CN101556910A - Processer - Google Patents
Processer Download PDFInfo
- Publication number
- CN101556910A CN101556910A CNA2009101331335A CN200910133133A CN101556910A CN 101556910 A CN101556910 A CN 101556910A CN A2009101331335 A CNA2009101331335 A CN A2009101331335A CN 200910133133 A CN200910133133 A CN 200910133133A CN 101556910 A CN101556910 A CN 101556910A
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- Prior art keywords
- guide rail
- ring
- shaped frame
- plant
- workpiece
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- 238000000034 method Methods 0.000 abstract description 18
- 230000007246 mechanism Effects 0.000 abstract description 8
- 238000005520 cutting process Methods 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 10
- 238000003754 machining Methods 0.000 description 9
- 230000001678 irradiating effect Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005465 channeling Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- -1 splicing tape Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Abstract
The invention provides a processor, which can ensure the space and simplify the mechanisms of devices. The processor (1) comprises: a maintaining component for maintaining workpieces (7) supported at the opening of annular frameworks (8) by a bonding belt, a processing component for processing the workpieces (7) maintained at the maintaining component, and a vacating component (11) which vacates the annular frameworks (8) from a case (6) loaded on a case work platform to a temporary placing area (3) of frameworks, wherein a locating device (10) is arranged in the processor (1) and comprises: framework guideways (12a, 12b) which load the annular frameworks vacated by the vacating component (11), and a guideway driving component (14) which causes the framework guideways (12a, 12b) to be at the position where the annular frameworks (8) are opened and at the clamping position where the annular frameworks (8) are located and moves the annular frameworks from the temporary placing area (3) to a next working procedure area (5).
Description
Technical field
The present invention relates to processing unit (plant) that various workpiece such as semiconductor wafer, glass, metal and plastics are processed.
Background technology
For example, in the manufacturing process of semiconductor device, integrated circuit) or LSI (large-scaleintegration: circuit such as large scale integrated circuit) form a plurality of IC (integrated circuit: on the surface of the semiconductor wafer of circular plate shape roughly, each zone that will be formed with these circuit is the cutting of clathrate ground along predetermined spacing track (cut-out line), produces semiconductor chip one by one thus.
As the device of cutting semiconductor chip, generally use topping machanism.On the device of such cutting semiconductor chip, be provided with usually: chuck table, it utilizes negative pressure to adsorb workpiece such as keeping semiconductor wafer; And cutting mechanism, it has the cutting tool (for example, with reference to patent documentation 1) that the workpiece that remains on this chuck table is cut.
In addition, under the situation of workpiece such as cutting semiconductor chip, the positioning accuracy when remaining to workpiece on the chuck table in order to improve need be carried out the location of workpiece in advance.Therefore, the applicant is at the framework positioner (with reference to patent documentation 2) that has proposed can precision to carry out well the location of workpiece in the past.In patent documentation 2 described positioners, before cutting or after the cutting, in interim zone of placing the workpiece that remains on the ring-shaped frame, be in the interim put area of framework, be equipped with the frame guide rail that can be positioned open mode and clamp position.
In this positioner, at first, make frame guide rail become open mode, the ring-shaped frame that maintains workpiece is taken out to the interim put area of framework from box.Then, make frame guide rail become clamp position, when keeping this state,, carry out the location of workpiece thus to box side shifting scheduled volume.In addition, this device is used for the workpiece that remains on the frame guide rail is positioned, with oriented work transporting to subsequent processing when zone, need other conveyance member.
In existing cutter sweep, generally use arm with work transporting to the subsequent processing zone (for example, with reference to patent documentation 3).In addition, the wafer ring supply method (with reference to patent documentation 4) that carrying arm can be moved along track.
Patent documentation 1: Japanese kokai publication hei 8-25209 communique
Patent documentation 2: Japanese kokai publication hei 11-204461 communique
Patent documentation 3: TOHKEMY 2007-281094 communique
Patent documentation 4: Japanese kokai publication hei 5-67670 communique
But,, then have the space in the [and cause the complicated problem of mechanism in the device if, conveyance members such as arm are set in each processing region as patent documentation 3,4 described devices.
Summary of the invention
Therefore, main purpose of the present invention is to provide a kind of processing unit (plant) that can guarantee the space in the device and make the simplification of device inner structure.
Processing unit (plant) of the present invention has: retaining member, and it keeps the workpiece that is bearing in the peristome of ring-shaped frame through splicing tape; Tool member, it is processed the workpiece that remains on the above-mentioned retaining member; With take out of member, it is taken out of above-mentioned ring-shaped frame to the interim put area of the framework of interim this ring-shaped frame of placement from mounting box in the box workbench, above-mentioned processing unit (plant) is characterised in that, this processing unit (plant) has positioner, this positioner comprises: frame guide rail, and it is taken out of the ring-shaped frame that member is taken out of in the interim put area mounting of said frame by above-mentioned; With the guide rail drive member, the clip position that it is positioned at the said frame guide rail to make the open position of above-mentioned ring-shaped frame and above-mentioned ring-shaped frame is positioned, and with this frame guide rail conveyance to the subsequent processing zone.
In processing unit (plant) of the present invention, positioner carries out the conveyance to next process zone of the location of workpiece and workpiece.That is, positioner is also used as the conveyance member.
In addition, in this processing unit (plant), above-mentioned guide rail drive member also can have: first drive division, and it makes the said frame guide rail be positioned at above-mentioned release position and above-mentioned clip position; With second drive division, it is transferred to the subsequent processing zone with the said frame guide rail.
According to the present invention, because positioner is held a concurrent post carrying device, do not need to be used for the arm of workpiece from the interim put area conveyance of framework to the subsequent processing zone, therefore can guarantee the space, and can make mechanism simplifying in the device in this part.
Description of drawings
Fig. 1 is the stereogram of the processing unit (plant) of expression first execution mode of the present invention.
Fig. 2 is the vertical view that expression is arranged on the layout of each processing region in the processing unit (plant) shown in Figure 1.
Fig. 3 is the stereogram of expression positioner shown in Figure 2.
Fig. 4 is the figure that schematically shows the relation of guide rail in the positioner shown in Figure 3 and conveyance member.
The flow chart of Fig. 5 operation that to be the expression processing unit (plant) that utilizes first execution mode of the present invention process workpiece.
(a)～(f) of Fig. 6 is the vertical view of representing the action of positioner shown in Figure 3 according to process sequence.
(a)～(f) of Fig. 7 is the vertical view of action of positioner of processing unit (plant) of representing the variation of first execution mode of the present invention according to process sequence.
Fig. 8 is the figure that schematically shows the structure of the positioner in the processing unit (plant) of second execution mode of the present invention.
Label declaration
1: processing unit (plant); 2: box mounting zone; 3: the interim put area of framework; 4: machining area; 5: the subsequent processing zone; 6: box; 7: workpiece; 8: ring-shaped frame; 10,20: positioner; 11,21: take out of member; 12a, 12b, 22a, 22b: frame guide rail; 13: the guide rail drive member; 14: the guide rail transferring members; 15: band; 16: motor; 17,27a, 27b: ball-screw; 18,28a, 28b: drive division; 19: install and use anchor clamps.
Embodiment
Below, describe being used to implement best mode of the present invention with reference to accompanying drawing.At first, the processing unit (plant) to first execution mode of the present invention describes.Fig. 1 is the stereogram of the processing unit (plant) of expression present embodiment, and Fig. 2 is the vertical view that expression is arranged on the layout of each processing region in the processing unit (plant) shown in Figure 1.The processing unit (plant) 1 of present embodiment shown in Figure 1 is the device that the workpiece that is bearing in the peristome of ring-shaped frame through splicing tape is processed; as shown in Figure 2; this processing unit (plant) 1 is provided with box mounting zone 2, the interim put area 3 of framework and machining area 4 at least; in addition; as required, diaphragm can be set forms the zone and/or cleans the zone.
Be provided with the box workbench with elevating mechanisms such as lifts in the box mounting zone 2 in the processing unit (plant) 1 of present embodiment, mounting box on this box workbench is taken in this box the one or more ring-shaped frames of work mounting s in peristome.In addition, regulate the position of above-below direction of the box of institute's mounting by this elevating mechanism, to take out predetermined ring-shaped frame.
In addition, the interim put area 3 of framework is interim zones of placing the ring-shaped frame that takes out from box, in the processing unit (plant) 1 of present embodiment, in this zone, utilizes the profile of ring-shaped frame to carry out the location of workpiece.In addition, as long as the interim put area 3 of this framework is arranged between box mounting zone 2 and the machining area 4, but be arranged on usually and box mounting zone 2 position adjacent.
In addition, machining area 4 is the zones of workpiece being implemented processing such as cutting, cut-out and boring, and this machining area 4 is provided with at least: retaining member, and it keeps the workpiece that is bearing on the ring-shaped frame; And tool member, it is processed the workpiece that remains on this retaining member.As the retaining member that in the processing unit (plant) 1 of present embodiment, uses, for example, enumerate the chuck table that utilizes negative pressure to adsorb to keep workpiece etc.In addition, as tool member, enumerate cutter and laser etc., but can suitably select according to the kind of workpiece and processing.
In addition, in the processing unit (plant) 1 of present embodiment, be provided with positioner 10 with location and these two functions of conveyance.Fig. 3 is the stereogram of expression positioner 10, and Fig. 4 is the figure that schematically shows the relation of the guide rail of this positioner and conveyance member.As shown in Figure 3, have on positioner 10: take out of member 11, its ring-shaped frame 8 that will be supported with as the workpiece 7 of processing object takes out the box 6 in box mounting zone 2 from mounting; Pair of frames guide rail 12a, 12b, the ring-shaped frame 8 that its mounting is taken out; Guide rail drive division 13, its make these frame guide rails 12a, 12b to mutually approaching direction or away from the direction motion; With guide rail transferring members 14, it makes frame guide rail 12a, 12b move to next process zone from the interim put area 3 of framework.
Take out of the abutting part that member 11 has the handle part of controlling ring-shaped frame 8 and is used to compress ring-shaped frame 8 in this positioner 10, this is taken out of member 11 and for example utilizes towards box 6 and extend guiding groove (not shown) channeling conduct that is provided with etc., can make this take out of member 11 and move in preset range.
In addition, the cross section of frame guide rail 12a, 12b forms roughly L font, and this frame guide rail 12a, 12b separate predetermined space ground and dispose in parallel to each other.Like this, frame guide rail 12a, 12b constitute by its bottom surface supporting ring-shaped frame 8 and by the structure of side clamping ring-shaped frame 8.In addition, frame guide rail 12a, 12b are preferably formed by the such coefficient of friction of for example fluorine-type resin material little, that resistance to wear is outstanding.
In addition,, for example, as shown in Figure 4, frame guide rail 12a, 12b be installed in be with on 15, utilize motor 16 to make this be with 15 rotations, can constitute thus and make frame guide rail 12a, the 12b structure of mobile phase same distance simultaneously about guide rail drive member 13.
In addition, as shown in Figure 4, guide rail transferring members 14 has the drive division 18 that sets the ball-screw 17 in subsequent processing zone 5 and this ball-screw 17 is rotated from the interim put area 3 of framework.This drive division 18 can use for example motor etc.In addition, on the ball-screw 17 of guide rail transferring members 14, with anchor clamps 19 frame guide rail 12a, 12b are installed via installing, drive division 18 makes ball-screw 17 rotations, and thus, frame guide rail 12a, 12b move between each zone along the lead screw shaft of ball-screw 17.That is, in the processing unit (plant) 1 of present embodiment, utilized the handover of the workpiece after the location that arm carries out itself to carry out by positioner 10 in the past.
Next, the Work piece processing method to the processing unit (plant) 1 that used present embodiment describes.Fig. 5 is the flow chart that expression utilizes the operation that 1 pair of workpiece of processing unit (plant) of present embodiment processes.As shown in Figure 5, in the processing unit (plant) 1 of present embodiment, at first, the ring-shaped frame 8 that is supported with as the workpiece 7 of processing object is taken out of (step S1) from mounting the box 6 in box mounting zone 2, after the location of having carried out workpiece 7 (step S2), with workpiece 7 conveyances to next process zone.
Below, localization method in the processing unit (plant) 1 of present embodiment and work transporting method are at length described.(a)～(f) of Fig. 6 is the vertical view of representing the action of positioner 10 according to process sequence.As shown in Figure 6, under the initial condition before the action beginning, frame guide rail 12a, 12b are the state (open state) that separates with degree that can mounting ring-shaped frame 8, take out of member 11 be configured in separate with box 6 and not with frame guide rail 12a, 12b position contacting.
Then, at first, shown in Fig. 6 (b), make and take out of member 11 and move, the end of the ring-shaped frame 8 that utilizes handle part to control to take in the box 6 to direction near box 6.Next, shown in Fig. 6 (c), make and take out of member 11 and moving to direction, the ring-shaped frame 8 that is supported with as the workpiece 7 of processing object is taken out of in the interim put area 3 of framework away from box 6 holding under the state of ring-shaped frame 8.Then, remove the gripping state of the handle part take out of member 11, with ring-shaped frame 8 mountings on frame guide rail 12a, 12b.
Next, shown in Fig. 6 (d), make frame guide rail 12a, 12b move to the precalculated position, form and utilize frame guide rail 12a, 12b clamping the state (clamp position) of ring-shaped frame 8 to mutual approaching direction.Thus, finish the location of ring-shaped frame 8 (workpiece 20) on the x direction.
Next, shown in Fig. 6 (e), keep the clamp position of frame guide rail 12a, 12b, make once more and take out of member 11 and move preset distance to direction near box 6.Then, utilize abutting part to push the end of ring-shaped frame 8, make ring-shaped frame 8 mobile a little to box 6 sides.Thus, finish the location of ring-shaped frame 8 (workpiece 7) on the y direction.At this moment, because frame guide rail 12a, 12b become clamp position, so, also can not swing even if ring-shaped frame 8 is moved at the y direction of principal axis.
Then, shown in Fig. 6 (f), keep the clamp position of frame guide rail 12a, 12b, utilize guide rail mobile member 14 that frame guide rail 12a, 12b are transferred to subsequent processing zone 5.
In addition; as the subsequent processing zone 5 in the present embodiment; list before processing the diaphragm that on the machined surface of workpiece, forms diaphragm form the zone, after processing the cleaning zone, machining area 4 etc. of the machined surface etc. of cleaning workpiece, but be not limited thereto.In addition, subsequent processing zone 5 might not be a zone, also can be or across setting ball-screw regionally with interim put area 3 adjacent areas of framework and another these two in zone adjacent with this zone in adjacent with the interim put area of framework 3 two zones, thus can between these zones, transfer.
Next, in machining area 4, workpiece 7 is implemented processing (step S3) such as cutting, cut-out and boring.Below, be that example describes with the situation of utilizing laser to cut.At first, the rotary chuck workbench, make along direction extend respectively to cut apart preset lines parallel with the x direction, will be determined to the laser light irradiation position along a y direction position of cutting apart preset lines of x direction extension.From this state travelling carriage is moved along the x direction, after cutting apart preset lines and having arrived the laser light irradiation zone, irradiate laser beam from laser irradiating part.1 of the wafer that moves along the x direction with travelling carriage is cut apart preset lines irradiating laser light, cut apart after preset lines left the laser light irradiation zone, stop the irradiation of laser beam at once at this.All preset lines of cutting apart of extending along the x direction are carried out such laser light irradiation action.
Next, make the chuck table half-twist, make along and shone that a plurality of directions of cutting apart the preset lines quadrature of laser beam extend respectively to cut apart preset lines parallel with the x direction.Then, by the method identical, to all preset lines irradiating laser light of cutting apart that extend along the x direction of irradiating laser light not with said method.Thus, workpiece 7 is cut apart in the precalculated position, thereby obtains a plurality of chips.
Then, with the ring-shaped frame 8 that is supported with the workpiece 7 after machining once more mounting on frame guide rail 12a, 12b, and move in the box 6 of before processing, taking in this ring-shaped frame 8 or the new box (step S4) by taking out of member 11.At this moment, also can the machined surface of workpiece 7 be cleaned before in moving into box.
As mentioned above, in the processing unit (plant) 1 of present embodiment,, therefore do not need to be used for workpiece is transplanted on from the interim put area 3 of framework the carrying arm in subsequent processing zone 5 because positioner 10 has positioning function and two kinds of functions of conveyance function.Thus, compare, can guarantee the space in the device with existing processing unit (plant), particularly can be in the top belay space of the interim put area 3 of framework, and can make mechanism simplifying in the device.Its result is that the degree of freedom of device design compared with the past uprises.
In addition, in the processing unit (plant) 1 of present embodiment, because frame guide rail 12a, 12b are mobile under clamp position, so can when keeping oriented state, workpiece 7 be transferred to subsequent processing zone 5.Therefore, can not reduce owing to handover makes positioning accuracy.
In addition, as the workpiece that the processing unit (plant) 1 that uses present embodiment is processed, list by semiconductor wafer, DAF (DieAttach Film: various substrates, the packaging body of semiconductor article and the various rapidoprints of the precision that requirement has micron order etc. that the chip attachment film) wait inorganic material such as splicing tape, glass and silicon, constitute by metal material or plastics etc.
In addition, also can move in linkage, then can in the conveyance workpiece, position with frame guide rail as long as take out of member.(a)～(f) of Fig. 7 is the vertical view of action of positioner of representing the processing unit (plant) of modified embodiment of the present embodiment according to process sequence.In addition, in positioner shown in Figure 7, the part identical with the structure important document of positioner shown in Figure 6 is marked with same numeral, and omits its detailed explanation.Shown in Fig. 7 (a)～(c), in the processing unit (plant) of this variation, utilize the method identical with the processing unit (plant) of above-mentioned first execution mode, the ring-shaped frame 8 that is supported with workpiece 7 is taken out of from box 6.
Then, shown in (d) and Fig. 7 (e) of Fig. 7, in the handover process of next process zone 5, formation utilizes the state (clamp position) of frame guide rail 12a, 12b clamping ring-shaped frame 8, and, when keeping this state, the end that utilizes the abutting part take out of member 21 to push ring-shaped frame 8 makes ring-shaped frame 8 mobile a little to box 6 sides.Then, to shown in (f), arrive next machining area 5, the location of so far finishing x direction and y direction as Fig. 7.In addition, the structure except that taking out of member in the processing unit (plant) of this variation is identical with the processing unit (plant) 1 of above-mentioned first execution mode.
In the processing unit (plant) of this variation, owing to can in the conveyance workpiece, position, so on the basis of above-mentioned effect, also can obtain to shorten the effect of the needed time of processing of a workpiece.Thus, compare with conventional device and can improve beat.
Next, the processing unit (plant) to second execution mode of the present invention describes.Fig. 8 is the figure that schematically shows the structure of the positioner in the processing unit (plant) of present embodiment of the present invention.In addition, in positioner shown in Figure 8 20, the part identical with the structure important document of positioner 10 shown in Figure 4 is marked with same numeral, and omits its detailed explanation.
About the processing unit (plant) of present embodiment, the structure that guide rail drive member in constituting positioner and guide rail transferring members become one, the processing unit (plant) 1 of first execution mode of other parts and Fig. 1～shown in Figure 5 is identical.Specifically, as shown in Figure 8, two ball- screw 27a, 27b are set up in parallel on above-below direction, and each ball- screw 27a, 27b are provided with drive division 28a, 28b such as motor.In addition, pair of frames guide rail 22a, 22b are installed in respectively on different the ball- screw 27a or 27b.
In this processing unit (plant), drive division 28a and/or drive division 28b make ball- screw 27a, 27b rotation, and thus, frame guide rail 22a, 22b become open mode or clamp position, and move between each zone.
In the processing unit (plant) of present embodiment, identical with the processing unit (plant) of above-mentioned first execution mode, positioner 20 also has positioning function and two functions of conveyance function, therefore, can guarantee the space in the device, make mechanism simplifying in the device, and positioning accuracy is reduced.
Claims (2)
1. processing unit (plant), it has: box, it is positioned on the box workbench, is used to take in ring-shaped frame, is supported with workpiece at the peristome of this ring-shaped frame through splicing tape; Take out of member, it takes out of the ring-shaped frame in the above-mentioned box to the interim put area of framework that is used for placing this ring-shaped frame temporarily; Retaining member, it keeps the workpiece that is bearing on the above-mentioned ring-shaped frame; And tool member, it is processed the workpiece that remains on the above-mentioned retaining member, and above-mentioned processing unit (plant) is characterised in that,
This processing unit (plant) has positioner, and this positioner comprises:
Frame guide rail, its mounting is taken out of the ring-shaped frame that member is taken out of by above-mentioned; With
The guide rail drive member, it is positioned at the said frame guide rail and makes open position of above-mentioned ring-shaped frame and the clip position that above-mentioned ring-shaped frame is positioned, and this guide rail drive member is transferred to the subsequent processing zone with above-mentioned ring-shaped frame from the interim put area of said frame.
2. processing unit (plant) as claimed in claim 1 is characterized in that,
Above-mentioned guide rail drive member has:
First drive division, it makes the said frame guide rail be positioned at above-mentioned release position and above-mentioned clip position; With
Second drive division, it is transferred to the subsequent processing zone with the said frame guide rail.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008-102821 | 2008-04-10 | ||
| JP2008102821 | 2008-04-10 | ||
| JP2008102821A JP5129002B2 (en) | 2008-04-10 | 2008-04-10 | Processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101556910A true CN101556910A (en) | 2009-10-14 |
| CN101556910B CN101556910B (en) | 2012-06-27 |
Family
ID=41174965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101331335A Active CN101556910B (en) | 2008-04-10 | 2009-04-09 | Processer |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5129002B2 (en) |
| CN (1) | CN101556910B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103733326A (en) * | 2011-09-29 | 2014-04-16 | 川崎重工业株式会社 | Transport system |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018181951A (en) * | 2017-04-06 | 2018-11-15 | 株式会社ディスコ | Processing device |
| KR102581316B1 (en) * | 2017-07-12 | 2023-09-22 | 도쿄엘렉트론가부시키가이샤 | Transport equipment, substrate processing system, transport method and substrate processing method |
| JP2019021674A (en) * | 2017-07-12 | 2019-02-07 | 東京エレクトロン株式会社 | Substrate processing system and substrate processing method |
| JP7343306B2 (en) * | 2019-05-29 | 2023-09-12 | 株式会社ディスコ | Transfer robot |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11165864A (en) * | 1997-12-03 | 1999-06-22 | Nikon Corp | Substrate conveying device and substrate treating device |
| JP4030654B2 (en) * | 1998-06-02 | 2008-01-09 | 大日本スクリーン製造株式会社 | Substrate transfer device |
| TWI272673B (en) * | 2001-11-21 | 2007-02-01 | Disco Corp | Cutting machine |
| JP4197103B2 (en) * | 2002-04-15 | 2008-12-17 | 株式会社荏原製作所 | Polishing equipment |
| JP4427396B2 (en) * | 2004-06-30 | 2010-03-03 | 株式会社ディスコ | Processing equipment |
-
2008
- 2008-04-10 JP JP2008102821A patent/JP5129002B2/en active Active
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2009
- 2009-04-09 CN CN2009101331335A patent/CN101556910B/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103733326A (en) * | 2011-09-29 | 2014-04-16 | 川崎重工业株式会社 | Transport system |
| CN103733326B (en) * | 2011-09-29 | 2016-03-16 | 川崎重工业株式会社 | Handling system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101556910B (en) | 2012-06-27 |
| JP2009253225A (en) | 2009-10-29 |
| JP5129002B2 (en) | 2013-01-23 |
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