CN101580658A - 用于改善特征清晰度的共挤出油墨化学 - Google Patents
用于改善特征清晰度的共挤出油墨化学 Download PDFInfo
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- CN101580658A CN101580658A CNA2009101389285A CN200910138928A CN101580658A CN 101580658 A CN101580658 A CN 101580658A CN A2009101389285 A CNA2009101389285 A CN A2009101389285A CN 200910138928 A CN200910138928 A CN 200910138928A CN 101580658 A CN101580658 A CN 101580658A
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/40—Ink-sets specially adapted for multi-colour inkjet printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Micromachines (AREA)
Abstract
Description
Claims (2)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/119,727 | 2008-05-13 | ||
US12/119727 | 2008-05-13 | ||
US12/119,727 US8080181B2 (en) | 2008-05-13 | 2008-05-13 | Coextrusion ink chemistry for improved feature definition |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101580658A true CN101580658A (zh) | 2009-11-18 |
CN101580658B CN101580658B (zh) | 2014-05-07 |
Family
ID=40902869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910138928.5A Expired - Fee Related CN101580658B (zh) | 2008-05-13 | 2009-05-12 | 用于改善特征清晰度的共挤出油墨化学 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8080181B2 (zh) |
EP (1) | EP2119749A1 (zh) |
JP (1) | JP2009274205A (zh) |
CN (1) | CN101580658B (zh) |
TW (1) | TW201000215A (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100124602A1 (en) * | 2008-11-18 | 2010-05-20 | Palo Alto Research Center Incorporated | Easily flowing inks for extrusion |
US9120190B2 (en) * | 2011-11-30 | 2015-09-01 | Palo Alto Research Center Incorporated | Co-extruded microchannel heat pipes |
US10371468B2 (en) | 2011-11-30 | 2019-08-06 | Palo Alto Research Center Incorporated | Co-extruded microchannel heat pipes |
CN105451950B (zh) | 2013-08-15 | 2019-03-12 | 哈利伯顿能源服务公司 | 支撑剂的加成制造 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1068007A (zh) * | 1991-06-17 | 1993-01-13 | 纳幕尔杜邦公司 | 多层电子电路的制作方法 |
CN1249051A (zh) * | 1997-03-05 | 2000-03-29 | 美国3M公司 | 易更换的图象片 |
CN1620369A (zh) * | 2001-06-29 | 2005-05-25 | 3M创新有限公司 | 可接受溶剂型喷墨油墨的薄膜 |
Family Cites Families (10)
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JP2009502583A (ja) | 2005-08-05 | 2009-01-29 | フジフィルム マニュファクチャリング ユーロプ ビー.ブイ. | 多孔質膜およびそれを含む記録媒体 |
US20070169806A1 (en) | 2006-01-20 | 2007-07-26 | Palo Alto Research Center Incorporated | Solar cell production using non-contact patterning and direct-write metallization |
US20070107773A1 (en) | 2005-11-17 | 2007-05-17 | Palo Alto Research Center Incorporated | Bifacial cell with extruded gridline metallization |
US7765949B2 (en) | 2005-11-17 | 2010-08-03 | Palo Alto Research Center Incorporated | Extrusion/dispensing systems and methods |
US7799371B2 (en) | 2005-11-17 | 2010-09-21 | Palo Alto Research Center Incorporated | Extruding/dispensing multiple materials to form high-aspect ratio extruded structures |
US7780812B2 (en) | 2006-11-01 | 2010-08-24 | Palo Alto Research Center Incorporated | Extrusion head with planarized edge surface |
US7922471B2 (en) | 2006-11-01 | 2011-04-12 | Palo Alto Research Center Incorporated | Extruded structure with equilibrium shape |
US8322025B2 (en) | 2006-11-01 | 2012-12-04 | Solarworld Innovations Gmbh | Apparatus for forming a plurality of high-aspect ratio gridline structures |
US7928015B2 (en) | 2006-12-12 | 2011-04-19 | Palo Alto Research Center Incorporated | Solar cell fabrication using extruded dopant-bearing materials |
US20090107546A1 (en) | 2007-10-29 | 2009-04-30 | Palo Alto Research Center Incorporated | Co-extruded compositions for high aspect ratio structures |
-
2008
- 2008-05-13 US US12/119,727 patent/US8080181B2/en not_active Expired - Fee Related
-
2009
- 2009-03-30 EP EP09156742A patent/EP2119749A1/en not_active Ceased
- 2009-05-07 JP JP2009112725A patent/JP2009274205A/ja not_active Abandoned
- 2009-05-08 TW TW098115266A patent/TW201000215A/zh unknown
- 2009-05-12 CN CN200910138928.5A patent/CN101580658B/zh not_active Expired - Fee Related
Patent Citations (3)
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CN1068007A (zh) * | 1991-06-17 | 1993-01-13 | 纳幕尔杜邦公司 | 多层电子电路的制作方法 |
CN1249051A (zh) * | 1997-03-05 | 2000-03-29 | 美国3M公司 | 易更换的图象片 |
CN1620369A (zh) * | 2001-06-29 | 2005-05-25 | 3M创新有限公司 | 可接受溶剂型喷墨油墨的薄膜 |
Also Published As
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JP2009274205A (ja) | 2009-11-26 |
US20090286069A1 (en) | 2009-11-19 |
US8080181B2 (en) | 2011-12-20 |
CN101580658B (zh) | 2014-05-07 |
TW201000215A (en) | 2010-01-01 |
EP2119749A1 (en) | 2009-11-18 |
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