CN101556939A - Ceramic encapsulated base and manufacture method thereof - Google Patents
Ceramic encapsulated base and manufacture method thereof Download PDFInfo
- Publication number
- CN101556939A CN101556939A CNA2009100395772A CN200910039577A CN101556939A CN 101556939 A CN101556939 A CN 101556939A CN A2009100395772 A CNA2009100395772 A CN A2009100395772A CN 200910039577 A CN200910039577 A CN 200910039577A CN 101556939 A CN101556939 A CN 101556939A
- Authority
- CN
- China
- Prior art keywords
- ceramic matrix
- ceramic
- encapsulated base
- creme
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention relates to a ceramic encapsulated base structure and a manufacture method thereof, which mainly aims at solving the problem of the difficult arrangement of a metal ring in the prior art, reduces production cost and improves production efficiency. The ceramic encapsulated base comprises a ceramic matrix, a metal ring formed on the ceramic matrix by a way of printing or sputtering and an infiltration and transition combined layer formed between the ceramic matrix and the printed metal ring. The manufacture method comprises: (1) proportioning alloy paste material; (2) manufacturing a ceramic matrix;(3) adhering the alloy paste material on the surface of the ceramic matrix in a way of through printing or vacuum sputtering to form an alloy paste material ring layer and the infiltration and transition combined layer; and (4) co-firing the alloy paste material ring layer and the ceramic matrix in a reducing atmosphere to form a metal ring on the ceramic matrix surface. Compared with the prior art, the shape and thickness of the metal ring of the invention is easier to control, the alloy paste material ring layer and the ceramic matrix are co-fired to be integral, thus the airtightness is better, the production process is simplified, the quality defect caused by human factors is reduced and the invention is suitable for mass production.
Description
Technical field
The present invention relates to the essential electronic element of electricity field, be specifically related to ceramic encapsulated base of small-sized oscillator, LED etc. and preparation method thereof.
Background technology
Ceramic encapsulated base becomes desirable encapsulating material because of having characteristics such as thermal conductivity height, electric simulation strength height.Along with constantly weeding out the old and bring forth the new of products such as mobile phone, digital camera, PC, increasing to the demand of ceramic encapsulated base; In addition, along with the miniaturization and the product miniaturization requirement of surface mount elements, also more and more littler to the requirement of ceramic encapsulated base size.
The ceramic encapsulated base for the conventional metals encapsulation of Figure 1 and Figure 2 is the becket of punching press on the ceramic encapsulated base surface soldered, and the crown cap of burn-oning on the becket surface is then realized level Hermetic Package.
As shown in Figure 1, get ceramic matrix 21 earlier and carry out chemical method or galvanoplastic nickel plating, can cut down the silver-copper brazing alloy ring 22 that the length and width size cooperates by accurate location instrument handle and metal again is positioned on the ceramic matrix 21, same then by accurate location instrument, can cut down ring 23 to metal is positioned on the silver-copper brazing alloy ring 22, can cut down ring 23 ceramic matrix to the metal of having good positioning at last puts into the silver-bearing copper bonding wire stove of spending 800 more and carries out soldering, make ceramic encapsulated base integral body as shown in Figure 2, as seen from the figure, final ceramic encapsulated base can obviously be seen ceramic matrix 21, silver-bearing copper content ring 22 and metal can cut down ring 23 these three-deckers.
The defective of conventional art is: be difficult to guarantee because existing ceramic encapsulated base metal can cut down the accuracy of ring contraposition, add that brazing process also can cause metal can cut down the ring displacement, it is generally low to have caused existing ceramic encapsulated base brazing metal can cut down the rate of finished products of ring, production cost is high always, greatly limit the ceramic encapsulated base batch process, obviously can not satisfy the growing market demand at present; In addition, require the smooth no burr of becket of punching press, for undersized becket, accurate installing and locating and be welded to the ceramic encapsulated base surface and be the devil, make extremely difficult breakthrough of ceramic encapsulated base production technology of metallic packaging, production cost is high always, and output and miniaturization also are subjected to the restriction of technology, equipment each side, can not satisfy the growing market demand far away.Therefore, seeking a kind of simple method replaces present design, manufacture method extremely urgent.
Summary of the invention
The invention provides a kind of novel ceramic encapsulated base structure and preparation method thereof, mainly solve the prior art becket difficult problem is set, reduce production costs, enhance productivity.
Above-mentioned purpose is achieved by following technical scheme:
A kind of ceramic encapsulated base comprises ceramic matrix, it is characterized in that: also comprise the infiltration transition binder course that is formed on the becket on the ceramic matrix and forms between ceramic matrix and type metal ring by printing or sputter mode.
A kind of method for preparing the described ceramic encapsulated base of claim 1 is characterized in that, comprises the steps: (1) alloyage creme; (2) make ceramic matrix; (3) by bite or the vacuum sputtering mode with the alloy creme attached to the ceramic matrix surface, form alloy creme circular layer and infiltration transition binder course; (4) alloy creme circular layer and ceramic matrix are burnt under reducing atmosphere altogether, form becket on the ceramic matrix surface.
The present invention compared with prior art has the following advantages: adopt and bite/vacuum sputtering technological forming becket, the easier control of the shape of becket and thickness, and becket and ceramic matrix to burn altogether be an integral body, air-tightness is higher, has avoided traditional weld metal ring gas leakage problem.The present invention has simplified the production technology of ceramic encapsulated base, and operating technology is less demanding, and required operating personnel are few, and having reduced the people is the mass defect that causes.Reduce production cost, improved production efficiency, be fit to large-scale production, can greatly satisfy the growing market demand.
Description of drawings
Fig. 1 is the discrete schematic diagram of existing each part of ceramic encapsulated base;
Fig. 2 is that existing ceramic encapsulated base brazing metal can cut down back overall co-ordination schematic diagram;
Fig. 3 is the finished product schematic diagram of ceramic encapsulated base provided by the invention.
Embodiment
Embodiment one
Embodiment one is an example with the method for biting on 5032 ceramic encapsulated bases, and the preparation method who obtains becket may further comprise the steps:
(1) configuration kovar alloy creme; With cobalt, iron and nickel powder, be mixed with the kovar alloy creme that is fit to viscosity according to corresponding mixture ratio, also can be other alloy creme.
(2) make ceramic matrix; Utilize the required matrix green compact of The tape casting moulding, can sinter porcelain into, co-sintered in the time of also can treating step (4) in this step.
(3) on the ceramic matrix surface, with the printing machine of band microcomputer light location, by the mask alloy cream of biting, by printing creme Weight control, and in conjunction with the thickness of the required becket of film thickness monitoring of thick-film printed circuit.
(4) for fear of alloy cream high-temperature oxydation, ceramic encapsulated base that will printing kovar alloy cream puts in the atmosphere furnace being higher than that the high temperature co-firing knot obtains having the ceramic encapsulated base that required metal can cut down layer under 1500 ℃ of temperature.Feed H in the atmosphere furnace
2H by the ammonia decomposition
2With N
2Gaseous mixture.
As shown in Figure 3, the whole finished product of ceramic encapsulated base that obtains according to the preparation side of ceramic encapsulated base becket in the present embodiment is by ceramic matrix 11, printing forms it on becket 12 and form between the two to permeate and become an integral body in conjunction with transition zone 13 co-sintered.Follow-up to cut down loam cake welding back air-tightness good, and the technical parameter that reaches is as follows:
Encapsulation torsion: 5～8Kgf.cm, average 6.5Kgf.cm
Air-tightness: do not have gas leakage.
Embodiment two
Embodiment two is with the difference of embodiment one: kovar alloy cream passes through the mode of vacuum sputtering attached to the ceramic encapsulated base surface, forms alloy creme circular layer and infiltration transition binder course, burns the formation becket then altogether.
Claims (7)
1, a kind of ceramic encapsulated base comprises ceramic matrix, it is characterized in that: also comprise the infiltration transition binder course that is formed on the becket on the ceramic matrix and forms between ceramic matrix and type metal ring by printing or sputter mode.
2, a kind of method for preparing the described ceramic encapsulated base of claim 1 is characterized in that, comprises the steps: (1) alloyage creme; (2) make ceramic matrix; (3) by bite or the vacuum sputtering mode with the alloy creme attached to the ceramic matrix surface, form alloy creme circular layer and infiltration transition binder course; (4) alloy creme circular layer and ceramic matrix are burnt under reducing atmosphere altogether, form becket on the ceramic matrix surface.
3, the method for preparing ceramic encapsulated base according to claim 2 is characterized in that: be by cobalt, iron and the cut down metal creme of nickel powder preparation formation with viscosity in the step (1).
4, the method for preparing ceramic encapsulated base according to claim 2 is characterized in that: the ceramic matrix in the step (2) refers to base substrate before the sintering or the pottery behind the sintering.
5, the method for preparing ceramic encapsulated base according to claim 2, it is characterized in that: described in the step (3) bite specifically comprise: with the printing machine of band microcomputer light location, by the mask alloy cream of biting, by printing creme Weight control, and in conjunction with the thickness of the required becket of film thickness monitoring of thick-film printed circuit.
6, the method for preparing ceramic encapsulated base according to claim 2 is characterized in that: in the step (4), described reducing atmosphere adopts H
2Or the H of ammonia decomposition
2With N
2Gaseous mixture.
