CN101588699B - Heat dissipation system and heat dissipation method - Google Patents

Heat dissipation system and heat dissipation method Download PDF

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Publication number
CN101588699B
CN101588699B CN2008100673275A CN200810067327A CN101588699B CN 101588699 B CN101588699 B CN 101588699B CN 2008100673275 A CN2008100673275 A CN 2008100673275A CN 200810067327 A CN200810067327 A CN 200810067327A CN 101588699 B CN101588699 B CN 101588699B
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China
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heat dissipation
air flue
rack
cabin
dissipation cabin
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CN2008100673275A
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CN101588699A (en
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洪宇平
姬生钦
孔小明
吴卫星
陈乔
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SnapTrack Inc
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Huawei Technologies Co Ltd
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Abstract

The embodiment of the invention provides a heat dissipation system having good heat dissipation conditions, which comprises a machine cabinet, a heat dissipation cabin, a first gas channel, a second gas channel, a first fan and a second fan, wherein the machine cabinet is internally provided with electronic equipment; the heat dissipation cabin is used for heat dissipation; the first gas channel and the second gas channel are both communicated with the heat dissipation cabin and the machine cabinet; the first fan is used for promoting the gas in the machine cabinet to be input into the heat dissipation cabin through the first gas channel; and the second fan is used for promoting the gas in the heat dissipation cabin to be input into the machine cabinet through the second gas channel. The invention also provides a heat dissipation method utilizing the heat dissipation method for improving the heat dissipation efficiency. The heat dissipation effect of the heat dissipation system can be greatly improved through the heat dissipation cabin arranged outside.

Description

A kind of cooling system and heat dissipating method
Technical field
The present invention relates to a kind of cooling system, relate in particular to a kind of cooling system that is used for the rack of communication electronic equipment.
Background technology
Social now; communication base station is dispersed throughout the every nook and cranny in the world; and in order to protect the electronic equipment in the various communication base station of these quantity to avoid being destroyed by the external world; industry generally adopts rack to hold communication equipment; but Just because of this; how, then become the problem that common carrier or equipment supplier must solve for these electronic equipments that are accommodated in the rack provide good heat radiation.
In the prior art, generally be by in rack, installing current path, and driving air by fan flows in current path, exchange with the heat inside and outside the realization rack, but variation and high efficiency along with communication service, only rely on the remaining space in the rack to set up the exchange heat that current path realizes that rack is inside and outside, can't satisfy the heat radiation requirement of the communication equipment that heat dissipation capacity increases year by year gradually.
To sum up, be necessary that electronic equipment provides a kind of cooling system.
Summary of the invention
The embodiment of the invention provides the cooling system that possesses good radiating condition, and it comprises rack, is provided with electronic equipment in the described rack, and described cooling system also comprises: heat dissipation cabin, be located at underground; First and second air flues, described first and second air flues all communicate with described heat dissipation cabin and described rack; First fan is used to impel air communication to cross described first air flue and described second air flue circulates between described heat dissipation cabin and described rack.
The present invention also provides a kind of heat dissipating method that utilizes heat dissipation cabin to improve radiating efficiency, and it mainly comprises the steps: to select to be in cavity in the heat absorption environment of rack periphery as heat dissipation cabin; Be communicated with described heat dissipation cabin and rack by first air flue and second air flue; And impel air communication to cross described first air flue and described second air flue circulates between described heat dissipation cabin and described rack by fan.
Cooling system provided by the present invention and heat dissipating method by be located at outward heat absorption in the environment heat dissipation cabin, enlarged the surface area that is used to dispel the heat, greatly improved radiating effect, and solved the problem of heat-dissipating space deficiency in the rack.
Description of drawings
Fig. 1 is the schematic diagram of the cooling system of first embodiment of the invention;
Fig. 2 is the schematic diagram of the cooling system of second embodiment of the invention;
Fig. 3 is the flow chart of the heat dissipating method of the embodiment of the invention;
Fig. 4 is the flow chart of second kind of execution mode of the heat dissipating method of the embodiment of the invention.
Embodiment
Please refer to Fig. 1, Figure 1 shows that the schematic diagram of the cooling system 100 of having used the first embodiment of the invention cooling system.Cooling system 100 comprises rack 10, heat dissipation cabin 20, first air flue 32 and second air flue 34.Described heat dissipation cabin 20 links to each other with second air flue 34 by first air flue 32 with described rack 10.
Described rack 10 comprises equipment compartment 12, contains power consumption equipment 123 in the described equipment compartment 12, and the 3rd air flue 122 has also been set up in the periphery of described equipment compartment 12, and described the 3rd air flue 122 communicates with described first air flue 32.In embodiments of the present invention, described the 3rd air flue 122 is attached on the shell 125 of the top of described equipment compartment 12 and sidepiece, so that shell 125 heat radiations by equipment compartment 12.
The top of described equipment compartment also is provided with first fan 124, be used for and sent into described the 3rd air flue 122 by the hot gas that power consumption equipment 123 heated, described the 3rd air flue 122 also be provided with pore or opening in described first fan, 124 residing sides so that hot gas passes through.Described equipment compartment 12 also is provided with second fan 126 in the exit of described second air flue 34, is 123 coolings of power consumption equipment to be used for extracting by second air flue 34 that cold air come out.
In other alternate embodiments, the cooling system 100 of the embodiment of the invention also can include only in described first fan 124 and second fan 126, can realize air-flow flowing between heat dissipation cabin 20 and equipment compartment 12 equally, reaches the purpose of heat radiation.
In other alternate embodiments, described first fan 124 in the embodiment of the invention and in second fan 126 one or two also can be located in the described heat dissipation cabin 20, and can realize similar or better effect.
What easily full of beard reached is, the putting position and the power of described first fan 124 and second fan 126, can adjust according to power consumption equipment 123 needed heat dissipating states, so that air-flow the 3rd air flue 122, first air flue 32, heat dissipation cabin 20, and the air flow path that constituted of second air flue 34 in the process of flowing, the heat that power consumption equipment 123 is come out can be dispersed in the surrounding enviroment fully.
In actual applications, gas around the power consumption equipment 123 is under the effect of first fan 124 and second fan 126, between the 3rd air flue 122, first air flue 32, heat dissipation cabin 20, second air flue 34, equipment compartment 12, circulate, and the heat that power consumption equipment 123 is discharged all the outer wall of outer wall, second air flue 34 of the outer wall by rack enclosure 125, first air flue 32, heat dissipation cabin 20 be dispersed in the environment of periphery and go.
To sum up, the cooling system 200 of first embodiment of the invention increases area of dissipation by make up heat dissipation cabin 20 outside rack 10, has improved radiating effect effectively.
Further, also can install the material that heat conduction with phase change medium etc. helps to dispel the heat in the described heat dissipation cabin 20 and further improve radiating effect.
Further, described heat dissipation cabin 20 can be placed in the heat absorption environment, to improve radiating efficiency.Described heat absorption environment is meant that temperature can more stably remain below or equal the environment that is in rack 10 peripheries of the temperature of electronic equipment operate as normal, such as being near the pond the rack 10, underground water vein etc.
The embodiment of the invention has enlarged area of dissipation by the heat dissipation cabin 20 of being located at rack 10 peripheries outward, has improved radiating effect effectively, and improves heat dissipation by external heat dissipation cabin 20, has also well solved the problem of heat-dissipating space deficiency in the rack.Further, described heat dissipation cabin 20 is to be located in the heat absorption environment, can guarantee at any time that the heat of heat dissipation cabin 20 can successfully be delivered in the surrounding enviroment.
Please refer to Fig. 2, Figure 2 shows that the schematic diagram of cooling system 200 of the cooling system of second embodiment of the invention.Described cooling system 200 comprises rack 210, heat dissipation cabin 220, first air intake duct 232, and second air intake duct 234, described rack 210 comprises the 3rd air flue 222, power consumption equipment 223, first fan 224, second fan 226, something in common is omitted explanation, the difference with above-mentioned first embodiment of the cooling system 200 of second embodiment of the invention is: in the present embodiment, described heat dissipation cabin 220, described first air intake duct 232, and second air intake duct 234 all is located at underground, described heat dissipation cabin 220 is safeguarded well for the cable of being located at rack 210 peripheries, and it also comprises the dissipating cover 2202 of being located at the face of land; Described rack 210 also comprises distribution cabin 210, also is provided with cable pipeline 236 between described rack 210 and the described heat dissipation cabin 220, is used for the cable of heat dissipation cabin 220 is inserted distribution cabin 210.Wherein, described the 3rd air flue 222 is located in the described distribution cabin 210, and described first air flue 232 communicates with described distribution cabin 210, that is to say, in the present embodiment, the gas in first fan, the 224 direct racks 210 is sent in the distribution cabin 210, and enters first air flue 232 through distribution cabin 210.
In the present embodiment, heat dissipation cabin 220 should guarantee certain degree of depth, recommends the degree of depth greater than 1.5m, and its wall portion can adopt the cement mortar material, and the dissipating cover at its top can adopt cast iron quality, also can be the armored concrete material.
Further, described second air flue 234 be in underground more depths in the air intake 2342 of described heat dissipation cabin 220 with respect to the air inlet 2322 in described heat dissipation cabin 220 of first air flue 232, thereby, when gas circulates in described heat dissipation cabin 220, cold air can descend and easier outflow from described air intake 2342, thereby has improved the effect of the exchange heat in the heat dissipation cabin 220.
The cooling system 200 of second embodiment of the invention also is to help heat radiation by set up heat dissipation cabin 220 outside rack 210.Particularly, between first air flue 232, heat dissipation cabin 220, second air flue 234 in the process of flowing, hot gas is by airway walls and heat radiation bulkhead and soil to execute heat exchange at hot gas, with a part of heat release in soil.The hot gas that enter in the heat dissipation cabin 220 circulate in heat dissipation cabin 220, make the gas in entire heat dissipation cabin 220 be in a higher temperature, and the wall of heat dissipation cabin 220 and dissipating cover 2202 are heated by hot gas and be in a higher temperature.Because underground has bigger thermal capacity, be in a lower temperature value from thermal source place far away, and keep relative stability, therefore between heat radiation bulkhead and soil, there is a bigger temperature gradient, thereby impel heat constantly to be discharged in the soil, the temperature of dissipating cover 2202 generally also can be higher than the temperature of environment in addition, and a part of heat is discharged in the environment by dissipating cover 2202.The temperature of the effect hot gas by heat dissipation cabin obtains reduction by a relatively large margin, has greatly improved the effect of heat radiation, has solved the problem of heat-dissipating space deficiency in the rack.
Further, second embodiment of the invention 200 joins in distribution cabin 220 in the flow path of radiating airflow, has avoided the generation of the knot of the frost in the distribution cabin 220 in low temperature environment well.
Please refer to Fig. 3, Fig. 3 is the flow chart of the heat dissipating method that adapts with the embodiment of the invention.The heat dissipating method of the embodiment of the invention comprises the steps:
Step 10: select to be in cavity in the heat absorption environment of rack periphery as heat dissipation cabin;
Wherein, described heat absorption environment is meant that temperature can more stably remain below or equal the environment that is in the rack periphery of the temperature of electronic equipment operate as normal, and is medium such as the pond, underground water vein, the underground that are near the rack.
Step 20: be communicated with described heat dissipation cabin and rack by first air flue and second air flue;
Step 30: impel air communication to cross described first air flue and described second air flue circulates between described heat dissipation cabin and described rack by fan.
The embodiment of the invention has enlarged area of dissipation by the heat dissipation cabin of being located at the rack periphery outward, has improved radiating effect effectively, and improves heat dissipation by external heat dissipation cabin, has also well solved the problem of heat-dissipating space deficiency in the rack.Further, described heat dissipation cabin is to be located in the heat absorption environment, can guarantee at any time that the heat of heat dissipation cabin can successfully be delivered in the surrounding enviroment.
Please refer to Fig. 4, Figure 4 shows that the flow chart of second kind of execution mode of the heat dissipating method of the embodiment of the invention.Second kind of execution mode of heat dissipating method of the present invention comprises the steps:
Step 11: select the cable of rack to safeguard that well is as heat dissipation cabin;
Step 21: be communicated with described heat dissipation cabin and rack by first air flue and second air flue;
Step 31: impel air communication to cross described first air flue and described second air flue circulates between described heat dissipation cabin and described rack by fan.
The embodiment of the invention has enlarged area of dissipation by the heat dissipation cabin of being located at the rack periphery outward, has improved radiating effect effectively, and improves heat dissipation by external heat dissipation cabin, has also well solved the problem of heat-dissipating space deficiency in the rack.Further, described heat dissipation cabin is to be located in the heat absorption environment, can guarantee at any time that the heat of heat dissipation cabin can successfully be delivered in the surrounding enviroment.
The above; only be the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, anyly is familiar with those skilled in the art in the technical scope that the present invention discloses; can expect easily changing or replacing, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion by described protection range with claim.

Claims (9)

1. a cooling system comprises rack, contains electronic equipment in the described rack, it is characterized in that, described cooling system also comprises:
Heat dissipation cabin is located at underground;
First and second air flues, described first and second air flues all communicate with described heat dissipation cabin and described rack, wherein, described second air flue in the blowhole on the described heat dissipation cabin with respect to the air inlet position on described heat dissipation cabin of described first air flue in underground more depths;
First fan is used to impel air communication to cross described first air flue and described second air flue circulates between described heat dissipation cabin and described rack.
2. the cooling system described in claim 1, it is characterized in that, described first fan is located in the described rack, also be provided with the 3rd air flue in the described rack, described the 3rd air flue communicates with described first air flue, and described first fan is to be used to impel the gas in the rack to enter in the described heat dissipation cabin by described first air flue and the 3rd air flue.
3. the cooling system described in claim 2 is characterized in that, described the 3rd air flue is located on the shell of described rack.
4. the cooling system described in claim 2 is characterized in that, also is provided with the cable cabin in the described rack, is used for receiving cable, and described the 3rd air flue is located in the described cable cabin, to be used to reduce described cable temperature on every side.
5. the cooling system described in claim 1 is characterized in that, described heat dissipation cabin is that the cable of being located at described rack periphery is safeguarded well.
6. the cooling system described in claim 1 is characterized in that, also is provided with second fan in the described cooling system, and described first fan and described second fan are respectively applied for and impel air communication to cross described first air flue and described second air flue.
7. a heat dissipating method is characterized in that comprising the steps:
Selection is in cavity in the heat absorption environment of rack periphery as heat dissipation cabin;
Be communicated with described heat dissipation cabin and rack by first air flue and second air flue, wherein, described second air flue in the blowhole on the described heat dissipation cabin with respect to the air inlet position on described heat dissipation cabin of described first air flue in underground more depths; And
Impel air communication to cross described first air flue and described second air flue circulates between described heat dissipation cabin and described rack by fan.
8. the heat dissipating method described in claim 7 is characterized in that, described heat absorption environment is in the underground.
9. the heat dissipating method described in claim 7 is characterized in that, described heat dissipation cabin is that the cable of rack is safeguarded well.
CN2008100673275A 2008-05-23 2008-05-23 Heat dissipation system and heat dissipation method Active CN101588699B (en)

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Application Number Priority Date Filing Date Title
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CN101588699B true CN101588699B (en) 2011-04-06

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102467201A (en) * 2010-11-12 2012-05-23 英业达股份有限公司 Cooling circulation system of server
CN110022653B (en) * 2019-03-26 2021-01-01 烟台职业学院 Desktop computer easily adjusts high heat dissipation encapsulation rack

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1173454A (en) * 1996-02-14 1998-02-18 阿尔卡泰尔阿尔斯特霍姆综合电力公司 Device for setting active and passive nodes assembly fo communication installation
CN1964613A (en) * 2005-11-10 2007-05-16 上海科宏变电设备有限公司 Heat radiation method for transformer chamber
CN201152599Y (en) * 2007-04-01 2008-11-19 陈中明 Buried heat radiating device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1173454A (en) * 1996-02-14 1998-02-18 阿尔卡泰尔阿尔斯特霍姆综合电力公司 Device for setting active and passive nodes assembly fo communication installation
CN1964613A (en) * 2005-11-10 2007-05-16 上海科宏变电设备有限公司 Heat radiation method for transformer chamber
CN201152599Y (en) * 2007-04-01 2008-11-19 陈中明 Buried heat radiating device

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Effective date of registration: 20160427

Address after: American California

Patentee after: Snaptrack, Inc.

Address before: 518129 Bantian HUAWEI headquarters office building, Longgang District, Guangdong, Shenzhen

Patentee before: Huawei Technologies Co., Ltd.