CN101536147B - 用于工具设备的布置方案 - Google Patents

用于工具设备的布置方案 Download PDF

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CN101536147B
CN101536147B CN2006800257885A CN200680025788A CN101536147B CN 101536147 B CN101536147 B CN 101536147B CN 2006800257885 A CN2006800257885 A CN 2006800257885A CN 200680025788 A CN200680025788 A CN 200680025788A CN 101536147 B CN101536147 B CN 101536147B
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G·亨特利
K·威尔逊
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    • H—ELECTRICITY
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    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
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    • Y10T137/86083—Vacuum pump
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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Abstract

一种布置方案，该布置方案包括安装至半导体加工工具的辅助设备和远离半导体加工工具的维护中心，从而使局部空间要求最小化并有利于容易地进入以便修理。

Description

用于工具设备的布置方案
技术领域
本发明涉及一种用于安装辅助设备的布置方案，该辅助设备与半导体加工工具结合起来工作。设备段缺少设施，只包含基本的设备机构，且安装到半导体工具上。更具体地说，本发明涉及这样一种布置方案：其中，容纳辅助设备的多个这样的设备段连接至维护段，该维护段提供操作设备的设施。这种布置方案允许容易地进入设备段以便修理或维护。
本发明还提供一种布置方案，其中，辅助设备段直接安装到半导体工具框架上且连接至维护段，该维护段处于远离设备段的位置。这样，可促进容易地进入以修理或维护任何辅助设备，同时使提供该功能的设备工具的空间要求最小化。
背景技术
半导体加工设施通常由两级构成。用来制造半导体的工具则会位于主级上，而辅助设备可位于主级下方的级上，它称为次加工级。位于次加工级内的每件辅助设备理想地将位于其服务的工具下方。例如，许多工具包括真空室。与特定室相关联的真空泵则将位于次加工级上的室的下方。
尽管设备相对于工具的布置看起来使用了最短的管道，但实际上源于此的过多管道网会降低效率或增大损失，并使设备的布局和维护非常困难。设备的安装也是成问题的，因为不仅必须将设备组装在制造设施内，而且必须在该设施内测试。假如任何一件设备呈现故障，则必须拆卸和更换该设备甚至可能其它周围设备。另一问题是，这些工具常常利用有害的危险化学物质，例如由真空泵抽取这些化学物质以由各种消减系统处理。
因此，需要一种布置方案设计，该设计可使空间要求最小化，并有利于与半导体工具一起使用的设备的拆卸和修理。
发明内容
本发明提供一种用于安装辅助设备以支持半导体加工工具的布置方案。该布置方案包括多个缺少设施的辅助设备段和维护段。辅助设备直接安装到所述半导体加工工具上，同时维护段处于远离所述设备段的位置。包括设施源且连接至设备段的所述维护段提供用于操作其中设备的设施。
这样，使用于容纳设备段的空间要求最小化，还可容易地进入每个设备段以便修理和维护。这就提供了使用维护例如泵送的位置，由此减少损失并提高效率。
附图说明
尽管本说明书以权利要求书作为结束，该权利要求书清楚地指出了申请人所认为的本发明的主题，但是应该相信，当与附图结合起来时将能更好地理解本发明，在这些附图中：
图1是根据本发明的布置方案的示意图，其中，设备段直接安装至半导体工具；
图2是根据本发明的布置方案的示意图，其中，泵直接安装至半导体工具；
图3是根据本发明的布置方案的示意图，其中，维护段直接安装至半导体工具；
图4是根据本发明的布置方案的示意图，其中，维护段包括泵；
图5是根据本发明的布置方案的示意图，其中，单个运输器将设施从维护段分配到所有的设备段；
图6(a)和6(b)分别是根据本发明的包括捆扎在一起的设施导管的运输器的横截面图和立体图；以及
图7是根据本发明的包括罩壳的运输器的立体图。
具体实施方式
参见图1，示出了根据本发明的布置方案，其中缺少设施的设备段2直接安装到半导体加工工具框架4上。维护段6包括用于操作设备段2的设施源。
用于半导体工具的设备部件对于熟悉本领域的技术人员来说是熟知的，它包括但不局限于泵电源、阀等等。安装在工具上的设备部件仅仅包括基本的机构。例如，如图2所示泵8通常包括若干部件：泵机构10、电动机12、驱动器14、控制器16和氮气模块18。在图2示意示出的本发明的一实施例中，没有控制器16或其它设施的泵10和电动机12的基本泵送组件安装到工具上，从而它可容易地取出以便修理或维护，并可使它在工具上占据的空间量最小化。控制器16、驱动器14和氮气模块18居中地安装在维护段6中。这样，基本泵送组件1O和电动机12可容易地取出以便修理或维护，而无需首先拆卸诸如控制器16、驱动器14和氮气模块18之类的其它泵部件。该布置方案有利于容易地进入需要修理的部件并且使用于半导体加工工具的停机时间最小化。
在图3所示的另一实施例中，维护段6可以安装到半导体加工工具4上和/或可以包括辅助设备中的至少一个但不是所有。例如，如图4所示，维护段6可以包括一泵，该泵可以用作用于设施的主连接点，并且还可以是将设施分配至其它辅助设备的毂。
在图5所示的另一实施例中，单个运输器20而不是图1所示的毂装置将设施从维护段6分配至所有的设备段2。
如同熟悉本领域的技术人员将会理解的，将设备部件或维护段安装到工具上将是这样的：设备或维护段容纳在不会以任何方式干涉工具的功能或损坏工具的区域中，而位置是这样的：部件可容易地取出以便修理或维护。例如，设备部件2和维护段6可以通过凸缘安装、托架安装、粘胶或任何其它合适的方式附连至加工工具4。
设备部件可以安装在矩形截面的支承件上，该支承件构造成接纳叉车的尖叉并允许叉车来移除，如同在美国专利第6,058,852号中描述的那样，在此以参见的方式引入该专利。
如图1所示，从维护段6通过运输器20来提供用于设备部件2的设施。运输器20可以是运输各设施的单个导管，或者也可以包括一组捆扎在一起的单独设施。用于泵的运输器的横截面图示于图6(a)中。例如，用于泵的设施可以包括冷却水馈送器22、冷却水返回器24、氮气源26、控制器接头28、电源30和清洁干燥空气32以驱动阀。泵设施可以由系带34捆扎在一起，如图6(b)所示。在图7所示的另一实施例中，设施被包封在中央罩壳38中。较佳的泵是可从美国新泽西州的BOC爱德华兹(Edwards)公司购买到的EPX泵。
尽管以上在这里具体显示和描述了较佳实施例，但是应该理解，根据以上说明且在所附权利要求书的范围内可以对本发明作出许多修改和变型，而不脱离本发明的精神实质和预期范围。

Claims (19)

1.一种用于安装辅助设备以支持半导体加工工具的布置方案，所述布置方案包括：
多个辅助设备段，所述辅助设备段中的每一个都缺少用于操作设备的设施且直接安装到所述半导体加工工具上；以及
维护段，所述维护段处于与所述辅助设备段中的至少一个相隔开的位置，所述维护段包括用于所述设备段中的至少一个的设施源，
其中，所述多个设备段和所述维护段彼此连接。
2.如权利要求1所述的用于安装辅助设备以支持半导体加工工具的布置方案，其特征在于，所述多个设备段和所述维护段通过在所述多个辅助设备段和所述维护段之间延伸的至少一个运输器而彼此连接。
3.如权利要求2所述的用于安装辅助设备以支持半导体加工工具的布置方案，其特征在于，所述运输器包括至少一个用于所述辅助设备的设施导管。
4.如权利要求3所述的用于安装辅助设备以支持半导体加工工具的布置方案，其特征在于，所述运输器包括至少一个用于选自以下的设施源的导管：氮气、电源、控制器、驱动器、冷却水馈送器、冷却水返回器和清洁干燥空气。
5.如权利要求1所述的用于安装辅助设备以支持半导体加工工具的布置方案，其特征在于，所述辅助设备包括至少一个泵。
6.如权利要求4所述的用于安装辅助设备以支持半导体加工工具的布置方案，其特征在于，所述辅助设备包括至少一个泵。
7.如权利要求3所述的用于安装辅助设备以支持半导体加工工具的布置方案，其特征在于，所述运输器包括多个捆扎在一起的设施导管。
8.如权利要求4所述的用于安装辅助设备以支持半导体加工工具的布置方案，其特征在于，所述运输器包括罩壳，所述用于设施源的导管位于所述罩壳内。
9.如权利要求4所述的用于安装辅助设备以支持半导体加工工具的布置方案，其特征在于，包括至少两个设施，其中，所述用于设施源的导管在所述运输器中捆扎在一起。
10.如权利要求1所述的用于安装辅助设备以支持半导体加工工具的布置方案，其特征在于，所述维护段直接安装到所述半导体加工工具上。
11.如权利要求1所述的用于安装辅助设备以支持半导体加工工具的布置方案，其特征在于，所述维护段包括所述辅助设备中的至少一个设备而少于所述辅助设备中的所有设备。
12.如权利要求1所述的用于安装辅助设备以支持半导体加工工具的布置方案，其特征在于，所述维护段包括泵。
13.如权利要求2所述的用于安装辅助设备以支持半导体加工工具的布置方案，其特征在于，包括一个在所述辅助设备和所述维护段之间延伸的运输器。
14.如权利要求1所述的用于安装辅助设备以支持半导体加工工具的布置方案，其特征在于，至少一个设备段包括泵机构和电动机，而所述维护段包括选自以下的至少一个设施源：控制器、驱动器和氮气模块。
15.如权利要求14所述的用于安装辅助设备以支持半导体加工工具的布置方案，其特征在于，所述维护段安装到所述半导体工具上。
16.如权利要求2所述的用于安装辅助设备以支持半导体加工工具的布置方案，其特征在于，至少一个设备段包括泵机构和电动机，而所述维护段包括选自以下的至少一个设施源：控制器、驱动器和氮气模块。
17.如权利要求2所述的用于安装辅助设备以支持半导体加工工具的布置方案，其特征在于，所述维护段安装到所述半导体工具上。
18.如权利要求16所述的用于安装辅助设备以支持半导体加工工具的布置方案，其特征在于，所述运输器包括罩壳。
19.如权利要求17所述的用于安装辅助设备以支持半导体加工工具的布置方案，其特征在于，所述运输器包括罩壳。
CN2006800257885A 2005-07-15 2006-06-28 用于工具设备的布置方案 Expired - Fee Related CN101536147B (zh)

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US11/182,531 US7392825B2 (en) 2005-07-15 2005-07-15 Arrangement for tool equipment
PCT/US2006/025495 WO2007011512A2 (en) 2005-07-15 2006-06-28 Arrangement for tool equipment

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6251759B1 (en) * 1998-10-03 2001-06-26 Applied Materials, Inc. Method and apparatus for depositing material upon a semiconductor wafer using a transition chamber of a multiple chamber semiconductor wafer processing system
US6277199B1 (en) * 1999-01-19 2001-08-21 Applied Materials, Inc. Chamber design for modular manufacturing and flexible onsite servicing
US6397883B1 (en) * 1999-12-16 2002-06-04 The Boc Group, Inc. Equipment skid

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5820723A (en) * 1996-06-05 1998-10-13 Lam Research Corporation Universal vacuum chamber including equipment modules such as a plasma generating source, vacuum pumping arrangement and/or cantilevered substrate support
US5940175A (en) * 1996-11-01 1999-08-17 Msp Corporation Method and apparatus for surface inspection in a chamber
US6312525B1 (en) * 1997-07-11 2001-11-06 Applied Materials, Inc. Modular architecture for semiconductor wafer fabrication equipment
US5915414A (en) * 1997-09-04 1999-06-29 Lsi Logic Corporation Standardized gas isolation box (GIB) installation
JPH11188329A (ja) * 1997-12-26 1999-07-13 Ums:Kk 処理装置
US6058852A (en) * 1999-05-12 2000-05-09 Estvanko; Gary A. Equipment skid
US7187994B1 (en) * 2000-08-18 2007-03-06 Kla-Tencor Technologies Corp. Method of interfacing ancillary equipment to FIMS processing stations

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6251759B1 (en) * 1998-10-03 2001-06-26 Applied Materials, Inc. Method and apparatus for depositing material upon a semiconductor wafer using a transition chamber of a multiple chamber semiconductor wafer processing system
US6277199B1 (en) * 1999-01-19 2001-08-21 Applied Materials, Inc. Chamber design for modular manufacturing and flexible onsite servicing
US6397883B1 (en) * 1999-12-16 2002-06-04 The Boc Group, Inc. Equipment skid

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TW200721350A (en) 2007-06-01
US20070012368A1 (en) 2007-01-18
KR20080043761A (ko) 2008-05-19
JP2009501445A (ja) 2009-01-15
JP5289947B2 (ja) 2013-09-11
US7392825B2 (en) 2008-07-01
WO2007011512A3 (en) 2009-04-30
EP1904776A2 (en) 2008-04-02
KR101317997B1 (ko) 2013-10-14
CN101536147A (zh) 2009-09-16
EP1904776A4 (en) 2010-06-02

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