CN101585103B - H62 copper alloy device Ag-Cu-Zn liquid phase diffusion connecting method - Google Patents
H62 copper alloy device Ag-Cu-Zn liquid phase diffusion connecting method Download PDFInfo
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Abstract
The invention relates to a H62 copper alloy device Ag-Cu-Zn liquid phase diffusion connecting method, which includes following steps: step one, trash extraction before workpiece welding; step two, interlayer preparing; presetting an Ag coating with a preset thickness of 4-10 mum on the copper alloy surface in a plating way; step three, welding process; putting the workpieces to be connected into abrazing furnace according to the required joint style, adopting the high purity inert gas shield, applying a balancing weight on the sample, heating and preventing heat at the temperature not exceedi ng Ag-Cu eutectic crystal, closing heating, sample furnace cooling to below 200 DEG C and taking out the sample, cooling to the room temperature in the air, finishing the connection. The invention effectively solves the connection of the copper alloy precision members with the device welding deformation smaller or equal to 0.02 mm, welding seam rounded corner R smaller or equal to 0.1 mm and excellent welding seam combination property.
Description
Technical field
The present invention relates to a kind of instantaneous liquid phase diffusion interconnection technique of copper alloy device, refer more particularly to a kind of H62 copper alloy device Ag-Cu-Zn liquid phase diffusion connecting method.
Background technology
Along with the continuous development of space technology, the performance requirement of radar is further promoted, require radar can realize the precision tracking target; Can carry out the identification of meticulous distance-doppler imaging and target; The structure of energy measurement complex target; Help observation space " fragment " class small size target, thereby help following the tracks of the spacecraft orbit whereabouts and guarantee spacecraft safety.The millimetre-wave radar advantage is obvious: can realize extreme low-altitude detection and precision tracking target, have bandwidth, resolving power height, antijamming capability is strong, system bulk is little, series of advantages such as in light weight, high angular resolution and high angle-measurement accuracy; Can obtain high antenna gain with less antenna physical pore size; Can obtain very wide signal bandwidth in millimere-wave band; Increased the doppler bandwidth of echo-signal; Can carry out the identification of meticulous distance-doppler imaging and target; The structure of energy measurement complex target; Help observation space " fragment " class small size target.
The millimetre-wave radar device generally adopts copper alloy, and especially H62 brass is owing to good processing properties has obtained using widely.This device size precision prescribed is high, generally requires the cavity distortion to be no more than ± 0.02mm brazed seam fillet R＜0.3mm.
Tradition soldering interconnection technique is because the part of devices complex structure place the solder difficulty, and the fillet size is wayward, can't satisfy requirement on devices fully;
Diffusion welding (DW) needs accurate controlled pressure, and joint efficiency is low, and can't realize the large tracts of land seam during small deformation rate.
Melt welding method can't be realized effective connection of this complex structural member at all.
Instantaneous liquid phase diffusion connecting method, between mother metal, add the intermediate layer, under the temperature that is lower than the mother metal fusing point, be incubated, utilize intermediate layer and mother metal generation eutectic reaction on linkage interface, to form the liquid phase of some, because the effect of liquid phase is quickened diffusion, the element that reduces fusing point in the liquid phase makes the combination interface chemical composition obviously change rapidly to the matrix diffusion simultaneously, liquid phase in balancing each other reduces, and causes being incubated at a certain temperature a period of time combination interface and realizes isothermal solidification.Through isothermal solidification, solid phase homogenization of composition, obtain the joint consistent at last and obtain continuous composition surface tissue with mother metal chemical composition and even tissue, a kind of novel accurate interconnection technique, have distortion little, connect that temperature is low, residual stress is little, the strength of joint advantages of higher.And the instantaneous liquid phase diffusion interconnection technique of traditional copper alloy device is utilized the Ag-Cu binary eutectic more, this eutectic temperature height, and amount of liquid phase is big, and the fillet size is wayward.If can find new eutectic system, realize fillet and size Control that the instantaneous liquid phase diffusion of copper alloy connects, will promote the application of copper alloy precision component energetically.
Summary of the invention
1, technical problem to be solved by this invention:
In order to overcome the problem that existing H62 copper alloy precision component solder technology exists, the invention provides a kind of good combination property, brazing seam structure's densification (the seam rate can reach more than 95%), bonding strength height, technology that the fillet size is little and method.
2, technical scheme:
The present invention passes through following steps:
Removal of impurities is handled before the weldering of step 1. workpiece;
Step 2. intermediate layer preparation: adopt plating mode to preset the Ag coating that thickness is 4-10 μ m at copper alloy surface;
Step 3. welding procedure: workpiece group to be connected joint style as requested is placed in the soldering oven, the protection of employing high purity inert gas, and above sample, apply balancing weight, heat tracing under the temperature that is no more than the Ag-Cu eutectic, its temperature is an arbitrary temp in 760～780 ℃ of warm areas, and the time that is incubated is 45-60min; Close heating, sample cools to the furnace below 200 ℃ and takes out sample, is cooled to room temperature in air, promptly finishes connection.
Removal of impurities is treated to the process of the copper alloy parts surface after machine-shaping machining before the described step 1. workpiece weldering, and carries out ultrasonic cleaning and remove impurity such as greasy dirt in acetone.
Balancing weight described in the step 3 is as the criterion with the weight that joint face 0.02MPa pressure is provided.
The purity of the high purity inert gas described in the step 3 is 99.999%.
3, beneficial effect:
Realization of the present invention, the connection that has effectively solved the copper alloy precision component, device welding deformation≤0.02mm, weld seam fillet R≤0.1mm, weld seam excellent combination property.
Description of drawings
Fig. 1 organizes photo for H62 copper alloy device Ag-Cu-Zn liquid phase diffusion attachment weld.
The specific embodiment
Furnace brazing is adopted in the connection of H62 copper alloy; under high purity inert gas protection environment, connect to suppress the volatilization of Zn in the copper alloy mother metal; its core technology utilizes the Ag-Cu-Zn ternary eutectic that diffuses to form to fill weld seam as liquid phase for adopting Ag as the intermediate layer.Be intermediate layer Ag to be placed on material to be connected connect between the surface among the present invention; Heat tracing under the temperature that is no more than the Ag-Cu eutectic (780 ℃), intermediate layer and the counterdiffusion of mother metal element phase are liquefied owing to reaching Ag-Cu-Zn ternary eutectic concentration, thereby form the thin liquid phase intermediate layer of one deck; Liquid is filled the space between the material surface to be connected, along with solute atoms continues diffusion in mother metal, isothermal solidification takes place; After isothermal solidification finished, the vestige that does not have residual liquid phase to exist had formed the jointing similar substantially with the mother metal composition.
Major advantage of the present invention and the technical performance index that can reach are as follows:
(1) because the intermediate layer adopts the plating form to apply, intermediate layer thickness is even.Avoided manual inhomogeneous shortcoming of smearing solder, welding fabrication is attractive in appearance.
(2) pressure is minimum in the connection procedure, and it is low to connect temperature.The mother metal distortion is minimum, and the welding precision height is suitable for the connection of high accuracy member.
(3) joint form that is suitable for of this method is various, can adopt arbitrary forms such as butt joint, overlap joint, T connector.
(4) performance indications that can reach:
The saturating rate of joint pricker (seam rate): 〉=95%
Joint shearing strength: 〉=90MPa
Fillet size: R＜0.1mm
The present invention realizes by following steps:
Removal of impurities is handled before the weldering of step 1. workpiece: with the process of the copper alloy parts surface after machine-shaping machining, and carry out ultrasonic cleaning and remove impurity such as greasy dirt in acetone.
Step 2. intermediate layer preparation: at first adopt plating mode to preset the Ag coating that thickness is 4-10 μ m at copper alloy surface.
Step 3. welding procedure: workpiece group to be connected joint style as requested is placed in the soldering oven; the protection of employing high purity inert gas; and above sample, apply balancing weight; but to realize the physics contact on surface in the connection procedure; balancing weight weight need be followed according to the soldered fitting area and be determined, general is criterion with the weight that joint face 0.02MPa pressure is provided.In ℃ warm area of heated parts to 760～780 (arbitrary temp), be incubated 45-60min.Close heating, sample cools to the furnace below 200 ℃ and takes out sample, is cooled to room temperature in air, promptly finishes connection.
The specific requirement of the described JA(junction ambient) of present embodiment is: 99.999% high-purity argon gas protection.
Be example to adopt the Ag-Cu-Zn ternary eutectic as instantaneous liquid phase welded H 62 copper alloy devices below, the present invention will be further described.
The instantaneous liquid phase diffusion of embodiment 1:H62 brass member connects
The parts of prewelding device are earlier silver-plated, and thickness of coating is at 6 μ m, 780 ℃ of welding temperatures; 99.999% high-purity argon gas protection, pressure 0.02MPa, welding temperature retention time 45min; production joint organizes photo as shown in Figure 1, and device size and brazed seam fillet detect and all meet the demands.
The instantaneous liquid phase diffusion of embodiment 2:H62 brass member connects
The parts of prewelding device are earlier silver-plated, and thickness of coating is at 10 μ m, 760 ℃ of welding temperatures, and 99.999% high-purity argon gas protection, pressure 0.02MPa, welding temperature retention time 60min, device size and brazed seam fillet detect and all meet the demands.
Claims (4)
1. H62 copper alloy device Ag-Cu-Zn liquid phase diffusion connecting method is characterized in that: may further comprise the steps:
Removal of impurities is handled before the weldering of step 1. workpiece;
Step 2. intermediate layer preparation: adopt plating mode to preset the Ag coating that thickness is 4-10 μ m at copper alloy surface;
Step 3. welding procedure: workpiece group to be connected joint style as requested is placed in the soldering oven, the protection of employing high purity inert gas, and above sample, apply balancing weight, heat tracing under the temperature that is no more than the Ag-Cu eutectic, its temperature is an arbitrary temp in 760～780 ℃ of warm areas, and the time that is incubated is 45-60min; Close heating, sample cools to the furnace below 200 ℃ and takes out sample, is cooled to room temperature in air, promptly finishes connection.
2. H62 copper alloy device Ag-Cu-Zn liquid phase diffusion connecting method according to claim 1, it is characterized in that: removal of impurities is treated to the process of the copper alloy parts surface after machine-shaping machining before the described step 1. workpiece weldering, and carries out ultrasonic cleaning and remove impurity such as greasy dirt in acetone.
3. H62 copper alloy device Ag-Cu-Zn liquid phase diffusion connecting method according to claim 1 is characterized in that: the balancing weight described in the step 3 is as the criterion with the weight that joint face 0.02MPa pressure is provided.
4. H62 copper alloy device Ag-Cu-Zn liquid phase diffusion connecting method according to claim 1, it is characterized in that: the purity of the high purity inert gas described in the step 3 is 99.999%.
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| CN2009100335733A CN101585103B (en) | 2009-06-23 | 2009-06-23 | H62 copper alloy device Ag-Cu-Zn liquid phase diffusion connecting method |
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| CN101585103B true CN101585103B (en) | 2011-05-04 |
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| CN114875463A (en) * | 2022-06-27 | 2022-08-09 | 西安理工大学 | Method for electrodepositing silver layer copper alloy/titanium alloy heterogeneous bimetal connection |
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Address after: 210000 Guorui Road, Yuhuatai District, Nanjing, Jiangsu Province Patentee after: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO. 14 Research Institute Address before: 1313 mailbox 210000, Jiangsu City, Nanjing Province Patentee before: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO. 14 Research Institute |