CN101556931A - Wafer cassette - Google Patents
Wafer cassette Download PDFInfo
- Publication number
- CN101556931A CN101556931A CNA2009100515632A CN200910051563A CN101556931A CN 101556931 A CN101556931 A CN 101556931A CN A2009100515632 A CNA2009100515632 A CN A2009100515632A CN 200910051563 A CN200910051563 A CN 200910051563A CN 101556931 A CN101556931 A CN 101556931A
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- CN
- China
- Prior art keywords
- wafer
- block
- supporting
- brilliant boat
- wafer cassette
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer cassette which comprises a plurality of wafer grooves; the wafer grooves respectively comprise a plurality of supporting units which are used for supporting the wafers; the supporting units comprise first supporting blocks and second supporting blocks, wherein, the second supporting blocks are arranged on the first supporting blocks and are smaller than the first supporting blocks. The wafer cassette can prevent the wafer from tiny granule pollution caused by friction between the wafer and the wafer cassette, so as to ensure cleanness of the wafer without influencing evenness of wafer processing procedure and reducing the amount of wafers contained by the wafer cassette. Therefore, the wafer cassette can further ensure normal operation of subsequent processing equipments, ensure product yield and reduce production cost.
Description
Technical field
The present invention relates to field of semiconductor manufacture, particularly a kind of brilliant boat that is used to produce wafer.
Background technology
Along with the progress of science and technology, the semiconductor electronic product has been applied to the every field of social life, and these semiconductor electronic products all have semiconductor wafer, this shows, semiconductor wafer has the importance of highly significant in current life.
In the manufacture process of semiconductor wafer, boiler tube is an indispensable equipment, and the diffusion process of for example wherein utilizing boiler tube is exactly a basic processing procedure, in the diffusion process, be earlier the multi-disc wafer to be placed on the brilliant boat, brilliant boat be placed on carry out a batch manufacturing in the boiler tube again.For semiconductor wafer, same during the quality and the quantity of the wafer that goes out of an inherent device fabrication, largely have influence on the yields of producing and the manufacturing cost of semiconductor wafer.
Yet, in the prior art, in the technological process of making semiconductor wafer, have several factors may cause the production of semiconductor wafer to go wrong.See also Figure 1A, for example when multi-disc wafer 110 is inserted into the wafer slot 120 of brilliant boat 100, owing between wafer 110 and the wafer slot 120 friction is arranged, can produce small particle 130, brilliant boat is vertically placed, because the effect of gravity, when extracting wafer 110, wafer 110 and wafer slot 120 fricative particles 130 can drop on the following wafer 110, and this will cause the surface of small particle 130 polluting wafers 110, see also Figure 1B, it is depicted as and is subjected to the wafer 110 that particle 130 pollutes, and then can cause follow-up manufacturing process normally not carry out, and influences yield of products, increase manufacturing cost.
Summary of the invention
The present invention is intended to solve in the prior art, and wafer is placed in the brilliant boat, because fricative molecule causes the technical problem of the pollution of wafer.
In view of this, the invention provides a kind of brilliant boat, comprising: a plurality of wafer slots, comprise a plurality of support portions respectively, be used for supporting wafer; Described support portion comprises: first back-up block; And second back-up block; Wherein said second back-up block is arranged on described first back-up block, and less than described first back-up block.
Further, described second back-up block and described first back-up block are positioned at the upper support face of described first back-up block.
Further, described a plurality of wafer slot is arranged in parallel and is identical at interval.
Brilliant boat provided by the present invention can not influence the silicon wafer process uniformity, not reduce under the prerequisite of brilliant boat placement wafer number, avoid the fricative molecule polluting wafer of wafer and brilliant boat, guarantee the cleanliness factor of wafer, further guaranteed the normal operation of subsequent technique equipment, guarantee yield of products, reduced manufacturing cost.
Description of drawings
Figure 1A is depicted as the schematic diagram that employed brilliant boat in the prior art causes the dust granule polluting wafer;
Figure 1B is depicted as the schematic diagram of the wafer that is subjected to particle contamination;
Figure 2 shows that the schematic diagram of the brilliant boat that one embodiment of the invention provides;
Figure 3 shows that the schematic diagram of the support portion of the brilliant boat that one embodiment of the invention provides.
Embodiment
For purpose of the present invention, feature are become apparent, provide preferred embodiment also in conjunction with the accompanying drawings, the invention will be further described.
Please participate in Fig. 2, it is depicted as the schematic diagram of the brilliant boat that one embodiment of the invention provides.This crystalline substance boat 200 comprises: a plurality of wafer slots 210, comprise a plurality of support portions 220 respectively, and be used for supporting wafer; Described support portion 220 comprises: first back-up block 222; And second back-up block 221; Wherein said second back-up block 221 is arranged on described first back-up block 222, and less than described first back-up block 222.
In the present embodiment, when the multi-disc wafer is inserted into the wafer slot 210 of brilliant boat 200, owing between wafer and the wafer slot 210 friction is arranged, can produce small particle, brilliant boat is vertically placed, because the effect of gravity, when extracting wafer, the particle that the upper support face contact friction of second back-up block 221 of the support portion 220 of wafer and wafer slot 210 produces, because first back-up block 222 is greater than second back-up block 221, these particles drop to the supporting surface of first back-up block 222, and can not drop on the following wafer, and this has just guaranteed the cleaning of crystal column surface.
In the present embodiment, described second back-up block 221 and described first back-up block 222 are positioned at the supporting surface of described first back-up block 222, are collected by the supporting surface of first back-up block 222 fully to guarantee particle.
In the present embodiment, described a plurality of wafer slots 210 are arranged in parallel, and identical at interval, and this has just guaranteed the quantity and the uniformity that wafer is placed, and wafer is being added man-hour, makes each wafer can both be in identical environment, has guaranteed the quality of wafer.
In the present embodiment, please in conjunction with referring to Fig. 3, it is depicted as the schematic diagram of the support portion of the brilliant boat that present embodiment provides.This support portion 300 comprises: first back-up block 310; And second back-up block 320, be arranged on described first back-up block 310, and less than described first back-up block 310.Described second back-up block 320 is positioned at described first back-up block, 310 supporting surfaces.When wafer is placed wafer slot, be upper support face supporting wafer, when extracting wafer by second back-up block 320; can drop to the supporting surface of first back-up block 310 because of fricative particle; and can not drop on the wafer face, avoided wafer to be subjected to particle contamination, guaranteed the cleaning of wafer.
The brilliant boat that the embodiment of the invention provided can not influence the silicon wafer process uniformity, not reduce under the prerequisite of brilliant boat placement wafer number, avoid the fricative molecule polluting wafer of wafer and brilliant boat, guarantee the cleanliness factor of wafer, further guaranteed the normal operation of subsequent technique equipment, guarantee yield of products, reduced manufacturing cost.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking claims person of defining.
Claims (3)
1. a brilliant boat is characterized in that, comprising:
A plurality of wafer slots comprise a plurality of support portions respectively, are used for supporting wafer;
Described support portion comprises: first back-up block; And second back-up block;
Wherein said second back-up block is arranged on described first back-up block, and less than described first back-up block.
2. brilliant boat according to claim 1 is characterized in that, described second back-up block and described first back-up block are positioned at the supporting surface of described first back-up block.
3. brilliant boat according to claim 1 is characterized in that, described a plurality of wafer slots are arranged in parallel and are identical at interval.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910051563A CN101556931B (en) | 2009-05-19 | 2009-05-19 | Wafer cassette |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910051563A CN101556931B (en) | 2009-05-19 | 2009-05-19 | Wafer cassette |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101556931A true CN101556931A (en) | 2009-10-14 |
| CN101556931B CN101556931B (en) | 2012-09-19 |
Family
ID=41174981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910051563A Active CN101556931B (en) | 2009-05-19 | 2009-05-19 | Wafer cassette |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101556931B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102560683A (en) * | 2010-12-29 | 2012-07-11 | 有研半导体材料股份有限公司 | Method and quartz boat for preventing edge breakage of silicon wafer in heat treatment process |
| CN114351256A (en) * | 2020-10-13 | 2022-04-15 | 中国科学院微电子研究所 | Wafer boat, disassembling tool and wafer processing equipment |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI250604B (en) * | 1999-07-29 | 2006-03-01 | Ibm | Improved ladder boat for supporting wafers |
| US6638391B1 (en) * | 2002-06-19 | 2003-10-28 | United Microelectronics Corp. | Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same |
| CN1915760A (en) * | 2005-08-15 | 2007-02-21 | 奇景光电股份有限公司 | Chip tray |
-
2009
- 2009-05-19 CN CN200910051563A patent/CN101556931B/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102560683A (en) * | 2010-12-29 | 2012-07-11 | 有研半导体材料股份有限公司 | Method and quartz boat for preventing edge breakage of silicon wafer in heat treatment process |
| CN102560683B (en) * | 2010-12-29 | 2015-09-30 | 有研半导体材料有限公司 | A kind of prevent silicon chip from heat treatment process, collapsing limit method and quartz boat |
| CN114351256A (en) * | 2020-10-13 | 2022-04-15 | 中国科学院微电子研究所 | Wafer boat, disassembling tool and wafer processing equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101556931B (en) | 2012-09-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI Effective date: 20140520 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20140520 Address after: 201203 Shanghai Zhangjiang hi tech park Zuchongzhi Road No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201203 Shanghai Guo Shou Jing Road, Zhangjiang hi tech Park No. 818 Patentee before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |