CN101530982B - Grinding clamp for changing wafer orientation - Google Patents
Grinding clamp for changing wafer orientation Download PDFInfo
- Publication number
- CN101530982B CN101530982B CN200910022002XA CN200910022002A CN101530982B CN 101530982 B CN101530982 B CN 101530982B CN 200910022002X A CN200910022002X A CN 200910022002XA CN 200910022002 A CN200910022002 A CN 200910022002A CN 101530982 B CN101530982 B CN 101530982B
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- dish
- support bar
- positioning seat
- grinding clamp
- angular deflection
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The invention discloses a grinding clamp for changing the wafer orientation. The grinding clamp comprises a loading disc connected with a fixed weighing rod; the lower part of the loading disc is provided with a positioning seat which is a hollow circular groove with an downward opening; the loading disc and the positioning seat are provided with two corresponding pylomes respectively; an adjusting strut and a fixed strut are arranged on each pair of the pylomes respectively; the adjusting strut is movably connected with the loading disc; the fixed strut is fixedly connected with the loading disc; the downward groove edge of the positioning seat is provided with a grinding washer; a hollow cavity of the positioning seat is provided with an angle deflexion disc; the angle deflexion disc is provided with a hinge rack and a connecting ear respectively; the hinge rack is connected with the fixed strut; the connecting ear is connected with the adjusting strut; and the lower surface of the angle deflexion disc is provided with an adhesive sheet disc. The grinding clamp can solve the problem of changing the wafer orientation or correcting the error of wafer orientation in the wafer fabrication.
Description
Technical field
The invention belongs to the materials processing technical field of tools, relate to a kind of grinding clamp that changes wafer orientation.
Background technology
The wafer of making electronics and opto-electronic device all needs definite crystalline orientation, and the way that adopts directed section to carry out plane lapping then on the engineering realizes that this helps producing in batches, reducing cost.But research work usually needs individual wafer to have different certain crystal orientations, thereby need be orientated grinding at any angle to wafer.In addition, directed section and subsequent grind sometimes also unavoidably because of operate miss or equipment reason cause the crystal orientation deviation also needs to grind by orientation and is revised.
Summary of the invention
The purpose of this invention is to provide a kind of grinding clamp that changes wafer orientation, realized wafer is carried out the grinding of arbitrary orientation.
The technical solution adopted in the present invention is, a kind of grinding clamp that changes wafer orientation, comprise the load dish, the load dish is provided with the fixed weight bar, the below of load dish is a positioning seat, positioning seat is a hollow opening round recessed down, load dish and positioning seat have two corresponding through holes, be respectively arranged with in two through holes and regulate support bar and fixed support bar, the fixed support bar is provided with screw thread with the adjusting support bar with the circumferential surface that the load dish is connected, on the load dish, lower surface is respectively arranged with nut C and adjustment disk, regulate support bar and be connected with the load dish with nut C by adjustment disk, the fixed support bar is connected with the load dish with packing ring by each one group of nut A of upper and lower surface; Be provided with an angular deflection dish in the cavity of positioning seat, the angular deflection dish has axle center hole, diameter two ends along the angular deflection dish are respectively arranged with hinge mount and lug, hinge mount is connected by the lower end of straight pin with the fixed support bar, lug is connected with the lower end of regulating support bar by another straight pin, the lower surface of angular deflection dish is equipped with the bonding die dish, and the axle center of bonding die dish is provided with threaded post upwards, and threaded post is passed the axle center hole of angular deflection dish and fixed by nut B.
Grinding clamp of the present invention, its feature also be,
All be provided with locating slide sleeve in two through holes of described positioning seat, regulating support bar and fixed support bar can be up and down along locating slide sleeve.
The downward groove of described positioning seat is along being provided with the grinding packing ring, grinds the following groove of packing ring by hexagon socket cap head screw and positioning seat along being connected.
Described lug is a kind of lug with ellipsoid shape eccentric pin hole.
Grinding clip prodigiosin of the present invention satisfies the requirement of wafer orientation attrition process, can solve the problem that changes wafer orientation in the crystalline material processing or revise the crystal orientation error, and this apparatus structure is simple, makes easy for installationly, controls easily, and cost is low.
Description of drawings
Fig. 1 is the structural representation of grinding clamp embodiment of the present invention;
Fig. 2 be among Fig. 1 A-A to view.
Among the figure, 1. regulate support bar, 2. fixed weight bar, 3. fixed support bar, 4. nut A, 5. packing ring, 6. positioning seat, 7. hinge mount, 8. the angular deflection dish 9. grinds packing ring, 10. bonding die dish, 11. nut B, 12. screws, 13. straight pins, 14. locating slide sleeve, 15. adjustment disks, 16. load dishes, 17. nut C, 18. threaded post, 19. lugs.
The specific embodiment
The present invention is described in detail below in conjunction with the drawings and specific embodiments.
Referring to Fig. 1, Fig. 2, the structure of grinding clamp of the present invention is, comprise load dish 16, load dish 16 upper surfaces are fixedlyed connected with fixed weight bar 2, the below of load dish 16 is positioning seats 6, positioning seat 6 is hollow opening round recesseds down, load dish 16 and positioning seat 6 have two corresponding through holes, two through holes of positioning seat 6 all are provided with locating slide sleeve 14, pass respectively in each through hole and regulate support bar 1 and fixed support bar 3, regulating support bar 1 and fixed support bar 3 can be up and down along locating slide sleeve 14, fixed support bar 3 is provided with screw thread with the end circumferential surface that adjusting support bar 1 is connected with load dish 16, regulate support bar 1 and be connected with load dish 16 with nut C17 by adjustment disk 15, two groups of nut A4 were connected with load dish 16 with packing ring 5 about fixed support bar 3 passed through.
Because grinding clamp weares and teares easily with the part that the polisher lapper master contacts, so the downward groove at positioning seat 6 grinds packing ring 9 along being provided with, so that wearing and tearing are more in time changed, the following groove that grinds the screw 12 of packing ring 9 by interior hexagonal cylinder head dummy and positioning seat 6 is along being connected, regulate support bar 1 and fixed support bar 3 and load dish 16 and all pass through positioning seat 6 realization vertical and horizontal motions, the location of both direction just can be realized vertically and be horizontally rotated to positioning seat 6 like this; Be provided with an angular deflection dish 8 in the cavity of positioning seat 6, angular deflection dish 8 has axle center hole, be respectively arranged with the hinge mount 7 and the high-order lug 19 of low level along the diameter two ends of angular deflection dish 8, hinge mount 7 is connected with fixed support bar 3 by straight pin 13, lug 19 is a kind of lugs with ellipsoid shape eccentric pin hole, lug 19 is connected with adjusting support bar 1 by another straight pin 13, the lower surface of angular deflection dish 8 is equipped with bonding die dish 10, the axle center of bonding die dish 10 is provided with threaded post 18 upwards, and threaded post 18 is passed the axle center hole of angular deflection dish 8 and fixed by nut B11.
The course of work of grinding clamp of the present invention is,
At first, bonding die dish 10 is taken off from angular deflection dish 8, wafer to be processed is sticked on bonding die dish 10 centers, then, the bonding die dish 10 that is stained with wafer to be processed is passed the axle center hole of angular deflection dish 8 through the threaded post 18 of self, fastening with nut B11 and angular deflection dish 8;
Second step, the lower end of regulating the lower end of support bar 1 and fixed support bar 3 is passed the locating slide sleeve 14 of positioning seat 6 upper surface through holes respectively, fix (wherein with angular deflection dish 8, it is fixing to regulate the lug 19 usefulness straight pins 13 of support bar 1 on angular deflection dish 8, fixed support bar 3 is fixing with angular deflection dish 8 by straight pin 13 through hinge mount 7, guarantee to regulate support bar 1,3 slips of fixed support bar freely, accurate positioning;
The 3rd step, the upper end of fixed support bar 3 is fastening with nut A4, the packing ring 5 of load dish 16 upper and lower surfaces, regulating support bar 1 links to each other through adjustment disk 15, nut C17 and load dish 16 successively, adjust the lifting of regulating support bar 1 with adjustment disk 15 and nut C17, change the deflection angle of angular deflection dish 8, also changed simultaneously the angle of wafer to be processed and horizontal plane, after regulating, with adjustment disk 15, load dish 16 usefulness nut C17 locking;
The 4th goes on foot, and the grinding clamp of the present invention that is stained with wafer to be processed is placed on carries out attrition process on the polisher lapper master, and the peak of the processing sheet on the bonding die dish 10 is-horizontal level (on the master of polisher lapper) same with grinding packing ring lower surface all the time.In the process of lapping, angular deflection dish 8, bonding die dish 10 and paste thereon wafer to be processed and under the drive of the compressing of added counterweight on the fixed weight bar 2 and load dish 16 and positioning seat 6, swing simultaneously and rotate, making wafer be subjected to the drift angle grinds, simultaneously along with the increase of grinding the degree of depth, polisher lapper control fixed weight bar 2 and progressively vertical subsidence of load dish 16, the drift angle milling area is increased gradually, finally cover whole wafer to be processed and make the orientation of wafer abradant surface that the change of expection take place.Take off this wafer to be processed then, the good crystal face of mill and the bonding die dish of wafer to be processed is bonding, according to preceding step grinding another side, finally make the entire wafer change or revised original crystal orientation.
Grinding clamp of the present invention makes the bonding die dish by positioning seat and pastes thereon processed wafer and abrasive disk and keeps the angle that needs, and this angle can be by the lifting adjusting arbitrarily within the specific limits of regulating support bar.In the process of lapping, angular deflection dish, bonding die dish and paste thereon wafer and under the drive of the compressing of load dish and positioning seat, swing simultaneously and rotate, making wafer be subjected to the drift angle grinds, simultaneously along with the increase control load dish vertical subsidence of grinding the degree of depth, the drift angle milling area is increased gradually, final cover entire wafer and make the orientation of wafer abradant surface that the change of expection take place, be typically designed to 0 °～10 °.Take off wafer then, will newly be orientated the bonding grinding another side of crystal face and bonding die dish, finally make the entire wafer change or revised original crystal orientation.
Grinding clamp of the present invention is simple in structure, make easy for installation, easily control, cost is low, is the corollary apparatus of polisher lapper, can be used for the drift angle degree processing of artificial lens wafer.
Claims (4)
1. grinding clamp that changes wafer orientation, it is characterized in that: comprise load dish (16), load dish (16) is provided with fixed weight bar (2), the below of load dish (16) is positioning seat (6), positioning seat (6) is a hollow opening round recessed down, load dish (16) and positioning seat (6) have two corresponding through holes, be respectively arranged with in two through holes and regulate support bar (1) and fixed support bar (3), fixed support bar (3) is provided with screw thread with adjusting support bar (1) with the circumferential surface that load dish (16) is connected, on the load dish (16), lower surface is respectively arranged with nut C (17) and adjustment disk (15), regulate support bar (1) and be connected with load dish (16) with nut C (17) by adjustment disk (15), fixed support bar (3) is connected with load dish (16) with packing ring (5) by each one group of nut A (4) of upper and lower surface;
Be provided with an angular deflection dish (8) in the cavity of positioning seat (6), angular deflection dish (8) has axle center hole, diameter two ends along angular deflection dish (8) are respectively arranged with hinge mount (7) and lug (19), hinge mount (7) is connected with the lower end of fixed support bar (3) by straight pin (13), lug (19) is connected with the lower end of regulating support bar (1) by another straight pin (13), the lower surface of angular deflection dish (8) is equipped with bonding die dish (10), the axle center of bonding die dish (10) is provided with threaded post (18) upwards, and it is fixing by nut B (11) that threaded post (18) is passed the axle center hole of angular deflection dish (8).
2. grinding clamp according to claim 1 is characterized in that, all is provided with locating slide sleeve (14) in two through holes of described positioning seat (6), and regulating support bar (1) and fixed support bar (3) can be up and down along locating slide sleeve (14).
3. grinding clamp according to claim 1 is characterized in that, the downward groove of described positioning seat (6) grinds packing ring (9) along being provided with, and grinds the following groove of packing ring (9) by hexagon socket cap head screw (12) and positioning seat (6) along being connected.
4. grinding clamp according to claim 1 is characterized in that, described lug (19) is a kind of lug with ellipsoid shape eccentric pin hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910022002XA CN101530982B (en) | 2009-04-13 | 2009-04-13 | Grinding clamp for changing wafer orientation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910022002XA CN101530982B (en) | 2009-04-13 | 2009-04-13 | Grinding clamp for changing wafer orientation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101530982A CN101530982A (en) | 2009-09-16 |
| CN101530982B true CN101530982B (en) | 2011-03-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910022002XA Expired - Fee Related CN101530982B (en) | 2009-04-13 | 2009-04-13 | Grinding clamp for changing wafer orientation |
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| CN (1) | CN101530982B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101769882B (en) * | 2009-12-15 | 2011-06-15 | 丹东奥龙射线仪器有限公司 | Gripping device for direction finder |
| CN103128657A (en) * | 2011-11-24 | 2013-06-05 | 宝山钢铁股份有限公司 | Clamp used for electron back scattering diffraction sample vibration polishing and use method thereof |
| CN102513923A (en) * | 2011-12-28 | 2012-06-27 | 彩虹集团公司 | Sample tray for precision grinding and polishing machine |
| CN103692301B (en) * | 2013-12-12 | 2016-01-20 | 中国电子科技集团公司第二研究所 | A kind of SiC single crystal crystal orientation angle compensation processing unit (plant) |
| CN104816237B (en) * | 2015-04-29 | 2017-03-15 | 新乡航空工业(集团)有限公司 | A kind of lower wound packages clamp mechanism of sleeve milling apparatus |
| CN107256742B (en) * | 2017-07-25 | 2023-05-16 | 上饶市达淋新材料有限公司 | Processing method of FFC with variable conductor section |
| CN108000291A (en) * | 2017-12-23 | 2018-05-08 | 哈尔滨秋冠光电科技有限公司 | Correct and use automatic orientation auxiliary device in sapphire ingot c faces |
| CN109080012A (en) * | 2018-08-23 | 2018-12-25 | 中国工程物理研究院激光聚变研究中心 | Crystal orientation angle correction method |
| CN110682202A (en) * | 2019-11-11 | 2020-01-14 | 浙江理工大学 | Clamping piece of grain polishing device |
| US10793367B1 (en) * | 2020-01-21 | 2020-10-06 | Transnorm System Gmbh | Conveying table and module |
| CN112589671B (en) * | 2020-11-10 | 2022-04-19 | 东莞市新美洋技术有限公司 | Polishing jig |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0878268A2 (en) * | 1994-05-23 | 1998-11-18 | Sumitomo Electric Industries, Ltd. | Polishing apparatus and method for hard material-coated wafer |
| CN1500029A (en) * | 2001-03-29 | 2004-05-26 | ��ķ�о�����˾ | Appts. and methods for aligning surface of active retainer ring with wafer surface for chemical mechanical polishing |
-
2009
- 2009-04-13 CN CN200910022002XA patent/CN101530982B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0878268A2 (en) * | 1994-05-23 | 1998-11-18 | Sumitomo Electric Industries, Ltd. | Polishing apparatus and method for hard material-coated wafer |
| CN1500029A (en) * | 2001-03-29 | 2004-05-26 | ��ķ�о�����˾ | Appts. and methods for aligning surface of active retainer ring with wafer surface for chemical mechanical polishing |
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| CN101530982A (en) | 2009-09-16 |
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Owner name: NANTONG OUTE MACHINERY EQUIPMENT CO., LTD. Free format text: FORMER OWNER: XI'AN UNIV. OF SCIENCE AND ENGINEERING Effective date: 20130821 |
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Free format text: CORRECT: ADDRESS; FROM: 710048 XI'AN, SHAANXI PROVINCE TO: 226600 NANTONG, JIANGSU PROVINCE |
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| TR01 | Transfer of patent right |
Effective date of registration: 20130821 Address after: 226600, Nantong County, Jiangsu City, Haian Province Liu Zhen Liu Village 1 groups Patentee after: Nantong Aote Machinery Equipment Co., Ltd. Address before: 710048 Shaanxi city of Xi'an Province Jinhua Road No. 5 Patentee before: Xi'an University of Technology |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110316 Termination date: 20180413 |