 B CN 101593586B
- Authority
- CN
- China
- Prior art keywords
- spring contact
- shell
- electric insulation
- contact plate
- electronics assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/008—Thermistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Ceramic Engineering (AREA)
- Thermistors And Varistors (AREA)
Abstract
The invention provides an electronic component which can automatically cut off the electricity after broken even if the broken electronic matched component is almost milled splinter because of the deterioration of electronic matched component during the electrifying process. The electronic component comprises an electronic matched component, a supporting device for supporting the electronic matched component which consists of the first and the second terminals made up of a spring contact piece and a supporting element, and a shell for containing the two terminals and the electronic matched component. The first and the second supporting elements are respectively disposed in the first and the second containing parts made up of electric insulation elements. Otherwise, the volume of the electronic matched component is smaller than the one between the imaginary cross section of imaginary shell and the bottom of the shell, wherein the imaginary shell comprises the first and the second spring contact pieces and the distance from the edge centre which is opposite to the shell bottom to the shell bottom is relatively long.
Description
Technical field
The present invention relates to possess the electronic building brick that electrode is formed on the electronics assembly element on the face of facing mutually, particularly relate to by double as and make electronics assembly element support the electronic building brick of electronics assembly element respectively with the bracing or strutting arrangement of the electric supply installation of each electrode Elastic Contact.
Background technology
For the present invention, attractive electronic building brick example is a positive-performance thermo-sensitive resistor device.As in degaussing circuit of the picture tube of the electric motor starting circuit of refrigerator etc., television receiver, monitor display unit etc. etc., positive-performance thermo-sensitive resistor device is used to current limliting.
Fig. 7 shows a structure example of the prior art of such positive-performance thermo-sensitive resistor device.Fig. 7 is a plane graph of seeing positive-performance thermo-sensitive resistor device 100 from the below of housing main body 102, and here, represented is to have removed 103 the state that covers.Positive-performance thermo-sensitive resistor device 100 is provided with housing main body 102, be incorporated in the lower opening of positive temperature coefficient thermis element 104 and first and second terminal components 107,112 and closure main body 102 in the housing main body 102 and the lid 103 that forms.
Positive temperature coefficient thermis element 104 sees it is plate-like on the whole, and its first and second electrode 105,106 against each other.This positive temperature coefficient thermis element 104 is inserted into the central part in the housing main body 102 in the side under the state of electrode 105,106.First and second terminal components 107,112 are inserted in the housing main body 102, and hold positive temperature coefficient thermis element 104 under the arm.First and second terminal components 107,112 constitute by having suitable flexible metallic plate respectively.The first terminal member 107 forms two spring contact plates 108 and 109, simultaneously, is received not shown connector pin, and connector pin between be formed with and be used for realizing the connecting portion 111 that is electrically connected.The sheet material that forms spring contact plate 108 and 109 for example gets up through stitch bonds with the sheet material that forms connecting portion 111.Second terminal component 112 also has the structure same with the first terminal member 107, forms two spring contact plates 113,114 and connecting portion 116.
In housing main body 102; The spring contact plate 108 of the first terminal member 107 and 109 relies on its elasticity and imposes roof pressure power towards first electrode 105; On the other hand, the spring contact plate 113 of second terminal component 112 and 114 relies on its elasticity and imposes roof pressure power towards second electrode 106.Like this, first and second terminal components 107,112 support it with regard to flexibly holding positive temperature coefficient thermis element 104 under the arm.
As stated, after being accommodated in positive temperature coefficient thermis element 104 and terminal component 107,112 housing main body 102 in, load onto, the lower opening of housing main body 102 is closed covering 103.On lid 103, be provided with and allow the hole of inserting connector pin to aforesaid connecting portion 111 and 116.
In such positive-performance thermo-sensitive resistor device 100; Along with use to its repetition; Positive temperature coefficient thermis element 104 deteriorations abnormal heating can occur, therefore on positive temperature coefficient thermis element 104; Electrode 105 and 106 at positive temperature coefficient thermis element 104 perhaps will produce spark on the edge part, might cause positive temperature coefficient thermis element 104 to destroy.And when positive temperature coefficient thermis element 104 was destroyed, the separation of fragments of positive temperature coefficient thermis element 104 was in the shell that is made up of housing main body 102 and lid 103.
But the result of such malfunction might cause more serious malfunction.That is, in positive-performance thermo-sensitive resistor device shown in Figure 7 100, the result who produces spark makes and has produced in the positive temperature coefficient thermis element 104 under the cracked situation, can not dispersed by the part that spring contact plate 108,109 and 113,114 elasticity are held under the arm.Therefore, proceed energising, and this residual fraction and the terminal component 107,112 of positive temperature coefficient thermis element 104 melted, generate the alloy of conductivity thus via this residual fraction.Its result just at terminal component 107, become the electric short circuit state between 112, further persistent anomaly heating probably can be shifted to producing the softening malfunction that waits of shell.
Above-mentioned problem is not limited to positive-performance thermo-sensitive resistor device; So long as corresponding to the electronics assembly element of positive temperature coefficient thermis element with the same supported and power supply of mode of situation of above-mentioned positive-performance thermo-sensitive resistor device; And can cause destroying because of deterioration, other electronic building brick also all has the possibility that same situation takes place.
Therefore, in like No. 2882322 communique of patent (patent documentation 1), just record attractive technology about solving the above problems.The electronic building brick of being showed in the patent documentation 1 is a kind of electronic building brick that possibly cause electronics assembly element destruction because of electronics assembly element deterioration; For the energising after interruption destroys automatically; This electronic building brick possesses first and second electrodes relatively and electronics assembly element that forms and elasticity are held this electronics assembly element under the arm and the bracing or strutting arrangement (terminal component) that is used for electronics assembly member supports is lived, and this bracing or strutting arrangement has to contact at mutually different locational first and second contact sites of first electrode respectively and be in across electronics assembly element and contacts mutually different locational third and fourth contact site at second electrode relatively and respectively with first and second contact sites respectively; The first and the 4th contact site is electrically connected with first and second electrodes respectively and is configured to the conductive path to electronics assembly element power supply, and on the other hand, second contacts first and second electrodes with the 3rd contact site respectively with the electric insulation state.
Fig. 8 and Fig. 9 show a structure example of such electronic building brick 200.Here, Fig. 8 is a plane graph of seeing positive-performance thermo-sensitive resistor device 200 from the below of housing main body 202, and represented here is to have removed 203 the state that covers.Fig. 9 is that direction is seen the figure of positive-performance thermo-sensitive resistor device 200 from the side, dots the configuration status of each inner parts.
In this electronic building brick 200; First to fourth contact site 219 to 222 all is used for flexibly seizing on both sides by the arms electronics assembly element; But have only the first and the 4th contact site 219 and 222 to supply power, second only contacts on electrode with the electric insulation state with 218 through the first and second electric insulation members 217 respectively with 221 with the 3rd contact site 220.Therefore; When having destroyed electronics assembly element owing to the deterioration of electronics assembly element; Be arranged on first and second contact sites 219 and 220 and be arranged on third and fourth contact site 221 and 222 on the terminal component 212 and just maintain former state and seize on both sides by the arms under the state of electronics assembly element on the terminal component 207; And the each several part of being seized on both sides by the arms by elasticity is respectively dispersed away; But only by being in first contact site 219 of "on" position with electrode with the 3rd contact site 221 that is not in "on" position, perhaps by seizing these parts respectively on both sides by the arms with second contact site 220 that is not in the electrifying electrodes state and the 4th contact site 222 that is in "on" position; So, and become open-circuit condition no longer via these part energisings.
; As the situation of destroying because of the deterioration causes electrons assembly element of electronics assembly element; The state of chapping that the sheet that the spring contact plate elasticity as above-mentioned, faced mutually seizes on both sides by the arms is not only arranged; But also the electronics assembly element after can destroying splits away off from spring contact plate, becomes the pulverizing situation of the fragment that is bordering on pulverizing.
In this case, the fragment of electronics assembly element is just piled up on the bottom surface in the enclosure, but might make conducting between terminal component 207 and 212 via the fragment of electronics assembly element, even this situation is actually rare.As a result, even if the electronic building brick of showing in the patent documentation 1 also becomes the electric short circuit state between the terminal component 207 and 212, the further abnormal heating of meeting probably also can be to producing the softening malfunction transfer that waits of shell.
No. 2882322 communique of [patent documentation 1] special permission
Summary of the invention
The object of the present invention is to provide in a kind of electronic building brick that as above-mentioned, in energising, possibly cause destroying because of electronics assembly element deterioration; Even the collapse state of electronics assembly element is the pulverizing state; Electronics assembly element after the destruction becomes under the situation of the fragment that is bordering on pulverizing, the energising after also can interrupting automatically destroying.
For solving above-mentioned problem, electronic building brick of the present invention possesses first and second electrodes relatively and the electronics assembly element, bracing or strutting arrangement and the shell that form; Bracing or strutting arrangement is flexibly held electronics assembly element under the arm and is supported this electronics assembly element; This bracing or strutting arrangement is provided with first and second terminal components and the first and second electric insulation members of conductivity; The first terminal member of conductivity has first spring contact plate and first column sections that relies on elasticity to impose roof pressure power to said first electrode; This first electric insulation member contacts said first electrode on the position that is different from said the first terminal member; Second terminal component of conductivity has and relies on elasticity to impose second spring contact plate and second column sections of roof pressure power to said second electrode, and this second electric insulation member contacts said second electrode on the position that is different from said second terminal component; Said first and second terminal components are electrically connected with said first and second electrodes respectively and constitute the conductive path to said electronics assembly element power supply, and said the first terminal member and the said second electric insulation member and the said first electric insulation member and said second terminal component are respectively relatively; This shell is used for taking in said electronics assembly element and said first and second terminal components; Wherein, Said first and second column sections are set at respectively in first and second incorporating sections that are made up of the electric insulation member; The volume that comprises the space in the said shell that forms between the bottom surface of imaginary cross section and said shell of a said shell side, supposition of distance of bottom surface in the edge part in said first and second spring contact plates and the bottom surface opposite side and said shell is greater than the volume of said electronics assembly element.
In the electronic building brick of the present invention; Best said the first terminal member also is provided with the 3rd spring contact plate that relies on said first electrode of elasticity court to impose roof pressure power, is inserted in the said first electric insulation member between said the 3rd spring contact plate and said first electrode; Preferably said second terminal component also is provided with the 4th spring contact plate that relies on said second electrode of elasticity court to impose roof pressure power, is inserted in the said second electric insulation member between said the 4th spring contact plate and said second electrode.
In the electronic building brick of the present invention, the electric insulation member of the most handy lining around said first and second column sections forms said first and second incorporating sections.
In the electronic building brick of the present invention, electronics assembly element is the positive temperature coefficient thermis element preferably.
First and second column sections that relate to electronic building brick of the present invention are set at respectively in first and second incorporating sections that are made up of the electric insulation member; And comprise the volume in the space in the shell that forms between the bottom surface of imaginary cross section and shell of a shell side, supposition of distance in the edge part in first and second spring contact plates and shell bottom surface opposite side and the shell bottom surface; Volume greater than electronics assembly element; So; As the situation of destroying because of the deterioration causes electrons assembly element of electronics assembly element, be not only the state of chapping of the sheet of being seized on both sides by the arms by relative spring contact plate elasticity, even the electronics assembly element after destroying splits away off from spring contact plate; Become the pulverizing state of the fragment that is bordering on pulverizing; The fragment of electronics assembly element is piled up in the enclosure, even in this case, also can fully be housed in the fragment of electronics assembly element in the space that is surrounded by the electric insulation member.Therefore, can not make conducting between the terminal component, can positively suppress the heating of further persistent anomaly and develop into the softening malfunction that waits of shell takes place, therefore can access the high electronic building brick of reliability via the fragment of electronics assembly element.
The first terminal member also is provided with the 3rd spring contact plate that relies on elasticity to impose roof pressure power towards first electrode; The first electric insulation member is inserted between the 3rd spring contact plate and first electrode; Second terminal component also is provided with the 4th spring contact plate that relies on elasticity to impose roof pressure power towards second electrode; The second electric insulation member is inserted between the 4th spring contact plate and second electrode, so, can increase the place of resiliency supported electronics assembly element.Therefore; The state that the electronics assembly element that causes as the deterioration because of electronics assembly element destroys, under the situation that the situation of chapping and pulverizing situation mixing existence has taken place, big fragment is held under the arm between spring contact plate under open-circuit condition; And reduce and reduced to fall into the fragment of the bottom of shell as much as possible; Therefore, can further suppress to make conducting between the terminal component, and can improve the reliability of electronic building brick more via the fragment of electronics assembly element.
Owing to reducing the volume of incorporating section under the situation that forms first and second incorporating sections with the electric insulation member on every side that covers first and second column sections, so form the space that the space that separates with the electric insulation member can further enlarge the fragment of accommodating electronics assembly element in the enclosure.
Owing to be used as electronics assembly element to the positive temperature coefficient thermis element, just can prevent the overheated of electronic installation with the simple mechanism of cheap electronic building brick.
Description of drawings
Fig. 1 is a plane graph of seeing the positive-performance thermo-sensitive resistor device of one embodiment of the present invention below the housing main body removing under the state of lid.
Fig. 2 is that direction is seen the diagrammatic sketch of the positive-performance thermo-sensitive resistor device of one embodiment of the present invention from the side.
Fig. 3 is a sectional drawing of seeing the positive-performance thermo-sensitive resistor device of other execution modes of the present invention from frontal.
Fig. 4 is that direction is seen the sectional drawing of the positive-performance thermo-sensitive resistor device of other execution modes of the present invention from the side.
Fig. 5 is a plane graph of seeing the positive-performance thermo-sensitive resistor device of other execution modes of the present invention below the housing main body removing under the state of lid.
Fig. 6 is the sectional drawing that forms the situation of incorporating section on every side that covers column sections with the electric insulation member.
Fig. 7 is a plane graph of under removing the state of lid, below housing main body, seeing the positive-performance thermo-sensitive resistor device the prior art example.
Fig. 8 is a plane graph of under removing the state of lid, below housing main body, seeing the positive-performance thermo-sensitive resistor device the other prior art example.
Fig. 9 is that direction is seen the diagrammatic sketch of the positive-performance thermo-sensitive resistor device in the other prior art example from the side.
[explanation of symbol]
1,1a positive-performance thermo-sensitive resistor device
2 housing main bodies
3 lids
4 positive temperature coefficient thermis elements
5 first electrodes
6 second electrodes
7 the first terminal members
8,9,13,14 spring contact plates
10 first column sections
11,16 connecting portions
12 second terminal components
15 second column sections
17 first electric insulation members
18 second electric insulation members
19 first contact sites
20 second contact sites
21 the 3rd contact sites
22 the 4th contact sites
23 first incorporating sections
24 second incorporating sections
25 the 3rd column sections
The imaginary cross section of S, Sa shell
Embodiment
Followingly specify electronic building brick of the present invention according to Fig. 1 and Fig. 2.
What Fig. 1 and Fig. 2 were represented is the positive-performance thermo-sensitive resistor device 1 of one embodiment of the present invention, and Fig. 1 is a plane graph of seeing positive-performance thermo-sensitive resistor device 1 below the housing main body removing under 3 the state of covering.Fig. 2 is the diagrammatic sketch of direction positive-performance thermo-sensitive resistor device 1 from the side, and with dashed lines is represented the configuration status of each inner parts.
Among Fig. 1; The same with aforesaid positive-performance thermo-sensitive resistor device 200, positive-performance thermo-sensitive resistor device 1 is provided with housing main body 2, be incorporated in positive temperature coefficient thermis element 4 and first and second terminal components 7,12 in the housing main body 2, the lid 3 and the first and second electric insulation members 17,18 of the lower opening of closure main body 2.
Housing main body 2 is equivalent to the good heat resistances such as phenol, polyphenylene sulfide, polybutyleneterephthalate of 94V (UL specification) by anti-flammability resin constitutes.Housing main body 2 also can be made up of inorganic material such as aluminium oxide.In order to take in positive temperature coefficient thermis element 4, become outstanding shape to the top part of housing main body 2.Housing main body 2 also can have can be with the shape of terminal component 7,12 and electric insulation member 17,18 location.
Positive temperature coefficient thermis element 4 sees it is plate-like on the whole, and its first and second electrode 5,6 against each other.Also can adopt like the square tabular shape that waits other, as positive temperature coefficient thermis element 4.This positive temperature coefficient thermis element 4 is inserted into the central part in the housing main body 2 in the side under the state that makes electrode 5,6.
And first and second terminal components 7,12 are inserted in the housing main body 2, and positive temperature coefficient thermis element 4 is clamped.First and second terminal components 7,12 are made up of metal blanks such as stainless steel, copper alloys respectively, like this, make first and second terminal components 7,12 have suitable elasticity and conductivity.
The first terminal member 7 forms two spring contact plates 8 and 9, simultaneously, is received not shown connector pin with first column sections 10, and connector pin between be formed with and be used for realizing the connecting portion 11 that is electrically connected.The sheet material that forms spring contact plate 8 and 9 for example gets up through stitch bonds with the sheet material that forms first column sections 10 and connecting portion 11.First column sections 10 is set in first incorporating section 23 that is made up of the electric insulation member.First column sections 10 is set so just can make first column sections 10 be the state of electric insulation in the enclosure with the space of supporting positive temperature coefficient thermis element 4.
Except that illustrated shape, can spring contact plate 8 and 9 changes be become arbitrary shape.Can also use the sheet material that forms column sections 10 and connecting portion 11 integrally formed through the shape of change spring contact plate 8 and 9 spring contact plate 8 and 9.
In shell 2, the spring contact plate 8 of the first terminal member 7 and 9 relies on its elasticity and imposes roof pressure power towards first electrode 5, and on the other hand, the spring contact plate 13 of second terminal component 12 and 14 relies on its elasticity and imposes roof pressure power towards second electrode 6.Like this, first and second terminal components 7,12 support it with regard to flexibly seizing positive temperature coefficient thermis element 4 on both sides by the arms, and in housing main body 2, positive temperature coefficient thermis element 4 is maintained under the state of suspension.
The first and second electric insulation members 17 and 18 for example are the lamellar members that is made up of inorganic matters such as mica, glass, are inserted between the first terminal member 7 sides' spring contact plate 9 and first electrode 5 respectively and between second terminal component, 12 sides' the spring contact plate 13 and second electrode 6.The film that also can form with each part that covers first and second electrodes 5,6 constitutes the first and second electric insulation members 17,18; The film or the tablet of the electric insulating quality that perhaps also can form with the inorganic matter or the resin of covering spring contact plate 9,13 constitute the first and second electric insulation members 17,18, to replace the tabular component of individual processing.
In this positive-performance thermo-sensitive resistor device 1, as shown in Figure 2, the spring contact plate 13,14 of the spring contact plate 8,9 of the first terminal member and second terminal component be provided with its bottom surface with respect to shell promptly cover 3 edge part apart from the bottom surface of shell with high.Represent to comprise such edge part and the imaginary cross section of the shell supposed with S, set the space that forms between the bottom surface of this imaginary cross section S and shell volume greater than positive temperature coefficient thermis element 4.
In this embodiment, though the edge part with respect to the bottom surface of shell of each spring contact plate be provided with apart from the bottom surface of shell with high, the height of the edge part of each spring contact plate also can be different high apart from the bottom surface of shell.In this case, suppose that imaginary cross section S comprises the side with the distance of the bottom surface of shell.
As stated, after being accommodated in positive temperature coefficient thermis element 4 and terminal component 7,12 and electric insulation member 17,18 in the housing main body 2, loading onto and cover 3, the lower opening of housing main body 2 is closed.Can be being used for this encapsulation like the embedded structure between housing main body 2 and the lid 3.Can cover 3 with constituting with aforesaid housing main body 2 same materials, lid 3 is provided with allows the hole of inserting connector pin to connecting portion 11 and 16.
In the positive-performance thermo-sensitive resistor device that obtains like this 1, be configured to flexibly hold under the arm positive temperature coefficient thermis element 4 and with its bracing or strutting arrangement that supports by terminal component 7,12 and electric insulation member 17,18.First and second contact sites 19,20 that contact the mutual diverse location on first electrode 5 respectively on this bracing or strutting arrangement are respectively arranged with the spring contact plate 8 and the first electric insulation member 17; On the other hand, be respectively arranged with the second electric insulation member 18 and spring contact plate 14 across positive temperature coefficient thermis element 4 facing to third and fourth contact site 21,22 first and second contact sites 19,20, that contact the mutual diverse location on second electrode 6.The spring contact plate 8,14 that constitutes the first and the 4th contact site 19,22 is connected on first and second electrodes 5,6, thereby is configured to the conductive path to 4 power supplies of positive temperature coefficient thermis element.On the other hand, constitute second and contact first and second electrodes 5,6 with the electric insulation state respectively with the first and second electric insulation members 17,18 of the 3rd contact site.
