CN101528000A - Novel printed circuit board weld pad - Google Patents

Novel printed circuit board weld pad Download PDF

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Publication number
CN101528000A
CN101528000A CN200810026695A CN200810026695A CN101528000A CN 101528000 A CN101528000 A CN 101528000A CN 200810026695 A CN200810026695 A CN 200810026695A CN 200810026695 A CN200810026695 A CN 200810026695A CN 101528000 A CN101528000 A CN 101528000A
Authority
CN
China
Prior art keywords
weld pad
weld
circuit board
printed circuit
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200810026695A
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Chinese (zh)
Inventor
曾祥平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitac Computer Shunde Ltd
Shunda Computer Factory Co Ltd
Original Assignee
Mitac Computer Shunde Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitac Computer Shunde Ltd filed Critical Mitac Computer Shunde Ltd
Priority to CN200810026695A priority Critical patent/CN101528000A/en
Publication of CN101528000A publication Critical patent/CN101528000A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a novel printed circuit board weld pad, which is arranged on a printed circuit board for welding a pin of an electronic component, and the weld pad is connected with a metallic surface by making use of a circuit with equal width as the weld pad. The invention does not directly set the weld pad with greater width on the metallic surface to increase loadable current of the weld pad, but rather make the circuit with equal width as the weld pad connected with the metallic surface, and the loadable current of the weld pad can be improved; in addition, poor phenomena of connection tin short circuit, and the like generated by small weld pad spacing resulted in wider weld pad are avoided.

Description

A kind of novel printed circuit board weld pad
Technical field
The present invention relates to a kind of weld pad design of novel printed circuit board.
Background technology
In printed circuit board (PCB) (Printed Circuit Board; abbreviation PCB) in the weld pad design; at the closeer electronic building brick of some pins; such as QFP (Quad Flat Package; small-sized square planar package) electronic building bricks such as assembly, DIMM (Dual Inline Memory Module, dual inline memory module) assembly, exclusion assembly can use metal covering usually; the weld pad of broad then is set on this metal covering, but so can increases the load current of weld pad.Yet, those broad weld pads are set cause the spacing between those weld pads to reduce, thus bad problem such as the company's of causing tin short circuit easily.As shown in Figure 1, on printed circuit board (PCB) 1000, be provided with first weld pad 2110 of two wider width, this 2 first weld pad 2110 is in order to weld two pins of an electronic building brick, this 2 first weld pad 2110 is arranged on the metal covering 2100, because these 2 first weld pads, 2110 wider width, therefore these 2 first weld pads, 2110 spacings reduce, in addition, also because these first weld pad, 2110 wider width, this first weld pad 2110 also reduces with second weld pad, 1110 spacings of facing mutually on being arranged at this printed circuit board (PCB) 1000, those second weld pads 1110 are in order to weld other electronic building brick, therefore after tin cream is gone up in these printed circuit board (PCB) 1000 printings, cause those first weld pads 2110 easily, connect problems such as tin short circuit between second weld pad 1110.
Summary of the invention
In view of the above problems, the object of the invention is to provide a kind of novel printed circuit board weld pad, but the bigger load current of this weld pad tool, simultaneously, also can the tin short circuit of the company of elimination etc. hidden danger.
For reaching above-mentioned purpose, the present invention has adopted following technical scheme: a kind of novel printed circuit board weld pad, this weld pad are arranged on this printed circuit board (PCB), and in order to weld the pin of an electronic building brick, this weld pad utilization circuit wide with it is connected on the metal covering.
Than prior art, but the present invention need not directly to be provided with the bigger weld pad of width to increase the load current of weld pad on metal covering, but the wide circuit of utilization and weld pad is connected on the metal covering, but thereby can increase the load current of weld pad, in addition, also can avoid that weld pad is wide to cause the weld pad pitch smaller and bad phenomenon such as the company's of generation tin short circuit.
Description of drawings
Fig. 1 is conventional printed circuit board weld pad schematic diagram.
Fig. 2 is a kind of novel printed circuit board weld pad schematic diagram of the present invention.
Embodiment
For describing technology contents of the present invention, structural feature in detail, illustrated in detail below in conjunction with execution mode and conjunction with figs..
See also shown in Figure 2, on this printed circuit board (PCB) 1000, be provided with 2 first weld pads 2110, this 2 first weld pad 2110 is in order to weld two pins of an electronic building brick, also be provided with on this printed circuit board (PCB) 2000 in order to weld some second weld pads 1110 of other electronic building brick, those second weld pads 1110 are adjacent to this 2 first weld pad 2110, also be provided with a metal covering 2100 on this printed circuit board (PCB) 1000, in present embodiment, these metal covering 2100 materials are copper, and this 2 first weld pad 2110 utilizes the circuit wide with it to be connected on this metal covering 2100 respectively.
Those are first years old, two weld pads 2110,1110 width basically identicals, but in order to increase the load current of this first weld pad 2110, can increase the width of these 2 first weld pads 2110, yet so promptly can cause between this 2 first weld pad 2110, this 2 first weld pad 2110 is pitch smaller between second weld pad 1110 that faces mutually, thereby problem such as the company's of causing tin short circuit easily, therefore in present embodiment, this 2 first weld pad 2110 utilizes the circuit wide with it to be connected on this metal covering 2100 respectively, so, but can increase the load current of these 2 first weld pads 2110, can not cause this first weld pad 2110 again, company's tin short circuit problem of second weld pad 1110.
Than prior art, the present invention connects this first weld pad 2110 on this metal covering 2100 by circuit, but can under the situation of the width that does not increase this first weld pad 2110, increase the load current of this first weld pad 2110 thus, thereby avoid causing the problems such as company's tin short circuit between first weld pad 2110, second weld pad 1110.
The above only is a preferable possible embodiments of the present invention, is not so limits to claim of the present invention, so the equivalent structure that every utilization specification of the present invention and accompanying drawing content are done changes, all is contained in protection scope of the present invention.

Claims (3)

1. novel printed circuit board weld pad, this weld pad is arranged on this printed circuit board (PCB), in order to weld the pin of an electronic building brick, it is characterized in that, and this weld pad utilization circuit wide with it is connected on the metal covering.
2. a kind of novel printed circuit board weld pad according to claim 1, it is characterized in that, this weld pad comprises 2 first weld pads, also is provided with on this printed circuit board (PCB) in order to weld some second weld pads of other electronic building brick, and those second weld pads are adjacent to this 2 first weld pad.
3. a kind of novel printed circuit board weld pad according to claim 1 is characterized in that, the material of this metal covering is a copper.
CN200810026695A 2008-03-07 2008-03-07 Novel printed circuit board weld pad Pending CN101528000A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200810026695A CN101528000A (en) 2008-03-07 2008-03-07 Novel printed circuit board weld pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200810026695A CN101528000A (en) 2008-03-07 2008-03-07 Novel printed circuit board weld pad

Publications (1)

Publication Number Publication Date
CN101528000A true CN101528000A (en) 2009-09-09

Family

ID=41095629

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200810026695A Pending CN101528000A (en) 2008-03-07 2008-03-07 Novel printed circuit board weld pad

Country Status (1)

Country Link
CN (1) CN101528000A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112203405A (en) * 2020-10-26 2021-01-08 恒为科技(上海)股份有限公司 Method for determining width of PCB (printed circuit board) bonding pad and PCB
CN113709971A (en) * 2021-09-01 2021-11-26 常州移远通信技术有限公司 Circuit board and communication equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112203405A (en) * 2020-10-26 2021-01-08 恒为科技(上海)股份有限公司 Method for determining width of PCB (printed circuit board) bonding pad and PCB
CN112203405B (en) * 2020-10-26 2022-05-20 恒为科技(上海)股份有限公司 Method for determining width of PCB bonding pad and PCB
CN113709971A (en) * 2021-09-01 2021-11-26 常州移远通信技术有限公司 Circuit board and communication equipment

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20090909