7, the method for preparing ceramic encapsulated base according to claim 6 is characterized in that: the atmosphere furnace temperature is higher than 1500 ℃ when burning altogether in the step (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100395772A CN101556939B (en) | 2009-05-19 | 2009-05-19 | Ceramic encapsulated base and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100395772A CN101556939B (en) | 2009-05-19 | 2009-05-19 | Ceramic encapsulated base and manufacture method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101556939A true CN101556939A (en) | 2009-10-14 |
| CN101556939B CN101556939B (en) | 2011-06-29 |
Family
ID=41174987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100395772A Expired - Fee Related CN101556939B (en) | 2009-05-19 | 2009-05-19 | Ceramic encapsulated base and manufacture method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101556939B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101997510A (en) * | 2010-10-18 | 2011-03-30 | 台晶(宁波)电子有限公司 | Manufacturing method of wafer level encapsulating structure for through-hole vibrator device |
| CN102254875A (en) * | 2011-07-11 | 2011-11-23 | 中国电子科技集团公司第五十五研究所 | Ceramic package and manufacturing method thereof |
| CN110828319A (en) * | 2019-12-10 | 2020-02-21 | 石家庄恒融世通电子科技有限公司 | Method for preparing sealing ring of integrated circuit packaging shell |
| CN111613710A (en) * | 2020-06-29 | 2020-09-01 | 松山湖材料实验室 | Electronic equipment, semiconductor device, packaging structure, support and manufacturing method thereof |
| CN113213950A (en) * | 2021-05-18 | 2021-08-06 | 中国科学院长春光学精密机械与物理研究所 | Preparation method of ceramic packaging base |
-
2009
- 2009-05-19 CN CN2009100395772A patent/CN101556939B/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101997510A (en) * | 2010-10-18 | 2011-03-30 | 台晶(宁波)电子有限公司 | Manufacturing method of wafer level encapsulating structure for through-hole vibrator device |
| CN102254875A (en) * | 2011-07-11 | 2011-11-23 | 中国电子科技集团公司第五十五研究所 | Ceramic package and manufacturing method thereof |
| CN110828319A (en) * | 2019-12-10 | 2020-02-21 | 石家庄恒融世通电子科技有限公司 | Method for preparing sealing ring of integrated circuit packaging shell |
| CN110828319B (en) * | 2019-12-10 | 2021-08-31 | 石家庄恒融世通电子科技有限公司 | Method for preparing sealing ring of integrated circuit packaging shell |
| CN111613710A (en) * | 2020-06-29 | 2020-09-01 | 松山湖材料实验室 | Electronic equipment, semiconductor device, packaging structure, support and manufacturing method thereof |
| CN113213950A (en) * | 2021-05-18 | 2021-08-06 | 中国科学院长春光学精密机械与物理研究所 | Preparation method of ceramic packaging base |
| CN113213950B (en) * | 2021-05-18 | 2023-02-14 | 中国科学院长春光学精密机械与物理研究所 | Preparation method of ceramic packaging base |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101556939B (en) | 2011-06-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101556939B (en) | Ceramic encapsulated base and manufacture method thereof | |
| CN105788779B (en) | A kind of sub- package casing of glass ceramics compound type insulating and preparation method thereof | |
| CN101433126A (en) | Power terminals for ceramic heater and method of making the same | |
| CN103100825A (en) | Manufacturing method for pre-alloying gold-tin pre-forming soldering lug | |
| CN104220396B (en) | Ceramic matrix and manufacture method thereof | |
| CN106631036A (en) | Sintering method of high-temperature co-firing aluminum nitride ceramics | |
| CN105948825A (en) | Ceramic composite layer for brazing and preparation method thereof | |
| CN103066941A (en) | Surface mounted device (SMD) quartz-crystal resonator base and processing method thereof | |
| CN107946248A (en) | A kind of ceramic contact pin shell mechanism and its manufacture method | |
| CN103840790A (en) | Cold pressure welding ceramic package case and crystal oscillator using the same | |
| CN201515351U (en) | Ceramic enclosed foundation bed | |
| JP4483366B2 (en) | Semiconductor package and manufacturing method thereof | |
| CN202750054U (en) | Surface mount device (SMD) quartz-crystal resonator base | |
| CN105355339A (en) | Ceramic insulator | |
| CN110112105A (en) | For encapsulating the ceramic shell and preparation method thereof of double metal-oxide-semiconductors and replacement SOP8 plastic device in situ | |
| WO2001017045A3 (en) | Layer between a cathode and an interconnector of a fuel cell and method for producing a layer of this type | |
| KR20030092692A (en) | The fabrication method of thermoelectric material united thermoelectric element with electrode | |
| CN205621525U (en) | Compound insulator of glass -ceramic encapsulation shell | |
| CN108025982A (en) | Ceramic matrix and its manufacture method | |
| CN105470208B (en) | ceramic substrate | |
| JPH02500907A (en) | Ceramic/glass/metal composite | |
| CN214957808U (en) | Gas discharge tube with integrated electrode | |
| CN203014756U (en) | Percussion welding ceramic sealed housing and crystal oscillator employing same | |
| CN209729885U (en) | Encapsulate the ceramic shell of double metal-oxide-semiconductors and replacement SOP8 plastic device in situ | |
| CN104557048A (en) | Sintering jig and manufacturing method for electronic components |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110629 Termination date: 20200519 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |