CN101529573A - Electronic component module and method for the production thereof - Google Patents
Electronic component module and method for the production thereof Download PDFInfo
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- CN101529573A CN101529573A CNA2006800561457A CN200680056145A CN101529573A CN 101529573 A CN101529573 A CN 101529573A CN A2006800561457 A CNA2006800561457 A CN A2006800561457A CN 200680056145 A CN200680056145 A CN 200680056145A CN 101529573 A CN101529573 A CN 101529573A
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Abstract
The invention relates to an electronic component module with at least one multi-layer ceramic circuit carrier (2, 3) and at least one cooling device comprising at least one cooling body (4). A composite layer (5, 6) is arranged at least in some regions between the ceramic circuit carrier (2, 3) and the cooling device (4). Said composite layer is designed for a reactive connection with the ceramic circuit carrier (2, 3) during a primary process and for connection with the cooling device (4). The invention also relates to a method for the production of said electronic component module.
Description
Technical field
The present invention relates to a kind of electronic-component module, the cooling device that it has the circuit bearing body of at least one multilayer and has cooling body.In addition, the invention still further relates to a kind of method that is used to make this electronic-component module.
Background technology
The electronic-component module that has a plurality of multilayer circuit supporting masses is disclosed.These electronic-component modules are for example made by LTCC (LTCC), and LTCC is a kind of high efficiency technology that is used for being made by a plurality of single layers the ceramic circuit supporting mass.For this reason, be used for by stamping-out carry out electric break-through contact, unsintered ceramic green sheet is provided with opening, its split shed is filled with conductive paste, and these films are provided with smooth line construction with method for printing screen in its surface.A plurality of this single layers at last each other lamination and under lower temperature conditions sintering.This technology provides the multilayer layout structure of burying (Layout-Strukturen), and these layout structures can be used for the circuit element of integrating passive.In addition, can realize having extraordinary high frequency characteristics thus, seal airtightly and have good stable on heating layout structure.By these characteristics, the LTCC technology is suitable for being applied in the hostile environment (for example being suitable for transducer), be suitable for being applied in the high frequency technique (for example mobile radio and field of radar), and be suitable for being applied in the power electronics devices (for example vehicle electronics, transmission control device and engine control system).Yet owing to the relatively poor capacity of heat transmission of material is restricted, wherein material typically has the capacity of heat transmission of 2W/m K usually in demanding application aspect heat.In order to cool off active semiconductor device (as surface mounting assembly, the part of normally this LTCC module of these semiconductor device), simply the LTCC substrate is installed on the cooling body not enough.Especially, with LTCC substrate welding or be adhered on the cooling body, as at " Micro channel water cooled power modules " that the people showed such as J.Schulz-Harder, 1 to 6 page, described in PCIM 2000 Nuernberg like that, not enough.
The LTCC pottery in standard technology with silver metallized thing compatibility.Therefore, a common solution at the LTCC substrate is integrated heat through-hole.Through hole is vertical break-through contact site, and they are filled by the conductive paste with argentiferous, and are mainly used in heat radiation.In this way, can realize the average capacity of heat transmission of 20W/m K.Combine with the film of argentiferous, can on vertical or horizontal direction, realize the value of 90W/m K and 150W/m K.This is by " LTCC substrates with internal cooling channel and heat exchanger " that the people showed such as M.A.Zampino, Proc.Internat.Symp.on Microelectronics 2003, Internat.Microelectronics and Packaging Society (IMAPS), 18.-20.11.2003, Boston, USA is open.
Another solution is, will have the semiconducter IC (integrated circuit) of high loss heat, and for example power amplifier is directly installed on the radiator in the recess of LTCC circuit board.
In addition, disclose following solution: these solutions are integrated based on the passage of fluid filled.At this, the convection current of the fluid (for example water) of cooling by having high heat capacity is carried out, as mentioning in the above, according in the prior art of " Micro channel water cooledpower modules " that people such as J.Schulz-Harder showed and this external M.A.Zampino etc. " Embedded heat pipes with MCM-C Technology " that the people showed, Proc.NEPCON West1998 Conference Vol.2, Reed Exhibition:Norwalk, CT USA 1998, the 777-785 page or leaf, the 2nd volume, (Conf.Anaheim, USA, described in 1.-5.03.1998) like that.
Structure solution is not thereon utilized the thermal capacitance of cooling fluid for the heat transmission, but has utilized the latent heat of phase transformation.This mention in the above according in the prior art of " LTCCsubstrates with internal cooling channel and heat exchanger " that the people showed such as M.A.Zampino and at " Thermal management in lowtemperature cofire ceramic (LTCC) using high density thermal vias andmicro heat pipes/spreaders " that the people showed such as W.K.Jones, Proc.Internat.Symp.on Microelectronics2002, Internat.Microelectronics and Packaging Society (IMAPS), 10.-13.03.2002, described in the Reno, USA like that." heat pipe (heatpipe) " that set forth there for example is used to cool off for example processor of kneetop computer of compact computer according to prior art.
Except these are suitable for the method for LTCC, so-called direct copper engages (Direct CopperBond) technology and is suitable for the aluminium oxide ceramics of height sintering and is used widely, so that the circuit bearing body that the aluminium oxide of sintering is constituted directly connects with the cooling symphysis of copper formation under about 1100 ℃ situation.This is at " DBC substrate withintegrated flat heat pipe " that the people showed such as " Micro channel water cooledpower modules " that people such as J.Schulz-Harder showed and J.Schulz-Harder, EMPC 2005, and The 15
ThEuropeanMicroelectronics and Packaging Conference ﹠amp; Exhibition, 12.-15.06.2005, Bruegge is described among the Belgien.
Summary of the invention
Task of the present invention is, realizes a kind of electronic-component module and a kind of method that is used to make this electronic-component module, and wherein the substrate of the high capacity of heat transmission can be connected with the circuit bearing body of multilayer is stable with saving trouble simply with, and can improve heat radiation.
This task solves by having according to the electronic-component module of the feature of claim 1 and the method that has according to the feature of claim 12.
Electronic-component module according to the present invention comprises the ceramic circuit supporting mass of at least one multilayer and has the cooling device of at least one cooling body.Between ceramic circuit supporting mass and cooling device, be provided with at least one composite bed at least partly, described composite bed is built as and is used for being connected in the reactivity of main technique with the ceramic circuit supporting mass, connect especially for LTCC is reactive, and be used for and being connected of cooling device.By this composite bed and particularly its configuration, can realize the stable connection between the parts of device blocks.In addition, can produce composite bed, because this composite bed is connected with the ceramic circuit supporting mass reactively with saving trouble.Being connected thus particularly of circuit bearing body and this composite bed can generate automatically with in ceramic circuit supporting mass and the real process that cooling device connects together.Composite bed can be connected with the circuit bearing body is stable reactively by its material construction during main technique.Main technique is interpreted as following technology: this technology is mainly implemented in order to set up other connections between the parts of device blocks.Especially, this composite construction can automatically produce in LTCC technology reactively.At this, needn't carry out independently follow-up method step again, as by non-reacted connection (as the welding or bonding in) situation.Thus, the reactive connection is interpreted as all technologies that produce double action, is to be composite bed on the other hand by the main effect of this technology and being connected of circuit bearing body on the one hand.In a preferred LTCC technology, double action is, single layer that on the one hand can the connecting circuit supporting mass, and the reactivity that additionally can make up according to the present invention between composite bed and the circuit bearing body connects.
Especially, when the circuit bearing body was configured to LTCC circuit bearing body, composite bed was configured to the reactive coating that is fit to LTCC.In this expansion scheme, so what also can realize in the LTCC of reality technology is that the ceramic circuit supporting mass automatically is connected with composite bed is mechanically stable.In addition, also guaranteed to be connected with the stable of mechanical system of cooling device.
Thus, can be to be used for that the LTCC technology that the circuit bearing body is applied on the cooling device is carried out the reactivity connection under common process conditions.
Preferably, whole ground of composite bed is structured between circuit bearing body and the cooling device.This can realize especially effectively fixing and also can realize optimum heat radiation in addition.
Preferably, cooling device is built as and is used for horizontal heat radiation, and cooling body laterally stretches out the scope of circuit bearing body at least in a side.By this horizontal cooling scheme, can make up compacter electronic-component module, this device blocks can realize improved heat radiation.
Particularly preferably be, the circuit bearing body is configured to the LTCC circuit bearing body of pottery, and composite bed is built as and is used for producing composite construction to make up the ceramic circuit supporting mass with circuit bearing precursor reactant ground during LTCC technology, perhaps can produce this composite construction.By what this expansion scheme can realize be, in fact can be during the LTCC method automatically generate, wherein in this LTCC method single layer by lamination one above the other and at corresponding sintering temperature.Significant advantage with respect to prior art is thus, needn't for example produce connection with other follow-up manufacture methods of LTCC technology by hard solder, but this connection can with the related manufacturing of the single layer of circuit bearing body basically side by side or carry out when having at least with overlapping.
Composite bed preferably is configured to LTCC film individual layer, no device and that do not have electric lead at least.In this expansion scheme, composite bed is provided as intermediate coat thus.Especially, so what can design is by particularly single intermediate coat composite bed to be installed in sintering process under particularly about appropriate condition aspect gas atmosphere and the temperature distribution history.Especially, be designed to this intermediate coat is applied on the cooling device at this.
Composite bed also can be made up by glass at least in part.
What can design equally is that composite bed is made up by nano crystal material at least in part, particularly the aluminium oxide of nanocrystal structure.What can design equally is, composite bed is at least in part by ceramic material, particularly made up by silica and/or silicon nitride.
Composite bed can be made up by reactive metal at least in part, is particularly made up by titanium.
Prove and particularly preferably be, the composite construction between circuit bearing body and the composite bed is by under the temperature between 840 ℃ to 930 ℃, particularly the sintering process under about 900 ℃ makes up.Under these process conditions, can guarantee that also the optimum of ceramic circuit supporting mass makes up and the composite construction between particularly single layer.Simultaneously, so under these optimized process conditions, also can realize the reactive composite construction between composite bed and the circuit bearing body.
In the method that is used for making electronic-component module according to the present invention, the multilayer circuit supporting mass that at least one is ceramic is connected with at least one cooling device that comprises at least one cooling body.The local at least composite bed that is used for link that is built with between ceramic circuit supporting mass and cooling device.Composite bed links to each other with the circuit bearing body during the connection technology of the single layer of circuit bearing body reactively.By this manufacture method, can realize obvious improved composite construction, this composite construction can obviously more be realized on manufacturing technology with saving trouble.
Prove and particularly preferably be, the circuit bearing body is configured to the LTCC circuit bearing body of pottery, and composite bed is connected with the circuit bearing body during LTCC technology.Can realize cooling body-ceramic composite structures under lower temperature thus, wherein preferably, cooling device is provided with the reactive composite layer of suitable LTCC to make up electronic-component module in processing step before.Subsequently, the LTCC multilayer and thus LTCC circuit bearing body under corresponding technological conditions, be applied on the surface of being prepared, particularly be sintered on it.
In favourable mode, as composite bed, at least one individual layer, no device and do not have circuit (not having electric lead) and also the LTCC film of electric insulation be built as the intermediate coat of gradient film (Gradientenfolie) form.What this preferably designed is that intermediate coat is applied under appropriate condition in sintering process.What this can design is that this carries out under the nitrogen atmosphere with argon additive.In this way, what can realize is, can carry out the coupling of technological parameter, for example be used to realize optimum metal-ceramic composite construction, and not consider the reference condition of connection of single layer of circuit bearing body and the reference condition of particularly not considering the LTCC technology.These reference condition of LTCC technology are owing to the line construction that has the silk screen printing cream formation that contains silver is determined.Especially, be characterised in that oxygen or air at this gas atmosphere.
The function LTCC film of multilayer circuit supporting mass is in turn laminated on the intermediate coat, and wherein these LTCC films have electronic device and integrated line construction.Xy for fear of functional layer shrinks, preferably additionally with aluminium oxide (Al
2O
3) consumable film (Opferfolie) that constitutes is laminated on the upside of circuit bearing body, and shrink (Zero-Shrinkage) method with so-called zero subsequently and be sintered.
In addition, what can design is that composite bed is made up by glass at least in part, particularly applies and heat-treats subsequently by silk screen printing.This expansion scheme also can realize optimum composite construction during single layer connection technology of circuit bearing body.
What also can design is, is applied to small part by the composite bed that nano crystal material constitutes, and particularly applies by method for printing screen.Particularly the aluminium oxide of nanocrystal can design as nano crystal material.Because sintering temperature reduces along with granular size and reduces, so nano crystal material has been opened up a kind of technology approach of LTCC compatibility.
In addition, composite bed also can be at least in part by ceramic material, particularly make up by silica and/or silicon nitride.What can design in this expansion scheme is that this ceramic material applies by sputtering method, particularly is splashed on the cooling device.The ceramic layer of the low temperature method deposition by physics is as at the adhesion layer with after-applied LTCC pottery.
In addition, composite bed also can be at least in part by have reactive metal particularly the coating of titanium make up.These reactive metals should be considered as increasing attached dose at the outstanding of Metal Contact.
Composite bed also can make up by the reactive ion beam etching (RIBE) by oxygen at least in part.By ion bombardment, carry out the abundant mixing (Durchmischung) of metal surface, this causes with different levels metal-oxide transition part.By prior sputter, for example sputter of silicon has for example formed with different levels metal-metallic oxide-silica transition part as the basis that has the composite construction of LTCC pottery.
Preferably, ceramic circuit supporting mass and composite bed by under the temperature between 840 ℃ to 930 ℃, particularly under about 900 ℃ temperature, carry out sintering and be connected to each other.
According to the present invention, the cooling body that has proposed thus to be used for to have the high capacity of heat transmission is integrated into the technology solution of LTCC.Cooling device and cooling body can have arbitrary form basically at the manufacturing process that is proposed.And advantageously as the configuration of formed body uniform thickness, horizontal expansion.This formed body can be on area the ceramic circuit supporting mass than multilayer littler, bigger or identical with it.Preferably, can hardware be set for the cooling body of cooling device.Especially, cooling body can be made up by copper, and copper has the very high capacity of heat transmission of about 400W/m K.And, also may be other metals with suitable thermal coefficient of expansion according to the circuit bearing body of multilayer thickness proportion with respect to cooling body.For example, also can use copper-sodium/molybdenum composite metal, its capacity of heat transmission is in the scope of about 200W/m K.For the slightly different coefficient of expansion of balance, the LTCC pottery can be arranged to two sides of cooling body with identical thickness.
When will making a kind of electronic-component module, it has the circuit bearing body of at least two multilayers and a plurality of and when having at least two integrated cooling bodies thus, it is particularly advantageous that the method according to this invention proves.Particularly in this multilayer system, be difficult to guarantee enough composite constructions especially by conventional art.Particularly by the method according to this invention, also can be simple and the system of this multilayer of generation with saving trouble, and particularly can realize integrally making up a plurality of cooling bodies.Because just in this labyrinth, at circuit bearing body and composite bed and also have composite construction between the cooling body can be automatically during the lamination of the single layer of these circuit bearing bodies and sintering, to be implemented thus.Thus, needn't after this manufacturing ceramic circuit supporting mass, carry out each with bothersome and mode with high costs again (for example by welding or bonding) independently is installed.Especially, can be under integrated cooling body situation by the remarkable simplification in the method according to this invention realization manufacturing.
In addition, in electronic-component module according to the present invention, can realize pure passive heat radiation, and not have material, phase boundary or the phase transformation of motion.In addition, it is possible significantly improving the capacity of heat transmission.For example, under the situation of using the copper-molybdenum-copper laminate, the capacity of heat transmission can reach about 10 times of heat through-hole.Under the situation of using pure copper substrate or the compound material compound material of carbonado-nanofiber (for example based on), can realize that the capacity of heat transmission further brings up to 400W/m K and higher.
Except the high capacity of heat transmission, by electric work can pottery (ceramic circuit supporting mass) and high heat conduction replacing of constituting of raw material layer can realize stable material composite construction.Particularly be built as when having transversely when cooling body, also can simply install by the stubborn incompatible realization in the scope of the cooling body that stretches out than bigger big or small of circuit bearing body.
By complete module assembling and the interface that limits, can realize simple further processing equally to environment.Under ceramic single layer situation of composite bed, realized having at the same time the high electric insulation under the high thermal coupling situation.Especially, also can realize in the circuit bearing body structure, the efficiently radiates heat of the device of burying in the LTCC pottery particularly.
The cutline of accompanying drawing
Embodiments of the invention have further been set forth by schematic diagram below.Unique sectional view that passes according to an embodiment that illustrates according to electronic-component module of the present invention.
Electronic-component module 1 comprises the first multi-layer ceramics LTCC circuit bearing body 2 and the second multi-layer ceramics LTCC circuit bearing body 3.These two circuit bearing bodies 2 and 3 are arranged on the opposed side of cooling body 4, and this cooling body is related with cooling device.In this embodiment, cooling body 4 integrally is arranged in electronic-component module 1 between two circuit bearing bodies 2 and 3 thus.Cooling body 4 is gone up the scope of stretching out LTCC circuit bearing body 2 and 3 in both sides at horizontal direction (x direction).In addition, make up hole 41 and 42 in cooling body 4, they designed to be used with miscellaneous part or housing fixes (particularly twist and close).
Be built with first composite bed 5 between the LTCC on top circuit bearing body 2 and cooling body 4, this composite bed mechanically stably is connected this first circuit bearing body 2 with cooling body 4, and wherein this cooling body is made of copper in this embodiment.Correspondingly, between cooling body 4 and the 2nd LTCC circuit bearing body 3, be built with composite bed 6 equally.Two composite beds 5 and 6 are built as and are used for being connected reactively with 3 with ceramic LTCC circuit bearing body 2.This means that during LTCC technology, the corresponding single layer for connecting circuit supporting mass 2 and 3 also is built with composite construction and the composite construction between second composite bed 6 and second circuit supporting mass 3 between the composite bed 5 and the first circuit bearing body 2.
In this embodiment, the whole respectively ground of composite bed 5 and 6 is structured between cooling body 4 and the corresponding circuit bearing body 2 and 3.In addition, these composite beds 5 and 6 extend to the whole surface of cooling body 4 in a lateral direction basically.What also can design is that composite bed 5 and 6 only makes up respectively partly.Especially, be built with composite bed 5 and 6: on these positions, maximum heating occurred owing to electronic device being arranged in corresponding circuit bearing body 2 and 3 at following position.By this composite bed 5 and 6 that on purpose makes up, shift so also can realize best as far as possible heat in the part.This heat shifts laterally carries out in an illustrated embodiment.
Electronic-component module 1 following manufacturing illustrated in the accompanying drawings: at first with composite bed 5 and 6 both sides be applied on the cooling body 4.Should how to make up according to these composite beds and can design different expansion scheme.These expansion scheme partly have mentioned at the summary of the invention of specification.On the principle, also can be designed as the different form of implementation combination in any of the composite bed that the there is mentioned.
After being applied to these composite beds 5 and 6 on the cooling body 4, produce the circuit bearing body 2 of multilayer and 3 configuration with the LTCC method subsequently.Simultaneously, in the method (wherein in described method circuit bearing body 2 and 3 single layer one above the other lamination and under about 900 ℃ temperature conditions, be sintered subsequently), composite construction is also making up between composite bed 6 and second circuit supporting mass 3 between composite bed 5 and the circuit bearing body 2 and on the other hand on the one hand reactively.
According to the present invention, by make circuit bearing body 2 and 3 by LTCC technology, also made up fully complete electronic-component module 1 and particularly composite bed 5 and 6 and circuit bearing body 2 or 3 between composite construction.
Claims (22)
1. electronic-component module, at least one cooling device that it comprises the ceramic circuit supporting mass (2,3) of at least one multilayer and has at least one cooling body (4),
It is characterized in that,
At ceramic circuit supporting mass (2,3) and be provided with composite bed (5,6) between the cooling device (4) at least partly, this composite bed is built as and is used for during main technique and ceramic circuit supporting mass (2,3) connect reactively, and be built as and be used for being connected with cooling device (4).
2. electronic-component module according to claim 1 is characterized in that,
Whole ground of composite bed (5,6) is structured between circuit bearing body (2,3) and the cooling device (4).
3. electronic-component module according to claim 1 and 2 is characterized in that,
Cooling device is built as and is used for horizontal heat radiation, and cooling body (4) laterally stretches out the scope of circuit bearing body (2,3) at least in a side.
4. each the described electronic-component module in requiring according to aforesaid right is characterized in that,
Main technique is the single layer of LTCC technology that connects that is used for ceramic circuit supporting mass (2,3).
5. each the described electronic-component module in requiring according to aforesaid right is characterized in that,
Composite bed (5,6) is configured to LTCC film individual layer, no device and that do not have circuit at least.
6. each the described electronic-component module in requiring according to aforesaid right is characterized in that,
Composite bed (5,6) is made up by glass at least in part.
7. each the described electronic-component module in requiring according to aforesaid right is characterized in that,
Composite bed (5,6) to small part is made up by nano crystal material, and particularly the aluminium oxide by nanocrystal makes up.
8. each the described electronic-component module in requiring according to aforesaid right is characterized in that,
Composite bed (5,6) to small part is made up by ceramic material, is particularly made up by silica and/or silicon nitride.
9. each the described electronic-component module in requiring according to aforesaid right is characterized in that,
Composite bed (5,6) is made up by reactive metal at least in part, is particularly made up by titanium.
10. each the described electronic-component module in requiring according to aforesaid right is characterized in that,
Composite construction between circuit bearing body (2,3) and the composite bed (5,6) is by under the temperature between 840 ℃ to 930 ℃, particularly the sintering process under about 900 ℃ makes up.
11. each the described electronic-component module according in the aforesaid right requirement is characterized in that at least one cooling device (4) integrally is structured between the circuit bearing body (2,3) of two multilayers.
12. a method that is used to make electronic-component module (1), wherein at least one ceramic multilayer circuit bearing body (2,3) is connected with the cooling device that has at least one cooling body (4),
It is characterized in that,
At ceramic circuit supporting mass (2,3) and between the cooling device (4) at least the part be built with and be used for parts (2,3,4) composite bed (5 of Lian Jieing, 6), wherein composite bed (5,6) during main technique, particularly at circuit bearing body (2, link to each other with circuit bearing body (2,3) reactively during the connection technology of single layer 3).
13. method according to claim 12 is characterized in that,
The circuit bearing body is configured to the LTCC circuit bearing body (2,3) of pottery, and during as the LTCC technology of main technique, composite bed (5,6) and circuit bearing body (2,3) is connected.
14. according to claim 12 or 13 described methods, it is characterized in that,
Go up structure composite bed (5,6) at cooling device (4) before at the circuit bearing body (2,3) that makes up multilayer.
15. each the described method according in the claim 12 to 14 is characterized in that,
LTCC film at least one individual layer, no device and that do not have a circuit is configured to composite bed (5,6).
16. each the described method according in the claim 12 to 15 is characterized in that,
Composite bed (5,6) to small part is made up by glass, particularly applies and heat-treats subsequently by silk screen printing.
17. each the described method according in the claim 12 to 16 is characterized in that,
Composite bed (5,6) is made up by nano crystal material at least in part, and particularly applies by method for printing screen.
18. each the described method according in the claim 12 to 17 is characterized in that,
Composite bed (5,6) is at least in part by ceramic material, particularly made up by silica and/or silicon nitride, and comes sputter with low temperature method.
19. each the described method according in the claim 12 to 18 is characterized in that,
Composite bed (5,6) at least in part by have reactive metal particularly the coating of titanium make up.
20. each the described method according in the claim 12 to 19 is characterized in that,
Composite bed (5,6) carries out reactive ion beam etching (RIBE) by the cooling body (4) that metal is made up by oxygen at least in part and produces.
21. method according to claim 20 is characterized in that, sputtered silicon before ion beam etching.
22. each the described method according in the claim 12 to 21 is characterized in that,
By under the temperature between 840 ℃ to 930 ℃, particularly under about 900 ℃ temperature, carry out sintering circuit bearing body (2,3) and composite bed (5,6) connected.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| EP06069126 | 2006-11-30 |
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Application publication date: 20090909 |