In such positive-performance thermo-sensitive resistor device 1; When causing that because of the generation of electric spark etc. the state of chapping of big fragment destroys; Owing to rely on elasticity that positive temperature coefficient thermis element 4 is applied with roof pressure power from spring contact plate 8,9,13,14; So the part of seizing on both sides by the arms by spring contact plate 8 and electric insulation member 18 elasticity and exempt from respectively dispersing by the part that spring contact plate 14 and electric insulation member 17 elasticity are seized on both sides by the arms, and keep such state of seizing on both sides by the arms.
Under this state; Do not insert electric insulation member 17,18 and respectively the spring contact plate 8,14 of contact electrode 5,6 not only be not in each other in the face of the position; And since from spring contact plate 8 through residual fraction to the path of its spring contact plate of facing mutually 13; And from spring contact plate 14 through residual fraction to the path of its spring contact plate of facing mutually 9 on be inserted with electric insulation member 17,18 respectively, so energising is interrupted, and become open-circuit condition.
The residual fraction of the positive temperature coefficient thermis element 4 that therefore, can positively prevent to continue to cause and terminal component 7, produce the alloying phenomenon between 12, become the electric short circuit state and still continue abnormal heating and shift to the malfunction of danger because of aforesaid energising.
In such positive-performance thermo-sensitive resistor device 1; The result of generation spark etc. is the positive temperature coefficient thermis element 4 after destroying splits away off such fragment that is bordering on pulverizing from spring contact plate a pulverizing state; And the fragment of positive temperature coefficient thermis element 4 is piled up in the enclosure; Even under these circumstances; Because first and second column sections 10,15 are set in first and second incorporating sections 23,24 that are made up of the electric insulation member, so the fragment of positive temperature coefficient thermis element 4 can not contact first and second column sections 10,15 yet.
In addition, because the space that forms between the bottom surface of setting imaginary cross section S and shell is greater than the volume of positive temperature coefficient thermis element 4, so can fully be housed in the fragment of electronic assemblies element in the space that is surrounded by the electric insulation member.Therefore; The fragment of positive temperature coefficient thermis element 4 can the contact spring contact chip; Can be between the terminal component through these fragment conductings; Can positively suppress to produce the softening malfunction that waits of shell and shift, so can access the high positive-performance thermo-sensitive resistor device of reliability 1 to further continuation abnormal heating.
Here; At the height of the edge part of each spring contact plate under the different high situation in the bottom surface of shell; Suppose that imaginary cross section S comprises and the bottom surface of shell between a side of distance, like this, even the fragment of positive temperature coefficient thermis element 4 is piled up in the enclosure; Owing to can not reach the side's spring contact plate with the distance of the bottom surface of shell at least, so can be and conducting between the terminal component through the fragment of electronics assembly element yet.
That Fig. 3 to Fig. 5 is represented is the positive-performance thermo-sensitive resistor device 1a of other execution modes of the present invention.Fig. 3 is a sectional drawing of seeing the positive-performance thermo-sensitive resistor device of other execution modes of the present invention from frontal; Fig. 4 is that direction is seen the sectional drawing of the positive-performance thermo-sensitive resistor device of other execution modes of the present invention from the side; Fig. 5 is a plane graph of seeing the positive-performance thermo-sensitive resistor device of other execution modes of the present invention below the housing main body removing under the state of lid.
Among Fig. 3 to Fig. 5, to being equivalent to the same reference marks of element annotation illustrated in figures 1 and 2, and omit the explanation of repetition.Fig. 3 and shown in Figure 4 be the state that has removed first and second incorporating sections 23,24 among Fig. 5.
In this execution mode, spring contact plate only is first spring contact plate 8 and second spring contact plate 14 these two, and different with the execution mode of front, electric insulation member 17,18 does not bear the flexible roof pressure power of spring contact plate.That is, the positive temperature coefficient thermis element 4 usefulness second electric insulation member 18 stops the roof pressure power of spring contact plate 8 and the roof pressure power of stopping spring contact plate 14 with the second electric insulation member 17, thereby in housing main body 2, is maintained under the state of suspension.
Be provided with the 3rd column sections 25, and connecting portion 11 ' with 16 ' not be the jack shape of utilizing the shape of the such column sections of the execution mode of front, but pin terminal shape.
Even in this embodiment; Also the execution mode with the front is the same; Because the space that forms between the bottom surface of setting imaginary cross section Sa and shell is greater than the volume of positive temperature coefficient thermis element 4, so can fully be housed in the fragment of electronic assemblies element in the space that is surrounded by the electric insulation member.Therefore; The fragment of positive temperature coefficient thermis element 4 can the contact spring contact chip; And can be through these fragment conductings between the terminal component; Therefore the malfunction that can positively suppress further to continue heating and develop into the softening grade that shell takes place, can obtain the high positive-performance thermo-sensitive resistor device 1a of reliability.
Fig. 6 is the sectional drawing that forms the situation of first incorporating section 23 on every side that covers first column sections 10 with the electric insulation member.Owing to like this directly the electric insulation member cover column sections around form the incorporating section; So can reduce the volume of incorporating section; Therefore, form the space that the space that separates just can further enlarge the fragment of accommodating electronics assembly element with the electric insulation member.
More than combine illustrated execution mode that the present invention has been described, but within the scope of the invention, other execution mode can be arranged also.
For example; Above-mentioned execution mode is the situation that the present invention is applicable to positive-performance thermo-sensitive resistor device; But the present invention is not limited to positive-performance thermo-sensitive resistor device, supplies power so long as support corresponding to the electronics assembly element of positive-performance thermo-sensitive resistor device and to it according to the same mode of situation with above-mentioned positive-performance thermo-sensitive resistor device, and causes destroying because of deterioration; Even for other electronic building bricks, can be suitable for equally.
Claims (5)
1. an electronic building brick is characterized in that, possesses first and second electrodes relatively and the electronics assembly element, bracing or strutting arrangement and the shell that form; Bracing or strutting arrangement is flexibly held electronics assembly element under the arm and is supported this electronics assembly element; This bracing or strutting arrangement is provided with first and second terminal components and the first and second electric insulation members of conductivity; The first terminal member of said conductivity has first spring contact plate and first column sections that relies on elasticity to impose roof pressure power to said first electrode; The said first electric insulation member contacts said first electrode on the position that is different from said the first terminal member; Second terminal component of said conductivity has and relies on elasticity to impose second spring contact plate and second column sections of roof pressure power to said second electrode, and the said second electric insulation member contacts said second electrode on the position that is different from said second terminal component; Said first and second terminal components are electrically connected with said first and second electrodes respectively and constitute the conductive path to said electronics assembly element power supply, and said the first terminal member and the said second electric insulation member and the said first electric insulation member and said second terminal component are respectively relatively; Said shell is used for taking in said electronics assembly element and said first and second terminal components; Said first and second column sections are set at respectively in first and second incorporating sections that are made up of the electric insulation member; In the opposed edges portion of the bottom surface of the bottom surface of said first spring contact plate and said shell opposed edges portion and said second spring contact plate and said shell; The residing plane of choosing with a side of the distance of the bottom surface of said shell of edge part is the imaginary cross section of said shell, and the volume in the space that forms between the bottom surface of said imaginary cross section and said shell is greater than the volume of said electronics assembly element.
2. electronic building brick according to claim 1; It is characterized in that said the first terminal member also is provided with the 3rd spring contact plate that relies on said first electrode of elasticity court to impose roof pressure power, the said first electric insulation member is inserted between said the 3rd spring contact plate and said first electrode; Said second terminal component also is provided with the 4th spring contact plate that relies on said second electrode of elasticity court to impose roof pressure power, and the said second electric insulation member is inserted between said the 4th spring contact plate and said second electrode.
3. electronic building brick according to claim 1 and 2 is characterized in that forming said first and second incorporating sections with the electric insulation member on every side that covers said first and second column sections.
4. electronic building brick according to claim 1 and 2 is characterized in that electronics assembly element is the positive temperature coefficient thermis element.
5. electronic building brick according to claim 3 is characterized in that electronics assembly element is the positive temperature coefficient thermis element.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008-142980 | 2008-05-30 | ||
| JP2008142980A JP4561876B2 (en) | 2008-05-30 | 2008-05-30 | Electronic components |
| JP2008142980 | 2008-05-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101593586A CN101593586A (en) | 2009-12-02 |
| CN101593586B true CN101593586B (en) | 2012-06-06 |
Family
ID=41408184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102035678A Expired - Fee Related CN101593586B (en) | 2008-05-30 | 2009-05-18 | Electronic component |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4561876B2 (en) |
| KR (1) | KR101014146B1 (en) |
| CN (1) | CN101593586B (en) |
| TW (1) | TW200949865A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107658083A (en) * | 2017-10-31 | 2018-02-02 | 常熟市天银机电股份有限公司 | Protector for electric appliances with thermal-sensitive electric resistance device |
| DE102019106617A1 (en) * | 2019-03-15 | 2020-09-17 | Schaeffler Technologies AG & Co. KG | Electrical assembly with electrically insulated housing; as well as drive train unit |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1313607A (en) * | 1995-11-07 | 2001-09-19 | 株式会社村田制作所 | Electronic component for reducing damages of internal components as faults occur |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05299206A (en) * | 1992-04-23 | 1993-11-12 | Murata Mfg Co Ltd | Overvoltage protecting part |
| JP3955116B2 (en) | 1996-10-30 | 2007-08-08 | ユー・エム・シー・ジャパン株式会社 | Semiconductor manufacturing apparatus scheduling method |
| JPH11102803A (en) | 1997-09-26 | 1999-04-13 | Tdk Corp | Laminated chip ntc thermistor |
-
2008
- 2008-05-30 JP JP2008142980A patent/JP4561876B2/en not_active Expired - Fee Related
-
2009
- 2009-03-12 TW TW098107993A patent/TW200949865A/en unknown
- 2009-05-18 CN CN2009102035678A patent/CN101593586B/en not_active Expired - Fee Related
- 2009-05-29 KR KR1020090047349A patent/KR101014146B1/en not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1313607A (en) * | 1995-11-07 | 2001-09-19 | 株式会社村田制作所 | Electronic component for reducing damages of internal components as faults occur |
Non-Patent Citations (1)
| Title |
|---|
| JP特开平5-299206A 1993.11.12 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101014146B1 (en) | 2011-02-14 |
| TW200949865A (en) | 2009-12-01 |
| JP2009290096A (en) | 2009-12-10 |
| KR20090124991A (en) | 2009-12-03 |
| JP4561876B2 (en) | 2010-10-13 |
| CN101593586A (en) | 2009-12-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6407659B2 (en) | Electronic device | |
| US5963125A (en) | Electronic devices having reduced destruction of internal elements upon malfunction | |
| US8089745B2 (en) | Overvoltage protection element | |
| JP5175627B2 (en) | Secondary battery | |
| US9852869B2 (en) | Switch module with a built-in structure of anti-surge and dual disconnection | |
| JP2019114501A (en) | Secondary battery | |
| JP2020512670A (en) | Battery connector for series connection of batteries and battery pack including the same | |
| CN101593586B (en) | Electronic component | |
| US5574615A (en) | Air spark gap for determining the maximum voltage at a voltage surge suppressor | |
| JPH10334882A (en) | Battery power unit | |
| JP2891179B2 (en) | Electronic components | |
| EP1681685A1 (en) | PTC current limiting device having flashover prevention structure | |
| JP6366906B2 (en) | Electronic equipment | |
| CN103489551B (en) | Electronic device | |
| JP2882322B2 (en) | Electronic components | |
| JP3177924B2 (en) | Electronic components | |
| US20220230824A1 (en) | Switching device with ceramic/glass eyelets | |
| US20210066008A1 (en) | Temperature Sensitive Pellet Type Thermal Fuse | |
| JP2897699B2 (en) | Electronic components | |
| CN110896007A (en) | Protective element | |
| CN103077789A (en) | Secure PTC starter | |
| JP2006147361A (en) | Jack and relay cable | |
| JP2010110052A (en) | Distribution panel | |
| TH10267B (en) | Electronic equipment Which the destruction of the internal elements When the failure was reduced |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120606 Termination date: 20170518 |